TLE7259-2GE
LIN Transceiver
Data Sheet
Rev. 1.5, 2013-07-26
Automotive Power
TLE7259-2GE
Table of Contents
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
4.1
4.2
4.2.1
4.2.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Normal Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Normal Slope Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Flash Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Stand-By Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Wake-Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Bus Wake-Up via LIN bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Local Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Mode Transition via EN pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
TxD Time Out function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Over Temperature protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3 V and 5 V Logic Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
LIN Specifications 1.2, 1.3, 2.0, 2.1, 2.2, and 2.2A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
5.1
5.2
5.3
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
6.1
6.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Functional Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7
7.1
7.2
7.3
7.4
7.5
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Robustness according to IEC61000-4-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Compatibility to other LIN Transceivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Master Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
9
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Data Sheet
2
16
16
17
17
24
24
24
25
25
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Rev. 1.5, 2013-07-26
LIN Transceiver
1
TLE7259-2GE
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Single-wire transceiver, pin compatible to the TLE7259-2GU
Transmission rate up to 20 kBaud
Compliant to LIN specification 1.3, 2.0, 2.1, 2.2 and 2.2A
Very high ESD robustness, +/- 11 kV according to IEC61000-4-2
Optimized for low electromagnetic emission (EME)
Optimized for high immunity against electromagnetic interference (EMI)
Very low current consumption in sleep mode with Wake-Up functions
Wake-Up source detection
Very low leakage current on the BUS output
Digital I/O levels compatible for 3.3 V and 5 V microcontrollers
Suitable for 12 V and 24 V board net
Bus short to VBAT protection and Bus short to GND handling
Over temperature protection and Under voltage detection
Flash mode
Green Product (RoHS compliant)
AEC Qualified
PG-DSO-8
Description
The TLE7259-2GE is a transceiver for the Local Interconnect Network (LIN) with integrated Wake-Up and
protection features. It is designed for in-vehicle networks using data transmission rates from 2.4 kBaud to
20 kBaud. The TLE7259-2GE functions as a bus driver between the protocol controller and the physical bus inside
the LIN network. Compliant to all LIN standards and with a wide operational supply range the TLE7259-2GE can
be used in all automotive applications.
Different operation modes and the INH output allow the TLE7259-2GE to control external components, like voltage
regulators. In Sleep-mode the TLE7259-2GE draws less than 8 μA of quiescent current while still being able to
wake up off of LIN bus traffic and a local Wake-Up input. The very low leakage current on the BUS pin makes the
TLE7259-2GE especially suitable for partially supplied networks and supports the low quiescent current
requirements of the LIN network.
Based on the Infineon Smart Power Technology SPT®, the TLE7259-2GE provides excellent ESD Robustness
together with a very high electromagnetic immunity (EMI). The TLE7259-2GE reaches a very low level of
electromagnetic emission (EME) within a broad frequency range and independent from the battery voltage.
The Infineon Smart Power Technology SPT® allows bipolar and CMOS control circuitry in accordance with DMOS
power devices existing on the same monolithic circuit. The TLE7259-2GE and the Infineon SPT® technology are
AEC qualified and tailored to withstand the harsh condition of the Automotive Environment.
Type
Package
Marking
TLE7259-2GE
PG-DSO-8
7259-2GE
Data Sheet
3
Rev. 1.5, 2013-07-26
TLE7259-2GE
Block Diagram
2
Block Diagram
VS
8
7
Supply
Output
Stage
RBUS
Bus
6
Driver
INH
5V
2
Mode
Control
Temp.Protection
Current
Limit
EN
REN
TxD Input
4
Timeout
Receiver
TxD
RTD
1
RxD
Filter
Wake and Bus
Comparator
WK
3
Figure 1
Data Sheet
5
GND
Filter
Block Diagram
4
Rev. 1.5, 2013-07-26
TLE7259-2GE
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
Figure 2
RxD
1
8
INH
EN
2
7
VS
WK
3
6
BUS
TxD
4
5
GND
Pin Configuration
Note: The pin configuration of the TLE7259-2GE is pin compatible to the devices TLE7259G, TLE7259-2GU and
the Twin LIN Transceiver TLE7269G. In comparison to the TLE7269G, the TLE 7259-2GE has no separate
VIO power supply and needs a pull up resistor at the RxD pin. Details can be found in the chapter “Pin
Compatibility to other LIN Transceivers” on Page 24.
3.2
Pin Definitions and Functions
Pin
Symbol
Function
1
RxD
Receive data output;
External Pull Up necessary
LOW in dominant state, active LOW after a Wake-Up event at BUS or WK pin
2
EN
Enable input;
integrated pull-down, device set to normal operation mode when HIGH
3
WK
Wake input;
active LOW, negative edge triggered, internal pull-up
4
TxD
Transmit data input;
integrated pull-down, LOW in dominant state; active LOW after Wake-Up via WK pin
5
GND
Ground
6
BUS
Bus input / output;
LIN bus line input / output
LOW in dominant state
Internal termination and pull-up current source
7
VS
Battery supply input
8
INH
Inhibit output;
battery supply related output
HIGH (VS) in Normal and Stand-By operation mode
can be used to control an external voltage regulator
can be used to control external bus termination resistor when the device will be used
as Master node
Data Sheet
5
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4
Functional Description
The LIN Bus is a single wire, bi-directional bus, used for in-vehicle networks. The LIN Transceiver TLE7259-2GE
is the interface between the microcontroller and the physical LIN Bus (see Figure 15 and Figure 16). The logical
values of the microcontroller are driven to the LIN bus via the TxD input of the TLE7259-2GE. The transmit data
stream on the TxD input is converted to a LIN bus signal with optimized slew rate to minimize the EME level of the
LIN network. The RxD output reads back the information from the LIN bus to the microcontroller. The receiver has
an integrated filter network to suppress noise on the LIN Bus and to increase the EMI (Electro Magnetic Immunity)
level of the transceiver.
