IRF7703

IRF7703

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TSSOP-8

  • 描述:

    MOSFET P-CH 40V 6A 8-TSSOP

  • 详情介绍
  • 数据手册
  • 价格&库存
IRF7703 数据手册
PD - 94221 B IRF7703 HEXFET® Power MOSFET l l l l l Ultra Low On-Resistance P-Channel MOSFET Very Small SOIC Package Low Profile (< 1.2mm) Available in Tape & Reel VDSS RDS(on) max (mW) ID -40V 28@VGS = -10V 45@VGS = -4.5V -6.0A -4.8A Description HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design, that International Rectifier is well known for, provides the de- signer with an extremely efficient and reliable device for battery and load management. TSSOP-8 The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (
IRF7703
- 物料型号:IRF7703 - 器件简介:超低导通电阻的P沟道MOSFET,采用非常小的SOIC封装,适合在电池和负载管理中使用。 - 引脚分配:文档中未明确列出引脚分配,但提到了TSSOP-8封装,通常这种封装有8个引脚。 - 参数特性: - 漏源电压(Vpss):-40V - 最大导通电阻(Rps(on) max):28毫欧(@VGs=-10V)和45毫欧(@VGs=-4.5V) - 连续漏极电流(ID):-6.0A(@VGs=-10V)和-4.8A(@VGs=-4.5V) - 功能详解:文档详细介绍了IRF7703的电气特性,包括其导通电阻、阈值电压、跨导、漏源电流等。 - 应用信息:适用于对印刷电路板空间有严格要求的应用,如便携式电子设备和PCMCIA卡。 - 封装信息:TSSOP-8封装,比标准SO-8封装面积小45%,低轮廓(<1.2mm)。
IRF7703 价格&库存

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