IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
OptiMOS®2 Power-Transistor
Product Summary
Features
V DS
100
V
• N-channel, normal level
R DS(on),max (TO252)
78
m:
ID
13
A
• Excellent gate charge x R DS(on) product (FOM)
• Very low on-resistance R DS(on)
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target application
• Ideal for high-frequency switching and synchronous rectification
Type
IPB79CN10N G
IPD78CN10N G
IPI80CN10N G
IPP80CN10N G
IPU78CN10N G
Package
PG-TO263-3
PG-TO252-3
PG-TO262-3
PG-TO220-3
PG-TO251-3
Marking
79CN10N
78CN10N
80CN10N
80CN10N
78CN10N
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
13
T C=100 °C
9
Unit
A
Pulsed drain current2)
I D,pulse
T C=25 °C
52
Avalanche energy, single pulse
E AS
I D=13 A, R GS=25 :
17
mJ
Gate source voltage3)
V GS
±20
V
Power dissipation
P tot
31
W
Operating and storage temperature
T j, T stg
-55 ... 175
°C
T C=25 °C
IEC climatic category; DIN IEC 68-1
1)
55/175/56
J-STD20 and JESD22
2)
see figure 3
3)
Tjmax=150°C and duty cycle D=0.01 for Vgs2|I D|R DS(on)max,
I D=13 A
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.04
page 2
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
538
716
-
76
101
Dynamic characteristics
Input capacitance
C iss
V GS=0 V, V DS=50 V,
f =1 MHz
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
8
12
Turn-on delay time
t d(on)
-
9
13
Rise time
tr
-
4
6
Turn-off delay time
t d(off)
-
13
18
Fall time
tf
-
3
4
Gate to source charge
Q gs
-
3
4
Gate to drain charge
Q gd
-
2
3
-
3
5
V DD=50 V, V GS=10 V,
I D=13 A, R G=2.4 :
pF
ns
Gate Charge Characteristics 5)
V DD=50 V, I D=13 A,
V GS=0 to 10 V
nC
Switching charge
Q sw
Gate charge total
Qg
-
8
11
Gate plateau voltage
V plateau
-
5.7
-
Output charge
Q oss
-
8
10
nC
-
-
13
A
-
-
52
-
1
1.2
V
-
67
-
ns
-
114
-
nC
V DD=50 V, V GS=0 V
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
5)
T C=25 °C
V GS=0 V, I F=13 A,
T j=25 °C
V R=50 V, I F=I S,
di F/dt =100 A/μs
See figure 16 for gate charge parameter definition
Rev. 1.04
page 3
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS10 V
40
15
30
I D [A]
P tot [W]
10
20
5
10
0
0
0
50
100
150
200
0
50
T C [°C]
100
150
200
T C [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
102
10
1 μs
10 μs
0.5
Z thJC [K/W]
100 μs
101
I D [A]
1 ms
0.2
1
0.1
0.05
100
10 ms
0.02
DC
0.01
single pulse
10-1
10-1
0.1
100
101
102
103
t p [s]
V DS [V]
Rev. 1.04
page 4
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
60
200
180
160
10 V
140
40
5V
R DS(on) [m:]
I D [A]
8V
7V
5.5 V
6V
6.5 V
7V
120
100
80
8V
6.5 V
20
10 V
60
6V
40
5.5 V
20
5V
4.5 V
0
0
0
1
2
3
4
5
0
10
20
V DS [V]
30
40
I D [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
30
20
25
15
g fs [S]
I D [A]
20
15
10
10
175 °C
5
25 °C
5
0
0
0
2
4
6
8
Rev. 1.04
0
10
20
30
I D [A]
V GS [V]
page 5
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=13 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
parameter: I D
180
4
160
3.5
140
120 μA
3
12 μA
2.5
100
V GS(th) [V]
R DS(on) [m:]
120
98 %
80
typ
2
1.5
60
1
40
0.5
20
0
0
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
103
100
Ciss
25 °C
175 °C
175 °C, 98%
Coss
102
I F [A]
C [pF]
10
Crss
101
1
100
0.1
0
20
40
60
80
0
0.5
1
1.5
2
V SD [V]
V DS [V]
Rev. 1.04
25 °C, 98%
page 6
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 :
V GS=f(Q gate); I D=13 A pulsed
parameter: T j(start)
parameter: V DD
100
12
50 V
10
80 V
20 V
V GS [V]
I AS [A]
8
10
6
4
25 °C
100 °C
150 °C
2
1
0
1
10
100
1000
0
2
4
6
8
10
Q gate [nC]
t AV [μs]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
115
V GS
Qg
V BR(DSS) [V]
110
105
V g s(th)
100
95
Q g(th)
Q sw
Q gs
90
-60
-20
20
60
100
140
Q g ate
Q gd
180
T j [°C]
Rev. 1.04
page 7
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
PG-TO220-3: Outline
Rev. 1.04
page 8
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
PG-TO-263-3 (D²-Pak)
Rev. 1.04
page 9
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
Rev. 1.04
page 10
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
PG-TO252-3: Outline
PG-TO252-3:
Outline
Rev. 1.04
page 11
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
PG-TO251-3: Outline
Rev. 1.04
page 12
2007-08-29
IPB79CN10N G IPD78CN10N G
IPI80CN10N G IPP80CN10N G IPU78CN10N G
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Legal disclaimer
The information given in this data sheet shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com ).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or
system. Life support devices or systems are intended to be implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
Rev. 1.04
page 13
2007-08-29
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