PD-90727E
IRFM460
500V, N-CHANNEL
POWER MOSFET
THRU-HOLE (TO-254AA)
HEXFET MOSFET TECHNOLOGY
Product Summary
Part Number
RDS(on)
ID
IRFM460
0.27
19A
Description
TO-254AA
HEXFET MOSFET technology is the key to IR HiRel
advanced line of power MOSFET transistors. The efficient
geometry design achieves very low on-state resistance
combined with high trans conductance. HEXFET transistors
also feature all of the well-established advantages of
MOSFETs, such as voltage control, very fast switching,
and electrical parameter temperature stability. They are
well-suited for applications such as switching power
supplies, motor controls, inverters, choppers, audio
amplifiers, high energy pulse circuits, and virtually any
application where high reliability is required. The HEXFET
transistor’s totally isolated package eliminates the need for
additional isolating material between the device and the
heat sink. This improves thermal efficiency and reduces
drain capacitance.
Features
Simple Drive Requirements
Hermetically Sealed
Dynamic dv/dt Rating
Light Weight
Absolute Maximum Ratings
Parameter
Symbol
ID1 @ VGS = 10V, TC = 25°C
Value
Continuous Drain Current
19
ID2 @ VGS = 10V, TC = 100°C Continuous Drain Current
12
Units
A
IDM @TC = 25°C
Pulsed Drain Current
76
PD @TC = 25°C
Maximum Power Dissipation
250
W
Linear Derating Factor
2.0
W/°C
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy
1200
mJ
IAR
Avalanche Current
19
A
EAR
Repetitive Avalanche Energy
25
mJ
Peak Diode Recovery dv/dt
3.5
V/ns
dv/dt
TJ
TSTG
Operating Junction and
Storage Temperature Range
Lead Temperature
-55 to + 150
°C
300 (0.063 in. /1.6 mm from case for 10s)
Weight
9.3 (Typical)
g
For Footnotes refer to the page 2.
1
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Symbol
BVDSS
BVDSS/TJ
Min. Typ. Max. Units
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
500
–––
–––
0.68
–––
–––
Static Drain-to-Source On-State
–––
–––
–––
–––
0.27
QG
QGS
QGD
td(on)
tr
td(off)
tf
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2.0
13
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
0.31
4.0
–––
25
250
100
-100
190
27
135
35
120
130
98
Ls +LD
Total Inductance
–––
6.8
–––
nH
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
4300
1000
250
–––
–––
–––
pF
RDS(on)
Resistance
VGS(th)
Gate Threshold Voltage
Forward Transconductance
Gfs
IDSS
Zero Gate Voltage Drain Current
IGSS
Test Conditions
V
V/°C
VGS = 0V, ID = 1.0mA
Reference to 25°C, ID = 1.0mA
VGS = 10V, ID2 = 12A
VGS = 10V, ID1 = 19A
VDS = VGS, ID = 250µA
VDS = 15V, ID2 = 12A
VDS = 400V, VGS = 0V
VDS = 400V,VGS = 0V,TJ =125°C
VGS = 20V
VGS = -20V
ID1 = 19A
VDS = 250V
VGS = 10V
VDD = 250V
ID1 = 19A
RG = 2.35
VGS = 10V
V
S
µA
nA
nC
ns
Measured from Drain lead (6mm / 0.25 in
from package) to Source lead (6mm/ 0.25 in
from package) with Source wire internally
bonded from Source pin to Drain pad
VGS = 0V
VDS = 25V
ƒ = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Symbol
Parameter
Min. Typ. Max. Units
Test Conditions
IS
Continuous Source Current (Body Diode)
–––
–––
19
ISM
Pulsed Source Current (Body Diode)
–––
–––
76
VSD
Diode Forward Voltage
–––
–––
1.8
V
TJ = 25°C,IS = 19A, VGS = 0V
trr
Reverse Recovery Time
–––
–––
580
ns
TJ = 25°C, IF = 19A, VDD ≤ 50V
Qrr
Reverse Recovery Charge
–––
–––
8.1
µC
di/dt = 100A/µs
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Thermal Resistance
Symbol
Parameter
A
RJC
Min.
–––
Typ.
–––
Max.
0.5
Units
Junction-to-Case
RCS
Case -to-Sink
–––
0.21
–––
°C/W
RJA
Junction-to-Ambient (Typical socket mount)
–––
–––
48
Footnotes:
Repetitive Rating; Pulse width limited by maximum junction temperature.
VDD = 50V, starting TJ = 25°C, L = 6.6mH, Peak IL = 19A, VGS = 10V
ISD 19A, di/dt 160A/µs, VDD 500V, TJ 150°C
Pulse width 300 µs; Duty Cycle 2%.
2
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
3
Fig 2. Typical Output Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 8. Maximum Safe Operating Area
Fig 10. Maximum Avalanche Energy
Vs. Drain Current
Fig 11. Maximum Effective Transient Thermal Impedance, Junction -to-Case
4
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
V(BR)DSS
tp
I AS
Fig 12a. Unclamped Inductive Test Circuit
Fig 13a. Basic Gate Charge Waveform
Fig 14a. Switching Time Test Circuit
5
Fig 12b. Unclamped Inductive Waveforms
Fig 13b. Gate Charge Test Circuit
Fig 14b. Switching Time Waveforms
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
Note: For the most updated package outline, please see the website: TO-254AA
Case Outline and Dimensions - Low-Ohmic TO-254AA
BERYLLIA WARNING PER MIL-PRF-19500
Package containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them
which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will
produce fumes containing beryllium.
www.infineon.com/irhirel
Infineon Technologies Service Center: USA Tel: +1 (866) 951-9519 and International Tel: +49 89 234 65555
Leominster, Massachusetts 01453, USA Tel: +1 (978) 534-5776
San Jose, California 95134, USA Tel: +1 (408) 434-5000
Data and specifications subject to change without notice.
6
International Rectifier HiRel Products, Inc.
2021-04-30
IRFM460
IMPORTANT NOTICE
The information given in this document shall be in no event regarded as guarantee of conditions or characteristic. The
data contained herein is a characterization of the component based on internal standards and is intended to
demonstrate and provide guidance for typical part performance. It will require further evaluation, qualification and
analysis to determine suitability in the application environment to confirm compliance to your system requirements.
With respect to any example hints or any typical values stated herein and/or any information regarding the application of
the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind including without
limitation warranties on non- infringement of intellectual property rights and any third party.
In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this
document and any applicable legal requirements, norms and standards concerning customer’s product and any use of
the product of Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of any
customer’s technical departments to evaluate the suitability of the product for the intended applications and the
completeness of the product information given in this document with respect to applications.
For further information on the product, technology, delivery terms and conditions and prices, please contact your local
sales representative or go to (www.infineon.com/irhirel).
WARNING
Due to technical requirements products may contain dangerous substances. For information on the types in question,
please contact your nearest Infineon Technologies office.
7
International Rectifier HiRel Products, Inc.
2021-04-30