Two logical states are possible on the LIN bus according to the LIN Specification 2.2A (see Figure 3):
In dominant state, the voltage on the LIN bus is set to the GND level. In recessive state, the voltage on the LIN
bus is set to the supply voltage VS. By setting the TxD input of the TLE7259-2GE to “Low” the transceiver
generates a dominant level on the BUS interface pin. The RxD output reads back the signal on the LIN bus and
indicates a dominant LIN bus signal with a logical “Low” to the microcontroller. Setting the TxD pin to “High” the
transceiver TLE7259-2GE sets the LIN interface pin BUS to the recessive level, at the same time the recessive
level on the LIN bus is indicated by a logical “High” on the RxD output.
Every LIN network consists of a master node and one or more slave nodes. To configure the TLE7259-2GE for
master node applications, a resistor in the range of 1 kΩ and a reverse diode must be connected between the LIN
bus and the power supply VS or the INH pin of the TLE7259-2GE (see Figure 15 and Figure 16).
VIO
Recessive
Dominant
Recessive
TxD
t
VS
Recessive
Dominant
Recessive
BUS
t
VIO
Recessive
Dominant
Recessive
RxD
t
Figure 3
Data Sheet
LIN bus signals
6
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4.1
Operating Modes
Start-Up
Power-Up
Note 1:
TxD:
TxD:
Note 2:
RxD:
Strong Pull Down > 1.5 mA
after Wake-Up via pin WK
Weak Pull Down 350 kΩ
after Power-Up and
Wake-Up via BUS
RxD:
Stand-By Mode
logical „High“
after Power-Up
logical „Low“
after Wake-Up via BUS
or after Wake-Up via pin WK
A external Pull-Up resistor to the external
microcontroller supply is required for the Wake-Up or
Power-Up indication
INH = HIGH
TxD (see Note 1)
RxD (see Note 2)
EN
Go To Normal
Operation Mode
EN High
Normal Operation Mode
Normal Slope Mode
Flash Mode
EN
INH = HIGH
EN = HIGH
TxD
EN
INH = HIGH
EN = HIGH
EN
Go To
Sleep Mode
EN Low
Sleep Mode
1)
INH = Float
EN = LOW
RxD = HIGH1)
EN
Wake-Up
via
via
Figure 4
Data Sheet
RxD is „High“ due to the external pullup resistor
on pin Wk
on pin BUS
Operation Mode State Diagram
7
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
The TLE7259-2GE has 3 major operation modes:
•
•
•
Stand-By mode
Normal Operation mode
Sleep mode
The Normal Operation mode contains 2 sub-operation modes, which differentiate by the slew rate control of the
LIN Bus signal (see Figure 4).
Sub-operation modes with different slew rates on the BUS pin:
•
•
Normal Slope mode, for data transmission rates up to 20 kBaud
Flash mode, for programming of the external microcontroller
The operation mode of the TLE7259-2GE is selected by the EN pin. (see Figure 4).
Table 1
Operating modes
Mode
EN
INH
Sleep
Low
Stand-By
TxD
RxD
LIN Bus
Comments
Termination
Floating Low
High1)
High
Impedance
No wake-up request detected
Low
High
Low
High2)
Low
High 1)
30 kΩ
(typical)
RxD “Low” after local Wake-Up (pin WK) or bus
Wake-Up (pin BUS)
RxD “High“ after Power-Up
TxD strong pull down after local Wake-Up (WK pin)2)
TxD weak pull down after bus Wake-Up (pin BUS) or
Power-Up2)
Normal
High
Operation
High
Low
High
Low
High
30 kΩ
(typical)
RxD reflects the signal on the BUS
TxD driven by the microcontroller
1) A pull-up resistor to the external microcontroller supply is required.
2) The TxD input needs an external termination to indicate a “High” or a “Low” signal. The external termination could be a pullup resistor or an active microcontroller output.
4.2
Normal Operation Mode
The TLE7259-2GE enters the Normal Operation mode after the microcontroller sets EN to “High” (see Figure 4). In
Normal Operation mode the LIN bus receiver and the LIN bus transmitter are active. Data from the microcontroller
is transmitted to the LIN bus via the TxD pin, the receiver detects the data stream on the LIN bus and forwards it to
the RxD output pin. In Normal Operation mode, the INH pin is “High” (set to VS) and the bus termination is set to
30 kΩ.
Normal Slope mode and the Flash mode are Normal Operation modes and in these sub-modes the behavior of
the INH pin and the bus termination is the same. Per default the TLE7259-2GE always enters into Normal Slope
mode, either from Sleep mode or from Stand-By mode. The Flash mode can only be entered from Normal Slope
mode.
In order to avoid any bus disturbance during a mode change, the output stage of the TLE7259-2GE is disabled
and set to recessive state during the mode change procedure. To release the TLE7259-2GE for data
communication on the LIN bus, the TxD pin needs to be set to “High” for the time tto,rec.
Data Sheet
8
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4.2.1
Normal Slope Mode
In Normal Slope mode data transmission rates up to 20 kBauds are possible. Setting the EN pin to “High” starts
the transition to Normal Slope mode. (see Figure 5).
The mode change to Normal Slope mode is defined by the time tMODE. The time tMODE specifies the delay time
between the threshold, where the EN pin detects a “High” input signal, and the actual mode change of TLE72592GE into Normal Slope mode. Entering in Normal Operation mode, the TLE7259-2GE always enters per default
into Normal Slope mode. The signal on the TxD pin is not relevant for entering into Normal Slope mode.
Finally to release the data communication it is required to set the TxD pin to “High” for the time tto,rec.
