IPTC007N06NM5ATMA1

OptiMOS™ power MOSFETs in TOLx family www.infineon.com/tolx OptiMOS™ power MOSFETs in TOLx family Three different packages addressing different requirements Drain Top Drain Drain Top Drain Top ----- Bottom Gate Bottom Bottom Gate Source Source Source Source Gate TOLL TOLG TOLT TO-Leadless TO-Leaded with gullwing TO-Leaded top-side cooling Optimized for high-power applications Optimized for better thermal cycling on board (TCoB) robustness Optimized for superior thermal performance TO-Leadless TO-Leadless offers the industry’s lowest on-state resistance RDS(on) together with high current capability. This enables a reduction in the number of paralleled MOSFETs in high-power applications and increases power density. Additionally, 60 percent board space reduction is achievable compared to D2PAK 7-pin. Voltage class [V] Sales name RDS(on) max. @ 10 V [mΩ] Current rating [A] 30 V IPT004N03L 0.40 300 40 V IRL40T209 0.72 586 IPT007N06N 0.70 486 60 V IPT009N06NM5* 0.90 427 80 V 100 V 120 V 150 V IPT012N06N 1.20 313 IPT010N08NM5 1.05 425 IPT012N08N5 1.20 400 IPT012N08NF2S 1.23 351 IPT014N08NM5 1.40 331 IPT019N08N5 1.90 247 IPT029N08N5 2.90 169 IPT014N10N5* 1.40 362 IPT015N10N5 1.50 300 IPT015N10NF2S 1.50 315 IPT017N10NF2S 1.75 294 IPT020N10N5 2.00 260 IPT022N10NF2S 2.25 236 IPT026N10N5 2.60 202 IPT030N12N3 3.00 237 IPT039N15N5 3.90 190 IPT044N15N5 4.40 174 IPT054N15N5 5.40 143 IPT063N15N5 6.30 122 200 V IPT111N20NFD 11.0 96 250 V IPT210N25NFD 21.0 59 *coming soon Furthermore, TO-Leadless has a 50 percent larger solder contact area compared to the D2PAK 7-pin, enabling lower current density, avoiding electromigration at high current levels and temperatures, resulting in improved reliability. TO-Leadless is a package without leads allowing the possibility of optical inspection due to tin plated grooved gate and source contacts. Tinned trapezoidal grooves on the tips of gate and source contacts Trapezoidal groove Visible solder meniscus allows a simple and inexpensive automatic optical inspection Pin of TO-Leadless Visible solder joint Groove Cu-tracks on PCB PCB TOLG – TO-Leaded with gullwing TOLG is the package encompassing the best features from both TO-Leadless and D2PAK 7-pin. It has the same footprint and excellent electrical performance as TOLL. The advantage of TOLG is the flexibility enabled by the gullwing leads, which offer better joint reliability on the Aluminum-IMS board. Thanks to this feature TOLG achieves two times better thermal cycling on board (TCoB) performance compared to IPC-9701 standard requirements. Part number RDS(on) max. @ 10 V [mΩ] ID [A] 60 IPTG007N06NM5 0.75 454 IPTG011N08NM5 1.10 408 IPTG018N08NM5 1.80 253 IPTG025N08NM5 2.50 184 IPTG014N10NM5 1.40 366 IPTG018N10NM5 1.80 273 IPTG025N10NM5 2.50 206 IPTG039N15NM5 3.90 190 IPTG044N15NM5 4.40 174 IPTG054N15NM5 5.40 143 IPTG063N15NM5 6.30 122 200 IPTG111N20NM3FD 11.10 77 250 IPTG210N25NM3FD 21.00 108 100 150 2000 TOLL fulfills the standard requirements Voltage class [V] 80 Cycles 1000 IPC - 9701 Requirements Thermal cycling on board (TCoB) performance on Al-IMS board TIM (Thermal interface material) TOLL is recommended for FR4 and Cu-based IMS board Solder joint TOLG is recommended for Al-IMS board IMS copper top IMS dielectric layer TOLT – TO-Leaded top-side cooling Drain TOLT package offers the same high current low profile benefits as the TOLL package with the additional advantage of top-side cooling for optimum thermal performance. Source Source Gate Drain Gate TIM (Thermal interface material) Top view w/o mould compoud TIM (Thermal interface material) Bottom view w/o mould compoud TOLT vs. TOLL - Thermal comparison 2,5 Voltage class [V] 60 80 100 150 *coming soon Part number RDS(on) max. @ 10 V [mΩ] ID [A] IPTC007N06NM5* 0.75 454 IPTC012N06NM5* 1.2 311 IPTC011N08NM5 1.1 408 IPTC014N08NM5 1.4 330 IPTC014N10NM5 1.4 365 IPTC019N10NM5 1.9 279 IPTC039N15N5 3.9 190 IPTC044N15N5 4.4 174 IPTC054N15N5 5.4 163 IPTC063N15N5 6.3 139 Rth [K/W] 2 With bottom-side cooling packages, like the TOLL or the D2PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses. With top-side cooling, the drain is exposed at the surface of the package allowing the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50 percent improved RthJC compared to the TOLL package. 2,11 36% Rth reduction 1,5 1,35 1 0,5 0 TOLL TOLT Rth (j-heatsink) @360um TIM 5000s35 TOLL on FR4 board without solder stop mask To meet the same current handling as the bottom side cooling package, it is possible to significantly reduce the heatsink size with TOLT package achieving lower system cost. Package TOLx family features TOLx family benefits 60% board space reduction compared to D2PAK 7pin TOLL Low RDS(on) TOLG High current rating Lower ringing and voltage overshoot compared to D2PAK TOLT Document number: B151-I1178-V1-7600-EU-EC-P Package key features Package key benefits Light electric vehicles High power density E-scooter Reduction in conduction losses High power density, system efficiency and extended lifetime Target applications E-bikes Gullwing leads Superior thermal cycling on board (TCoB) capability Battery management system Hotswap Higher efficiency by lower switching losses and lower EMI Power and gardening tools Top side cooling Negative stand-off Superior thermal performance Minimize thermal resistance to heatsink Drones Robotics All rights reserved. © 2022 Infineon Technologies AG