TLE5011

March 2011 TLE5011 GMR Angle Sensor Final Data Sheet V2.0 Sensors Edition 2011-03 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. TLE5011 Revision History: 2011-03, V2.0 Previous Revision: V1.0 Page Subjects (major changes since last revision) 6 Ordering code updated 7 Section 1.2 updated 14 Table 3, supply voltage and magnetic induction expanded; figure 7 added 15 Table 4; notes of supply current expanded 16 Table 5; table 6 added 17 Table 7, ESD expanded 21 Table 10, Notes updated 27 Table 14, register 0x0D updated 42 Package outline in figure 23 modified 43 Figure 24 added general Spelling and typing errors We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continously improve the quality of this document. Please send your proposal (including a reference to this document) to: sensors@infineon.com Final Data Sheet 3 V2.0, 2011-03 TLE5011 Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1 1.1 1.2 1.3 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 2.2 2.3 2.4 2.5 2.5.1 2.5.2 2.5.3 2.5.4 2.5.5 2.5.6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Internal Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 GMR Voltage Regulator VRG (VDDG-Voltage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Analog Voltage Regulator VRA (VDDA-Voltage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Digital Voltage Regulator VRD (VDDD-Voltage) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Phase-Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Safety Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 3.1 3.2 3.3 3.4 3.4.1 3.4.2 3.4.3 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GMR Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Offset and Amplitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Offset Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Amplitude Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature-dependent behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Orthogonality Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GMR Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Calibration Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Angle Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Components of the Output Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GMR Error Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature-dependent Offset Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Offset Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Amplitude Normalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-Orthogonality Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Resulting Angle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GMR Parameters after Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Supply (CLK Timing Definition) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Synchronous Serial Communication Interface (SSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Timing Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 3.6 3.6.1 3.6.2 3.6.3 3.7 3.8 3.9 3.9.1 Final Data Sheet 4 6 6 7 7 13 13 13 14 15 15 17 17 17 18 18 18 18 19 19 19 19 19 19 19 19 20 20 20 20 21 21 22 22 23 23 V2.0, 2011-03 TLE5011 Table of Contents 3.9.2 3.9.3 3.9.4 3.9.5 3.9.6 3.9.7 3.9.8 3.10 3.10.1 3.10.2 3.10.3 3.11 3.11.1 3.11.2 3.11.3 3.11.4 4 4.1 SSC Baud rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Spike Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Spike Filter Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Spike Filter On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Filter for DATA and CS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Command Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Register Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bit Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reserved Registers (08H to 0BH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Communication via SSC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CRC Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Slave-active Byte Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Example1: CRC calculation (Update X and Y and set ADC-Test Mode) . . . . . . . . . . . . . . . . . . . Example2: Use of two TLE5011 units in a bus mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Test Structures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Angle Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ADC Test Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Angle Test and Temperature Measurement Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overvoltage Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal Supply Voltage Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD Overvoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND-off Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD - off Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 25 25 25 26 26 26 27 27 30 33 34 34 35 36 37 37 38 38 39 40 40 40 40 41 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline PG-DSO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Footprint PG-DSO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 42 42 43 43 44 44 Final Data Sheet 5 V2.0, 2011-03 GMR Angle Sensor 1 1.1 TLE5011 Product Description Overview The TLE5011 is a 360° angle sensor that detects the orientation of a magnetic field