Version 1.0 , Aug 2004
Datasheet
DS-CoreControl-TDA21103
TDA21103
Authors:
Edward Chang
Published by Infineon Technologies AG
http://www.infineon.com/DCDC
Power Management & Supply
N e v e r s t o p t h i n k i n g.
CoreControl TM
Page 1 of 13
DS-CoreControl-TDA21103
Contents:
Features………………………………………………………………………………………………………......3
Application……………………………………………………………………………………………………...…3
Pinout Drawing and Description………………………………………………………………………………...3
General Description……………………………………………………………………………………………...4
Block Diagram…………………………………………………………………………………………………….4
Application Circuit…...……………………………………………………………………………………………5
Absolute Maximum Rating .................................................................................................................... 6
Thermal Characteristic.......................................................................................................................... 7
Operation Condition.............................................................................................................................. 7
Electrical Characteristic ........................................................................................................................ 8
Timing Diagram ………..…………………………………………………………………………………………9
Outline Diemension……………………………………………………………………………………………..11
Revision Histroy…..……………………………………………………………………………………………..12
Sales Office Worldwide……………..…………………………………………………………………………..13
CoreControl TM
Page 2 of 13
DS-CoreControl-TDA21103
High speed Driver with bootstrapping for
dual Power MOSFETs
Features :
•
•
•
•
•
•
•
•
•
•
P-DSOP-14
Fast rise and fall times for frequencies up to 1 MHz
Changes the High Side and Low Side MOSFET´s gate to 6..12 V according to PVCC
setting.
Adjustable High Side and Low Side MOSFET gate drive voltage via PVCC pin for
optimizing ON losses and gate drive losses
Integrates the bootstrap diode for reducing the part count
Prevents from cross-conducting by adaptive gate drive control
Supports shut-down mode for low quiescent current through three-state input
Compatible to standard PWM controller ICs (Intersil, Analog Devices)
Floating High Side MOSFET drive
Power-On Overvoltage Protection
Ideal for multi-phase Desktop CPU supplies on motherboards and VRM´s
Application :
•
•
Voltage Regulator Modules
Low Output Voltage High Output Current DC-DC Converters
Type
Package
Marking
Ordering Code
TDA21103
P-DSOP-14
21103
Q67042-S4252
Pinout Drawing and Description :
CoreControl TM
Page 3 of 13
DS-CoreControl-TDA21103
General Description
The dual high speed driver is designed to drive a wide range of N-Channel low side and N-Channel high
side MOSFETs with varying gate charges. It has a small propagation delay from input to output, short
rise and fall times and the same pin configuration as the HIP6602B. In addition it provides several
protection features as well as a shut down mode for efficiency reasons.
Target application
The dual high speed driver is designed to work well in half-bridge type circuits where dual N-Channel
MOSFETs are utilized. A circuit designer can fully take advantage of the driver´s capabilities in highefficiency, high-density synchronous DC/DC converters that operate at high switching frequencies, e.g.
in multi-phase converters for CPU supplies on motherboards and VRM´s but also in motor drive and half
bridge class-D amplifier type applications.
Block Diagram
PVCC
BOOT1
HS
Driver1
GND
40KΩ
Control
Logic
PWM1
40KΩ
Shoot
Through &
Power-On
OVP
Protection
PGND
5V
VCC
5V
Control
Logic
PWM2
40KΩ
GND
PHASE1
LS
Driver1
PVCC
HS
Driver2
Shoot
Through &
Power-On
OVP
Protection
GATELS1
BOOT2
Bias
40KΩ
GATEHS1
GATEHS2
PHASE2
LS
Driver2
GATELS2
PGND
GND
CoreControl TM
Page 4 of 13
DS-CoreControl-TDA21103
Application Circuit
CoreControl TM
Page 5 of 13
DS-CoreControl-TDA21103
Absolute Maximum Ratings
At Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Value
Unit
Min.
Max.
Voltage supplied to ‘VCC’ pin; DC
VVCC
-0,3
15
Voltage supplied to ‘PVCC’ pin; DC
VPVCC
-0,3
VCC+0,3
Voltage supplied to ‘PWM’ pin
VPWM
-0,3
7
VBOOT –
VPHASE
-0,3
15
Voltage supplied to ‘BOOT’ pin referenced to ‘GND’
VBOOT
-0,3
30
Voltage rating at ‘PHASE’ pin, DC
VPHASE
-4
15
Junction temperature
TJ
0
125
Storage temperature
TS
-40
150
Voltage supplied to ‘BOOT’ pin referenced to ‘PHASE’
Lead temperature ( Soldering, 10 seconds )
°C
260
ESD Rating; Human Body Model
Machine Mode
IEC climatic category; DIN EN 60068-1
55/
2
KV
200
V
-
150/
56
CoreControl TM
V
Page 6 of 13
DS-CoreControl-TDA21103
Thermal Characteristic
Parameter
Symbol
Values
Min.
