TLE5014SP16E0001XUMA1

TLE5014SP16 E0001 GMR-based Ang le Sensor Features • Fast SSC interface up to 8MHz • Giant Magneto Resistance (GMR)-based principle • Integrated magnetic field sensing for angle measurement • 360° angle measurement • EEPROM for storage of configuration (e.g. zero angle) and customer specific ID • 15 bit representation of absolute angle value on the output • Max. 1° angle error over lifetime and temperature range • 32 point look-up table to correct for systematic angle errors (e.g. magnetic circuit) • 112 bit customer ID (programmable) • Automotive qualified Q100, Grade 1: -40°C to 125°C (ambient temperature) • ESD: 4 kV (HBM) on VDD and 2kV (HBM) on output pins • RoHS compliant and halogen free package Product validation Qualified for automotive applications. Product validation according to AEC-Q100. Description The TLE5014SP16 E0001 is an iGMR (integrated GMR) based angle sensor with a high speed serial interface (SSC interface). It provides high accurate angular position information for various applications. Table 1 Derivative Ordering codes Product Type Marking Ordering Code Package Comment TLE5014SP16 E0001 014SP01 SP004232096 PG-TDSO-16 SSC Interface, single die Data Sheet www.infineon.com 1 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Table of contents 1 1.1 1.2 1.3 1.4 1.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sensing Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 3.1 3.2 3.3 3.3.1 3.3.2 3.3.3 3.4 3.5 3.6 3.7 3.8 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Angle Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 EEPROM Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reset Concept and Fault Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External & Internal Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Device Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 4.1 4.1.1 4.1.2 4.2 4.2.1 4.2.2 4.2.3 Synchronous Serial Communication (SSC) interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bit Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Update of update-registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Command Word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Safety word . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cyclic Redundancy Check (CRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18 18 18 20 20 21 22 5 5.1 5.2 5.3 5.4 5.5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 23 25 26 26 27 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Data Sheet 2 3 3 3 4 6 6 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Functional Description 1 Functional Description 1.1 Block Diagram PMU Clock EEPROM GMR_X ADC_X Filter SSC ISM GMR_Y ADC_Y Temp. ADC_T Filter Interface CORDIC Figure 1-1 TLE5014SP16 E0001 block diagram 1.2 Functional Block Description Internal Power Supply (PMU) The internal blocks of the TLE5014 are supplied from several voltage regulators: • • • GMR Voltage Regulator, VRS Analog Voltage Regulator, VRA Digital Voltage Regulator, VRD These regulators are directly connected to the supply voltage VDD. Oscillator and PLL (Clock) The digital clock of the TLE5014 is given by the Phase-Locked Loop (PLL), which is fed by an internal oscillator. SD-ADC The Sigma-Delta Analog-Digital-Converters (SD-ADC) transform the analog GMR voltages and temperature voltage into the digital domain. Digital Signal Processing Unit ISM The Digital Signal Processing Unit ISM contains the: • • Intelligent State Machine (ISM), which does error compensation of offset, offset temperature drift, amplitude synchronicity and orthogonality of the raw signals from the GMR bridges. COordinate Rotation DIgital Computer (CORDIC), which contains the trigonometric function for angle calculation Data Sheet 3 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Functional Description Interface The Interface block is used to generate the SSC signals EEPROM The EEPROM contains the configuration and calibration parameters. A part of the EEPROM can be accessed by the customer for application specific configuration of the device. Programming of the EEPROM is achieved with the SSC interface. Programming mode can be accessed directly after power-up of the IC. 1.3 Sensing Principle The Giant Magneto Resistance (GMR) sensor is implemented using vertical integration. This means that the GMR-sensitive areas are integrated above the logic part of the TLE5014 device. These GMR elements change their resistance depending on the direction of the magnetic field. Four individual GMR elements are connected to one Wheatstone sensor bridge. These GMR elements sense one of two components of the applied magnetic field: • X component, Vx (cosine) or the • Y component, Vy (sine) With this full-bridge structure the maximum GMR signal is available and temperature effects cancel out each other. 