PZTA92E6433HTMA1

PZTA92 PNP Silicon High Voltage Transistor
High breakdown voltage 4
Low collector-emitter saturation voltage
Complementary type: PZTA42 (NPN) 3 2 1 Type Marking PZTA92 PZTA 92 Pin Configuration 1=B 2=C 3=E VPS05163 Package 4=C SOT223 Maximum Ratings Parameter Symbol Collector-emitter voltage VCEO 300 Collector-base voltage VCBO 300 Emitter-base voltage VEBO 5 DC collector current IC 500 Base current IB 100 Total power dissipation, TS = 124 °C Ptot 1.5 W Junction temperature Tj 150 °C Storage temperature Tstg Value Unit V mA -65 ... 150 Thermal Resistance Junction - soldering point 1) RthJS
17 K/W 1For calculation of R thJA please refer to Application Note Thermal Resistance 1 Dec-12-2001 PZTA92 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. V(BR)CEO 300 - - V(BR)CBO 300 - - V(BR)EBO 5 - - ICBO - - 250 nA ICBO - - 20 µA IEBO - - 100 nA DC Characteristics Collector-emitter breakdown voltage V IC = 1 mA, IB = 0 Collector-base breakdown voltage IC = 100 µA, IE = 0 Emitter-base breakdown voltage IE = 10 µA, IC = 0 Collector cutoff current VCB = 200 V, IE = 0 Collector cutoff current VCB = 200 V, IE = 0 , TA = 150 °C Emitter cutoff current VEB = 3 V, IC = 0 DC current gain 1) - hFE IC = 1 mA, VCE = 10 V 25 - - IC = 10 mA, VCE = 10 V 40 - - IC = 30 mA, VCE = 10 V 25 - - VCEsat - - 0.5 VBEsat - - 0.9 fT - 100 - MHz Ccb - - 6 pF Collector-emitter saturation voltage1) V IC = 20 mA, IB = 2 mA Base-emitter saturation voltage 1) IC = 20 mA, IB = 2 mA AC Characteristics Transition frequency IC = 20 mA, VCE = 10 V, f = 100 MHz Collector-base capacitance VCB = 20 V, f = 1 MHz 1) Pulse test: t < 300
s; D < 2% 2 Dec-12-2001 PZTA92 Total power dissipation Ptot = f(TS) Transition frequency fT = f (IC) VCE = 10V, f = 100MHz 10 3 1.8 mW EHP00734 MHz fT 1.4 Ptot PZTA 92/93 1.2 1 10 2 0.8 5 0.6 0.4 0.2 0 0 15 30 45 60 75 10 1 10 0 °C 150 TS 90 105 120 5 10 1 5 DC current gain hFE = f (IC ) Ptotmax / PtotDC = f (tp ) VCE = 10V PZTA 92/93 Ptot max 5 Ptot DC 10 3 EHP00346 D= tp T tp 10 1 10 2 5 2 10 1 5 10 0 10 -6 EHP00735 h FE D= 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 5 PZTA 92/93 5 T 10 2 10 3 ΙC Permissible pulse load 10 3 10 2 mA 5 5 10 -5 10 -4 10 -3 10 -2 s 10 0 -1 10 10 0 tp 3 5 10 0 5 10 1 5 10 2 mA 10 3 ΙC Dec-12-2001 PZTA92 Collector cutoff current ICBO = f (TA) Collector current IC = f (VBE) VCB = 200V VCE = 10V 10 4 nA PZTA 92/93 EHP00736 10 3 PZTA 92/93 EHP00737 mA Ι CB0 ΙC max 10 3 10 2 5 10 2 10 1 5 10 1 typ 10 10 0 0 10 -1 5 0 50 100 ˚C 10 -1 150 TA 0 0.5 V 1.0 1.5 V BE 4 Dec-12-2001 Package SOT223 Package Outline 1.6 ±0.1 6.5 ±0.2 0.1 MAX. 2 B 0.5 MIN. 1 +0.2 acc. to DIN 6784 3.5 ±0.2 4 7 ±0.3 3 ±0.1 15˚ MAX. A 3 0.28 ±0.04 2.3 0.7 ±0.1 4.6 0.25 M A 0.25 M B Foot Print 1.4 4.8 1.4 3.5 1.2 1.1 Marking Layout Manufacturer Date code (Year/Calendarweek) 2003, July Type code BCP52-16 Pin 1 Example Packing Code E6327: Reel ø180 mm = 1.000 Pieces/Reel Code E6433: Reel ø330 mm = 4.000 Pieces/Reel 0.3 MAX. Pin 1 6.8 12 7.55 8 1.75 Impressum Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.Infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.