Typ.
Unit
Max.
K/W
Thermal resistance, junction-soldering point
Thermal resistance, junction-ambient
127
Operating Conditions
At Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Conditions
Min.
Typ.
Unit
Max.
Voltage supplied to ‘VCC’
pins
VVCC
10,8
13,2
V
Voltage supplied to ‘PVCC’
pins
VPVCC
6
13,2
V
f
0,1
1
MHz
Input signal transition
frequency
Power dissipation
PTOT
TA = 25 °C, TJ = 125 °C
0,75
W
Junction temperature
TJ
0
125
°C
Ambient temperature
TA
0
70
°C
CoreControl TM
Page 7 of 13
DS-CoreControl-TDA21103
Electrical Characteristic
At Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Min.
Values
Typ. Max.
Unit
Supply Characteristic
f =250 KHz,
VCC supply current
mA
Bias Current
IVCC
VPVCC = VVCC = 12 V
5,5
8
Power Supply Current
IPVCC
CBOOT=0.1uF, RPHASE = 20 Ω
5,5
10
10,7
V
µA
Under-voltage
VVCC rising threshold
lockout
8,6
9,9
Hysteresis
0,6
1,35
Input Characteristic
Current in ‘PWM’ pin
IPWM_L
V_PWM = 0 V
-80
-127
-150
Current in ‘PWM’ pin
IPWM_H
V_PWM = 5 V
80
127
150
PWM pin open
VPWM_O
1,1
2,1
3,7
PWM Low level
VPWM_L
1,0
1,26
1,5
PWM High level
VPWM_H
3,3
3,7
4,3
CoreControl TM
Page 8 of 13
DS-CoreControl-TDA21103
V
At Tj = 25 °C, unless otherwise specified
Dynamic Characteristic
Turn-on propagation Delay
High Side
td(ON)_HS
Turn-off propagation delay
High Side
td(OFF)_HS
60
Rise time High Side
tr_HS
30
Fall time High Side
tf_HS
40
Turn-on propagation Delay
Low Side
td(ON)_LS
Turn-off propagation delay
Low Side
td(OFF)_LS
Rise time Low Side
tr_LS
30
Fall time Low Side
tf_LS
30
ns
PPVCC = VVCC= 12 V
CISS = 3000 pF
45
Timing diagram
Td(ON)_HS
Tr_HS
Td(OFF)_HS
Tf_HS
Td(ON)_LS
Td(OFF)_LS
CoreControl TM
Tr_LS
Tf_LS
Page 9 of 13
DS-CoreControl-TDA21103
At Tj = 25 °C, unless otherwise specified
Parameter
Conditions
Values
Min. Typ. Max.
Output Characteristic High Side (HS) and Low Side (LS), ensured by design
Output
Unit
HS; Source
VPVCC = VVCC= 12 V
1,75
3,0
Ω
HS; Sink
VPVCC = VVCC= 12 V
2,8
5,0
Ω
LS; Source
VPVCC = VVCC= 12 V
1,9
3,0
Ω
LS; Sink
VPVCC = VVCC= 12 V
1,6
3,0
Ω
Resistance
CoreControl TM
Page 10 of 13
DS-CoreControl-TDA21103
Package Drawing P-DSO-14
Layout Footprints
e
A
L
B
1,27 mm
5,69 mm
1,31 mm
0,65 mm
CoreControl TM
Page 11 of 13
DS-CoreControl-TDA21103
Revision History
Datasheet DS-CoreControl-TDA21103
Actual Release: V1.0 Date: 10.08.2004
Page of
Page of
actual Rel.
prev. Rel.
Previous Release:
Date:
Subjects changed since last release
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in
Germany or the Infineon Technologies Companies and Representatives worldwide: see the address list
on the last page or our webpage at
http://www.infineon.com/DCDC
CoreControlTM, OptiMOS and OptiMOS II are trademarks of Infineon Technologies AG.
We listen to Your Comments
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Edition 2004-08-10
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts
stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany
or our Infineon Technologies Representatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies,
if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be
endangered.
CoreControl TM
Page 12 of 13
DS-CoreControl-TDA21103
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DS-CoreControl-TDA21103
