TLE493DP2B6A2HTSA1

TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Features • • • • • • • • • • 3D (X, Y, Z) magnetic flux density sensing of ±160 mT Programmable flux resolution down to 65 µT (typ.) X-Y angular measurement mode Diagnostic measurements to check digital parts, analog parts and Hall probe of the sensor Wake Up function and Power down mode with 7 nA (typ.) power consumption 12-bit data resolution for each measurement direction plus 10-bit temperature sensor Variable update frequencies and power modes (configurable during operation) Temperature range Tj = -40°C…125°C, supply voltage range = 2.8 V…3.5 V Triggering by external µC possible via I2C protocol Interrupt signal to indicate a valid measurement to the microcontroller PG-TSOP6-6-8 Potential applications The TLE493D-P2B6 is designed for a wide range of magnetic sensing, including the following: • Gear stick position • Control elements in the top column module and multi function steering wheel • Multi function knobs • Pedal/valve position sensing Benefits • • • • • • Component reduction due to 3D magnetic measurement principle Wide application range addressable due to high flexibility Platform adaptability due to device configurability Supporting functional safety by means of integrated diagnostics Very low system power consumption due to Wake-Up mode resulting in extended battery runtime Disturbance of smaller stray fields are neglectable compared to the high magnetic flux measurement range Product validation Qualified for Automotive Applications. Product validation according to AEC-Q100. Datasheet www.infineon.com Please read the Important Notice and Warnings at the end of this document 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Ordering information Ordering information Product type Marking 1) Ordering code Package Default address write/read TLE493D-P2B6 A0 P0 SP005557415 PG-TSOP6-6-8 6AH / 6BH TLE493D-P2B6 A1 P1 SP005557413 PG-TSOP6-6-8 44H / 45H TLE493D-P2B6 A2 P2 SP005557411 PG-TSOP6-6-8 F0H / F1H TLE493D-P2B6 A3 P3 SP005557408 PG-TSOP6-6-8 88H / 89H 1 Engineering samples are marked with “SA” Datasheet 2 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Table of contents Table of contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 1.1 1.1.1 1.1.2 1.1.3 1.2 1.3 1.4 1.5 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 Power mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Definition of magnetic field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Sensitive area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Magnetic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Temperature measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Overview of modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Interface and timing description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3 3.1 3.2 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Datasheet 3 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Functional description 1 Functional description This three dimensional Hall effect sensor can be configured by the microcontroller. The measurement data is provided in digital format to the microcontroller. The microcontroller is the master and the sensor is the slave. It also provides test functions and the capability to Wake-Up a sleeping system. 1.1 General Description of the block diagram and its functions. F-OSC Power Mode Control LP-OSC VDD GND Bias Vertical Hall plates X-Direction Wake-up Lateral Hall plates Z-Direction SCL; /INT Comparator ADC MUX Digital tracking, demodulation & I²C interface SDA Vertical Hall plates Y-Direction Temperature Figure 1 Block diagram The IC consists of three main functional units containing the following building blocks: • The power mode control system, containing a low-power oscillator, basic biasing, accurate restart, undervoltage detection and a fast oscillator. • The sensing unit, which contains the HALL biasing, HALL probes with multiplexers and successive tracking ADC, as well as a temperature sensor is implemented. • The I2C interface, containing the register files and I/O pads 1.1.1 Power mode control The power mode control provides the power distribution in the IC, a power-on reset function and a specialized low-power oscillator as the