IPP019N06NF2S
MOSFET
StrongIRFETTM2Power-Transistor
PG-TO220-3
tab
Features
•Optimizedforwiderangeofapplications
•N-channel,normallevel
•100%avalanchetested
•Pb-freeleadplating;RoHScompliant
•Halogen-freeaccordingtoIEC61249-2-21
Productvalidation
QualifiedaccordingtoJEDECStandard
Drain
Pin 2, Tab
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS
60
V
RDS(on),max
1.9
mΩ
ID
185
A
Qoss
108
nC
QG(0V..10V)
108
nC
Gate
Pin 1
Source
Pin 3
Type/OrderingCode
Package
IPP019N06NF2S
PG-TO220-3
Final Data Sheet
1
Marking
RelatedLinks
019N06NS
-
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Final Data Sheet
2
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
1Maximumratings
atTA=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Values
Unit
Note/TestCondition
185
142
33
A
VGS=10V,TC=25°C
VGS=10V,TC=100°C
VGS=10V,TA=25°C,
RthJA=40°C/W2)
-
740
A
TC=25°C
-
-
349
mJ
ID=100A,RGS=25Ω
VGS
-20
-
20
V
-
Power dissipation
Ptot
-
-
188
3.8
W
TC=25°C
TA=25°C,RthJA=40°C/W2)
Operating and storage temperature
Tj,Tstg
-55
-
175
°C
-
Unit
Note/TestCondition
Min.
Typ.
Max.
ID
-
-
ID,pulse
-
Avalanche energy, single pulse
EAS
Gate source voltage
1)
Continuous drain current
Pulsed drain current3)
4)
2Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
Values
Min.
Typ.
Max.
RthJC
-
-
0.8
°C/W -
Thermal resistance, junction - ambient,
RthJA
6 cm² cooling area2)
-
-
40
°C/W -
Thermal resistance, junction - ambient,
RthJA
minimal footprint
-
-
62
°C/W -
1)
Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature
as specified. For other case temperatures please refer to Diagram 2. De-rating will be required based on the actual
environmental conditions.
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
3)
See Diagram 3 for more detailed information
4)
See Diagram 13 for more detailed information
Final Data Sheet
3
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
3Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
2.8
3.3
V
VDS=VGS,ID=129µA
-
0.5
10
1
100
µA
VDS=60V,VGS=0V,Tj=25°C
VDS=60V,VGS=0V,Tj=125°C
IGSS
-
10
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance1)
RDS(on)
-
1.7
2.1
1.9
2.9
mΩ
VGS=10V,ID=100A
VGS=6V,ID=50A
Gate resistance
RG
-
2.7
-
Ω
-
gfs
110
-
-
S
|VDS|≥2|ID|RDS(on)max,ID=100A
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
60
-
Gate threshold voltage
VGS(th)
2.1
Zero gate voltage drain current
IDSS
Gate-source leakage current
2)
Transconductance
Table5Dynamiccharacteristics
Parameter
Symbol
Input capacitance
Values
Min.
Typ.
Max.
Ciss
-
7300
-
pF
VGS=0V,VDS=30V,f=1MHz
Output capacitance
Coss
-
1550
-
pF
VGS=0V,VDS=30V,f=1MHz
Reverse transfer capacitance
Crss
-
63
-
pF
VGS=0V,VDS=30V,f=1MHz
Turn-on delay time
td(on)
-
22
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext=1.6Ω
Rise time
tr
-
31
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext=1.6Ω
Turn-off delay time
td(off)
-
48
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext=1.6Ω
Fall time
tf
-
17
-
ns
VDD=30V,VGS=10V,ID=100A,
RG,ext=1.6Ω
Unit
Note/TestCondition
Table6Gatechargecharacteristics3)
Parameter
Symbol
Gate to source charge
Values
Min.
Typ.
Max.
Qgs
-
33
-
nC
VDD=30V,ID=100A,VGS=0to10V
Gate charge at threshold
Qg(th)
-
20
-
nC
VDD=30V,ID=100A,VGS=0to10V
Gate to drain charge
Qgd
-
20
-
nC
VDD=30V,ID=100A,VGS=0to10V
Switching charge
Qsw
-
33
-
nC
VDD=30V,ID=100A,VGS=0to10V
Gate charge total
Qg
-
108
162
nC
VDD=30V,ID=100A,VGS=0to10V
Gate plateau voltage
Vplateau
-
4.5
-
V
VDD=30V,ID=100A,VGS=0to10V
Gate charge total, sync. FET
Qg(sync)
-
100
-
nC
VDS=0.1V,VGS=0to10V
Output charge
Qoss
-
108
-
nC
VDS=30V,VGS=0V
2)
1)
RDS(on) is specified at a distance of 1.8 mm distance to the package body; mounting at a larger distance increases the
overallpackage resistance of approximately 0.04 mOhm/mm per leg.
2)
Defined by design. Not subject to production test.
3)
See ″Gate charge waveforms″ for parameter definition
Final Data Sheet
4
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
Table7Reversediode
Parameter
Symbol
Diode continuous forward current
Values
Unit
Note/TestCondition
144
A
TC=25°C
-
740
A
TC=25°C
-
0.92
1.0
V
VGS=0V,IF=100A,Tj=25°C
trr
-
34
-
ns
VR=30V,IF=100A,diF/dt=500A/µs
Qrr
-
169
-
nC
VR=30V,IF=100A,diF/dt=500A/µs
Min.