16 15 14 13 12 11 10 Reference Direction: Resistance low when external magnetic field is in this direction 9 Y 0° X 1 2 3 4 5 6 7 8 Figure 1-2 Sensitive bridges of the GMR sensor (not to scale) In Figure 1-2 the arrows in the resistors represent the magnetic direction which is fixed in the reference layer. If the external magnetic field is parallel to the direction of the Reference Layer, the resistance is minimal. If they are anti-parallel, resistance is maximal. The output signal of each bridge is only unambiguous over 180° between two maxima. Therefore two bridges are oriented orthogonally to each other to measure 360°. Data Sheet 4 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Functional Description With the trigonometric function ARCTAN2, the true 360° angle value is calculated out of the raw X and Y signals from the sensor bridges. Data Sheet 5 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Functional Description 1.4 Pin Configuration 16 15 14 13 12 11 10 9 Center of Sensitive area 1 2 3 4 5 6 7 8 Figure 1-3 Pin configuration (top view) 1.5 Pin Description The following Table 1-1 describes the pin-out of the chip. Table 1-1 Pin description TLE5014SP16 Pin Symbol In/Out Function 1 IF1 I/O DATA (MOSI/MISO) 2 IF2 I SCK (SSC clock) 3 IF3 I CSQ (chip select) 4 VDD – Supply voltage, positive 5 GND – Supply voltage, ground 6 IFA – Connect to GND 7 IFB – Connect via pull-up to VDD 8 IFC – Keep open 9-16 - – n.c. Data Sheet 6 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Application Circuits 2 Application Circuits The application circuit in this chapter shows the communication possibilities of the TLE5014SP16 E0001. To improve robustness against electro-magnetic disturbances, a capacitor of 100nF on the supply is recommended. This capacitor shall be placed as close as possible to the corresponding sensor pins. The load capacitor CL shall not exeed the specified value (Table 3-5). The DATA line is actively driven to HIGH and LOW but the driver is switched off once reaching the HIGH state. Therefore, a pull-up resistor is recommended to maintain a stable HIGH level. In case of a high speed communication, an additional serial resistor in the range of 140Ω can be implemented in the DATA, SCK and CSQ line to avoid reflections and enhance communication reliability. In this case the user is responsible to verify that the intended communication speed can be reached in his specific setup. VµC VDD TLE501 4 VDD RPU 50k IF1 MOSI/MISO CL IF2 CD 100nF VDD SCK VDD GND GND IF3 IFA CSQ RP1 2.2k µControlle r Master IFB IFC GND Figure 2-1 Application circuit for TLE5014SP16 E0001 with SSC interface, microcontroller switches pin between MISO and MOSI Data Sheet 7 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 3 Specification 3.1 Absolute Maximum Ratings Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. Table 3-1 Maximum Ratings for Voltages and Output Current Parameter Symbol Values Min. Absolute maximum supply voltage VDD Voltage Peaks VDD Typ. -18 Unit Note / Test Condition 26 V for 40h, no damage of device; -18V means VDD < GND 30 V for 50µs, no current limitation Max. Absolute maximum voltage VIF for pin IF1, IF2, IF3 -0.3 6 V no damage of device Absolute maximum voltage VIO for pin IFB -18 19.5 V for 40h; no damage of device, -18V means VDD < GND 30 V for 50µs, no current limitation Unit Note / Test Condition 125 °C Q100, Grade 1 Maximum allowed magnetic B field 200 mT max 5 min @ TA = 25°C Maximum allowed magnetic B field 150 mT max 5 h @ TA = 25°C 40 °C for dry packed devices, Relative humidity < 90%, storage time < 3a Voltage Peaks (for pin IFB) Table 3-2 VIO Maximum Temperature and Magnetic Field Parameter Symbol Values Min. Maximum ambient temperature Storage & Shipment1) 2) TA Tstorage Typ. -40 5 Max. 1) Air-conditioning of ware houses, distribution centres etc. is not necessary, if the combination of the specified limits of 75% R.H. and 40 °C will not be exceeded during storage for more than 10 events per year, irrespective of the duration per event, and one of the specified limits (75 % R.H. or 40 °C) will not be exceeded for longer than 30 days per year 2) See Infineon Application Note: “Storage of Products Supplied by Infineon Technologies” Table 3-3 Mission Profile Parameter Symbol Values Min. Mission Profile Data Sheet Typ. TA,max Note / Test Condition °C for 2000h Max. 125 8 Unit Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification Table 3-4 Lifetime & Ignition Cycles Parameter Symbol Values Min. Typ. Unit Note / Test Condition Max. Operating life time top_life 15.000 h see Table 3-3 for mission profile Total life time ttot_life 19 a additional 2a storage time1) Ignition cycles Nignition 200.000 during operating lifetime top_life 1) The lifetime shall be considered as an anticipation with regard to the product that shall not extend the warranty period The device qualification is done according to AEC Q100 Grade 1 for ambient temperature range -40°C < TA < 125°C 3.2 Operating Range The following operating conditions must not be exceeded in order to ensure correct operation of the angle sensor. All parameters specified in the following sections refer to these operating conditions, unless otherwise noted. Table 3-5 is valid for -40°C < TA < 125°C unless otherwise noted. Table 3-5 Operating Range Parameter Symbol Values Min. Operating supply voltage VDD Typ. Unit Note / Test Condition V - V/s - Max. 3.0 5.5 8 Supply Voltage Slew Rate VDD_slew 0.1 10 Operating ambient temperature TA -40 125 °C - Angle speed n 30000 rpm - Capacitive output load on SSC interface (DATA pin) CL 50 pF – – Magnetic Field Range The operating range of the magnetic field describes the field values where the performance of the sensor, especially the accuracy, is as specified in Table 3-11 and Table 3-12. This value is valid for a NdFeB magnet with a Tc of -1300ppm/K. In case a different magnet is used, the individual Tc of this magnet has to be considered and ensured that the limits are not exceeded. The allowed magnetic field range is given in Figure 3-1. Table 3-6 Magnetic Field Range Parameter Symbol Values Min. Angle measurement field range @ 25°C B Typ. 25 Unit Note / Test Condition mT TA = 25°C, valid for NdFeB magnet Max. 80 The below figure Figure 3-1 shows the magnetic field range which shall not be exceeded during operation at the respective ambient temperature. The temperature dependency of the magnetic field is based on a NdFeB magnet with Tc = -1300ppm/K. Data Sheet 9 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 100 90 magnetic field (mT) 80 70 60 50 40 30 20 -50 -30 -10 10 30 50 70 Temperature (°C) 90 110 130 150 Figure 3-1 Allowed magnetic field range within operating ambient temperature range. It is also possible to widen the magnetic field range for higher temperatures. In that case, additional angle errors have to be considered. Data Sheet 10 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 3.3 Electrical Characteristics 3.3.1 Input/Output Characteristics The indicated parameters apply to the full operating range, unless otherwise specified. The typical values correspond to a supply voltage VDD = 5.0V and an ambient temperature TA = 25°C, unless individually specified. All other values correspond to -40°C < TA < 125°C. Table 3-7 Electrical Characteristics Parameter Symbol Values Min. Operating Supply Current IDD Unit Note / Test Condition - Typ. Max. 12 15 mA 7 ms Time between supply voltage tPon reaches reset value and valid angle value is available on the output (without interface delay – 6.5 7.0 V In an overvoltage condition the output switches to tristate Undervoltage detection on VDD VUV 2.3 2.5 2.7 V In an undervoltage condition the sensor performs a reset Internal clock tolerance -5 5 % including temperature and lifetime Overvoltage detection on VDD VOV Δfclock The following Figure 3-2 shows the operating area of the device, the condition for overvoltage and undervoltage and the corresponding sensor reaction. The values for the over- and undervoltage comparators are the typical values from Table 3-7. In the extended range, the sensor fulfills the full specification. However, voltages above the operating range can only be applied for a limited time (see Table 3-1). Data Sheet 11 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification V_out No output 8.0 Sensor reset No output 7.0 2.5 Extended range Extended range 5.7 Operating range No output VDD 3.0 5.5 6.5 Figure 3-2 Operating area and sensor reaction for over- and undervoltage. Table 3-8 Output driver Parameter Symbol Values Min. Output low level1) 1) Output high level Typ. Note / Test Condition Max. VOL VOH Unit 0.3*VDD 0.7*VDD 1) In case several sensors are connected in a bus mode, the output levels may be influenced and out of specification in case a malfunction of one of the sensors on the bus occurs (e.g. one sensors has loss of VDD). VOUT VDD VOH VOL t Figure 3-3 Output level high / low Output Delay Time and Jitter Data Sheet 12 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification Due to the internal signal sampling and signal conditioning, there