SPP07N60CFD
CoolMOSTM Power Transistor
Product Summary
Features
• Intrinsic fast-recovery body diode
• Extremely low reverse recovery charge
V DS @Tjmax
650
V
R DS(on),max
0.7
"
ID
6.6
A
• Ultra low gate charge
• Extreme dv /dt rated
PG-TO220
• High peak current capability
• Qualified for industrial grade applications according to JEDEC1)
CoolMOS CFD designed for:
• Soft switching PWM Stages
• LCD & CRT TV
Type
Package
Marking
SPP07N60CFD
PG-TO220
07N60CFD
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
6.6
T C=100 °C
4.3
Pulsed drain current2)
I D,pulse
T C=25 °C
17
Avalanche energy, single pulse
E AS
I D=3.3 A, V DD=50 V
230
Avalanche energy, repetitive2),3)
E AR
I D=6.6 A, V DD=50 V
0.5
Avalanche current, repetitive2),3)
I AR
Drain source voltage slope
dv /dt
Reverse diode dv /dt
dv /dt
Maximum diode commutation speed
Gate source voltage
mJ
6.6
A
80
V/ns
40
V/ns
di /dt
600
A/µs
V GS
static
±20
V
AC (f >1 Hz)
±30
T C=25 °C
83
W
-55 ... 150
°C
P tot
Operating and storage temperature
T j, T stg
Rev. 1.4
A
I S=6.6 A, V DS=480 V,
T j=125 °C
Power dissipation
Mounting torque
I D=6.6 A, V DS=480 V,
T j=125°C
Unit
M3 & M3.5 screws
page 1
60
Ncm
2009-11-27
SPP07N60CFD
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
1.5
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance, junction ambient
R thJA
leaded
-
-
62
Soldering temperature, wave
soldering only allowed at leads
T sold
1.6 mm (0.063 in.)
from case for 10 s
-
-
260
°C
600
-
-
V
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=250 µA
Avalanche breakdown voltage
V (BR)DS
V GS=0 V, I D=6.6 A
-
700
-
Gate threshold voltage
V GS(th)
V DS=V GS, I D=300 µA
3
4
5
Zero gate voltage drain current
I DSS
V DS=600 V, V GS=0 V,
T j=25 °C
-
0.6
-
V DS=600 V, V GS=0 V,
T j=150 °C
-
630
-
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
-
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=4.6 A,
T j=25 °C
-
0.59
0.7
"
V GS=10 V, I D=4.6 A,
T j=150 °C
-
1.6
-
Gate resistance
RG
f =1 MHz, open drain
-
1.2
-
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=4.6 A
-
5.0
-
Rev. 1.4
page 2
S
2009-11-27
SPP07N60CFD
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
790
-
-
260
-
-
16
-
-
30
-
Dynamic characteristics
Input capacitance
C iss
V GS=0 V, V DS=25 V,
f =1 MHz
Output capacitance
C oss
Reverse transfer capacitance
C rss
Effective output capacitance, energy
related4)
C o(er)
Effective output capacitance, time
related5)
C o(tr)
-
55
-
Turn-on delay time
t d(on)
-
12
-
Rise time
tr
-
25
-
Turn-off delay time
t d(off)
-
36
-
Fall time
tf
-
9
-
Gate to source charge
Q gs
-
6.6
-
Gate to drain charge
Q gd
-
20
-
Gate charge total
Qg
-
35
47
Gate plateau voltage
V plateau
-
7.2
-
pF
V GS=0 V, V DS=0 V
to 480 V
V DD=400 V,
V GS=10 V, I D=6.6 A,
R G=6.8 "
ns
Gate Charge Characteristics
V DD=480 V, I D=6.6A,
V GS=0 to 10 V
1)
J-STD20 and JESD22
2)
Pulse width t p limited by T j,max
3)
Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f.
4)
C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS.
5)
C o(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS.