Typ.
Max.
IS
-
-
Diode pulse current
IS,pulse
-
Diode forward voltage
VSD
Reverse recovery time
Reverse recovery charge
Final Data Sheet
5
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
Diagram2:Draincurrent
200
160
160
120
120
ID[A]
Ptot[W]
200
80
80
40
40
0
0
25
50
75
100
125
150
0
175
0
25
50
TC[°C]
75
100
125
150
175
TC[°C]
Ptot=f(TC)
ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
3
101
10
1 µs
100 µs
10 µs
102
100
single pulse
0.01
0.02
0.05
0.1
0.2
0.5
10 ms
ID[A]
10
ZthJC[K/W]
1 ms
1
DC
100
10-1
10-2
-1
10
10-2
10-1
100
101
102
10-3
10-6
10-5
10-4
VDS[V]
10-2
10-1
100
tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp
Final Data Sheet
10-3
ZthJC=f(tp);parameter:D=tp/T
6
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
Diagram5:Typ.outputcharacteristics
Diagram6:Typ.drain-sourceonresistance
800
4.0
10 V
700
8V
3.5
6V
600
400
RDS(on)[mΩ]
500
ID[A]
5V
5.5 V
7V
5.5 V
300
3.0
2.5
6V
5V
200
2.0
7V
8V
100
10 V
0
0
1
2
3
4
1.5
5
0
50
100
VDS[V]
150
200
250
300
350
400
ID[A]
ID=f(VDS),Tj=25°C;parameter:VGS
RDS(on)=f(ID),Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
Diagram8:Typ.drain-sourceonresistance
800
5.0
25 °C
700
4.5
600
4.0
500
3.5
RDS(on)[mΩ]
ID[A]
175 °C
400
300
3.0
175 °C
2.5
200
2.0
100
1.5
25 °C
0
0
1
2
3
4
5
6
7
VGS[V]
3
6
9
12
15
VGS[V]
ID=f(VGS),|VDS|>2|ID|RDS(on)max;parameter:Tj
Final Data Sheet
1.0
RDS(on)=f(VGS),ID=100A;parameter:Tj
7
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
Diagram9:Normalizeddrain-sourceonresistance
Diagram10:Typ.gatethresholdvoltage
2.0
3.5
1.8
1.6
2.5
1.4
VGS(th)[V]
RDS(on)(normalizedto25°C)
3.0
1.2
1290 µA
2.0
129 µA
1.0
1.5
0.8
0.6
-75
-50
-25
0
25
50
75
1.0
-75
100 125 150 175 200
-50
-25
0
Tj[°C]
25
50
75
100 125 150 175 200
Tj[°C]
RDS(on)=f(Tj),ID=100A,VGS=10V
VGS(th=f(Tj),VGS=VDS;parameter:ID
Diagram11:Typ.capacitances
Diagram12:Typ.forwardcharacteristicsofreversediode
4
103
10
25 °C
175 °C
Ciss
Coss
102
IF[A]
C[pF]
103
102
101
Crss
101
0
10
20
30
40
50
60
100
0.4
0.6
VDS[V]
1.0
1.2
1.4
1.6
1.8
VSD[V]
C=f(VDS);VGS=0V;f=1MHz
Final Data Sheet
0.8
IF=f(VSD);parameter:Tj
8
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
Diagram13:Avalanchecharacteristics
Diagram14:Typ.gatecharge
3
10
10
12 V
30 V
48 V
9
8
7
102
VGS[V]
6
IAV[A]
25 °C
100 °C
5
4
1
10
3
150 °C
2
1
100
100
101
102
103
tAV[µs]
0
0
20
40
60
80
100
120
Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj,start
VGS=f(Qgate),ID=100Apulsed,Tj=25°C;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Diagram Gate charge waveforms
65
64
63
VBR(DSS)[V]
62
61
60
59
58
57
-75
-50
-25
0
25
50
75
100 125 150 175 200
Tj[°C]
VBR(DSS)=f(Tj),ID=1mA
Final Data Sheet
9
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
5PackageOutlines
PACKAGE - GROUP
NUMBER:
PG-TO220-3-U05
REVISION: 02
DATE: 15.12.2020
MILLIMETERS
MIN.
MAX.
4.25
4.75
1.40
1.14
2.92
2.47
0.71
0.97
1.14
1.78
0.36
0.61
14.32
15.80
8.39
9.20
11.89
12.80
9.90
10.67
8.10
8.74
2.54
3
6.00
6.70
13.00
14.40
3.56
4.06
3.90
3.54
2.94
2.54
DIMENSIONS
A
A1
A2
b
b1
c
D
D1
D2
E
E1
e
N
H
L
L1
øP
Q
Figure1OutlinePG-TO220-3,dimensionsinmm
Final Data Sheet
10
Rev.2.1,2022-05-19
StrongIRFETTM2Power-Transistor
IPP019N06NF2S
RevisionHistory
IPP019N06NF2S
Revision:2022-05-19,Rev.2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.0
2022-02-14
Release of final version
2.1
2022-05-19
Updated diagram 12 title
Trademarks
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Final Data Sheet
11
Rev.2.1,2022-05-19