will be a delay of the provided angle value at the output. The definition of this delay is described in below Figure 3-4 Table 3-9 Signal delay and delay time jitter Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. tadel Delay time between real angle and angle value available at the AVAL register 60.8 64 67.2 µs Min/max values include clock tolerance Variation of delay time tadel tdeljit +/-12.0 +/-12.8 +/-14.0 µs Min/max values include clock tolerance Angle update rate (new angle value is provided in the AVAL register) tupdate 24.3 25.6 27.0 µs Min/max values include clock tolerance The sensor calculates a new angle value every tupdate. The delay time (latency) of the angle value is determined by the time needed for the sampling of the sin/cos raw signals and angle calculation. The calculated angle is then transferred into the corresponding SSC register. This register is updated every tupdate. As the reading of the angle value with the SSC interface is asynchronous to the internal angle update rate, a jitter on the delay time of the angle value is introduced in the range of tdeljit = +/- tupdate/2. Figure 3-4 shows this relation. angle sin/cos raw values filtering α1 α2 α3 X1; Y1 angle calculation α4 X2; Y2 X3; Y3 X4; Y4 calculate α1 calculate α2 calculate α3 α1 α2 tupdate angle value register tdeljit tadel tdeljit t Figure 3-4 Definition of update rate tupdate, delay time tadel and jitter of delay time tdeljit Data Sheet 13 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 3.3.2 ESD Protection Table 3-10 ESD Voltage Parameter Symbol Values Min. Typ. Unit Note / Test Condition Max. Electro-Static-Discharge VHBM voltage (HBM), according to ANSI/ESDA/JEDEC JS-001 ±4 kV HBM contact discharge for pins VDD, GND, IFB Electro-Static-Discharge VHBM voltage (HBM), according to ANSI/ESDA/JEDEC JS-001 ±2 kV HBM contact discharge for pins IF1, IF2, IF3, IFA, IFC Electro-Static-Discharge VCDM voltage (CDM), according to JESD22-C101 ±0.5 kV for all pins except corner pins ±0.75 kV for corner pins only Data Sheet 14 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 3.3.3 Angle Performance After internal angle calculation, the sensor has a remaining error, as shown in Table 3-11 for an ambient temperature range up to 85°C and a reduced magnetic field range and in Table 3-12 for the ambient temperature range up to 125°C and full magnetic operating range. The error value refers to BZ= 0mT. The overall angle error represents the relative angle error. This error describes the deviation from the reference line after zero-angle definition. It is valid for a static magnetic field. If the magnetic field is rotating during the measurement, an additional propagation error is caused by the angle delay time (see Table 3-9). Table 3-11 Angle Error for -40°C < TA < 85°C and magnetic field range 33mT < B < 50mT Parameter Symbol Values Min. Typ. 1) Unit Note / Test Condition Max. Accuracy over temperature AErr,T w/o look-up table 0.8 ° 0h2), over temperature Accuracy1) over temperature AErr,s and lifetime, w/o look-up table 0.9 ° lifetime stress: TA=85°C/1000h/50mT Accuracy1)3) over temperature and lifetime, with look-up table AErr,sLUT 0.65 ° lifetime stress: TA=85°C/1000h/50mT with look-up table correction Hysteresis4) AHyst 0.16 ° value includes quantization error 1) 2) 3) 4) 0.1 Hysteresis and noise are included in the angle accuracy specification “0h” is the condition when the part leaves the production at Infineon Verified by characterization Hysteresis is the maximum difference of the angle value for forward and backward rotation Table 3-12 Angle Error for -40°C < TA < 125°C Parameter Symbol Values Min. Typ. 1) Unit Note / Test Condition Max. Accuracy over temperature AErr,T w/o look-up table 0.8 ° 0h2), over temperature B = 33mT to 80mT3) Accuracy1) over temperature AErr,s and lifetime, w/o look-up table 1.0 ° 33mT…80mT3) lifetime stress: TA=125°C/2000h Accuracy1)4) over temperature and lifetime, with look-up table AErr,sLUT 0.85 ° B = 33mT to 80mT3), lifetime stress: TA=125°C/2000h with look-up table correction Hysteresis5) AHyst 0.16 ° B = 33mT to 80mT6), value includes quantization error 1) 2) 3) 4) 5) 0.1 Hysteresis and noise are included in the angle accuracy specification “0h” is the condition when the part leaves the production at Infineon For the magnetic field range of 25mT < B < 33mT, 0.2° have to be added to the max. angle accuracy Verified by characterization Hysteresis is the maximum difference of the angle value for forward and backward rotation Data Sheet 15 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification 6) For the magnetic field range of 25mT < B < 33mT, 0.1° have to be added to the max. hysteresis AHyst 3.4 EEPROM Memory The sensor includes a non-volatile memory (NVM) where calibration data and sensor configuration data are stored. The customer has access to a part of this memory for storage of application specific data (e.g. look-up table & customer ID) The time for programming the customer relevant part of the NVM as well as maximum cycles of programming and data retention is given in Table 3-13 Table 3-13 EEPROM Parameter Symbol Values Min. Typ. Number of possible NVM programming cycles nProg NVM data retention tretention - Time for programming of whole NVM (customer relevant part) tProg 0.5 3.5 Unit Max. Note / Test Condition 100 - 21 a includes 19a lifetime and 2a storage s incl. look-up table, configuration, customer ID; with 100kbit/s Number Reset Concept and Fault Monitoring Some internal and external faults of the device can trigger a reset. During this reset, all output pins are highohmic to avoid any disturbance of other sensors which may be connected together in a bus mode. A reset is indicated as soon as the sensor is back at operational mode by a status bit. 3.6 External & Internal Faults In case of an occurrence of external or internal faults, as for example overvoltage or undervoltage, the sensor reacts in a way that these faults are indicated to the customer. All errors are indicated as long as they persist, but at least once. After disappearance of the error, the error indication is also cleared. Overvoltage, undervoltage It is ensured, that the sensor provides a valid output value as long as the voltage is within the operating range or no under- or overvoltage is indicated. At occurrence of an undervoltage, the sensor performs a reset. The implemented undervoltage comparator at VDD detects an undervoltage at ~2.5V (typ. value). At occurrence of an overvoltage, the sensor output goes to tristate and no protocol is transmitted. The implemented overvoltage comparator at VDD detects an overvoltage at ~6.5V (typ. value). Open and Shorts All pins of the device withstand a short to ground (GND) and a short to VDD (as long as VDD is within the operating range). In case of an open VDD connection or an open GND the sensor provides a detectable wrong signal (e.g. no valid output protocol). It is also ensured that a short between two neighboring pins leads to a detectable wrong output signal. Data Sheet 16 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Specification Communication Failures An external fault can happen where an ongoing communication is interrupted before it is finished correctly. In such an event, no sensor malfunction or dead-lock will occur. 3.7 Power Dissipation Following table describes the calculated power dissipation for the different application cases within the operating range defined in Table 3-5. It is a worst case assumption with the maximum values within the operating range. Table 3-14 Power Dissipation Scenario Configuration VDD (V) IDD (mA) 1 SSC 3.3 2 SSC 5.5 3.8 Device Programming VOUT (V) IOUT (mA) P (mW) 15 ~0 49.5 15 ~0 82.8 It is possible to do the programming of the EEPROM with the SSC interface. The programming mode can be accessed directly after start-up of the IC by sending the appropriate command. Following parameters can be programmed and stored in the EEPROM: • • • • Zero angle (angle base) Rotation direction (clock wise or counter clock wise) Look-up table (32 points) Customer ID (112bit individual data) To align the angle output of the sensor with the application specific required zero angle direction this value can be programmed. All further output angles are in reference to this zero angle. Look-Up Table To increase the accuracy of the provided angle value, a look-up table is implemented which allows to compensate for external angle errors which may be introduced for example by the magnetic circuit. Alignment tolerances (eccentricity or tilt) may lead to a non-linearity of the output signal which can be compensated using the implemented look-up table. This look-up table has 32 equidistant points over 360° angle range with a linear interpolation between the 32 defined values Further details for programming and configuration of the device can be found in the corresponding user manual of the TLE5014. Data Sheet 17 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Synchronous Serial Communication (SSC) interface 4 Synchronous Serial Communication (SSC) interface The SSC interface is a half-duplex communication protocol. The communication is always initiated by the microcontroller by sending a command to the TLE5014SP16 E0001. The command can be either a Read access (Figure 4-3) or a Write access (Figure 4-4). According to the command, the microcontroller can either send a data word to the TLE5014SP16 E0001 (Write access) or receive data word from the TLE5014SP16 E0001 (Read access). At the end of the communication the TLE5014SP16 E0001 sends a safety word. The 3-pin SSC Interface is composed of: • DATA: Bidirectional data line. Data bits are sent synchronously with the clock line. • SCK: Unidirectional clock line. Generated by the microcontroller, TLE5014SP16 E0001 is always a slave. • CSQ: Chip select, active low. Asserted by the microcontroller to select a slave. 