clock source. It also manages the start-up behavior. • On start-up, this unit: - activates the biasing, provides an accurate reset detector and fast oscillator - sensor enters low power mode and can be configured via I2C interface • After re-configuration, a measurement cycle is performed, which consists of the following steps: - activating internal biasing, checking for the restart condition and providing the fast oscillator - HALL biasing - measuring the three HALL probe channels sequentially (including the temperature). This is enabled by default - reentering configured mode Datasheet 4 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Functional description In any case functions are only executed if the supply voltage is high enough, otherwise the restart circuit will halt the state machine until the required level is reached and restart afterwards. The functions are also restarted if a restart event occurs in between (see parameter ADC restart level ). 1.1.2 Sensing Measures the magnetic field in X, Y and Z direction. Each X-, Y- and Z-Hall probe is connected sequentially to a multiplexer, which is then connected to an analog to digital converter (ADC). Optional, the temperature (default = activated) can be determined as well after the three Hall channels. 1.1.3 Wake-Up For each of the three magnetic channels (X/Y/Z), the Wake-Up function has an upper and lower comparison threshold. Each component of the applied field is compared to the lower and upper threshold. If one of the results is above or below these thresholds, an interrupt pulse /INT is generated. This is called a Wake-Up function. The sensor signals a certain field strength change to the microcontroller. As long as all components of the field stay within the envelope, no interrupt signal will be provided. Note however that the /INT can also be inhibited during I2C activities, by activated collision avoidance. A Wake-Up interrupt /INT is the logical OR among all Wake-Up interrupt envelopes of the three channels. 1.2 Pin configuration (top view) Figure 2 shows the pinout of the TLE493D-P2B6. Figure 2 TLE493D-P2B6 pinout Table 1 TSOP6 pin description and configuration (see Figure 2) Pin no. Name Description 1 SCL /INT Interface serial clock pin (input) Interrupt pin, signals a finished measurement cycle, open-drain 2 GND Connect to GND 3 GND Ground pin 4 VDD Supply pin 5 GND Connect to GND 6 SDA Interface serial data pin (input/output), open-drain Datasheet 5 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Functional description 1.3 Definition of magnetic field A positive field is considered as south-pole facing the corresponding Hall element. Figure 3 shows the definition of the magnetic directions X, Y, Z of the TLE493D-P2B6. Figure 3 Definition of magnetic field direction 1.4 Sensitive area The magnetic sensitive area for the Hall measurement is shown in Figure 4. Figure 4 Datasheet Center of sensitive area (dimensions in mm) 6 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Functional description 1.5 Application circuit The use of an interrupt line is optional, but highly recommended to ensure proper and efficient readout of the sensor data. The pull-up resistor values of the I2C bus have to be calculated in such a way as to fulfill the rise and fall time specification of the interface for the given worst case parasitic (capacitive) load of the actual application setup. Please note: Too small resistive R1/2 values have to be prevented to avoid unnecessary power consumption during interface transmissions, especially for low-power applications. VDD R2 R1 VDD TLE493D CBuf C1 VDD µC RSCL SCL GND GND RSDA SDA Power Supply (/INT) GND R1 = 1.2kΩ R2 = 1.2kΩ C1 = 100nF Optional (recommended for wire harness ): RSDA, RSCL SDA, SCL capacitance < 200 pF each, including all stray capacitances Figure 5 Application circuit with external power supply and µC For additional EMC precaution in harsh environments, C1 may be implemented by two 100 nF capacitors in parallel, which should be already given by CBuf near the µC and/or power supply. Datasheet 7 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification 2 Specification This sensor is intended to be used in an automotive environment. This chapter describes the environmental conditions required by the device (magnetic, thermal and electrical). 