IRGP4750DPbF
IRGP4750D-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 650V
C
IC = 50A, TC =100°C
tSC 5.5µs, TJ(max) = 175°C
E
G
VCE(ON) typ. = 1.7V @ IC = 35A
C
G
IRGP4750DPbF
TO‐247AC
E
n-channel
Applications
Industrial Motor Drive
UPS
Solar Inverters
Welding
G
Gate
C
Collector
Features
G
C
E
IRGP4750D‐EPbF
TO‐247AD
E
Emitter
Benefits
Low VCE(ON) and Switching Losses
5.5µs Short Circuit SOA
Square RBSOA
Maximum Junction Temperature 175°C
Positive VCE (ON) Temperature Coefficient
High Efficiency in a Wide Range of Applications
Lead-Free, RoHs compliant
Environmentally friendly
Base part number
Package Type
IRGP4750DPbF
IRGP4750D-EPbF
TO-247AC
TO-247AD
Rugged Transient Performance
Increased Reliability
Excellent Current Sharing in Parallel Operation
Standard Pack
Form
Quantity
Tube
25
Tube
25
Orderable Part Number
IRGP4750DPbF
IRGP4750D-EPbF
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 25°C
IF @ TC = 100°C
IFM
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulse Collector Current, VGE = 15V
Clamped Inductive Load Current, VGE = 20V
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Continuous Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Max.
Units
650
70
50
105
140
80
50
140
±20
273
136
-40 to +175
V
A
V
W
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
C
Thermal Resistance
RJC (IGBT)
RJC (Diode)
RCS
RJA
1
Parameter
Thermal Resistance Junction-to-Case-(each IGBT)
Thermal Resistance Junction-to-Case-(each Diode)
Thermal Resistance, Case-to-Sink (flat, greased surface)
Thermal Resistance, Junction-to-Ambient (typical socket mount)
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Min.
–––
–––
–––
–––
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Typ.
–––
–––
0.24
–––
Max.
0.55
0.95
–––
40
Units
°C/W
November 13, 2014
IRGP4750DPbF/IRGP4750D-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
Parameter
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
650
—
Typ.
—
0.72
—
1.7
—
2.1
Gate Threshold Voltage
5.5
—
VGE(th)
Threshold Voltage Temperature Coeff.
—
-18
VGE(th)/TJ
gfe
Forward Transconductance
—
23
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
1.0
—
—
IGES
Gate-to-Emitter Leakage Current
—
1.6
VF
Diode Forward Voltage Drop
—
1.3
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max.
—
—
2.0
IC = 35A, VGE = 15V, TJ = 25°C
V
—
IC = 35A, VGE = 15V, TJ = 175°C
7.4
V
VCE = VGE, IC = 1.4mA
—
mV/°C VCE = VGE, IC = 1.4mA (25°C-175°C)
—
S
VCE = 50V, IC = 35A, PW = 20µs
35
µA VGE = 0V, VCE = 650V
—
mA VGE = 0V, VCE = 650V, TJ = 175°C
±100
nA VGE = ±20V
2.1
IF = 35A
V
—
IF = 35A, TJ = 175°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
5.5
—
—
Erec
trr
Irr
Reverse Recovery Energy of the Diode
Diode Reverse Recovery Time
Peak Reverse Recovery Current
—
—
—
380
150
27
—
—
—
Min.
—
—
—
—
—
—
—
—
—
—
—
Typ.
70
20
30
1.3
0.5
1.8
50
30
105
20
2.4
—
—
—
—
—
—
—
—
—
0.9
3.3
45
30
120
70
2200
190
60
Units
Conditions
V
VGE = 0V, IC = 100µA
V/°C VGE = 0V, IC = 2.0mA (25°C-175°C)
Max Units
Conditions
105
IC = 35A
30
nC VGE = 15V
VCC = 400V
45
2.2
0.8
mJ IC = 35A, VCC = 400V, VGE=15V
3.0
RG = 10, TJ = 25°C
70
Energy losses include tail & diode
50
ns reverse recovery
120
40
—
—
—
—
—
—
—
—
—
—
FULL SQUARE
mJ
ns
IC = 35A, VCC = 400V, VGE=15V
RG = 10, TJ = 175°C
Energy losses include tail & diode
reverse recovery
VGE = 0V
VCC = 30V
f = 1.0MHz
TJ = 175°C, IC = 140A
VCC = 520V, Vp ≤ 650V
VGE = +20V to 0V
TJ = 150°C,VCC = 400V, Vp ≤ 650V
µs V = +15V to 0V
GE
pF
µJ
ns
A
TJ = 175°C
VCC = 400V, IF = 35A
VGE = 15V, Rg = 10
Notes:
VCC = 80% (VCES), VGE = 20V.
