SPW35N60C3
CoolMOS
TM
Power Transistor
Product Summary
Features
• New revolutionary high voltage technology
• Ultra low gate charge
V DS @ T j,max
650
V
R DS(on),max
0.1
Ω
ID
34.6
A
• Periodic avalanche rated
• Extreme dv /dt rated
• Ultra low effective capacitances
PG-TO247
• Improved transconductance
Type
Package
Ordering Code
Marking
SPW35N60C3
PG-TO247
Q67040-S4673
35N60C3
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C
34.6
T C=100 °C
21.9
Unit
A
Pulsed drain current1)
I D,pulse
T C=25 °C
103.8
Avalanche energy, single pulse
E AS
I D=17.3 A, V DD=50 V
1500
Avalanche energy, repetitive t AR1),2)
E AR
I D=34.6 A, V DD=50 V
1.5
Avalanche current, repetitive t AR1)
I AR
Drain source voltage slope
dv /dt
I D=34.6 A,
V DS=480 V, T j=125 °C
50
V/ns
Gate source voltage
V GS
static
±20
V
V GS
AC (f >1 Hz)
±30
Power dissipation
P tot
T C=25 °C
313
W
Operating and storage temperature
T j, T stg
-55 ... 150
°C
Reverse diode dv/dt 6)
dv/dt
Rev. 2.5
34.6
15
Page 1
mJ
A
V/ns
2008-02-11
Please note the new package dimensions arccording to PCN 2009-134-A
SPW35N60C3
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
0.4
leaded
-
-
62
1.6 mm (0.063 in.)
from case for 10 s
-
-
260
°C
600
-
-
V
Thermal characteristics
Thermal resistance, junction - case
R thJC
Thermal resistance, junction ambient
R thJA
Soldering temperature, wavesoldering T sold
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=250 µA
Avalanche breakdown voltage
V (BR)DS
V GS=0 V, I D=34.6 A
-
700
-
Gate threshold voltage
V GS(th)
V DS=V GS, I D=1.9 mA
2.1
3
3.9
Zero gate voltage drain current
I DSS
V DS=600 V, V GS=0 V,
T j=25 °C
-
0.1
1
V DS=600 V, V GS=0 V,
T j=150 °C
-
-
100
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
-
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=21.9 A,
T j=25 °C
-
0.081
0.1
Ω
V GS=10 V, I D=21.9 A,
T j=150 °C
-
0.2
-
Gate resistance
RG
f =1 MHz, open drain
-
0.6
-
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=21.9 A
-
36
-
Rev. 2.5
Page 2
S
2008-02-11
Please note the new package dimensions arccording to PCN 2009-134-A
SPW35N60C3
Parameter
Values
Symbol Conditions
Unit
min.
typ.
max.
-
4500
-
-
1500
-
-
100
-
-
180
-
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
Effective output capacitance, energy
C o(er)
related3)
V GS=0 V, V DS=25 V,
f =1 MHz
pF
V GS=0 V, V DS=0 V
to 480 V
Effective output capacitance, time
related4)
C o(tr)
-
324
-
Turn-on delay time
t d(on)
-
10
-
Rise time
tr
-
5
-
Turn-off delay time
t d(off)
-
70
-
Fall time
tf
-
10
-
Gate to source charge
Q gs
-
18
-
Gate to drain charge
Q gd
-
70
-
Gate charge total
Qg
-
150
200
Gate plateau voltage
V plateau
-
5.3
-
V DD=480 V,
V GS=10 V, I D=34.6 A,
R G=3.3 Ω
ns
Gate Charge Characteristics
V DD=480 V,
I D=34.6 A,
V GS=0 to 10 V
nC
V
1)
Pulse width limited by maximum temperature T j,max only
2)
Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f.
3)
C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS.
4)
C o(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS.
6)
ISD
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