IRG7PK35UD1PbF
IRG7PK35UD1-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 1400V
C
C
C
IC = 20A, TC =100°C
TJ(max) = 150°C
G
G
VCE(ON) typ. = 2.0V @ IC = 20A
E
n-channel
Applications
Induction heating
Microwave ovens
Soft switching applications
C
E
G
IRG7PK35UD1PbF
TO‐247AC
G
Gate
IRG7PK35UD1‐EPbF
TO‐247AD
C
Collector
Features
E
C
E
Emitter
Benefits
Low VCE(ON), ultra-low VF, and turn-off soft switching losses
High efficiency in a wide range of soft switching
applications and switching frequencies
Positive VCE (ON) temperature coefficient and tight distribution
of parameters
Excellent current sharing in parallel operation
Lead-free, RoHS compliant
Environmentally friendly
Base part number
Package Type
IRG7PK35UD1PbF
IRG7PK35UD1-EPbF
TO-247AC
TO-247AD
Standard Pack
Form
Quantity
Tube
25
Tube
25
Orderable Part Number
IRG7PK35UD1PbF
IRG7PK35UD1-EPbF
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 25°C
IF @ TC = 100°C
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulse Collector Current, VGE = 15V
Clamped Inductive Load Current, VGE = 20V
Diode Continuous Forward Current
Diode Continuous Forward Current
Continuous Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Max.
Units
1400
40
20
200
80
40
20
±30
167
67
-40 to +150
V
A
V
W
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
C
Thermal Resistance
RJC (IGBT)
RJC (Diode)
RCS
RJA
1
Parameter
Thermal Resistance Junction-to-Case (IGBT)
Thermal Resistance Junction-to-Case (Diode)
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min.
–––
–––
–––
–––
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Typ.
–––
–––
0.24
40
Max.
0.75
1.4
–––
–––
Units
°C/W
February 27, 2014
IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
—
2.0
Collector-to-Emitter Saturation Voltage
VCE(on)
—
2.4
VGE(th)
Gate Threshold Voltage
3.0
—
gfe
Forward Transconductance
—
21
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
150
—
—
IGES
Gate-to-Emitter Leakage Current
—
1.30
Diode Forward Voltage Drop
VF
—
1.25
Max. Units
2.35
V
—
6.0
V
—
S
100
µA
—
±100
nA
1.43
V
—
Conditions
IC = 20A, VGE = 15V, TJ = 25°C
IC = 20A, VGE = 15V, TJ = 150°C
VCE = VGE, IC = 600µA
VCE = 50V, IC = 20A, PW = 20µs
VGE = 0V, VCE = 1400V
VGE = 0V, VCE = 1400V, TJ = 150°C
VGE = ±30V
IF = 20A
IF = 20A, TJ = 150°C
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Min.
—
—
—
Eoff
Turn-Off Switching Loss
—
td(off)
tf
Turn-Off delay time
Fall time
—
—
Eoff
Turn-Off Switching Loss
—
td(off)
tf
Cies
Coes
Cres
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
—
—
—
—
—
RBSOA
Reverse Bias Safe Operating Area
Typ.
65
15
25
Max Units
Conditions
98
IC = 20A
23
nC VGE = 15V
VCC = 600V
38
IC = 20A, VCC = 600V, VGE = 15V
0.65
0.90
mJ
RG = 10, TJ = 25°C
150
170
Energy losses include tail
ns
75
95
IC = 20A, VCC = 600V, VGE = 15V
1.3
—
mJ
RG = 10, TJ = 150°C
180
—
Energy losses include tail
ns
180
—
2200
—
VGE = 0V
pF VCC = 30V
70
—
f = 1.0MHz
35
—
TJ = 150°C, IC = 80A
FULL SQUARE
VCC = 1120V, Vp ≤ 1400V
RG = 10, VGE = +20V to 0V
Notes:
FBSOA operating conditions only.
Pulse width limited by max. junction temperature.
VCC = 80% (VCES), VGE = 20V, RG = 10.
R is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Maximum limits are based on statistical sample size characterization.
2
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February 27, 2014
IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
40
200
30
150
Ptot (W)
IC (A)
20
100
10
50
0
0
25
50
75
100
125
150
25
50
75
100
125
150
TC (°C)
TC (°C)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 2 - Power Dissipation vs.
