TLE7230RAUMA1

Data Sheet TLE 7230R Smart Octal Low-Side Switch Features Product Summary ♦ Protection Supply voltage VS 4.5 – 5.5 V Overload, short circuit Drain source clamping voltage VDS(AZ)max 60 V Overtemperature Overvoltage On resistance RON 0.8 Ω ♦ Low Quiescent Current< 10µA ♦ 16 bit SPI (for Daisychain) ♦ Direct Parallel Control of Four Channels ♦ PWM input (demux) ♦ Parallel Inputs High or Low Active Programmable ♦ Programmable functions Boolean operation Overload behavior Overtemperature behavior Switching time Power PG-DSO 36-47 ♦ General Fault Flag ♦ Digital Ports Compatible to 5V and 3,3 V Micro Controllers ♦ Electrostatic Discharge (ESD) Protection ♦ Full reverse current capability without latch up ♦ Green Product (RoHS compliant) ♦ AEC qualified Application • µC-compatible 8-channel low-side switch • Switch for Automotive and Industrial Applications • Solenoids, Relays and Resistive Loads General description The TLE 7230 R is an Octal Low-Side Switch in Smart Power Technology (SPT) with a Serial Peripheral Interface (SPI) and eight open drain DMOS output stages. It is protected by embedded protection functions and designed for automotive and industrial applications. The output stages are controlled via an SPI Interface. Additionally, four channels can be controlled in parallel for PWM applications. These features make the TLE 7230 R particularly suitable for engine management and body systems. Detailed Block Diagram PRG GND RESET FAULT VS VDO VS VBB Protection Functions IN1 IN2 as Ch. 1 IN3 as Ch. 1 LOGIC Output Stage IN4 as Ch. 1 16 SCLK SI CS OUT1 8 Serial Interface SPI 4 1 Output Control Buffer 8 OUT8 SO V3.4 GND Page 1 2009-07-15 Data Sheet TLE 7230R Power SO 36 package Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Symbol GND NC NC OUT1 OUT2 IN1 IN2 VS Reset CS PRG IN3 IN4 OUT3 OUT4 NC NC GND GND NC NC OUT5 OUT6 NC VDO 26 27 28 29 30 31 32 33 34 35 36 Fault SO SCLK SI NC NC OUT7 OUT8 NC NC GND Pin Configuration (Top view) Function Ground not connected not connected Output Channel 1 Output Channel 2 Input Channel 1 Input Channel 2 Supply Voltage Reset Chip Select Program Input Channel 3 Input Channel 4 Output Channel 3 Output Channel 4 not connected not connected Ground Ground not connected not connected Output Channel 5 Output Channel 6 not connected Supply for digital Outputs General Fault Flag Serial Data Output Serial Clock Serial Data Input not connected not connected Output Channel 7 Output Channel 8 not connected not connected Ground 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 GND NC NC Out1 Out2 IN1 IN2 VS Reset CS PRG IN3 IN4 Out3 Out4 NC NC GND GND NC NC Out8 Out7 NC NC SI SCLK SO Fault VDO NC Out6 Out5 NC NC GND 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 Power- PG-DSO-36 Heat Slug internally connected to ground pins V3.4 Page 2 2009-07-15 Data Sheet TLE 7230R Maximum Ratings for Tj = – 40°C to 150°C Parameter Supply Voltage Continuous Drain Source Voltage (OUT1...OUT8) Symbol VS, V VDO VDS Values -0.3 ... + 6 48 Unit V V Input Voltage, All Inputs and Data Lines Operating Temperature Range Storage Temperature Range Output Current per Channel (see el. characteristics) VIN Tj Tstg ID(lim) - 0.3 ... + 6 - 40 ... + 150 - 55 ... + 150 ID(lim)min V °C Reverse current per channel IR - ID(lim)min A A Output Clamping Energy per channel (single pulse, triangular shape, individual switch off) ID = 0.3 A, TJ(start) = 150°C ID = 0.4 A, TJ(start) = 85°C Output Clamping Energy per channel (repetitive pulses, triangular shape) ID = 0.25 A, TJ(aver.) = 150°C, repetitive (1⋅ 106 cycles) EAS Maximum Battery Voltage for full OVL = 0 4 short circuit protection (single pulse) OVL = 1 Electrostatic Discharge Voltage (Human Body Model) HBM according to EIA/JESD 22-A114 Output 1-8 Pins All other Pins VBAT(SC) 20 28 V VESD VESD 2000 2000 V V mJ 50 65 EAR mJ 15 DIN