IRG8P60N120KDPbF
IRG8P60N120KD-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 1200V
C
IC = 60A, TC =100°C
tSC 10µs, TJ(max) = 150°C
G
G
VCE(ON) typ. = 1.7V @ IC = 40A
E
n-channel
Applications
• Industrial Motor Drive
• UPS
• Solar Inverters
• Welding
C
E
GC
IRG8P60N120KDPbF
TO‐247AC
G
Gate
Features
E
IRG8P60N120KD‐EPbF
TO‐247AD
C
Collector
E
Emitter
Benefits
Benchmark Low VCE(ON)
High Efficiency in a Motor Drive Applications
10μs Short Circuit SOA
Increases margin for short circuit protection scheme
Positive VCE(ON) Temperature Coefficient
Excellent Current Sharing in Parallel Operation
Square RBSOA and high ILM- rating
Rugged Transient Performance
Lead-Free, RoHS compliant
Environmentally friendly
Base part number
Package Type
IRG8P60N120KDPbF
IRG8P60N120KD-EPbF
TO-247AC
TO-247AD
Standard Pack
Form
Quantity
Tube
25
Tube
25
Orderable Part Number
IRG8P60N120KDPbF
IRG8P60N120KD-EPbF
Absolute Maximum Ratings
Parameter
Max.
Units
V
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
Collector-to-Emitter Voltage
Continuous Collector Current (Silicon Limited)
Continuous Collector Current
Pulse Collector Current (see fig. 2)
1200
100
60
120
ILM
IF @ TC = 25°C
IF @ TC = 100°C
IFM
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Clamped Inductive Load Current (see fig. 3)
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Continuous Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
160
50
30
160
±30
420
170
-40 to +150
A
V
W
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
C
Thermal Resistance
RJC (IGBT)
RJC (Diode)
RCS
RJA
1
Parameter
Thermal Resistance Junction-to-Case (IGBT)
Thermal Resistance Junction-to-Case (Diode)
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min.
–––
–––
–––
–––
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Typ.
–––
–––
0.24
40
Max.
0.3
0.8
–––
–––
Units
°C/W
October 30, 2014
IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
Parameter
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
1200
—
Typ.
—
1.0
—
1.7
—
2.1
Gate Threshold Voltage
5.0
—
VGE(th)
Threshold Voltage Temperature Coeff.
—
-16
VGE(th)/TJ
gfe
Forward Transconductance
—
22
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
1.2
Gate-to-Emitter Leakage Current
IGES
—
—
—
2.3
Diode Forward Voltage Drop
VF
—
2.5
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max.
—
—
2.0
V
IC = 40A, VGE = 15V, TJ = 25°C
—
IC = 40A, VGE = 15V, TJ = 150°C
6.5
V
VCE = VGE, IC = 1.6mA
—
mV/°C VCE = VGE, IC = 1.6mA (25°C-150°C)
—
S
VCE = 50V, IC = 40A, PW = 20µs
35
µA VGE = 0V, VCE = 1200V
—
mA VGE = 0V, VCE = 1200V, TJ = 150°C
±400
nA VGE = ±30V
2.9
V
IF = 40A
—
IF = 40A, TJ = 150°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
10
—
—
Erec
trr
Irr
Reverse Recovery Energy of the Diode
Diode Reverse Recovery Time
Peak Reverse Recovery Current
—
—
—
1.8
210
21
—
—
—
Min.
—
—
—
—
—
—
—
—
—
—
—
Typ.
230
15
140
2.8
2.3
5.1
40
30
240
110
4.4
—
—
—
—
—
—
—
—
—
4.2
8.6
40
30
310
110
3700
215
120
Units
Conditions
V
VGE = 0V, IC = 250µA
V/°C VGE = 0V, IC = 5.0mA (25°C-150°C)
Max Units
Conditions
345
IC = 40A
nC VGE = 15V
25
VCC = 600V
210
—
—
mJ IC = 40A, VCC = 600V, VGE=15V
—
RG = 5.0, TJ = 25°C
—
Energy losses include tail & diode
—
ns reverse recovery
—
—
—
—
—
—
—
—
—
—
—
—
FULL SQUARE
mJ
ns
IC = 40A, VCC = 600V, VGE=15V
RG = 5.0, TJ = 150°C
Energy losses include tail & diode
reverse recovery
VGE = 0V
VCC = 30V
f = 1.0Mhz
TJ = 150°C, IC = 160A
VCC = 960V, Vp ≤ 1200V
VGE = +20V to 0V
TJ = 150°C,VCC = 600V, Vp ≤ 1200V
µs V = +15V to 0V
GE
pF
mJ
ns
A
TJ = 150°C
VCC = 600V, IF = 40A
VGE = 15V, Rg = 5.0
Notes:
VCC = 80% (VCES), VGE = 20V.
R is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Maximum limits are based on statistical sample size characterization.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement.