by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance (iGMR) elements. Data communications are accomplished with a bi-directional Synchronous Serial Communication (SSC) interface that is SPI compatible. The sine and cosine values can be read out digitally. These signals can be digitally processed to calculate the angle orientation of the magnetic field (magnet). This calculation can be done by using a COordinate Rotation DIgital Computer (CORDIC) algorithm. It is possible to connect more than one TLE5011 to one SSC interface of a microcontroller for redundancy or any other reason. If multiple TLE5011 devices are used, the synchronization of the connected TLE5011 is performed by a broadcast command. Each connected TLE5011 can be addressed by a dedicated Chip Select CS pin. Type Marking Ordering Code Package TLE5011 5011 SP000857850 PG-DSO-8 Final Data Sheet 6 V2.0, 2011-03 TLE5011 Product Description 1.2 • • • • • • • • • • • • • • • • • Features Giant Magneto Resistance (GMR)-based principle Integrated magnetic field sensing for angle measurement Designed for 3.3 V and 5 V systems Full 0 - 360° angle measurement Highly accurate single-bit SD-ADC 16-bit representation of sine / cosine values on the interface Wide magnetic operating range: 30mT to 50mT Bi-directional SSC interface up to 2 Mbit/s 3-pin SSC interface, SPI compatible with open drain ADCs and filters synchronized with external commands via SSC Test resistors for simulating angle values Core supply voltage 2.5 V 0.25-µm CMOS technology Automotive qualified: -40°C to +150°C (junction temperature) Latch-up immunity according JEDEC standard ESD > 4 kV (HBM) Green package with lead-free (Pb-free) plating 1.3 Application Example The TLE5011 GMR angle sensor is designed for angular position sensing in automotive applications, such as: • • • • Steering angle Brushless DC motor commutation (e.g. Electric Power Steering (EPS)) Rotary switch General angular sensing Final Data Sheet 7 V2.0, 2011-03 TLE5011 Functional Description 2 Functional Description 2.1 General The GMR angle sensor is implemented in vertical integration. This means that the GMR active areas are integrated above the logic portion of the TLE5011 device. GMR elements change their resistance depending on the direction of the magnetic field. Four individual GMR elements are connected to one Wheatstone sensor bridge. These GMR elements sense either of two components of the applied magnetic field: • • X component, VX (cosine) Y component, VY (sine) The advantage of a full-bridge structure is that the amplitude of the GMR signal is doubled. GMR Resistors S 0° VX VY N ADCX+ ADCX - GND ADCY + ADCY- VDDG 90° Figure 1 Sensitive Bridges of the GMR Angle Sensor Note: In Figure 1, the arrows in the resistor symbols denote the direction of the reference layer, which is used for the further explanation (Figure 2). The output signal of each bridge is only unambiguous over 180° between two maxima. Therefore two bridges are orientated orthogonally to each other to measure the 360° angle range. Using the ARCTAN function, the true 360° angle value can be calculated that is represented by the relation of the cosine (here X) and sine (here Y) signals. Because only the relative values influence the result, the absolute size of the two signals is of minor importance. Therefore, most influences on the amplitudes are compensated. Final Data Sheet 8 V2.0, 2011-03 TLE5011 Functional Description Y Component (SIN) VY X Component (COS) VX V VX (COS) 90° 0° 180° 270° 360° Angle α VY (SIN) Figure 2 Ideal Output of the GMR Angle Sensor 2.2 Pin Configuration Figure 3 2.3 Table 1 8 7 6 5 1 2 3 4 Center of Sensitive Area Pin Configuration (Top View) Pin Description Pin Describtion Pin No. Symbol In/Out Function 1 CLK I Chip Clock 2 SCK I SSC Clock 3 CS I SSC Chip Select 4 DATA I/O SSC Data, open drain 5 TST1 I/O Test Pin 1, must be connected to GND 6 VDD - Supply Voltage 7 GND - Ground 8 TST2 I/O Test Pin 2, must be connected to GND Final Data Sheet 9 V2.0, 2011-03 TLE5011 Functional Description 2.4 Block Diagram The block diagram shows all switches in the reset position. GND VDD GND-off Comp TST 1 VDD_max VDD_OV Comp VDD-off Comp CLK SCK SCK VRG VRG_OV VRG_Rst VRA VRA_OV VRA_Rst VRD VRD_OV SSC VRD_Rst DATA CS Angle Voltage GMR X Temperature Sensor VDDG A D 2 1 GND Comb Filter 16 FSYNC FIR Filter 16 XH XL Control FSM FCNT VDDG A D 2 GND 1 Comb 16 Filter FIR 16 Filter YH YL Angle Voltage GMR Y Analog Clock Digital Clock 2 VRG_Rst VRA_Rst VRD_Rst differential TLE5011 Reset PLL CLK Lock Digital Reset TST1 Figure 4 TST 2 Block Diagram Final Data Sheet 10 V2.0, 2011-03 TLE5011 Functional Description 2.5 Functional Block Description 2.5.1 Internal Power Supply The internal stages of the TLE5011 are supplied with different voltage regulators: • • • GMR Voltage Regulator VRG Analog Voltage Regulator VRA Digital Voltage Regulator VRD Each voltage regulator has its own overvoltage and undervoltage detection circuits. 2.5.2 GMR Voltage Regulator VRG (VDDG-Voltage) The GMR voltage regulator supplies all GMR parts: • • • GMR bridges Test voltages for angle test ADC reference voltage The voltages are monitored in the VRG overvoltage and undervoltage detectors. 