IPD90N03S4L03ATMA1

IPD90N03S4L-03 OptiMOS®-T2 Power-Transistor Product Summary V DS 30 V R DS(on),max 3.3 mΩ ID 90 A Features • N-channel - Enhancement mode PG-TO252-3-11 • Automotive AEC Q101 qualified • MSL1 up to 260°C peak reflow • 175°C operating temperature • Green product (RoHS compliant) • 100% Avalanche tested Type Package Marking IPD90N03S4L-03 PG-TO252-3-11 4N03L03 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions T C=25 °C, V GS=10 V T C=100 °C, V GS=10 V2) Value 90 Unit A 90 Pulsed drain current2) I D,pulse T C=25 °C 360 Avalanche energy, single pulse E AS I D=90 A 85 mJ Avalanche current, single pulse I AS T C=25 °C 90 A Gate source voltage V GS - ±16 V Power dissipation P tot T C=25 °C 94 W Operating and storage temperature T j, T stg - -55 ... +175 °C IEC climatic category; DIN IEC 68-1 - - 55/175/56 Rev. 2.1 page 1 2010-03-08 IPD90N03S4L-03 Parameter Symbol Values Conditions Unit min. typ. max. - - 1.6 minimal footprint - - 62 6 cm2 cooling area3) - - 40 Thermal characteristics2) Thermal resistance, junction - case R thJC SMD version, device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D= 1 mA 30 - - Gate threshold voltage V GS(th) V DS=V GS, I D=45 µA 1.0 1.6 2.2 Zero gate voltage drain current I DSS V DS=30 V, V GS=0 V, T j=25 °C - 0.01 1 - 10 1000 - 5 60 V DS=30 V, V GS=0 V, T j=125 °C2) V DS=18 V, V GS=0 V, T j=85 °C2) V µA Gate-source leakage current I GSS V GS=16 V, V DS=0 V - 1 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=45 A - 3.4 4.4 mΩ V GS=10 V, I D=90 A - 2.5 3.3 Rev. 2.1 page 2 2010-03-08 IPD90N03S4L-03 Parameter Symbol Values Conditions Unit min. typ. max. - 4000 5100 - 1000 1300 Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 53 100 Turn-on delay time t d(on) - 9 - Rise time tr - 6 - Turn-off delay time t d(off) - 37 - Fall time tf - 7 - Gate to source charge Q gs - 12 15 Gate to drain charge Q gd - 8 16 Gate charge total Qg - 60 75 Gate plateau voltage V plateau - 3.1 - V - - 90 A - - 360 0.6 0.9 1.3 V - 60 - ns - 50 - nC V GS=0 V, V DS=25 V, f =1 MHz V DD=15 V, V GS=10 V, I D=90 A, R G=3.5 Ω pF ns Gate Charge Characteristics2) V DD=24 V, I D=90 A, V GS=0 to 10 V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD V GS=0 V, I F=90 A, T j=25 °C Reverse recovery time2) t rr V R=15 V, I F=I S, di F/dt =100 A/µs Reverse recovery charge2) Q rr T C=25 °C 1) Current is limited by bondwire; with an R thJC = 1.6K/W the chip is able to carry 129A at 25°C. 2) Defined by design. Not subject to production test. 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 2.1 page 3 2010-03-08 IPD90N03S4L-03 1 Power dissipation 2 Drain current P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS ≥ 6 V 100 100 90 80 80 70 60 I D [A] P tot [W] 60 50 40 40 30 20 20 10 0 0 0 50 100 150 0 200 50 100 T C [°C] 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 1000 101 1 µs 100 10 µs 100 0.5 I D [A] Z thJC [K/W] 1 ms 100 µs 0.1 0.05 10-1 0.01 10 10-2 10-3 1 0.1 1 10 100 10-6 10-5 10-4 10-3 10-2 10-1 100 t p [s] V DS [V] Rev. 2.1 single pulse page 4 2010-03-08 IPD90N03S4L-03 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = f(I D); T j = 25 °C parameter: V GS parameter: V GS 280 10 V 12 5V 4.5 V 240 4V 3.5 V 10 200 R DS(on) [mΩ] 9 160 I D [A] 3V 11 3.5 V 120 8 7 6 5 80 4V 4 3V 4.5 V 40 5V 3 2.5 V 10 V 0 2 0 1 2 3 4 0 30 60 V DS [V] 90 120 I D [A] 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 6V R DS(on) = f(T j); I D = 90 A; V GS = 10 V parameter: T j 5 280 -55 °C 25 °C 240 175 °C 4 R DS(on) [mΩ] 200 I D [A] 160 120 3 80 2 40 0 1 2 3 4 5 V GS [V] Rev. 2.1 1 -60 -20 20 60 100 140 180 T j [°C] page 5 2010-03-08 IPD90N03S4L-03 9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D 104 2 Ciss 1.75 450 µA 1.5 C [pF] Coss 45 µA V GS(th) [V] 1.25 103 1 0.75 102 Crss 0.5 0.25 101 0 -60 -20 20 60 100 140 0 180 5 10 15 20 25 30 V DS [V] T j [°C] 11 Typical forward diode characteristicis 12 Typ. avalanche characteristics IF = f(VSD) I A S= f(t AV) parameter: T j parameter: T j(start) 100 103 25 °C 100 °C 150 °C I F [A] I AV [A] 102 175 °C 10 25 °C 1 10 100 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 V SD [V] Rev. 2.1 1 10 100 1000 t AV [µs] page 6 2010-03-08 IPD90N03S4L-03 13 Typical avalanche energy 14 Typ. drain-source breakdown voltage E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA parameter: I D 34 400 350 33 22.5 A 300 32 V BR(DSS) [V] E AS [mJ] 250 200 150 31 45 A 30 100 29 90 A 50 28 0 25 75 125 -55 175 -15 T j [°C] 25 65 105 145 T j [°C] 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 90 A pulsed parameter: V DD 10 V GS 6V 9 24 V Qg 8 7 V GS [V] 6 5 V g s(th) 4 3 2 Q g (th) Q sw 1 Q gs 0 0 20 40 60 Q gate Q gd 80 Q gate [nC] Rev. 2.1 page 7 2010-03-08 IPD90N03S4L-03 Published by Infineon Technologies AG 81726 Munich, Germany © Infineon Technologies AG 2010 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.1 page 8 2010-03-08 IPD90N03S4L-03 Revision History Version Date Changes Rev 2.0 09.03.2007 Final data sheet Rev 2.1 08.03.2010 Update of RDSon Rev. 2.1 page 9 2010-03-08