2
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
100
For both:
Duty cycle : 50%
Tj = 150°C
Tcase = 100°C
Gate drive as specified
Power Dissipation = 167W
Load Current ( A )
80
60
Square Wave:
40
VCC
I
20
Diode as specified
0
0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
1000
100
100
10
100µsec
IC (A)
IC (A)
10µsec
10
1msec
1
Tc = 25°C
Tj = 150°C
Single Pulse
DC
0.1
1
1
10
100
1000
10
10000
100
1000
10000
VCE (V)
VCE (V)
Fig. 2 - Forward SOA
TC = 25°C; TJ ≤ 150°C; VGE = 15V
Fig. 3 - Reverse Bias SOA
TJ = 150°C; VGE = 20V
1000
1000
100
ICE (A)
100
ICE (A)
10
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
1.0
10
1
0.1
0.1
0
0
2
4
6
8
10
V CE (V)
Fig. 4 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
3
Tc = -40°C
Tc = 25°C
Tc = 150°C
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2
4
6
8
10
V CE (V)
Fig. 5 - Typ. IGBT Saturation Voltage
VGE = 15V; tp = 20µs
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
16
V GE, Gate-to-Emitter Voltage (V)
1000
ICE (A)
100
10
TJ = -40°C
TJ = 25°C
1
TJ = 150°C
V CES = 600V
14
V CES = 400V
12
10
8
6
4
2
0
0.1
4
6
8
10
12
14
16
18
0
20
50
100
150
200
250
Q G, Total Gate Charge (nC)
V GE (V)
Fig. 7 - Typical Gate Charge vs. VGE
ICE = 40A
Fig. 6 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
1000
16
tdOFF
EOFF @ Tj = 150°C
EON @ Tj = 150°C
Energy (mJ)
Swiching Time (ns)
ERR @ Tj = 150°C
12
EOFF @ Tj = 25°C
8
EON @ Tj = 25°C
ERR @ Tj = 25°C
tF
100
tdON
10
tR
4
1
0
0
10
20
30
40
50
60
70
0
80
20
40
1000
EON @ Tj = 150°C
EOFF @ Tj = 150°C
tdOFF
ERR @ Tj = 150°C
6
Swiching Time (ns)
EON @ Tj = 25°C
EOFF @ Tj = 25°C
ERR @ Tj = 25°C
4
tF
100
tdON
2
tR
10
0
5
7
9
11 13 15 17 19 21 23 25 27
Rg ()
Fig. 10 - Typ. Energy Loss vs. RG
VCE = 600V, ICE = 40A; VGE = 15V
4
80
Fig. 9 - Typ. Switching Time vs. IC
TJ = 150°C; VCE = 600V, RG = 5.0; VGE = 15V
Fig. 8 - Typ. Energy Loss vs. IC
VCE = 600V, RG = 5.0; VGE = 15V
8
60
IC (A)
IC (A)
Energy (mJ)
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3
6
9
12
15
18
21
24
27
RG ( )
Fig. 11 - Typ. Switching Time vs. RG
TJ = 150°C; VCE = 600V, ICE = 40A; VGE = 15V
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
4000
25
VCC = 600V
3000
R G = 5
R G = 10
R G =
R G = 27
RG = 27
2500
Energy (µJ)
IF = 40A
23
RG = 5.0
RG = 10
RG = 22
3500
Tj = 150°C
VGE = 15V
24
IRR (A)
2000
1500
1000
22
500
0
21
200
400
600
800
1000
1200
20
1400
30
40
50
60
70
80
IF (A)
diF /dt (A/µs)
Fig. 13 - Typ. Diode ERR vs. IF
TJ = 150°C
Fig. 12 - Typ. IRR vs. di/dt
1000
-40°C
25°C
150°C
100
IF (A)
10
1
0.1
0.0
1.0
2.0
3.0
4.0
5.0
6.0
V F (V)
Fig. 14 - Typ. Diode Forward Voltage Drop
Characteristics
5
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
Thermal Response ( Z thJC )
1
0.1
D = 0.50
0.20
0.10
R1
R1
0.05
0.01
J
0.02
0.01
J
1
R2
R2
R3
R3
R4
R4
C
2
1
3
2
4
3
C
4
Ci= iRi
Ci= iRi
0.001
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
1E-005
Ri (°C/W)
i (sec)
0.004527
0.000014
0.079980
0.000178
0.134306
0.004032
0.079980
0.019255
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 15- Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
10
Thermal Response ( Z thJC )
1
D = 0.50
0.20
0.10
0.1
0.05
J
0.02
0.01
0.01
0.001
R1
R1
J
1
R2
R2
R3
R3
C
1
2
2
3
3
Ci= iRi
Ci= iRi
1E-005
0.0001
0.001
4
C
4
Ri (°C/W)
i (sec)
0.036277
0.000132
0.245235
0.000597
0.294572
0.012360
0.233626
0.098387
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
R4
R4
0.01
0.1
1
10
t1 , Rectangular Pulse Duration (sec)
Fig. 16 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
6
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
L
L
0
80 V +
VCC
DUT
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
L
4X
DC
VCC
-5V
DUT /
DRIVER
DUT
VCC
Rg
RSH
Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
(Board Stray Inductance 180nH)
C force
100K
D1
22K
C sense
DUT
G force
0.0075µF
E sense
E force
Fig.C.T.5 - BVCES Filter Circuit
7
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October 30, 2014
IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
800
240
700
210
600
VCE
180
500
150
ICE
400
120
300
90
200
60
100
30
0
-100
-20.00
Ice (A)
Vce (V)
0
-10.00
0.00
-30
10.00
time (µs)
Fig. WF1 - Typ. S.C. Waveform
@ TJ = 150°C using Fig. CT.3
8
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
9
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October 30, 2014
IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM BLED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
10
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IRG8P60N120KDPbF/IRG8P60N120KD-EPbF
Qualification Information†
Industrial
(per JEDEC JESD47F) ††
Qualification Level
Moisture Sensitivity Level
TO-247AC
N/A
TO-247AD
N/A
Yes
RoHS Compliant
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
11
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October 30, 2014