Rev. 1.4
page 3
nC
V
2009-11-27
SPP07N60CFD
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
6.6
-
-
17
-
1.0
1.2
V
-
104
200
ns
-
0.5
1.42
µC
-
8
-
A
-
1000
-
A/µs
Reverse Diode
Diode continuous forward current
IS
Diode pulse current2)
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
Peak reverse recovery current
I rrm
Peak rate of fall of reverse recovery
current
di rr / dt
Rev. 1.4
A
T C=25 °C
V GS=0 V, I F=I S,
T j=25 °C
V R=480 V, I F=I S,
di F/dt =100 A/µs
T j=25 °C
page 4
2009-11-27
SPP07N60CFD
1 Power dissipation
2 Safe operating area
P tot=f(T C)
I D=f(V DS); T C=25 °C; D =0
parameter: t p
102
90
limited by on-state
resistance
80
70
1 µs
101
60
50
I D [A]
P tot [W]
10 µs
40
100 µs
DC
30
10
1 ms
0
10 ms
20
10
10-1
0
0
40
80
120
100
160
101
102
103
V DS [V]
T C [°C]
3 Max. transient thermal impedance
4 Typ. output characteristics
I D=f(V DS); T j=25 °C
I D=f(V DS); T j=25 °C
parameter: D=t p/T
parameter: V GS
101
20
20 V
15
10 V
I D [A]
0.5
Z thJC [K/W]
10
0
0.2
0.1
8V
10
0.05
10-1
0.02
0.01
7V
5
single pulse
6.5 V
6V
5.5 V
10-2
10-5
10-4
10-3
10-2
10-1
t p [s]
Rev. 1.4
5V
0
0
5
10
15
20
V DS [V]
page 5
2009-11-27
SPP07N60CFD
5 Typ. output characteristics
6 Typ. drain-source on-state resistance
I D=f(V DS); T j=150 °C
R DS(on)=f(I D); T j=150 °C
parameter: V GS
parameter: V GS
2.8
12
20 V
10
10 V
8V
6
R DS(on) [ ]
I D [A]
8
2.4
7V
7V
6.5 V
2
6V
5V
5.5 V
6.5 V
4
2
10 V
1.6
6V
20 V
5.5 V
5V
1.2
0
0
5
10
15
0
20
2
4
V DS [V]
6
8
I D [A]
7 Drain-source on-state resistance
8 Typ. transfer characteristics
R DS(on)=f(T j); I D=4.6 A; V GS=10 V
I D=f(V GS); |V DS|>2|I D|R DS(on)max
parameter: T j
2
24
1.8
25 °C
20
1.6
1.4
I D [A]
R DS(on) [ ]
16
1.2
1
0.8
12
150 °C
typ
98 %
8
0.6
0.4
4
0.2
0
0
-60
-20
20
60
100
140
180
T j [°C]
Rev. 1.4
0
4
8
12
16
20
V GS [V]
page 6
2009-11-27
SPP07N60CFD
9 Typ. gate charge
10 Forward characteristics of reverse diode
V GS=f(Q gate); I D=6.6 A pulsed
I F=f(V SD)
parameter: V DD
parameter: T j
102
10
120 V
8
480 V
10
150 °C, 98%
25 °C
1
6
I F [A]
V GS [V]
150 °C
25 °C, 98%
4
100
2
10
0
0
5
10
15
20
25
-1
0
30
0.5
1
Q gate [nC]
1.5
2
V SD [V]
11 Avalanche SOA
12 Avalanche energy
I AR=f(t AR)
E AS=f(T j); I D=3.3 A; V DD=50 V
parameter: T j(start)
7
250
6
200
150
4
3
125 °C
E AS [mJ]
I AV [A]
5
25 °C
100
2
50
1
0
10-3
0
10-2
10-1
100
101
102
103
104
t AR [µs]
Rev. 1.4
25
50
75
100
125
150
175
T j [°C]
page 7
2009-11-27
SPP07N60CFD
14 Typ. capacitances
V BR(DSS)=f(T j);
C =f(V DS); V GS=0 V; f =1 MHz
700
104
660
103
C [pF]
V BR(DSS) [V]
13 Drain-source breakdown voltage
620
Ciss
102
Coss
101
580
10
540
-60
-20
20
60
100
140
Crss
0
0
180
100
T j [°C]
200
300
400
500
V DS [V]
15 Typ. C oss stored energy
16 Typ. reverse recovery charge
E oss= f(V DS)
Q rr=f(T j);parameter: I D =6.6 A
6
0.7
5
0.65
Q rr [µC]
E oss [µJ]
4
3
0.6
2
0.55
1
0
0.5
0
100
200
300
400
500
600
V DS [V]
Rev. 1.4
25
50
75
100
125
T j [°C]
page 8
2009-11-27
SPP07N60CFD
17 Typ. reverse recovery charge
18 Typ. reverse recovery charge
Q rr=f(I S); parameter: di/ dt =100 A/µs
Q rr=f(di /dt ); parameter: I D=6.6 A
0.8
1.1
0.7
1
125 °C
0.9
Q rr [µC]
Q rr [µC]
0.6
0.5
125 °C
0.8
0.7
0.4
25 °C
25 °C
0.6
0.3
0.5
0.2
2
3
4
5
6
I S [A]
Rev. 1.4
100
300
500
700
900
d i/d t [A/µs]
page 9
2009-11-27
SPP07N60CFD
Definition of diode switching characteristics
Rev. 1.4
page 10
2009-11-27
SPP07N60CFD
PG-TO-220-3-1; -3-21
Dimensions in mm/ inches
Rev. 1.4
page 11
2009-11-27
SPP07N60CFD
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Rev. 1.4
page 12
2009-11-27