Case Temperature
1000
5.0
4.6
100
4.2
IC (A)
VGE(th) , Gate Threshold Voltage
IC = 600µA
3.8
10
3.4
1
3.0
25
50
75
100
125
10
150
10000
Fig. 4 - Reverse Bias SOA
TJ = 150°C; VGE = 20V
Fig. 3 - Typical Gate Threshold Voltage
vs. Junction Temperature
80
80
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
60
ICE (A)
60
ICE (A)
1000
V CE (V)
T J , Temperature (°C)
40
20
40
20
0
0
0
3
100
2
4
6
8
10
0
2
4
6
8
10
V CE (V)
V CE (V)
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 20µs
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
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February 27, 2014
IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
80
80
25°C
150°C
60
50
IF (A)
60
ICE (A)
70
V GE = 18V
V GE = 15V
V GE = 12V
V GE = 10V
V GE = 8.0V
40
40
30
20
20
10
0
0
0
2
4
6
8
10
0.0
1.0
2.0
V CE (V)
Fig. 8 - Typ. Diode Forward Voltage Drop
Characteristics
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 150°C; tp = 20µs
12
12
10
10
8
ICE = 40A
ICE = 20A
6
ICE = 10A
ICE = 40A
ICE = 20A
8
V CE (V)
V CE (V)
3.0
VF (V)
ICE = 10A
6
4
4
2
2
0
0
5
10
15
5
20
10
15
20
V GE (V)
V GE (V)
Fig. 9 - Typical VCE vs. VGE
TJ = -40°C
Fig. 10 - Typical VCE vs. VGE
TJ = 25°C
12
80
10
ICE = 40A
ICE = 20A
6
ICE = 10A
ICE (A)
V CE (V)
60
8
40
4
TJ = 25°C
TJ = 150°C
20
2
0
0
5
4
10
15
20
2
4
6
8
10
12
V GE (V)
V GE (V)
Fig. 11 - Typical VCE vs. VGE
TJ = 150°C
Fig. 12 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
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February 27, 2014
IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
1000
2.5
tdOFF
Swiching Time (ns)
Energy (mJ)
2.0
EOFF
1.5
1.0
tF
100
0.5
0.0
10
0
10
20
30
40
0
10
20
IC (A)
30
40
IC (A)
Fig. 13 - Typ. Energy Loss vs. IC
TJ = 150°C; VCE = 600V, RG = 10; VGE = 15V
Fig. 14 - Typ. Switching Time vs. IC
TJ = 150°C; VCE = 600V, RG = 10; VGE = 15V
10000
2.6
Swiching Time (ns)
2.2
Energy (mJ)
EOFF
1.8
1000
tdOFF
100
tF
1.4
10
1.0
0
20
40
60
80
0
100
60
80
100
RG ( )
Fig. 15 - Typ. Energy Loss vs. RG
TJ = 150°C; VCE = 600V, ICE = 20A; VGE = 15V
Fig. 16 - Typ. Switching Time vs. RG
TJ = 150°C; VCE = 600V, ICE = 20A; VGE = 15V
16
V GE, Gate-to-Emitter Voltage (V)
Cies
1000
Capacitance (pF)
40
Rg ( )
10000
100
Coes
10
Cres
V CES = 600V
14
V CES = 400V
12
10
8
6
4
2
0
1
0
100
200
300
400
500
600
V CE (V)
Fig. 17 - Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
5
20
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0
10
20
30
40
50
60
70
Q G, Total Gate Charge (nC)
Fig. 18 - Typical Gate Charge vs. VGE
ICE = 20A
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February 27, 2014
IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
1
Thermal Response ( Z thJC )
D = 0.50
0.20
0.1
0.10
0.05
J
R1
R1
J
1
0.02
2
1
R3
R3
3
2
3
R4
R4
4
R5
R5
5
4
C
C
5
Ci= iRi
Ci= iRi
0.01
0.01
R2
R2
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
Ri (°C/W)
i (sec)
0.009435
0.00000971
0.134412
0.00005224
0.182875
0.00033830
0.286292
0.00397000
0.136974
0.02151000
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 19 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
Thermal Response ( Z thJC )
10
1
D = 0.50
0.20
0.10
0.1
0.05
J
0.02
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
4
3
4
Ci= iRi
Ci= iRi
0.01
1E-005
0.0001
i (sec)
0.017209
0.000012
0.520952
0.000591
0.550676
0.004389
0.309755
0.032009
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
C
Ri (°C/W)
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 20 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
6
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IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
L
80 V +
-
DUT
VCC
Rg
Fig.C.T.2 - RBSOA Circuit
Fig.C.T.1 - Gate Charge Circuit (turn-off)
diode clamp /
DUT
C force
L
100K
D1
-5V
22K
C sense
DUT /
DRIVER
VCC
DUT
G force
0.0075µF
Rg
E sense
E force
Fig.C.T.4 - BVCES Filter Circuit
Fig.C.T.3 - Switching Loss Circuit
800
80
tf
70
600
60
500
50
400
40
300
30
ICE (A)
VCE (V)
700
90% ICE
200
20
100
0
10
10% ICE
5% VCE
0
Eoff Loss
-100
-1.4
-0.4
0.6
1.6
-10
2.6
time(µs)
Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 150°C using Fig. CT.3
7
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IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
8
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IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM B LED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
9
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IRG7PK35UD1PbF/IRG7PK35UD1-EPbF
Qualification Information†
Consumer††
(per JEDEC JESD47F)†††
Qualification Level
Moisture Sensitivity Level
TO-247AC
N/A
TO-247AD
N/A
Yes
RoHS Compliant
†
††
†††
Qualification standards can be found at International Rectifier’s web site
http://www.irf.com/product-info/reliability
Higher qualification ratings may be available should the user have such requirements.
Please contact your International Rectifier sales representative for further information:
http://www.irf.com/whoto-call/salesrep/
Applicable version of JEDEC standard at the time of product release.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
10
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February 27, 2014