R is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Maximum limits are based on statistical sample size characterization.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement.
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IRGP4750DPbF/IRGP4750D-EPbF
80
For both:
Duty cycle : 50%
Tj = 175°C
Tcase = 100°C
Gate drive as specified
Power Dissipation = 136W
Load Current ( A )
70
60
50
Square Wave:
VCC
40
I
30
20
Diode as specified
10
0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
80
300
250
60
Ptot (W)
IC (A)
200
40
150
100
20
50
0
0
25
50
75
100
125
150
175
25
TC (°C)
75
100
125
150
175
TC (°C)
Fig. 3 - Power Dissipation vs.
Case Temperature
Fig. 2 - Maximum DC Collector Current vs.
Case Temperature
1000
1000
100
10µsec
100
100µsec
IC (A)
IC (A)
50
10
1msec
10
DC
1
Tc = 25°C
Tj = 175°C
Single Pulse
1
0.1
1
10
100
1000
VCE (V)
Fig. 4 - Forward SOA
TC = 25°C; TJ ≤ 175°C; VGE = 15V
3
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10
100
1000
VCE (V)
Fig. 5 - Reverse Bias SOA
TJ = 175°C; VGE = 20V
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IRGP4750DPbF/IRGP4750D-EPbF
140
140
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
120
100
100
80
ICE (A)
80
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
120
60
60
40
40
20
20
0
0
0
2
4
6
8
10
0
2
4
V CE (V)
140
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
120
100
IF (A)
ICE (A)
80
60
40
80
60
20
0
0
2
4
6
8
0
10
0.0
V CE (V)
0.5
1.0
1.5
2.0
2.5
3.0
V F (V)
Fig. 9 - Typ. Diode Forward Voltage Drop
Characteristics
Fig. 8 - Typ. IGBT Output Characteristics
TJ = 175°C; tp = 20µs
10
10
8
8
ICE = 18A
ICE = 35A
ICE = 70A
6
VCE (V)
VCE (V)
-40°C
25°C
175°C
40
20
4
ICE = 18A
ICE = 35A
6
ICE = 70A
4
2
2
0
0
5
10
15
20
V GE (V)
Fig. 10 - Typical VCE vs. VGE
TJ = -40°C
4
10
140
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
100
8
V CE (V)
Fig. 6 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 20µs
120
6
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5
10
15
20
V GE (V)
Fig. 11 - Typical VCE vs. VGE
TJ = 25°C
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IRGP4750DPbF/IRGP4750D-EPbF
10
140
6
ICE = 18A
ICE = 35A
100
ICE = 70A
80
ICE (A)
VCE (V)
TJ = 25°C
TJ = 175°C
120
8
4
60
40
2
20
0
0
5
10
15
20
4
6
8
10
V GE (V)
12
14
16
V GE (V)
Fig. 13 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
Fig. 12 - Typical VCE vs. VGE
TJ = 175°C
8
1000
7
Energy (mJ)
5
Swiching Time (ns)
6
EON
4
3
EOFF
2
tF
tdOFF
100
tdON
tR
10
1
0
1
0
10
20
30
40
50
60
70
0
10
20
30
IC (A)
40
50
60
70
IC (A)
Fig. 14 - Typ. Energy Loss vs. IC
TJ = 175°C; ; VCE = 400V, RG = 10; VGE = 15V
Fig. 15 - Typ. Switching Time vs. IC
TJ = 175°C; VCE = 400V, RG = 10; VGE = 15V
6
1000
5
EON
4
Energy (mJ)
Swiching Time (ns)
tdOFF
3
2
tdON
100
tF
tR
EOFF
1
0
10
0
20
40
60
80
100
0
20
40
Rg ()
Fig. 16 - Typ. Energy Loss vs. RG
TJ = 175°C; VCE = 400V, ICE = 35A; VGE = 15V
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60
80
100
RG ()
Fig. 17 - Typ. Switching Time vs. RG
TJ = 175°C; VCE = 400V, ICE = 35A; VGE = 15V
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November 13, 2014
IRGP4750DPbF/IRGP4750D-EPbF
40
45
RG = 5
35
30
IRR (A)
IRR (A)
RG = 10
25
20
RG = 100
15
10
RG = 47
0
5
10
20
30
40
50
60
0
70
20
40
60
100
RG (
IF (A)
Fig. 19 - Typ. Diode IRR vs. RG
TJ = 175°C
Fig. 18 - Typ. Diode IRR vs. IF
TJ = 175°C
40
5000
30
4000
QRR (nC)
70A
IRR (A)
80
20
3000
35A
10
2000
0
0
200
400
600
800
1000
18A
1000
1200
0
200
400
diF /dt (A/µs)
600
800 1000 1200 1400
diF /dt (A/µs)
Fig. 20 - Typ. Diode IRR vs. diF/dt
VCC = 400V; VGE = 15V; IF = 35A; TJ = 175°C
Fig. 21 - Typ. Diode QRR vs. diF/dt
VCC = 400V; VGE = 15V; TJ = 175°C
25
800
180
RG = 5
RG = 10
RG = 47