VEN,ON
EN
Don’t care
Data transmission
TxD
tto,rec
tMODE
Stand-By Mode / Sleep Mode
Figure 5
Normal Slope Mode
Timing to enter Normal Slope Mode
.
4.2.2
Flash Mode
In Flash mode it is possible to transmit and receive LIN messages on the LIN bus. The slew rate control
mechanism of the LIN bus signal is disabled. This allows higher data transmission rates, disregarding the EMC
limitations of the LIN network. The Flash mode is intended to be used during the ECU production for programming
the microcontroller via the LIN bus interface.
The TLE7259-2GE can be set to Flash mode only from Normal Slope mode (see Figure 4). Flash mode is entered
by setting the EN pin to “Low” for the time tfl1 and generating a falling and a rising edge at the TxD pin with the
timing tfl2, tfl3 and tfl4 (see Figure 6). Leaving the Flash mode by the same sequence, sets the TLE7259-2GE back
to Normal Slope mode. Finally to release the data transmission it is required to set the TxD pin to “High” for the
time tto,rec.
Additionally the TLE7259-2GE can leave the Flash mode as well by switching only the EN pin to “Low”. By applying
this “Low” signal to the EN pin the TLE7259-2GE is put into Sleep mode.
Data Sheet
9
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
Normal Slope
Mode
Normal Slope
Mode
Flash Mode
tfl1
EN
tfl1
Data transmission
TxD
tfl2
tfl3
tfl4
tfl2
ttorec
Figure 6
Timing to enter and leave Flash Mode
4.3
Stand-By Mode
Data transm.
tfl3
tfl4
ttorec
The Stand-By mode is entered automatically after:
•
•
•
•
•
A Power-Up event at the supply VS.
A bus Wake-Up event at the pin BUS.
A local Wake-Up event at the pin WK.
A power on reset caused by power supply VS.
In Stand-By mode the Wake-Up sources are monitored by the TxD and RxD pins.
In Stand-By mode no communication on the LIN Bus is possible. The output stage is disabled and the LIN Bus
termination remains activated. The RxD and the TxD pin are used to indicate the Wake-Up source or a Power-Up
event. The RxD pin remains “Low“ after a local Wake-Up event on the pin WK and a bus Wake-Up event on the
LIN bus. A Power-Up event is indicated by a logical “High“ on the RxD pin. The signal on the TxD pin indicates the
Wake-Up source, a weak pull-down signals a bus Wake-Up event on the LIN bus and a strong pull-down signals
a local Wake-Up event caused by the WK pin (see Table 1 and Table 2). In order to detect a Wake-Up event via
the TxD pin, the external microcontroller output needs to provide a logical “High” signal. The Wake-Up flags
indicating the Wake-Up source on the pins TxD and RxD are reset by changing the operation mode to Normal
Operation mode.
The signal on the EN pin remains “Low“ due to an internal pull-down resistor. Setting the EN pin to “High“, by the
microcontroller returns the TLE7259-2GE to Normal Operation mode. In Stand-By mode the INH output is
switching to VS. The INH output can be used to control external devices like a voltage regulator.
Table 2
Logic table for wake up monitoring
Power up
WK
BUS
RxD1)
TxD2)
Remarks
Yes
1
1
1
1
No Wake-Up, Power-Up event
No
Wake-Up3) 1
0
0
Wake via wake pin
0
1
Wake via BUS
No
1
4)
Wake-Up
1) To indicate the Wake-Up sources via the RxD pin, a pull-up resistor to the external microcontroller supply is required.
2) The TxD input needs an external termination to indicate a “High” or a “Low” signal. The external termination could be a pullup resistor or an active microcontroller output.
3) A local Wake-Up event is considered after a low signal on the pin WK (see Chapter 4.7).
4) A bus Wake-Up event is considered after a low to high transition on the LIN bus (see Chapter 4.6)
Data Sheet
10
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4.4
Sleep Mode
In order to reduce the current consumption the TLE7259-2GE offers a Sleep mode. In Sleep mode the quiescent
current on VS and the leakage current on the pin BUS are cut back to a minimum.
To switch the TLE7259-2GE from Normal Operation mode to Sleep mode, the EN pin has to be set to “Low”.
Conversely a logical “High” on the EN pin sets the device directly back to Normal Operation mode (see Figure 4).
While the TLE7259-2GE is in Sleep mode the following functions are available:
•
•
•
•
•
•
•
The output stage is disabled and the internal bus terminations are switched off (High Impedance on the pin
BUS). The internal current source on the bus pin ensures that the level on the pin BUS remains recessive and
protects the LIN network against accidental bus Wake-Up events.
The receiver stage is turned off.
RxD output pin is “High” if a pull-up resistor is connected to the external microcontroller supply. The TxD pin is
disabled. The logical state on the TxD pin is “Low”, due to the internal pull-down resistor.
The INH output is switched off and floating.
The bus Wake-Up comparator is active and turns the TLE7259-2GE to Stand-By mode in case of a bus WakeUp event.
The WK pin is active and turns the TLE7259-2GE to Stand-By mode in case of a local Wake-Up.
The EN pin remains active, switching the EN pin to “High“ changes the operation mode to Normal Slope mode.
4.5
Wake-Up Events
A Wake-Up event changes the operation mode of the TLE7259-2GE from Sleep mode to Stand-By mode. There
are 3 different ways to wake-up the TLE7259-2GE from Sleep mode.
•
•
•
Bus Wake-Up via a minimum dominant signal (tWK,bus) on the pin BUS.
Local Wake-Up via a minimum dominant time (tWK) on the WK pin.
Mode change from Sleep mode to Normal Operation mode, by setting the EN pin to logical “High”.