Humidity Category, DIN 40 040 IEC Climatic Category, DIN IEC 68-1 E 40/150/56 Thermal Characteristics Parameter Symbol Thermal Resistance, Junction – Case (all channels active, 0.3W power dissipation each channel) (only one channel active, 0.5W power dissipation) RthJC V3.4 Page 3 Values min max --- 2.6 12 Unit K/W 2009-07-15 Data Sheet TLE 7230R Electrical Characteristics Parameter and Conditions VS = 4.5 to 5.5 V ; VVDO = 3.0 to 5.5V; Tj = - 40 °C to + 150 °C ; Reset = H (unless otherwise specified) Symbol Values min Unit typ max -- 5.5 V 5.5 V 1. Power Supply, Reset Supply Voltage1 VS 4.5 Supply Voltage Digital Output VVDO 3.0 Supply Current Supply Current (reset mode) IS IS(reset) --- 3 5 10 mA µA tReset,min 10 -- -- µs TJ = 25°C 2 TJ = 150°C RDS(ON) --- 0.8 -- 1 1.7 Ω Output OFF VDS(AZ) 48 -- 60 V ID(lim) 1 2 A ID(lkg) -- 2 µA tON -- 15 60 µs tOFF -- 15 60 µs 3. Digital Inputs Input Low Voltage Input High Voltage Input Voltage Hysteresis VINL VINH VINHys - 0.3 2.0 --100 1.0 -- V V mV Input Pull Down/Up Current (IN1 ... IN4) PRG, Reset Pull Up Current Input Pull Down Current (SI, SCLK) IIN(1..4) IIN(PRG,Res) IIN(SI,SCLK) 20 20 10 50 50 20 100 100 50 µA µA µA Input Pull Up Current (CS) IIN(CS) 10 20 50 µA Reset = L Minimum Reset Duration 2. Power Outputs ON Resistance VS = 5 V; ID = 500 mA Output Clamping Voltage Current Limit Output Leakage Current VReset = L Tj =125°C ; Vbb=13.5V Turn-On Time SLE = 0 ID = 0.5 A, resistive load SLE = 1 Turn-Off Time SLE = 0 ID = 0.5 A, resistive load SLE = 1 4. Digital Outputs (SO, Fault) SO High State Output Voltage SO Low State Output Voltage ISOH = 2 mA VVDO = 5V VVDO = 3V ISOL = 2.5 mA VSOH V VVDO–0.4 -- -- VVDO–0.6 Output Tristate Leakage Current, CS = H, 0 ≤ VSO ≤ VS Fault Output Low Voltage IFAULT = 1.6 mA 1 -- VSOL -- -- 0.4 V ISOlkg VFAULTL -10 -- 0 -- 10 0.4 µA V For VS < 4.5V the power stages are switched according the input signals and data bits or are definitely switched off. The undervoltage reset becomes active at VS = 3V (typ. value) and is specified by design. Not subject to production test. V3.4 Page 4 2009-07-15 Data Sheet TLE 7230R Electrical Characteristics cont. Parameter and Conditions VS = 4.5 to 5.5 V; VVDO = 3.0 to 5.5V; Tj = - 40 °C to + 150 °C ; Reset = H (unless otherwise specified) Symbol Values min Unit typ max 5. Diagnostic Functions Open Load Detection Voltage VDS(OL) VS -2.5 VS -2 Output Pull Down Current IPD(OL) 50 Fault Delay Time Overload switch off delay time td(fault) Td(off) 50 10 Short to Ground Detection Voltage Short to Ground Detection Current VDS(SHG) ISHG VS -3.6 VS -3.0 VS -2.6 V -50 -100 -150 µA Overload Threshold Current Overtemperature Shutdown Threshold2,4 Hysteresis2 ID(OVL) 1...8 Tth(sd) Thys 1 170 -- 6. SPI-Timing (for VVDO = 4.5V to 5.5V) Serial Clock Frequency (depending on SO load) Serial Clock Period (1/fclk) fSCK VS -1.3 V 90 150 µA 100 200 50 µs µs -10 2 200 -- A °C K tp(SCK) DC 200 --- 5 -- MHz ns tSCKH tSCKL tlead 50 50 250 ---- ---- ns ns ns Enable Lag Time (falling edge of CLK to rising edge ofCS) tlag 250 --- -- ns Data Setup Time (required time SI to falling of CLK) Data Hold Time (falling edge of CLK to SI) Disable Time2 tSU tH tDIS 20 20 -- ---- --150 ns ns ns Transfer Delay Time3 (CS high time between two accesses) Data Valid Time (for VVDO = 4.5V to 5.5V) tdt 200 -- -- ns tvalid ---- 100 120 150 ns tvalid ---- 100 140 240 ns Serial Clock High Time Serial Clock Low Time Enable Lead Time (falling edge of CS to rising edge of CLK) Data Valid Time (for VVDO = 3.0V to 3.6V) 2 3 CL = 50 pF2 CL = 100 pF2 CL = 220 pF2 CL = 50 pF2 CL = 100 pF2 CL = 220 pF2 This parameter is not subject to production test. Specified by design. This time is necessary between two write accesses. To get the correct diagnostic information, the transfer delay time has to be extended to the maximum fault delay time td(fault)max = 200µs. V3.4 Page 5 2009-07-15 Data Sheet TLE 7230R Functional Description The TLE 7230 R is an octal low-side power switch with a serial peripheral interface (SPI) for control and diagnostic feedback of the 8 power DMOS switches. The power transistors are protected4 against overload (current limitation), overtemperature and overvoltage (by active zener clamping). The diagnostic logic recognizes a fault condition which can be read out via the serial diagnostic output (SO). Output Stage Control: Parallel Control or SPI Control The Output stages can be controlled by parallel Inputs or by SPI commands. The IC can be programmed via SPI to switch the outputs according to the corresponding SPI command bit or to a combination of SPI bit and parallel input signal. The Boolean logic combination of parallel and serial signal is programmable by SPI to logic "AND" or "OR". The respective SPI data bits are active high and the parallel Inputs are active high or low according to the PRG pin (see pin description). Boolean operation: The logic combination of the parallel and the serial input signal can be configured by an SPI command for each of the 8 channels individually. Logic "AND" or logic "OR" is possible. parallel in off off on on serial in off on off on Output "OR" off on on on Output "AND" off off off on Map able parallel input (IN 4): The parallel input 4 (IN4) can be defined via SPI command as parallel input for one or more power outputs. Depending on the Input Map Register this input can be used to control one up to eight of the parallel outputs. Default operation: IN4 is the parallel input for channel 4. Input Map register Input buffer IN n (1..3) Input buffer IN 4 Boolean register Input buffer IN 4 Boolean register & & Output Latch ≥1 Output Latch ≥1 serial controll register Channel 4 to 8 serial controll register Channel 1 to 3 Signal logic channel 1 to 3 Input Map register Signal logic channel 4 to 8 Switching speed / Slew rate: The switching speed / slew rate of each individual channel can be configured by SPI for slow or fast switching speed (max. 15µs or 60µs). Overtemperature Behavior: Each channel has an overtemperature sensor and is individually protected against overtemperature. As soon as an overtemperature event occurs, the channel is immediately turned off and the overtemperature information is reported by diagnosis. In this case, there are two different behaviors of the affected channel that can be selected by SPI (for all channels individually). • Auto restart: as long as the input signal of the channel remains on (e.g. parallel input high) the channel turns automatically on again after cooling down. • Latching: In the event of an overtemperature shutdown, the channel stays off until the overtemperature latch is reset by a new LàH transition of the input signal. 4 The integrated protection functions help to prevent damage to the device under fault conditions and may not be used in normal operation or permanently. V3.4 Page 6 2009-07-15 Data Sheet TLE 7230R Note: The overtemperature sensors of the output channels are only active if the channel is turned on. Low Quiescent Current Mode (Sleep Mode) : By applying a low signal at the Reset Pin, the device can be set to sleep mode. In this mode, all outputs are turned off, diagnosis and biasing are disabled, the diagnosis and the on/off register are reset and the current consumption is drastically reduced (V3.3 V3.3 -> V3.2 V3.1 -> V3.2 V3.4 Date 2009-07-15 2008-07-22 Changes Short to Ground Detection Voltage min limit changed from VS -3.4 to VS -3.6 Version Change : changed Package naming only 2007-06-11 Version Change 2007-06-11 Revision History cleaned – only “final” data sheet related contents Page 14 2009-07-15 Data Sheet TLE 7230R Edition 2009-07-1415 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. V3.4 Page 15 2009-07-15