2.1 Absolute maximum ratings Stresses above those listed under “Absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Furthermore, only single error cases are assumed. More than one stress/error case may also damage the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions the voltage on VDD pin with respect to ground (GND) must not exceed the values defined by the absolute maximum ratings. Table 2 Absolute maximum ratings Parameter Symbol Values Unit Min. Typ. Max. Note or test condition Junction temperature Tj -40 – 125 °C Voltage on VDD VDD -0.3 – 3.5 V Magnetic field Bmax – – ±1 T Voltage range on any pin to GND Vmax -0.1 – 3.5 V open-drain outputs are not current limited. Unit Note or test condition Table 3 ESD protection2) Ambient temperature TA = 25°C Parameter Symbol Values Min. ESD voltage (HBM)3) ESD voltage (CDM)4) 2 3 4 VESD Typ. Max. – – ±2.0 kV R = 1.5 kΩ, C = 100 pF – – ±0.75 kV for corner pins – – ±0.5 kV all pins Characterization of ESD is carried out on a sample basis, not subject to production test. Human body model (HBM) tests according to ANSI/ESDA/JEDEC JS-001. Charged device model (CDM), ESD susceptibility according to JEDEC JESD22-C101. Datasheet 8 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification 2.2 Operating range To achieve ultra low power consumption, the chip does not use a conventional, power-consuming restart procedure. The focus of the restart procedure implemented is to ensure a proper supply for the ADC operation only. So it inhibits the ADC until the sensor supply is high enough. Table 4 Operating range Parameter Symbol Values Min. Typ. Max. Unit Note or test condition Operating temperature Tj -40 – 125 °C Tj = Ta +3 K in fast mode Supply voltage VDD 2.8 3.3 3.5 V Supply voltage must be above restart level ADC restart level Vres 2.2 2.5 2.8 V Min. ADC operating level ADC restart hysteresis Vres-hys – 50 – mV Register stable level Vreg – – 2.5 V Register values are stable above this voltage level The sensor relies on a proper supply ramp defined with tPUP, VOUS and IDD-PUP, see Figure 6. The I2C reset feature of the sensor shall be used by the µC after power up. If supply monitoring is used in the system (e.g. brown-out detector etc.), it is also recommended to use the I2C reset of the sensor following events detected by this monitor. In any case, an external supply switch (either provided by a system-basis-chip solution which includes a supply-enable feature, a Bias-resistor-transistor device, a capable µC GPIO pin, etc.) shall allow a power-cycle of the sensor as backup for high availability applications to cope with any form of VDD ramps (including potential EMC influences), see Figure 6. At power up, SDA and SCL shall be pulled to VDD using R1 and R2 of Figure 5 and not be driven to low by any device or µC on SDA and SCL. VDD VOUS 3.3V ≈ tPUP Figure 6 Datasheet tAPC t VDD power up and power cycle for high availability 9 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification Table 5 VDD power up and power cycle Parameter Symbol Values Unit Min. Typ. Max. Note or test condition Power up ramp time tPUP – – 10 µs Availability power cycle5) tAPC – 150 400 µs Power up over- undershoot VOUS 3 3.3 3.5 V Envelope which must not be exceeded at the end of a power up. – – 10 mA Current consumption during tPUP Power up current consumption IDD-PUP 2.3 Electrical characteristics This sensor provides different operating modes and a digital communication interface. The corresponding electrical parameters are listed in Table 6. Regarding current consumption more information are available in Chapter 2.6. Table 6 Electrical setup Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified) Parameter Symbol Values Unit Note or test condition Min. Typ. Max. IDD_pd – 7 130 nA Tj = 25°C; power down mode IDD_fm 1 3.4 5 mA Fast mode Input voltage low threshold7) VIL – – 30 %VDD All input pads Input voltage high threshold7) VIH 70 – – %VDD All input pads Input voltage hysteresis7) VIHYS 5 – – %VDD All input pads – – 0.4 V All output pads, static load Supply current 6) Output voltage low level @ 3 mA load VOL 5 6 7 Not subject to production test - verified by design. Currents at pull up resistors (Figure 