4.6
Bus Wake-Up via LIN bus
LIN BUS Signal
VBUS
VBUS,wk
VBUS,wk
tWK,bus
Sleep Mode
Stand-By Mode
INH
Figure 7
Bus Wake-Up behavior
The bus Wake-Up event, often called remote Wake-Up, changes the operation mode from Sleep mode to StandBy mode. A falling edge on the LIN bus, followed by a dominant bus signal t > tWK,bus results in a bus Wake-Up
event. The mode change to Stand-By mode becomes active with the following rising edge on the LIN bus. The
Data Sheet
11
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
TLE7259-2GE remains in Sleep mode until it detects a change from dominant to recessive on the LIN bus (see
Figure 7).
In Stand-By mode the TxD pin indicates the source of the Wake-Up event. A weak pull-down on the pin TxD
indicates a bus Wake-Up event (see Figure 4). The RxD pin signals if a Wake-Up event occurred or the powerup event. A “Low” signal on the RxD pin reports a local or bus Wake-Up event, a logical “High“ signal on RxD
indicates a power-up event.
4.7
Local Wake-Up
WK Signal
VWK
VWK,L
tWK
Stand-By Mode
Sleep Mode
INH
Figure 8
Local Wake-Up behavior
Beside the remote Wake-Up, a Wake-Up of the TLE7259-2GE via the WK pin is possible. This type of wake-up
event is called “Local Wake Up”. A falling edge on the WK pin followed by a “Low“ signal for t > tWK results in a
local Wake-Up (see Figure 8) and changes the operation mode to Stand-By mode.
In Stand-By mode the TxD pin indicates the source of the Wake-Up event. A strong pull-down on the pin TxD
indicates a bus Wake-Up event (see Figure 4). The RxD pin signals if a Wake-Up event or the Power-Up event
occurred. A “Low” signal on the RxD pin reports a local or bus Wake-Up event, a logical “High“ signal on RxD
indicates a Power-Up event.
Data Sheet
12
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4.8
Mode Transition via EN pin
EN Signal
VEN
VEN,ON
EN Hysteresis
VEN,OFF
tMODE
Sleep Mode /
Stand-By Mode
Figure 9
tMODE
Normal Operation Mode
Sleep Mode
Mode Transition via EN pin
It is also possible to change from Sleep mode to Normal Operation mode by setting the EN pin to logical “High“.
This feature is useful if the external microcontroller is continuously powered, the microcontroller power-supply is
not controlled by the INH pin. The EN pin has an integrated pull-down resistor to ensure the device remains in
Sleep or Stand-By mode even if the voltage on the EN pin is floating. The EN pin has an integrated hysteresis (see
Figure 9).
A transition from logical “High“ to logical “Low“ on the EN pin changes the operation mode from Normal Operation
mode to Sleep mode. If the TLE7259-2GE is already in Sleep mode, changing the EN from “Low“ to “High” results
into a mode change from Sleep mode to Normal Operation mode. If the device is in Stand-By mode a change from
“Low“ to “High” on the EN pin changes the mode to Normal Operation mode, as well (see Figure 4).
Data Sheet
13
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
4.9
TxD Time Out function
If the TxD signal is dominant for a time t > ttimeout the TxD time-out function deactivates the transmission of the LIN
signal to the bus and disables the output stage. This is realized to prevent the bus from being blocked by a
permanent “Low” signal on the TxD pin, caused by an error on the external microcontroller (see Figure 10).
The transmission is released again, after a rising edge at the pin TxD has been detected.
Recovery of the
microcontroller error
TxD Time-Out due to
microcontroller error
Normal Communication
ttimeout
ttorec
Release after TxD
Time-out
Normal Communication
TxD
t
BUS
t
Figure 10
TxD Time-Out function
4.10
Over Temperature protection
The TLE7259-2GE has an integrated over temperature sensor to protect the device against thermal overstress on
the output stage. In case of an over temperature event, the temperature sensor will disable the output stage (see
Figure 1). An over temperature event will not cause any mode change and won’t be indicated by the RxD pin or
the TxD pin. When the junction temperature falls below the thermal shut down level TJ < TjSD, the output stage is
re-enabled and data communication can start again on the LIN bus. A 10°C hysteresis avoids toggling during the
temperature shut down.
4.11
3.3 V and 5 V Logic Capability
The TLE7259-2GE can be used for 3.3 V and 5 V microcontrollers. The inputs and the outputs are capable to
operate with both voltage levels. The RxD output must have an external pull-up resistor to the microcontroller
supply to define the output voltage level.
BUS Short to GND Feature
The TLE7259-2GE has a feature implemented to protect the battery from running out of charge in case the LIN
bus is shorted to GND.
In this failure case a normal master termination, a 1 kΩ resistor and diode between the LIN bus and the power
supply VS, would cause a constantly drawn current even in Sleep mode. The resulting resistance of this short to
GND is lower than 1 kΩ. To avoid this current during a generator off state, like in a parked car, the TLE7259-2GE
has a bus short to GND feature implemented, which is activated in Sleep mode.
Data Sheet
14
Rev. 1.5, 2013-07-26
TLE7259-2GE
Functional Description
This feature is only applicable, if the master termination of the LIN bus is connected to the INH pin, instead of being
connected to the power supply VS (see Figure 15 and Figure 16). Internally, the 30 kΩ path is also switched off
from the power supply VS (see Figure 1).
A separate Master Termination Switch is implemented at the pin BUS, to avoid a voltage drop on the recessive
level of LIN bus, in case of a dominant level or a short to ground on at the LIN bus.
4.12
LIN Specifications 1.2, 1.3, 2.0, 2.1, 2.2, and 2.2A
The device fulfills the Physical Layer Specification of LIN 1.2, 1.3, 2.0, 2,1, 2.2 and 2.2A.
The differences between LIN specification 1.2 and 1.3 is mainly the physical layer specification. The reason was
to improve the compatibility between the nodes.