4.1 Data transmission The data communication via SSC interface has the following characteristic: • The SSC Interface is word-aligned. All functions are activated after each transmitted word. • The microcontroller selects a TLE5014SP16 E0001 by asserting the CSQ to low. A “high” condition on the negated Chip Select pin (CSQ) of the selected TLE5014SP16 E0001 interrupts the transfer immediately. The CRC calculator is automatically reset. • Data is put on the data line with the rising edge on SCK and read with the falling edge on SCK. Similar to a SPI configuration with CPOL=0 and CPHA=1. • After changing the data direction, a delay (twr_delay) has to be considered before continuing the data transfer. This is necessary for internal register access. • After sending the Safety Word the transfer ends. To start another data transfer, the CSQ has to be deselected once for tCSoff. • The SSC is default Push-Pull. The Push-Pull driver is only active, if the TLE5014SP16 E0001 has to send data, otherwise the Push-Pull is disabled for receiving data from the microcontroller. SSC Transfer twr_delay Command Word Data Word (s) SCK DATA MSB 14 13 12 11 10 9 8 7 6 5 4 3 2 1 LSB MSB 1 LSB CSQ RW PRTY CMD ACCESS ADDR LEN SSC -Master is driving DAT A SSC -Slave is driving DAT A Figure 4-1 SSC data transmission 4.1.1 Bit Numbering The SSC communication is using the convention: Most Significant Bit (MSB) first. Figure 4-1 shows the Command Word and the beginning of the Data Word to demonstrate the bit numbering. 4.1.2 Update of update-registers At a rising edge of CSQ without a preceding data transfert (no SCK pulse), the content of all registers which have an update buffer is saved into the buffer. The content of the update buffer can be read by sending a read Data Sheet 18 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Synchronous Serial Communication (SSC) interface command for the desired register and setting the ACCESS bits of the Command Word to 11B. This feature allows to take a snapshot of all necessary system parameters at the same time. Update -Signal Command Word Data Word (s) Update -Event SCK MSB DATA LSB LSB CSQ tCSupdate SSC -Master is driving DAT A SSC -Slave is driving DAT A Figure 4-2 Update of update-registers The types of functions used in the registers are listed here: Table 4-1 Bit types Abbreviation Function Description R Read Read-only registers W Write Read and write registers U Update Update buffer for this bit is present. If an update is issued and the UpdateRegister Access bits (ACCESS in Command Word) are set, the immediate values are stored in this update buffer simultaneously. This enables a snapshot of all necessary system parameters at the same time Data Sheet 19 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Synchronous Serial Communication (SSC) interface 4.2 Data transfer The SSC data transfer is word aligned. The following transfer words are possible: • Command word (to access and change operating modes of the TLE5014SP16 E0001) • Data words (any data transferred in any direction) • Safety word (confirms the data transfer and provide status information) twr_delay COMMAND READ Data SAFETY-WORD SSC-Master is driving DATA SSC-Slave is driving DATA Figure 4-3 SSC data transfer (data read example) twr_delay COMMAND WRITE Data SAFETY-WORD SSC-Master is driving DATA SSC-Slave is driving DATA Figure 4-4 SSC data transfer (data write example) 4.2.1 Command Word The TLE5014SP is controlled by a command word. It is sent first at every data transmission.The structure of the command word is shown in Table 4-2. Table 4-2 Structure of the command word Name Bits Description RW [15] Read - Write 0: Write 1: Read PRTY [14] Command parity Odd parity of all Command-Word-bits. Number of “1”s has to be odd CMD [13] Set to 0B ACCESS [12:11] Access mode to registers 00B: Direct access 11B: Update register; read-access ADDR [10:4] 7-bit Address LEN [3:0] Set to 1B Data Sheet 20 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Synchronous Serial Communication (SSC) interface 4.2.2 Safety word The safety word contains following bits: Table 4-3 Structure of the safety word Name Bits Description STAT Chip and Interface Status. [15] Indication of chip reset (undervoltage, watchdog) (resets after readout via SSC) 0: Reset occurred 1: No reset [14] System Error (e.g. Overvoltage; Undervoltage; VDD-, GND- off; ROM) 0: Error occurred 1: No error [13] Interface Access Error (access to wrong address; wrong lock, wrong parity, wrong access) 0: Error occurred 1: No error [12] Angle Value error (ADC , vectorlength or redundant angle calculation error) 0: Angle value invalid 1: Angle value valid RESP [11:8] Sensor Number Response Indicator The sensor no. bit is pulled low and the other bits are high CRC [7:0] Cyclic Redundancy Check (CRC) includes Command Word, Data-words, STAT and RESP Data Sheet 21 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Synchronous Serial Communication (SSC) interface 4.2.3 Cyclic Redundancy Check (CRC) • This CRC is according to the J1850 Bus-Specification. • Every new transfer resets the CRC generation. • Every Byte of a transfer will be taken into account to generate the CRC (also the sent command(s)). • Generator-Polynomial: X8+X4+X3+X2+1, but for the CRC generation the fast-CRC generation circuit is used (see Figure 4-5). • The remainder of the fast CRC circuit is initial set to 11111111B. • Remainder is inverted before transmission. Serial CRC output X7 1 X6 1 X5 1 X4 1 xor X3 1 X2 xor 1 X1 xor 1 X0 1 & xor Input TX_CRC parallel Remainder Figure 4-5 Fast CRC polynomial division circuit Two code examples to compute the CRC are provided. The first implementation is based on a two loops implentation. This implementation is recommended if the memory space is critical in the application. The second implementation replaces the inner loop by a look-up-table. It requires more memory space but the computation time is lower. Data Sheet 22 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Package Information 5 Package Information The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant. 5.1 Package Parameters Table 5-1 Package Parameters Parameter Symbol Limit Values Unit Notes Min. Typ. Max. Thermal resistance RthJA 150 K/W Junction to air1) RthJC 45 K/W Junction to case RthJL 70 K/W Junction to lead 260°C2) Moisture Sensitively Level MSL 3 Lead Frame Cu Plating Sn 100% > 7 μm 1) according to Jedec JESD51-7 2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014) Table 5-2 Position of the die in the package Parameter Symbol Limit Values Unit Notes Min. Typ. Max. Tilt 3 ° in respect to the z-axis and reference plane (see Figure 5-1), Rotational displacement 3 ° in respect to the reference axis (see Figure 5-1) Placement tolerance in package 100 µm in x and y direction z y Chip Package Tilt angle Die pad Reference plane Rotational displacement x Chip x Figure 5-1 Tolerance of the die in the package The active area of the GMR sensing element is 360µm x 470µm. It has to be ensured that a magnet is used which has sufficient size to provide a homogeneous magnetic field over the total sensing element area. For a practical application design this means that the magnet has to be Data Sheet 23 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Package Information large enough to ensure that the non-homogeneity of the magnetic field in this area (plus relevant positioning tolerances) is negligible. In case the magnet diameter is too small or there is a misalignment of the magnet to the sensor, an additional angle error may occur which has to be taken into account by the user. Data Sheet 24 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Package Information 5.2 Package Outline Figure 5-2 PG-TDSO-16 package dimension Figure 5-3 Position of sensing element Data Sheet 25 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Package Information 5.3 Footprint Figure 5-4 Footprint of PG TDSO-16 5.4 Packing Figure 5-5 Tape and Reel Data Sheet 26 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Package Information 5.5 Marking Position Marking Description 1st Line Gxxxx G: green, 4-digit date code: YYWW e.g. “1801”: 1st week in 2018 2nd Line xxxxxxxx Interface type and version 3rd Line xxx Lot code Figure 5-6 Marking of PG-TDSO-16 Data Sheet 27 Rev. 1.1 2019-04-04 TLE5014SP16 E0001 GMR-based Angle Sensor Revision history 6 Revision history Revision Date Changes 1.0 2019-01-15 Initial creation. 1.1 2019-04-04 Remove Register chapter Data Sheet 28 Rev. 1.1 2019-04-04 Trademarks All referenced product or service names and trademarks are the property of their respective owners. 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