SPU30N03S2-08

SPU30N03S2-08 OptiMOS Power-Transistor Product Summary Feature • N-Channel VDS 30 V • Enhancement mode R DS(on) 8.2 mΩ ID 30 A • Low On-Resistance RDS(on) • Excellent Gate Charge x RDS(on) product (FOM) P- TO251 -3-1 • Superior thermal resistance • 175°C operating temperature • Avalanche rated • dv/dt rated Type SPU30N03S2-08 Package P- TO251 -3-1 Ordering Code Q67042-S4140 Marking 2N0308 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Value Unit A 30 TC=25°C 1) 30 ID puls 120 EAS 250 Repetitive avalanche energy, limited by Tjmax 2) EAR 12 Reverse diode dv/dt dv/dt 6 Gate source voltage VGS ±20 V Power dissipation Ptot 125 W -55... +175 °C Pulsed drain current TC=25°C Avalanche energy, single pulse mJ ID=30 A , V DD=25V, RGS=25Ω kV/µs IS=30A, VDS=24V, di/dt=200A/µs, T jmax=175°C TC=25°C Operating and storage temperature T j , Tstg IEC climatic category; DIN IEC 68-1 55/175/56 Page 1 2003-04-30 SPU30N03S2-08 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - case RthJC - - 1.2 Thermal resistance, junction - ambient, leaded RthJA - - 100 SMD version, device on PCB: RthJA - - 75 - - 50 @ min. footprint @ 6 cm2 cooling area 3) K/W Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. V(BR)DSS 30 - - VGS(th) 2.1 3 4 Static Characteristics Drain-source breakdown voltage V V GS=0V, ID=1mA Gate threshold voltage, VGS = V DS ID=85µA Zero gate voltage drain current µA IDSS V DS=30V, VGS=0V, Tj=25°C - 0.01 1 V DS=30V, VGS=0V, Tj=125°C - 1 100 IGSS - 1 100 nA RDS(on) - 6.3 8.2 mΩ Gate-source leakage current V GS=20V, VDS=0V Drain-source on-state resistance V GS=10V, I D=30A 1Current limited by bondwire; with an RthJC = 1.2 K/W the chip is able to carry ID = 100A at 25°C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos. 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2003-04-30 SPU30N03S2-08 Electrical Characteristics Parameter Symbol Conditions Values Unit min. typ. max. 25 50 - Dynamic Characteristics Transconductance gfs VDS ≥2*ID *RDS(on)max, S ID =30A Input capacitance Ciss VGS =0V, VDS =25V, - 1630 2170 pF Output capacitance Coss f=1MHz - 750 996 Reverse transfer capacitance Crss - 155 230 Turn-on delay time td(on) VDD =15V, VGS =10V, - 11.2 16.7 Rise time tr ID =30A, - 17 26 Turn-off delay time td(off) RG =6.8Ω - 22.8 34.6 Fall time tf - 14.8 22.2 - 7.9 10.5 - 14.1 21.1 - 35 47 V(plateau) VDD =24V, ID =30A - 4.7 - V IS - - 30 A - - 120 ns Gate Charge Characteristics Gate to source charge Qgs Gate to drain charge Qgd Gate charge total Qg VDD =24V, ID =30A VDD =24V, ID =30A, nC VGS =0 to 10V Gate plateau voltage Reverse Diode Inverse diode continuous TC=25°C forward current Inv. diode direct current, pulsed ISM Inverse diode forward voltage VSD V GS=0V, IF=30A - 0.9 1.2 V Reverse recovery time trr V R=15V, I F=lS, - 41 51 ns Reverse recovery charge Qrr diF/dt=100A/µs - 46 58 nC Page 3 2003-04-30 SPU30N03S2-08 1 Power dissipation 2 Drain