The LIN specification 2.0 is a super set of the 1.3 version. The 2.0 version offers new features. However, it is
possible to use the LIN 1.3 slave node in a 2.0 node cluster, as long as the new features are not used. Vice versa
it is possible to use a LIN 2.0 node in the 1.3 cluster without using the new features.
In terms of the physical layer the LIN 2.1, LIN 2.2 and LIN 2.2A Specification doesn’t include any changes and is
fully compliant to the LIN Specification 2.0.
LIN 2.2A is the latest version of the LIN specification, released in December 2010.
Data Sheet
15
Rev. 1.5, 2013-07-26
TLE7259-2GE
General Product Characteristics
5
General Product Characteristics
5.1
Absolute Maximum Ratings
Table 3
Absolute Maximum Ratings Voltages, Currents and Temperatures1)
All voltages with respect to ground; positive current flowing into pin;
(unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Remarks
LIN Spec 2.2A (Par. 11)
Voltages
5.1.1
Battery supply voltage
VS
-0.3
40
V
5.1.2
Bus and WK input voltage
versus GND
versus VS
VBUS,G
VBUS,Vs
-40
-40
40
40
V
V
-0.3
5.5
V
VINH,G
VINH, Vs
-0.3
-40
40
0.3
V
V
IINH
-150
80
mA
2)
–
5.1.3
Logic voltages at EN, TxD, Vlogic
RxD
5.1.4
INH Voltage
versus GND
versus VS
–
–
Currents
5.1.5
Output current at INH
Temperatures
5.1.6
Junction temperature
Tj
-40
150
°C
–
5.1.7
Storage temperature
Ts
-55
150
°C
–
ESD Resistivity
5.1.8
Electrostatic discharge
voltage at VS, Bus, WK
versus GND
VESD
-6
6
kV
Human Body Model
(100pF via 1.5 kΩ)3)
5.1.9
Electrostatic discharge
voltage all pins
VESD
-2
2
kV
Human Body Model
(100pF via 1.5 kΩ)3)
1) Not subject to production test, specified by design
2) Output current is internally limited to -150 mA
3) ESD susceptibility HBM according to EIA / JESD 22-A 114
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
16
Rev. 1.5, 2013-07-26
TLE7259-2GE
General Product Characteristics
5.2
Functional Range
Table 4
Operating Range
Pos.
Parameter
Symbol Limit Values
Min.
Typ.
Max.
Unit
Remarks
Supply voltages
5.2.1
Extended Supply Voltage VS(ext)
Range for Operation
5
–
40
V
Parameter deviations
possible
5.2.1
Supply Voltage range for VS(nor)
Normal Operation
5.5
–
27
V
LIN Spec 2.2A (Par. 10)
-40
–
150
°C
1)
Thermal parameters
5.2.2
Junction temperature
Tj
1) Not subject to production test, specified by design
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
5.3
Thermal Characteristics
Table 5
Thermal Resistance1)
Pos.
Parameter
Symbol
Limit Values
Min.
Typ.
Max.
Unit
Remarks
Thermal Resistance
5.3.1
Junction to Soldering
Point
RthJSP
–
–
25
K/W
measured on pin 5
5.3.2
Junction ambient
RthJA
–
130
–
K/W
2)
Thermal Shutdown Junction Temperature
5.3.3
Thermal shutdown temp. TjSD
150
175
190
°C
–
5.3.4
Thermal shutdown hyst. ΔT
–
10
–
K
–
1) Not subject to production test, specified by design
2) JESD 51-2, 51-3, FR4 76,2 mm x 114,3 mm x 1,5 mm, 70 μm Cu, minimal footprint, Ta = 27°C
Data Sheet
17
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
6
Electrical Characteristics
6.1
Functional Device Characteristics
Table 6
Electrical Characteristics
5.5 V < VS < 27 V; RL = 500 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing
into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
Current Consumption
6.1.1 Current consumption at VS
IS,rec
0.5
1.1
3.0
mA
Recessive state, without RL;
VS = 13.5 V; VTxD = “High”
6.1.2 Current consumption at VS
Dominate State
IS,dom
–
1.5
5.0
mA
Dominant state, without RL;
VS = 13.5 V; VTxD = 0 V
6.1.3 Current consumption at VS
in sleep mode
IS,sleep
–
5
12
µA
Sleep mode.
