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IPD025N06N

IPD025N06N

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TO-252-2(DPAK)

  • 描述:

    IPD025N06N

  • 数据手册
  • 价格&库存
IPD025N06N 数据手册
MOSFET MetalOxideSemiconductorFieldEffectTransistor OptiMOSTM OptiMOSTMPower-Transistor,60V IPD025N06N DataSheet Rev.2.5 Final PowerManagement&Multimarket OptiMOSTMPower-Transistor,60V IPD025N06N 1Description D-PAK Features •Optimizedforsynchronousrectification •100%avalanchetested •Superiorthermalresistance •N-channel,normallevel •QualifiedaccordingtoJEDEC1)fortargetapplications •Pb-freeleadplating;RoHScompliant •Halogen-freeaccordingtoIEC61249-2-21 tab 1 2 3 Table1KeyPerformanceParameters Parameter Value Unit VDS 60 V RDS(on),max 2.5 mΩ ID 90 A QOSS 81 nC QG(0V..10V) 71 nC Drain Pin 2, Tab Gate Pin 1 Source Pin 3 Type/OrderingCode Package Marking RelatedLinks IPD025N06N PG-TO252-3 025N06N - 1) J-STD20 and JESD22 Final Data Sheet 2 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Final Data Sheet 3 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N 2Maximumratings atTj=25°C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current Values Unit Note/TestCondition 90 90 26 A VGS=10V,TC=25°C VGS=10V,TC=100°C VGS=10V,TC=25°C,RthJA=50K/W - 360 A TC=25°C - - 210 mJ ID=90A,RGS=25Ω VGS -20 - 20 V - Power dissipation Ptot - - 167 3.0 W TC=25°C TA=25°C,RthJA=50K/W Operating and storage temperature Tj,Tstg -55 - 175 °C IEC climatic category; DIN IEC 68-1: 55/175/56 Unit Note/TestCondition Min. Typ. Max. ID - - ID,pulse - Avalanche energy, single pulse EAS Gate source voltage Pulsed drain current1) 2) 3Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case Values Min. Typ. Max. RthJC - 0.5 0.9 K/W - Device on PCB, minimal footprint RthJA - - 62 K/W - Device on PCB, 6 cm² cooling area3) RthJA - - 40 K/W - Soldering temperature, wave and reflow soldering are allowed Tsold - - 260 °C Reflow MSL1 1) See figure 3 for more detailed information See figure 13 for more detailed information 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 2) Final Data Sheet 4 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N 4Electricalcharacteristics Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=1mA 2.8 3.3 V VDS=VGS,ID=95µA - 0.5 10 1 100 µA VDS=60V,VGS=0V,Tj=25°C VDS=60V,VGS=0V,Tj=125°C IGSS - 10 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 2.1 2.7 2.5 3.8 mΩ VGS=10V,ID=90A VGS=6V,ID=22.5A Gate resistance1) RG - 1.7 2.6 Ω - Transconductance gfs 80 160 - S |VDS|>2|ID|RDS(on)max,ID=90A Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 60 - Gate threshold voltage VGS(th) 2.1 Zero gate voltage drain current IDSS Gate-source leakage current Table5Dynamiccharacteristics1) Parameter Symbol Input capacitance Values Min. Typ. Max. Ciss - 5200 6500 pF VGS=0V,VDS=30V,f=1MHz Output capacitance Coss - 1200 1500 pF VGS=0V,VDS=30V,f=1MHz Reverse transfer capacitance Crss - 48 96 pF VGS=0V,VDS=30V,f=1MHz Turn-on delay time td(on) - 16 - ns VDD=30V,VGS=10V,ID=90A, RG,ext,ext=1.6Ω Rise time tr - 20 - ns VDD=30V,VGS=10V,ID=90A, RG,ext,ext=1.6Ω Turn-off delay time td(off) - 34 - ns VDD=30V,VGS=10V,ID=90A, RG,ext,ext=1.6Ω Fall time tf - 12 - ns VDD=30V,VGS=10V,ID=90A, RG,ext,ext=1.6Ω 1) Defined by design. Not subject to production test Final Data Sheet 5 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N Table6Gatechargecharacteristics1) Parameter Symbol Gate to source charge Gate charge at threshold Values Unit Note/TestCondition - nC VDD=30V,ID=90A,VGS=0to10V 14 - nC VDD=30V,ID=90A,VGS=0to10V - 13 17 nC VDD=30V,ID=90A,VGS=0to10V Qsw - 23 - nC VDD=30V,ID=90A,VGS=0to10V Gate charge total Qg - 71 83 nC VDD=30V,ID=90A,VGS=0to10V Gate plateau voltage Vplateau - 4.7 - V VDD=30V,ID=90A,VGS=0to10V Gate charge total, sync. FET Qg(sync) - 62 - nC VDS=0.1V,VGS=0to10V Qoss - 81 102 nC VDD=30V,VGS=0V Unit Note/TestCondition Min. Typ. Max. Qgs - 24 Qg(th) - Gate to drain charge Qgd Switching charge 2) 2) Output charge Table7Reversediode Parameter Symbol Diode continuous forward current Diode pulse current Values Min. Typ. Max. IS - - 90 A TC=25°C IS,pulse - - 360 A TC=25°C VSD - 1.0 1.2 V VGS=0V,IF=90A,Tj=25°C Reverse recovery time trr - 83 133 ns VR=30V,IF=IS,diF/dt=100A/µs Reverse recovery charge Qrr - 105 - nC VR=30V,IF=IS,diF/dt=100A/µs Diode forward voltage 2) 1) 2) See ″Gate charge waveforms″ for parameter definition Defined by design. Not subject to production test Final Data Sheet 6 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N 5Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Draincurrent 180 100 160 80 140 120 ID[A] Ptot[W] 60 100 80 40 60 40 20 20 0 0 25 50 75 100 125 150 175 0 200 0 25 50 75 TC[°C] 100 125 150 175 200 TC[°C] Ptot=f(TC) ID=f(TC);VGS≥10V Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 3 100 10 1 µs 0.5 10 µs 0.2 2 10 100 µs 10-1 10 ms 1 10 0.05 ZthJC[K/W] ID[A] 1 ms 0.1 DC 0.02 0.01 10-2 single pulse 100 10-1 10-1 100 101 102 10-3 10-6 10-5 VDS[V] 10-3 10-2 10-1 tp[s] ID=f(VDS);TC=25°C;D=0;parameter:tp Final Data Sheet 10-4 ZthJC=f(tp);parameter:D=tp/T 7 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance 360 8 10 V 7V 6V 320 7 5.5 V 5V 280 6 240 5.5 V RDS(on)[mΩ] ID[A] 5 200 160 5V 120 6V 3 7V 10 V 2 80 1 40 0 4 0.0 0.5 1.0 1.5 2.0 2.5 0 3.0 0 40 80 120 160 VDS[V] 200 240 280 320 360 ID[A] ID=f(VDS);Tj=25°C;parameter:VGS RDS(on)=f(ID);Tj=25°C;parameter:VGS Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance 360 200 320 280 150 200 gfs[S] ID[A] 240 160 100 120 50 80 175 °C 40 0 25 °C 0 2 4 6 8 0 0 VGS[V] 40 60 80 100 ID[A] ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj Final Data Sheet 20 gfs=f(ID);Tj=25°C 8 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage 6.0 5 5.5 5.0 4 4.5 3 3.5 VGS(th)[V] RDS(on)[mΩ] 4.0 max 3.0 2.5 950 µA 95 µA 2 typ 2.0 1.5 1 1.0 0.5 0.0 -60 -20 20 60 100 140 0 -60 180 -20 20 Tj[°C] 60 100 140 180 Tj[°C] RDS(on)=f(Tj);ID=90A;VGS=10V VGS(th)=f(Tj);VGS=VDS Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode 4 103 10 25 °C 175 °C Ciss 103 102 IF[A] C[pF] Coss 102 101 Crss 101 0 20 40 60 100 0.0 0.5 VDS[V] C=f(VDS);VGS=0V;f=1MHz Final Data Sheet 1.0 1.5 2.0 VSD[V] IF=f(VSD);parameter:Tj 9 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge 102 12 30 V 10 100 °C 25 °C 12 V 48 V 8 VGS[V] IAV[A] 125 °C 101 6 4 2 100 100 101 102 103 0 0 10 tAV[µs] 20 30 40 50 60 70 80 Qgate[nC] IAS=f(tAV);RGS=25Ω;parameter:Tj(start) VGS=f(Qgate);ID=90Apulsed;parameter:VDD Diagram15:Drain-sourcebreakdownvoltage Gate charge waveforms 66 64 VBR(DSS)[V] 62 60 58 56 54 -60 -20 20 60 100 140 180 Tj[°C] VBR(DSS)=f(Tj);ID=1mA Final Data Sheet 10 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N 6PackageOutlines Figure1OutlinePG-TO252-3,dimensionsinmm/inches Final Data Sheet 11 Rev.2.5,2014-07-23 OptiMOSTMPower-Transistor,60V IPD025N06N RevisionHistory IPD025N06N Revision:2014-07-23,Rev.2.5 Previous Revision Revision Date Subjects (major changes since last revision) 2.5 2014-07-23 Rev.2.5 WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com Publishedby InfineonTechnologiesAG 81726München,Germany ©2014InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 12 Rev.2.5,2014-07-23
IPD025N06N 价格&库存

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IPD025N06N
    •  国内价格 香港价格
    • 1+25.580071+3.07720
    • 10+13.5558110+1.63072
    • 50+10.4682850+1.25930
    • 100+9.85729100+1.18580
    • 500+9.39294500+1.12994
    • 1000+9.083371000+1.09270
    • 2000+9.026352000+1.08584
    • 4000+8.977474000+1.07996

    库存:2500

    IPD025N06N
    •  国内价格
    • 10+12.77230
    • 100+11.03060
    • 200+9.28890
    • 500+8.12780
    • 800+6.96670
    • 2500+5.80560
    • 12500+5.51530

    库存:10000

    IPD025N06N
      •  国内价格
      • 20+5.38164
      • 200+5.12568
      • 1000+5.02308

      库存:300