20
140
Time (µs)
RG = 100
400
200
Tsc
15
100
10
60
5
0
0
10
20
30
40
50
60
70
80
IF (A)
Fig. 22 - Typ. Diode ERR vs. IF
TJ = 175°C
6
Isc
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Current (A)
Energy (µJ)
600
20
9
10
11
12
13
14
15
16
VGE (V)
Fig. 23 - VGE vs. Short Circuit Time
VCC = 400V; TC = 150°C
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IRGP4750DPbF/IRGP4750D-EPbF
10000
VGE, Gate-to-Emitter Voltage (V)
16
Cies
Capacitance (pF)
1000
100
Coes
Cres
10
14
VCES = 400V
VCES = 300V
12
10
8
6
4
2
1
0
0
100
200
300
400
500
600
0
10
VCE (V)
20
30
40
50
60
70
80
Q G, Total Gate Charge (nC)
Fig. 25 - Typical Gate Charge vs. VGE
ICE = 35A
Fig. 24 - Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
1
Thermal Response ( ZthJC )
D = 0.50
0.20
0.1
0.10
0.05
0.02
0.01
0.01
J
R1
R1
J
1
R3
R3
C
2
1
3
2
C
3
Ci= iRi
Ci= iRi
SINGLE PULSE
( THERMAL RESPONSE )
0.001
R2
R2
Ri (°C/W)
i (sec)
0.16631
0.000327
0.23758
0.003309
0.14552
0.01848
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 26 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
10
Thermal Response ( ZthJC )
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.1
0.01
J
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
3
4
4
Ci= iRi
Ci= iRi
0.001
1E-005
0.0001
0.001
i (sec)
0.01502
0.000029
0.26877
0.000327
0.40240
0.003652
0.26426
0.028923
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-006
C
Ri (°C/W)
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 27 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
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IRGP4750DPbF/IRGP4750D-EPbF
L
L
VCC
DUT
0
80 V +
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
L
4X
DC
VCC
-5V
DUT /
DRIVER
DUT
VCC
Rg
RSH
Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
C force
R=
VCC
ICM
100K
D1
22K
C sense
DUT
VCC
DUT
G force
0.0075µF
Rg
E sense
E force
Fig.C.T.5 - Resistive Load Circuit
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Fig.C.T.6 - BVCES Filter Circuit
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IRGP4750DPbF/IRGP4750D-EPbF
600
90
500
75
tf
tr
75
400
ICE (A)
200
30
10% VCE
0
45
200
30
100
15
10% ICE
300
90% ICE
10%ICE
15
10% VCE
0
0
0
Eoff Loss
-100
Eon Loss
-15
-0.3
-0.1
0.1
0.3
-100
0.5
-15
-0.3
0
0.3
0.6
time (µs)
time(µs)
Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 175°C using Fig. CT.4
Fig. WF2 - Typ. Turn-on Loss Waveform
@ TJ = 175°C using Fig. CT.4
500
40
500
VCE
QRR
30
0.9
tRR
20
400
400
300
300
200
200
Vce (V)
IF (A)
10
0
-10
100
Peak
IRR
-30
-0.40
0.00
0.40
0.80
time (µS)
Fig. WF3 - Typ. Diode Recovery Waveform
@ TJ = 175°C using Fig. CT.4
9
100
ICE
0
-20
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Ice (A)
100
VCE (V)
45
90% ICE
60
TEST
CURRENT
60
300
VCE (V)
400
ICE (A)
500
0
-100
-5.00
0.00
-100
10.00
5.00
Time (uS)
Fig. WF4 - Typ. S.C. Waveform
@ TJ = 150°C using Fig. CT.3
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IRGP4750DPbF/IRGP4750D-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRGP4750DPbF/IRGP4750D-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM B LED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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IRGP4750DPbF/IRGP4750D-EPbF
Qualification Information†
Industrial
Qualification Level
TO-247AC
Moisture Sensitivity Level
N/A
TO-247AD
Yes
RoHS Compliant
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
Revision History
Date
11/13/2014
Comments
Added IFM Diode Maximum Forward Current = 140A with the note on page 1.
Removed note from switching losses test condition on page 2.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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November 13, 2014