VS = 18 V; VWK= VS= VBUS
6.1.4 Current consumption at VS in
sleep mode
IS,sleep,typ
–
–
10
µA
Sleep mode, Tj < 85 °C
VS = 13.5 V; VWK= VS= VBUS
6.1.5 Current consumption in sleep
mode bus shorted to GND
IS,lkg,SC_GND
–
45
100
µA
Sleep mode,
VS = 13.5 V;VBUS = 0V
6.1.6 HIGH level leakage current
IRD,H,leak
-5
–
5
µA
VRxD = 5V; VBUS = VS
6.1.7 LOW level output current
IRD,L
1.7
–
10
mA
VRxD = 0.9V, VBUS = 0V
6.1.8 HIGH level input voltage range VTD,H
2
–
5.5
V
Recessive state
VTD,hys
6.1.10 LOW level input voltage range VTD,L
150
300
450
mV
1)
-0.3
–
0.8
V
Dominant state
RTD
ITD,L
100
350
800
kΩ
VTxD = High
1.5
3
10
mA
VTxD = 0.9 V; VWK = 0 V;
VS = 13.5 V
Ci
–
5
–
pF
1)
Receiver Output: RxD
Transmission Input: TxD
6.1.9 Input hysteresis
6.1.11 Pull-down resistance
6.1.12 Dominant current standby
mode after Wake-Up
6.1.13 Input capacitance
Data Sheet
18
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
Table 6
Electrical Characteristics (cont’d)
5.5 V < VS < 27 V; RL = 500 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing
into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
6.1.14 HIGH level input voltage range VEN,ON
2
–
5.5
V
Normal Operation mode
6.1.15 LOW level input voltage range VEN,OFF
-0.3
–
0.8
V
Sleep mode or Stand-By
mode
150
300
450
mV
1)
6.1.17 Pull-down resistance
VEN,hys
REN
15
30
60
kΩ
–
6.1.18 Input capacitance
Ci EN
–
5
–
pF
1)
RINH,on
IINH
IINH,lk
22
36
50
Ω
IINH = -15 mA
-150
-110
-40
mA
VINH = 0 V
-5.0
–
5.0
μA
Sleep mode;
VINH = 0 V
6.1.22 High level input voltage
VWK,H
VS 1V
–
VS +
3V
V
tested VS = 13.5 V;
6.1.23 Low level input voltage
VWK,L
-0.3
–
VS 4V
V
tested VS = 13.5 V;
6.1.24 Pull-up current
-60
-20
-3
μA
–
-5
–
5
μA
VS = 0 V; VWK = 40 V
6.1.26 Dominant time for Wake-Up
IWK,PU
IWK,H,leak
tWK
30
–
150
μs
–
6.1.27 Input Capacitance
Ci WK
–
15
–
pF
1)
6.1.28 Receiver threshold voltage,
recessive to dominant edge
Vth_dom
0.4 ×
VS
0.45 × –
VS
V
–
6.1.29 Receiver dominant state
VBUSdom
VS 40 V
–
0.4 ×
VS
V
LIN Spec 2.2A (Par. 17) 2)
6.1.30 Receiver threshold voltage,
dominant to recessive edge
Vth_rec
–
0.55 × 0.6 ×
VS
VS
V
–
6.1.31 Receiver recessive state
VBUSrec
0.6 ×
VS
–
1.15 x V
Vs
LIN Spec 2.2A (Par. 18) 3)
6.1.32 Receiver center voltage
VBUS_CNT
0.475
× VS
0.5 ×
VS
0.525 V
× VS
7.0V < VS < 27V
LIN Spec 2.2A (Par. 19) 4)
6.1.33 Receiver hysteresis
VHYS
0.07 × 0.12 × 0.175 V
VS
VS
× VS
LIN Spec 2.2A (Par. 20) 5)
6.1.34 Wake-Up threshold voltage
VBUS,wk
0.40 × 0.5 ×
VS
VS
0.6 ×
VS
V
–
6.1.35 Dominant time for bus WakeUp
tWK,bus
30
150
μs
–
Enable Input: EN
6.1.16 Input hysteresis
Inhibit, Master Termination Output: INH
6.1.19 Inhibit Ron resistance
6.1.20 Maximum INH output current
6.1.21 Leakage current
Wake Input: WK
6.1.25 High level leakage current
Bus Receiver: BUS
Data Sheet
–
19
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
Table 6
Electrical Characteristics (cont’d)
5.5 V < VS < 27 V; RL = 500 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing
into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
0.8 ×
VS
–
VS
–
–
–
–
–
–
1.2
V
0.2 x VS V
2.0
V
Bus Transmitter BUS
6.1.36 Bus recessive output voltage
VBUS,ro
6.1.37 Bus dominant output voltage
maximum load
VBUS,do
6.1.38 Bus short circuit current
IBUS_LIM
70
100
150
mA
VBUS = 13.5 V;
LIN Spec 2.2A (Par. 12);
6.1.39 Leakage current
IBUS_NO_GND
-1
-0.5
–
mA
VS = 0 V; VBUS = -12 V;
LIN Spec 2.2A (Par. 15)
6.1.40 Leakage current
IBUS_NO_BAT –
1
8
μA
VS = 0 V; VBUS = 18 V;
LIN Spec 2.2A (Par. 16)
6.1.41 Leakage current
IBUS_PAS_dom -1
-0.5
–
mA
VS = 18 V; VBUS = 0 V;
LIN Spec 2.2A (Par. 13)
6.1.42 Leakage current
IBUS_PAS_rec –
1
8
μA
VS = 8 V; VBUS = 18 V;
LIN Spec 2.2A (Par. 14)
6.1.43 Bus pull-up resistance
Rslave
20
30
47
kΩ
Normal mode
LIN Spec 2.2A (Par. 26)
6.1.44 LIN output current
IBUS
-60
-30
-5
μA
Sleep mode
VS = 13.5V VEN = 0V
6.1.45 Input Capacitance
Ci BUS
15
–
pF
1)
V
VTxD = high Level
VTxD = 0 V; RL = 500 Ω
6.0 ≤ VS ≤ 7.3 V;
7.3 < VS ≤ 10 V;
10 < VS ≤ 18 V;
(see Figure 12)
Dynamic Transceiver Characteristics: BUS
6.1.46 Propagation delay
LIN bus to RxD
Dominant to RxD Low
Recessive to RxD High
trx_pdf
trx_pdr
–
–
1
1
6
6
μs
μs
6.1.47 Receiver delay symmetry
trx_sym
-2
–
2
μs
LIN Spec 2.2A (Par. 32)
trx_sym = trx_pdf- trx_pdr;
RRxD = 2.4 kΩ; CRxD = 20 pF
6.1.48 Delay time for mode change
tMODE
ttimeout
ttorec
–
–
150
μs
1)
8
13
20
ms
VTxD = 0 V
–
–
15
μs
1)
6.1.51 EN toggling to enter the flash
mode
tfl1
25
35
50
μs
1)
See Figure 6
6.1.52 TxD time for flash activation
tfl2
tfl3
tfl4
5
10
10
–
–
–
–
–
–
μs
1)
See Figure 6
6.1.49 TxD dominant time out
6.1.50 TxD dominant time out
recovery time
Data Sheet
LIN Spec 2.2A (Par. 31)
RRxD = 2.4 kΩ; CRxD = 20 pF
20
See Figure 5
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
Table 6
Electrical Characteristics (cont’d)
5.5 V < VS < 27 V; RL = 500 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing
into pin; unless otherwise specified.