5) needs to be considered for power supply dimensioning. Based on I2C standard 1995 for VDD related input levels Datasheet 10 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification 2.4 Magnetic characteristics The magnetic parameters are specified for an end of line production scenario and for an application life time scenario. The magnetic measurement values are provided in the two’s complement with 12 bit or 8 bit resolution in the registers with the symbols Bx, By and Bz. Two examples, how to calculate the magnetic flux density are shown in Table 10 and Table 11. Initial magnetic characteristics8) Table 7 Values for VDD = 3.3 V, Tj = 25°C (unless otherwise specified) Parameter Symbol Values Min. Typ. Max. Unit Note or test condition -40°C < Tj < 125°C Magnetic linear range9) (full range) Bxyz_LIN -160 – 160 mT Magnetic linear range9) (short range) Bxyz_LINSR -100 – 100 mT Sensitivity X, Y, Z (full range) Sx, Sy, Sz 6 7.7 10 Sensitivity X, Y, Z (short range) SxSR, SySR, SzSR 12 15.4 20 LSB12/ mT Z-Offset (full range and short range) B0z -1.8 ±0.2 1.8 mT @ 0 mT XY-Offset (full range and short range) B0xy -0.75 ±0.2 0.75 mT @ 0 mT X to Y magnetic matching10) MXY -5 ±1 5 % X/Y to Z magnetic matching10) MX/YZ -19 -4 11 % Magnetic initial noise (rms) (full range and short range) Bineff – 0.1 0.4 mT rms = 1 sigma Magnetic hysteresis9) (full range and short range) BHYS – 1 – LSB12 due to quantization effects MXY = 100 ⋅ 2 ⋅ Equation 1 Sx − Sy % Sx + Sy M X /YZ = 100 ⋅ 2 ⋅ Equation 2 8 9 10 Parameter “X to Y magnetic matching” Sx + Sy − 2 ⋅ Sz % Sx + Sy + 2 ⋅ Sz Parameter “X/Y to Z magnetic matching” Magnetic test on wafer level. It is assumed that initial variations are stored and compensated in the external µC during module test and calibration. Not subject to production test - verified by design/characterization. See the magnetic matching definition in Equation 1 and Equation 2. Datasheet 11 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification Table 8 Sensor drifts11) valid for both full range and short range (unless indicated) Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C, static magnetic field within full magnetic linear range (unless otherwise specified) Parameter Symbol Values Min. Unit Note or test condition Typ. Max. Sensitivity drift X, Y, Z SxD, SyD, SzD -15 ±5 15 % TC0 Offset drift X, Y BO_DXY -0.45 – 0.45 mT @ 0 mT, TC0 Offset drift Z BO_DZ -1.6 – 1.6 mT @ 0 mT, TC0 Offset drift Z BO_DZ -0.45 – 0.45 mT @ 0 mT, TC0, Z Hall spin test X to Y magnetic matching drift12) MXY_D -1.9 ±0.5 1.9 % TC0 -12 ±5 12 % TC0 X/Y to Z magnetic matching drift12) MX/YZ_D Table 9 Temperature compensation, non-linearity and noise13) Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified) Parameter Symbol Values Unit Note or test condition Min. Typ. Max. TC0 – ±0 – TC1 – -750 – Bx, By and Bz (option 1) TC2 – -1500 – Bx, By and Bz (option 2) TC3 – +350 – Bx, By and Bz (option 3) Differential non linearity (full range) DNL – ±2 – Differential non linearity (short range) DNLSR – ±4 – Integral non linearity (full range) INL – ±2 – Integral non linearity (short range) INLSR – ±4 – Magnetic noise (rms) BNeff – – Z-magnetic noise (rms) BNeffZ – XY-magnetic noise (rms) BNeffXY – Temperature compensation14) (full range and short range) 11 12 13 14 ppm/K Bx, By and Bz (default) LSB12 Bx, By and Bz LSB12 Bx, By and Bz 1 mT rms = 1 sigma – 0.5 mT – 0.25 mT rms = 1 sigma, -40°C < Tj < 85°C Not subject to production test, verified by design/characterization. Drifts are changes from the initial characteristics Table 7 due to external influences. See the magnetic matching definition in Equation 1 and Equation 2. Not subject to production test, verified by design/characterization. TCX must be set before magnetic flux trimming and measurements with the same value. Datasheet 12 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification Conversion register value to magnetic field value: Table 10 [Dec] Magnetic conversion table for 12 bit MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB -2048 1024 512 256 128 64 32 16 8 4 2 1 1 1 1 0 0 0 0 1 1 1 1 [Bin] e.g. 1 The conversion is realized by the two’s complement. Please use following table for transformation: Example for 12-bit read out: 1111 0000 1111B: -2048 + 1024 + 512 + 256 + 0 + 0 + 0 + 0 + 8 + 4 + 2 +1 = -241 LSB12 Calculation of magnetic flux density: -241 LSB12 x 0.13 mT/LSB12 = -31.3 mT Table 11 Magnetic conversion table for 8 bit MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 LSB [Dec] -128 64 32 16 8 4 2 1 [Bin] e.g. 0 0 1 1 1 1 0 1 Example for 8-bit read out: 0011 1101B: 0 + 0 +32 + 16 + 8 + 4 + 0 + 1 = 61 LSB8 Calculation of magnetic flux density (full range): 61 LSB8 x 16 / 7.7 LSB8/mT = 127 mT 2.5 Temperature measurement By default, the temperature measurement is activated. The temperature measurement can be disabled if it is not needed and to increase the speed of repetition of the magnetic values. Temperature measurement characteristics15) Table 12 Parameter Symbol Values Unit Min. Typ. Max. Note or test condition Digital value @ 25°C T25 1000 1180 1360 LSB12 Temperature resolution, 12 bit TRes12 0.21 0.24 0.27 K/LSB12 referring to Tj Temperature resolution, 8 bit TRes8 – 3.84 – K/LSB8 referring to Tj Table 13 Temperature conversion table for 12 bit The bits MSB to Bit2 are read out from the temperature value registers. Bit1 and LSB are added to get a 12-bit value for calculation. MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 [Dec] -2048 1024 512 256 128 64 32 16 8 4 [Bin] e.g. 0 1 0 1 0 0 1 0 1 1 Example for 12-bit calculation: 0110 1010 11B: 0 + 1024 + 0 + 256 + 0 + 0 + 32 + 0 + 8 + 4 = 1324 LSB12 Calculation to temperature: (1324 LSB12 - 1180 LSB12) x 0.24 K/LSB12 + 25°C ≈ 60°C 15 The temperature measurement is not trimmed on the sensor. An external μC can measure the sensor during module production and implement external trimming to gain higher accuracies. Temperature values are based on 12 bit resolution. Please note: only bit 11 ... 2 are listed in the bitmap registers. Datasheet 13 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification 2.6 Overview of modes For a good adaptation on application requirements this sensor is equipped with different modes. An overview is listed in Table 14. Table 14 Overview of modes16) Mode Measurements Typ. fUpdate17) Description Power down No measurements – Lowest possible supply current IDD 0.05 Hz - 770 Hz (8 steps) Cyclic measurements and ADCconversions with different update rates Bx, By, Bz, T 5.8 kHz Bx, By, Bz 7.8 kHz Bx, By 11.6 kHz Measurements and ADC conversions are running continuously. An I2C clock speed up to 1 MHz and use of the interrupt /INT is required. Bx, By, Bz, T 4.5 kHz Bx, By, Bz 5.6 kHz Bx, By 8.5 kHz Low power mode Bx, By, Bz, T (full range and short range) Bx, By, Bz Bx, By Fast mode (full range) Fast mode (short range) Master controlled mode Bx, By, Bz, T (full range and short range) Bx, By, Bz Up to fast mode values Measurements triggered by the microcontroller via I2C Bx, By Typical IDD current consumption estimation formula (e.g. full range and all channels): I DD ≈ I DD_fm ⋅ fUpdate ⋅ tBx + tBy + tBz + tTemp Equation 3 16 17 IDD estimation formula Not subject to production test - verified by design/characterization. This is the frequency at which specified measurements are updated. Datasheet 14 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification 2.7 Interface and timing description This chapter refers to how to set the boundary conditions in order to establish a proper interface communication. Table 15 Interface and timing18) Parameter Symbol Values Unit Min. Typ. Max. Note or test condition Bx, By and Bz conversion time (full range) tBx, tBy, tBz 32 43 54 μs Bx, By and Bz conversion time (short range) tBx_SR, tBy_SR, tBz_SR 44 59 74 μs Temp conversion time (all ranges) tTemp 32 43 54 μs /INT pulse width tINT 1.8 2.5 3.2 μs /INT delay tINT_d 1.8 2.5 3.2 μs Allowed I2C bit clock frequency19) fI2C_clk – 400 1000 kHz Low period of SCL clock tL 0.5 – – μs 1.3 μs for 400-kHz mode High period of SCL clock tH 0.4 – – μs 0.6 μs for 400-kHz mode SDA fall to SCL fall hold time (hold time start condition to clock) tSTA 0.4 – – μs 0.6 μs for 400-kHz mode SCL rise to SDA rise setup time (setup time clock to stop condition) tSTOP 0.4 – – μs 0.6 μs for 400-kHz mode SDA rise to SDA fall hold time (wait time from stop to start cond.) tWAIT 0.4 – – μs 0.6 μs for 400-kHz mode SDA setup before SCL rising tSU 0.1 – – μs SDA hold after SCL falling tHOLD 0 – – μs Fall time SDA/SCL signal20) tFALL – 0.25 0.3 µs Rise time SDA/SCL signal20) tRISE – 0.5 – µs I2C timings R = 1.2 kΩ The fast mode, shown in Figure 7, requires a very strict I2C behavior synchronized with the sensor conversions and high bit rates. In this mode, a fresh measurement cycle is started immediately after the previous cycle was completed. Other modes are available for more relaxed timing and also for a synchronous microcontroller operation of sensor conversions. In these modes, a fresh measurement cycle is only started if it is triggered by an internal or external trigger source. 