current Ptot = f (TC) ID = f (T C) parameter: VGS≥ 6 V parameter: VGS≥ 10 V SPU30N03S2-08 140 SPU30N03S2-08 32 W A 120 110 24 90 ID P tot 100 20 80 70 16 60 12 50 40 8 30 20 4 10 0 0 20 40 60 80 0 100 120 140 160 °C 190 0 20 40 60 80 100 120 140 160 °C 190 TC TC 3 Safe operating area 4 Max. transient thermal impedance ID = f ( VDS ) Z thJC = f (t p) parameter : D = 0 , TC = 25 °C parameter : D = t p/T 10 3 SPU30N03S2-08 10 1 SPU30N03S2-08 K/W A 0 /I D 10 = 2 R ID DS (on ) 10 Z thJC V DS t = 14.0µs p 10 -1 10 -2 100 µs D = 0.50 10 0.20 1 ms 1 0.10 0.05 10 single pulse -3 0.02 0.01 10 0 10 -1 10 0 10 1 V 10 2 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 tp VDS Page 4 2003-04-30 0 SPU30N03S2-08 5 Typ. output characteristic 6 Typ. drain-source on resistance ID = f (V DS); T j=25°C RDS(on) = f (I D) parameter: tp = 80 µs parameter: VGS SPU30N03S2-08 75 SPU30N03S2-08 36 Ptot = 125W A mΩ g 60 55 ID 45 4.5 c 4.8 d 5.0 f e 5.2 50 f 5.5 40 g 5.8 35 h 6.0 i 10.0 e d e f 4.2 b 28 R DS(on) h i V [V] GS a 24 20 g 16 30 h 25 12 20 d 8 15 i c 10 VGS [V] = 4 5 d 5.0 b a 0 0 0.5 1 1.5 2 2.5 3 3.5 4 V e f 5.2 5.5 g 5.8 h i 6.0 10.0 0 5 0 10 20 30 A 40 55 ID VDS 7 Typ. transfer characteristics 8 Typ. forward transconductance ID= f ( V GS ); V DS≥ 2 x ID x RDS(on)max g fs = f(I D); T j=25°C parameter: tp = 80 µs parameter: g fs 100 80 A S 80 60 g fs ID 70 60 50 50 40 40 30 30 20 20 10 10 0 0 1 2 3 4 5 V 6.5 VGS Page 5 0 0 20 40 60 80 A 120 ID 2003-04-30 SPU30N03S2-08 9 Drain-source on-state resistance 10 Typ. gate threshold voltage RDS(on) = f (Tj) VGS(th) = f (T j) parameter : ID = 30 A, VGS = 10 V parameter: VGS = VDS SPU30N03S2-08 19 4 mΩ V 16 V GS(th) R DS(on) 415 µA 14 12 10 98% 3 83 µA 2.5 2 8 1.5 typ 6 1 4 0.5 2 0 -60 -20 20 60 140 °C 100 0 -60 200 -20 20 60 °C 100 180 Tj Tj 11 Typ. capacitances 12 Forward character. of reverse diode C = f (V DS) IF = f (V SD) parameter: VGS=0V, f=1 MHz parameter: T j , tp = 80 µs 10 4 10 3 SPU30N03S2-08 A pF 10 2 10 1 C IF Ciss 10 Coss 3 T j = 25 °C typ T j = 175 °C typ Crss T j = 25 °C (98%) T j = 175 °C (98%) 10 2 0 10 5 10 15 20 V 30 0 0 0.4 0.8 1.2 1.6 2 2.4 V 3 VSD VDS Page 6 2003-04-30 SPU30N03S2-08 13 Typ. avalanche energy 14 Typ. gate charge E AS = f (T j) VGS = f (QGate) par.: I D = 30 A , V DD = 25 V, R GS = 25 Ω parameter: ID = 30 A pulsed 260 SPU30N03S2-08 16 mJ V 220 12 180 VGS E AS 200 160 0,2 VDS max 10 0,8 VDS max 140 8 120 100 6 80 4 60 40 2 20 0 25 45 65 85 105 125 145 °C 185 Tj 0 0 10 20 30 40 nC 55 QGate 15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA 36 SPU30N03S2-08 V(BR)DSS V 34 33 32 31 30 29 28 27 -60 -20 20 60 100 140 °C 200 Tj Page 7 2003-04-30 SPU30N03S2-08 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Further information Please notice that the part number is BSPU30N03S2-08, for simplicity the device is referred to by the term SPU30N03S2-08 throughout this documentation. Page 8 2003-04-30