Pos. Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
6.1.53 Duty cycle D1
(for worst case at 20 kBit/s)
D1
0.396
–
–
duty cycle 16)
THRec(max) = 0.744 × VS;
THDom(max) = 0.581 × VS;
VS = 7.0 … 18 V;
tbit = 50 μs;
D1 = tbus_rec(min)/2 tbit;
LIN Spec 2.2A (Par. 27)
6.1.54 Duty cycle D1
for Vs supply 5.5 V to 7.0 V
(for worst case at 20 kBit/s)
D1
0.396
–
–
duty cycle 16)
THRec(max) = 0.760 × VS;
THDom(max) = 0.593 × VS;
5.5 V < VS < 7.0 V;
tbit = 50 μs;
D1 = tbus_rec(min)/2 tbit;
6.1.55 Duty cycle D2
(for worst case at 20 kBit/s)
D2
–
–
0.581
duty cycle 26)
THRec(min) = 0.422 × VS;
THDom(min) = 0.284 × VS;
VS = 7.6 … 18 V;
tbit = 50 μs;
D2 = tbus_rec(max)/2 tbit;
LIN Spec 2.2A (Par. 28)
6.1.56 Duty cycle D2
for Vs supply 6.1 V to 7.6 V
(for worst case at 20 kBit/s)
D2
–
–
0.581
duty cycle 26)
THRec(min) = 0.410 × VS;
THDom(min) = 0.275 × VS;
6.1 V < VS < 7.6 V;
tbit = 50 μs;
D2 = tbus_rec(max)/2 tbit;
1)
2)
3)
4)
5)
6)
Not subject to production test, specified by design
Minimum limit specified by design
Maximum limit specified by design
VBUS_CNT = (Vth_dom + Vth_rec)/2
VHYS = Vth_rec - Vth_dom
Bus load concerning LIN Spec 2.2A:
Load 1 = 1 nF / 1 kΩ = CBUS / RBUS
Load 2 = 6.8 nF / 660 Ω = CBUS / RBUS
Load 3 = 10 nF / 500 Ω = CBUS / RBUS
Data Sheet
21
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
6.2
Diagrams
VS
EN
100 nF
INH
VµC
TxD
RBUS
RRxD
RxD
CRxD
Bus
CBus
Figure 11
WK
GND
Simplified test circuit for dynamic characteristics
VS
EN
100 nF
INH
VµC
TxD
RBUS
RRxD
RxD
CRxD
Bus
CBus
Figure 12
Data Sheet
WK
GND
Simplified test circuit for static characteristics
22
Rev. 1.5, 2013-07-26
TLE7259-2GE
Electrical Characteristics
tBit
TxD
tBit
tBit
(input to
transmitting node)
tBus_dom(max)
VSUP
(Transceiver supply
of transmitting
node)
tBus_rec(min)
THRec(max)
THDom(max)
Thresholds of
receiving node 1
THRec(min)
THDom(min)
Thresholds of
receiving node 2
tBus_dom(min)
tBus_rec(max)
RxD
(output of receiving
node 1)
trx_pdf(1)
trx_pdr(1)
RxD
(output of receiving
node 2)
trx_pdr(2)
trx_pdf(2)
Duty Cycle 1 = tBUS_rec(min) / (2 x tBIT)
Duty Cycle 2 = tBUS_rec(max) / (2 x tBIT)
Figure 13
Data Sheet
Timing diagram for dynamic characteristics
23
Rev. 1.5, 2013-07-26
TLE7259-2GE
Application Information
7
Application Information
7.1
ESD Robustness according to IEC61000-4-2
Test for ESD robustness according to IEC61000-4-2 “Gun test” (150 pF, 330 Ω) have been performed. The results
and test conditions are available in a separate test report.
Table 7
ESD Robustness according to IEC61000-4-2
Performed Test
Result
Electrostatic discharge voltage at pin VS, BUS versus GND ≥ 11
Electrostatic discharge voltage at pin VS, BUS versus GND ≤ -11
Unit
Remarks
kV
1)
Positive pulse
kV
1)
Negative pulse
Positive pulse
Negative pulse
Electrostatic discharge voltage at pin WK versus GND
≥9
kV
1)
Electrostatic discharge voltage at pin WK versus GND
≤ -9
kV
1)
1) ESD susceptibility “ESD GUN” according LIN EMC 1.3 Test Specification, Section 4.3. (IEC 61000-4-2) -Tested by external
test house.
7.2
Pin Compatibility to other LIN Transceivers
The LIN Transceiver TLE7259-2GE is pin and function compatible to the Single LIN Transceivers like the
TLE7259G, the TLE7259-2GU and other single LIN Transceivers on the market. The TLE7259-2GE has no VIO
supply pin. Therefore the TLE7259-2GE needs a pull-up resistor to the external microcontroller supply. The
TLE7259-2GE can also be used on a PCB design for the Twin LIN TLE7269G. Since the TLE7269G doesn’t need
a pull-up resistor on the RxD pin, a pull-up resistor to the external microcontroller needs to be added to get the
same functionality.