2.5.3 Analog Voltage Regulator VRA (VDDA-Voltage) The analog voltage regulator supplies the analog parts: • • • • • ADCs PLL (analog) VDD-off comparator GND-off comparator VDD Overvoltage detection The voltages are monitored in the VRA overvoltage and undervoltage detectors. 2.5.4 Digital Voltage Regulator VRD (VDDD-Voltage) The digital voltage regulator supplies all digital parts: • • • • • Comb filters, FIR filters PLL (digital) Control FSM with bitmap SSC interface Counters (Reset, FSYNC, FCNT) The voltages are monitored in the VRD overvoltage and undervoltage detectors. 2.5.5 Phase-Locked Loop (PLL) The clock for the sensors is provided externally. This ensures synchronous operation in case of multiple system participants. The sensor has its own PLL to generate the necessary clock frequency for the chip operation. Final Data Sheet 11 V2.0, 2011-03 TLE5011 Functional Description 2.5.6 Safety Features The TLE5011 has a multiplicity on safety features to support Safety Integrity Level (SIL). Sensors meeting this performance standard are identified by Infineon with the following logo: Figure 5 PRO SIL Logo Safety features are: • • • • • • • • • Angle test (generated via test voltages feeding the ADC). Crossed signal paths (switchable for comparison) Invertable ADC bitstreams Overvoltage and undervoltage detection of internal and external voltages VDD-off and GND-off to detect supply malfunctions Frame counter and synchronisation counter Separate bandgap-reference voltages for regulators and comparators CRC-protected SSC protocol Locked configuration registers Disclaimer PRO-SIL™ is a Registered Trademark of Infineon Technologies AG The PRO-SIL™ Trademark designates Infineon products which contain SIL Supporting Features. SIL Supporting Features are intended to support the overall System Design to reach the desired SIL (according to IEC61508) or A-SIL (according to ISO26262) level for the Safety System with high efficiency. SIL respectively A-SIL certification for such a System has to be reached on system level by the System Responsible at an accredited Certification Authority. SIL stands for Safety Integrity Level (according to IEC 61508) A-SIL stands for Automotive-Safety Integrity Level (according to ISO 26262) Final Data Sheet 12 V2.0, 2011-03 TLE5011 Specification 3 Specification 3.1 Application Circuit The application circuit shows the microcontroller version with open-drain capabilities. 12V Voltage Regulator VDD SSC CLK each 100 R 1k VDD 100 R DATA_o CAN RX CAN TX CAN Tranceiver CAN µController Master GMR-Sensor TLE5011 DATA_i SCK 100 nF GND CSQ GND Figure 6 Application Circuit A complete system may consist of one TLE5011 and a microcontroller. The second TLE5011 may be used for redundancy to increase system reliability. The microcontroller should contain a CORDIC coprocessor for fast angle calculations, and flash memory for the calibration data storage. 3.2 Absolute Maximum Ratings Table 2 Absolute Maximum Rating Parameters Parameter Symbol Limit Values min. Unit Notes max. Voltage on VDD pin with respect VDD to ground (VSS) -0.5 6.5 V max 40 h / lifetime Voltage on any pin with respect to ground (VSS) VIN -0.5 6.5 V VDD + 0.5 V may not be exceeded Junction temperature TJ -40 150 °C 150 °C for 1000 h not additive - |125| mT max 5 min. @ TA = 25°C - |100| max 5 h @ TA = 25°C - |70| max 1000 h @ TA = 85°C not additive - |60| max 1000 h @ TA = 100°C not additive -40 150 Magnetic field induction Storage temperature B TST °C without magnetic field Note: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Final Data Sheet 13 V2.0, 2011-03 TLE5011 Specification 3.3 Operating Range To ensure correct operation of the TLE5011, the operating conditions identified in Table 3 must not be exceeded. All parameters specified in the following sections refer to these operating conditions, unless otherwise indicated. Table 3 is valid for -40°C < TJ < 150°C Table 3 Operating Range Parameter Symbol Limit Values min. typ. max. Unit Notes Supply Voltage VDD 3.0 - 5.5 V For 3.3 & 5.0V systems1) Output Current IQ - -5 -10 mA 2) 3) Input Voltage VIN -0.3 - 5.5 V VDD + 0.35 V may not be exceeded Magnetic Induction at TA= 25°C 4) 5) BXY 30 - 50 mT -40°C < TJ VVDDoff or (VSCK - VDD) > VVDDoff . VDDA - VDD 1µs Mono Flop VVDDoff CLK SCK -dV GND Figure 22 + 10µs Spike Filter VDD _OFF GND VDD - off Comparator Final Data Sheet 41 V2.0, 2011-03 TLE5011 Package Information 4 Package Information 4.1 Package Parameters Table 21 Package Parameters Parameter Symbol Thermal Resistance Limit Values Unit Notes min. typ. max. RthJA - 150 200 K/W Junction to air 1) RthJC - - 75 K/W Junction to case RthJL - - 85 K/W Junction to lead Soldering Moisture Level Lead frame MSL 3 260°C Cu Plating Sn 100% > 7 µm 1) According to Jedec JESD51-7 Package Outline PG-DSO-8 Figure 23 PG-DSO-8 Package Dimension Final Data Sheet 42 V2.0, 2011-03 TLE5011 Package Information Figure 24 Position of Sensing Element 1.31 Footprint PG-DSO-8 5.69 0.65 1.27 Figure 25 Footprint PG-DSO-8 Packing 0.3 5.2 12 ±0.3 8 1.75 6.4 2.1 Figure 26 Tape and Reel Final Data Sheet 43 V2.0, 2011-03 TLE5011 Package Information Marking Position Marking Description 1st Line 5011xx See ordering table on page 6 2nd Line xxx Lot code 3rd Line Gxxxx G .. green, 4-digit .. date code Processing Note: For processing recommendations, please refer to Infineon’s Notes on Processing Final Data Sheet 44 V2.0, 2011-03 www.infineon.com Published by Infineon Technologies AG