18 19 20 Not subject to production test - verified by design/characterization Dependent on R-C-combination on SDA and SCL. Ensure reduced capacitive load for speeds above 400 kHz. Dependent on used R-C-combination. Datasheet 15 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Specification In the default measurement configuration (Bx, By, Bz and T), shown in Figure 7, the measurement cycle ends after the temperature measurement. In 3-channel measurement configuration (Bx, By and Bz), the temperature channel is not converted and updated. Thus, the measurement cycle ends after the Bz measurement. In X/Y angular measurement configuration (Bx and By), the Bz and temperature channel are not converted and updated. Thus, the measurement cycle ends after the By measurement. SCL falling edge @ ACK bit reads X[n-1] SCL falling edge SCL falling edge SCL falling edge @ ACK bit @ ACK bit @ ACK bit reads Y[n-1] reads Z[n-1] reads T[n-1] *) setup/hold time for i2c readout to register value. time must be either: or: status output starts with odd parity bit of last 6 bytes transmitted 1 tS/H ≥ f i2c_clk (update after read) i2c bus protocol SCL / SDA S i2c_adr transmission direction Mà S sens_reg X[n-1]MSBs Y[n-1]MSBs Z[n-1]MSBs T[n-1]MSBs Mà S Sà M Sà M Sà M Sà M Z[n-1]LSBs T[n-1]LSBs Sà M STATUS (update before read) P Sà M S i2c_adr tS/H *) Mà S tBy tBz tTemp X[n-1] Sà M tBx X[n] Y[n-1] Y[n] Z[n-1] Z value register Z[n] T[n-1] T value register Bx By T[n] Bz T Bx I2C readout frame, ADC conversion and related timing Figure 7 tRISE tFALL tH tL tSTOP t WAIT tSTA 70% VDD SCL pin 30% VDD 70% VDD SDA pin 30% VDD t HOLD t SU 1 bit transfer Datasheet Mà S tINT tINT_d 1 / update_rate (fast mode) Y value register Figure 8 sens_reg X[n-1]MSBs corresponds to 10bit addressing: two bytes following a S condition (i2c standard 1995, section 13.1) tS/H *) tBx ADC conversion chan. (fast mode) first register address is 0, trigger bits are 0 addressing options; R/W bit is 1 tS/H *) tINT tINT_d X value register X[n-1]LSBs Y[n-1]LSBs Sà M 1 tS/H ≤ - f i2c_clk tS/H *) µC can start readout after /INT is high again /INT shadowed LSBs from prev. MSBs read STOP cond . START cond . I2C timing specification 16 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Package information 3 Package information 3.1 Package parameters Table 16 Package parameters Parameter Symbol Values Min. Typ. Max. Unit Notes Thermal resistance21) Junction ambient RthJA – – 200 K/W Junction to air for PG-TSOP-6-6-8 Thermal resistance Junction lead RthJL – – 100 K/W Junction to lead for PG-TSOP-6-6-8 Soldering moisture level22) MSL 1 260°C Figure 9 Image of TLE493D-P2B6 in TSOP6 Figure 10 Footprint PG-TSOP6-6-8 (compatible to PG-TSOP6-6-5, all dimensions in mm) 21 22 According to Jedec JESD51-7 Suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020D.1 (March 2008) Datasheet 17 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Package information 3.2 Package outlines Figure 11 Package outlines (all dimensions in mm) Datasheet 18 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Package information Figure 12 Packing (all dimensions in mm) Further information about the package can be found here: http://www.infineon.com/cms/en/product/packages/PG-TSOP6/PG-TSOP6-6-8/ Datasheet 19 1.0 2021-01-12 TLE493D-P2B6 High Accuracy Low Power 3D Hall Sensor with I2C Interface Revision history Revision history Document version Date of release Description of changes V1.0 2021-01-12 Initial release Datasheet 20 1.0 2021-01-12 Trademarks All referenced product or service names and trademarks are the property of their respective owners. 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