RxD1
1
14
INH1
RxD
1
8
INH
EN
2
13
VS
EN
2
7
VS
WK
3
12
BUS1
WK
3
6
BUS
TxD1
4
11
GND
TxD
4
5
GND
TxD2
5
10
BUS2
VIO
6
9
W2O
RxD2
7
8
INH2
TLE7259G
TLE7259-2GE
TLE7259-2GU
and other single LIN
transceivers
TLE7269G
Figure 14
Data Sheet
Pin configuration TLE7259-2GE, TLE7259-2GU, TLE7259G and TLE7269G
24
Rev. 1.5, 2013-07-26
TLE7259-2GE
Application Information
7.3
Master Termination
To achieve the required timings for the dominant to recessive transition of the bus signal an additional external
termination resistor of 1 kΩ is mandatory. It is recommended to place this resistor at the master node. To avoid
reverse currents from the bus line into the battery supply line it is recommended to place a diode in series with the
external pull-up. For small systems (low bus capacitance) the EMC performance of the system is supported by an
additional capacitor of at least 1 nF at the master node (see Figure 15 and Figure 16).The values for the Master
Termination resistor and the bus capacitances influence the performance of the LIN network. They depend on the
number of nodes inside the LIN network and on the parasitic cable capacitance of the LIN bus wiring.
7.4
External Capacitors
A capacitor of 10 μF at the supply voltage input VS buffers the input voltage. In combination with the required
reverse polarity diode this prevents the device from detecting a power down conditions in case of negative
transients on the supply line (see Figure 15 and Figure 16).
The 100 nF capacitor close to the VS pin of the TLE7259-2GE is required to get the best EMC performance.
Data Sheet
25
Rev. 1.5, 2013-07-26
TLE7259-2GE
Application Information
7.5
Application Example
VBat
22 µF
100 nF
VI
VQ
INH
10 µF
GND
100 nF
LIN
BUS
e.g. TLE4678
Master Node
VS
WK
INH
5 V or 3.3V
TLE7259-2GE
1 kΩ
Pull-Up to Micro
Controller Supply
RxD
TxD
BUS
100 nF
Micro Controller
e.g XC22xx
EN
GND
GND
1 nF
ECU1
22 µF
100 nF
VI
VQ
INH
10 µF
GND
100 nF
e.g. TLE4678
Slave Node
VS
WK
INH
5 V or 3.3V
TLE7259-2GE
1 kΩ
RxD
TxD
BUS
220 pF
Pull-Up to Micro
Controller Supply
EN
GND
100 nF
Micro Controller
e.g XC22xx
GND
ECUX
Figure 15
Data Sheet
Simplified Application Circuit with Bus Short to GND Feature applied
26
Rev. 1.5, 2013-07-26
TLE7259-2GE
Application Information
VBat
22 µF
100 nF
VI
VQ
INH
10 µF
GND
100 nF
LIN
BUS
e.g. TLE4678
Master Node
VS
WK
INH
5 V or 3.3V
TLE7259-2GE
1 kΩ
Pull-Up to Micro
Controller Supply
RxD
TxD
BUS
100 nF
Micro Controller
e.g XC22xx
EN
GND
GND
1 nF
ECU1
22 µF
100 nF
VI
VQ
INH
10 µF
GND
100 nF
e.g. TLE4678
Slave Node
VS
WK
INH
5 V or 3.3V
TLE7259-2GE
1 kΩ
RxD
TxD
BUS
220 pF
Pull-Up to Micro
Controller Supply
EN
GND
100 nF
Micro Controller
e.g XC22xx
GND
ECUX
Figure 16
Data Sheet
Simplified application Circuit without Bus Short to GND Feature
27
Rev. 1.5, 2013-07-26
TLE7259-2GE
Package Outlines
8
Package Outlines
0.1
2)
0.41+0.1
-0.06
0.2
8
5
1
4
5 -0.2 1)
M
0.19 +0.06
4 -0.2
C
B
8 MAX.
1.27
1.75 MAX.
0.175 ±0.07
(1.45)
0.35 x 45˚
1)
0.64 ±0.25
6 ±0.2
A B 8x
0.2
M
C 8x
A
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
GPS01181
Figure 17
PG-DSO-8 (Plastic Dual Small Outline PG-DSO-8-16)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
28
Dimensions in mm
Rev. 1.5, 2013-07-26
TLE7259-2GE
Revision History
9
Revision History
Revision
Date
Changes
1.5
2013-07-26
Editorial changes
1.4
2013-04-25
Data Sheet updated
Page: 19, 21:
• Parameter 6.1.32: Updated condition, corrected footnote in accordance with
LIN specification
• Parameter 6.1.33: Corrected footnote in accordance with LIN specification
1.3
2012-04-27
Data Sheet updated
• Cover page, change format
• Added references to LIN Specification 2.2A
Page: 17 - 21:
• Extended the device’s operating range, Table 4 and Table 6, from
7.0 V < VS < 27 V to 5.5 V < VS < 27 V
• Parameter 6.1.38 - Tightened parameter range, Min. 40 mA to Min. 70 mA
• New Parameter 6.1.54 - Duty cycle D1 specified for VS = 5.5 V to 7.0 V
• New Parameter 6.1.56 - Duty cycle D2 specified for VS = 6.1 V to 7.6 V
1.21
2010-06-21
Editorial changes
1.2
2010-04-12
Data Sheet updated
• Cover page, change format
• page 21, update table 6, pos 6.1.49
change min. limit from 6 ms to 8 ms
change typical value from 12 ms to 13 ms
1.1
2008-09-05
Data Sheet updated
Page: 19 - 22
• Change the temperature range at table 6, form -40 °C < Tj < 125°C to
-40 °C < Tj < 150°C
Page 19:
•
Parameter 6.1.7 - change Min. Limit from 1.3 mA to 1.7 mA
Page 21:
•
1.0
Data Sheet
2007-11-06
Parameter 6.1.42 - change the Max. Limit from 20 μΑ to 8 μA.
Data Sheet created
29
Rev. 1.5, 2013-07-26
Edition 2013-07-26
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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