TLE7368EXUMA2

TLE7368 Next Generation Microcontroller Supply 1 Overview Features • High efficient next generation microcontroller power supply system • Wide battery input voltage range < 4.5 V up to 45 V • Operating temperature range Tj = -40°C to +150°C • Pre-regulator for low all over power loss: Integrated current mode Buck converter 5.5 V/2.5 A • Post-regulators, e.g. for system and controller I/O supply: – LDO1: 5 V ±2%, 800 mA current limit – LDO2: 3.3 V ±2% or 2.6V ±2% (selectable output), 700 mA current limit • Integrated linear regulator control circuit to supply controller cores: – LDO3 control for an external NPN power stage: – 1.5 V ±2% at TLE7368E – 1.2 V ±2% at TLE7368-2E – 1.3 V ±2% at TLE7368-3E • Post-regulators for off board supply: – 2 Tracking regulators following the main 5 V, 105 mA and 50 mA • Stand-by regulator with lowest current consumption: – Linear voltage regulator as stand-by supply for e.g.memory circuits – Hardware selectable output voltages as 1.0 V or 2.6 V, 30 mA – Independent battery input, separated from Buck regulator input • Hardware controlled on/off logic • Undervoltage detection: – Undervoltage reset circuits with adjustable reset delay time at power up – Undervoltage monitoring circuit on stand-by supply • Window watchdog circuit • Overcurrent protection on all regulators • Power sequencing on controller supplies • Overtemperature shutdown • Package: Small exposed pad PG-DSO-36 • Green Product (RoHS compliant) Data Sheet www.infineon.com/dcdc 1 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Overview Potential application Microcontroller supply Product validation Qualified for automotive applications. Product validation according to AEC-Q100. Description The TLE7368 device is a multifunctional power supply circuit especially designed for Automotive powertrain systems using a standard 12 V battery. The device is intended to supply and monitor next generation 32-bit microcontroller families (13 µm lithography) where voltage levels such as 5 V, 3.3 V or 1.5/1.2/1.3 V are required. The regulator follows the concept of its predecessor TLE6368/SONIC, where the output of a pre-regulator feeds the inputs of the micro’s linear supplies. In detail, the TLE7368 cascades a Buck converter with linear regulators and voltage followers to achieve lowest power dissipation. This configuration allows to power the application even at high ambient temperatures. The step-down converter delivers a pre-regulated voltage of 5.5 V with a minimum peak current capability of 2.5 A. Supplied by this step down converter two low drop linear post-regulators offer 5 V and 3.3 V (2.6 V) with high accuracy. The current capability of the regulators is 800 mA and 700 mA. The 3.3 V (2.6 V) linear regulator does have its own input allowing to insert a dropper from the Buck output to reduce the on chip power dissipation if necessary. For the same reason, reduction of on chip power dissipation, the core supply (1.5 V, 1.2 V or 1.3 V) follows the concept of integrated control circuit with external power stage. Implementing the on board and microcontroller supplies in this way described, allows operation even at high ambient temperatures. The regulator system contains the so called power sequencing function which provides a controlled power up sequence of the three output voltages. In addition to the main regulators the inputs of two voltage trackers are connected to the 5.5 V Buck converter output voltage. Their protected outputs follow the main 5 V linear regulator with high accuracy and are able to drive loads of 50 mA and 105 mA. To monitor the output voltage levels of each of the linear regulators two independent undervoltage detection circuits are available. They can be used to implement the reset or an interrupt function. For energy saving reasons, e.g. while the motor is turned off, the TLE7368 offers a stand-by mode. The standby mode can be enabled and disabled either by battery or the microcontroller. In this stand-by mode just the stand-by regulator remains active and the current drawn from battery is reduced to a minimum for extended battery lifetime. A selection pin allows to configure the output voltages of the stand-by regulator to the application’s needs. The input of the stand-by regulator is separated from the high power input of the pre/post-regulator system. The TLE7368 is based on Infineon’s Power technology SPT™ which allows bipolar, CMOS and power DMOS circuitry to be integrated on the same monolithic chip/circuitry. Type Package Marking TLE7368E PG-DSO-36 TLE7368 E TLE7368-2E PG-DSO-36 TLE7368-2 E TLE7368-3E PG-DSO-36 TLE7368-3 E Data Sheet 2 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 3.1 3.2 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin Definitions and Functions TLE7368E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 4.1 4.2 4.3 4.4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 5.1 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 5.10 Detailed Internal Circuits Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Buck Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Buck Regulator Control Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High Side Driver Supply and 100% Duty Cycle Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electromagnetic Emission Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Charge Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Buck Converter Protection Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Linear Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Tracking Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Up and Power Down Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Stand-by Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Overtemperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Enable Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Monitoring Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 23 23 23 25 25 25 25 26 26 28 28 28 28 30 32 6 6.1 6.2 6.3 6.4 6.4.1 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Choosing Components for the Buck Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Setting up LDO1, LDO2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Setting up of LDO3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Setting up the Stand-by Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Stand-by Regulator’s Output Voltage Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 36 36 37 37 37 7 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Data Sheet 3 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Block Diagram 2 Block Diagram CCP C2+ C2C1+ C1- INT.BIASING, CHARGE PUMP BST IN PWM CONTROLLER 5.5V SW TLE 7368 FB/L_IN Q_T1 TEMPERATURE SENSE Q_T2 EN_µC EN_IGN ENABLE ≥1 Q_LDO1 5.0V RO_1 RT RO_2 WDI RESET (WINDOW COMPARATOR) TIMING RESET (WINDOW COMPARATOR) IN_LDO2 Q_LDO2 2.6/3.3V SEL_LDO2 1.5/ 1.2/ 1.3V DRV_EXT FB_EXT WINDOW WATCHDOG WDO Q_STBY IN_STBY 1.0/2.6V MON_STBY STANDBY MONITOR SEL_STBY GND_P GND_A Figure 1 Data Sheet Block Diagram 4 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Pin Configuration 3 Pin Configuration 3.1 Pin Assignment Figure 2 3.2 GND_A 1 36 GND_A RT 2 35 MON_STBY RO_1 3 34 IN_STBY RO_2 4 33 Q_STBY IN_LDO2 5 32 DRV_EXT Q_LDO2 6 31 FB_EXT Q_T1 7 30 Q_LDO1 Q_T2 8 29 FB/L_IN EN_uC 9 28 BST EN_IGN 10 27 SW SEL_STBY 11 26 SW C1- 12 25 WDO C2- 13 24 WDI C1+ 14 23 SEL_Q2 C2+ 15 22 IN CCP 16 21 IN GND_P 17 20 IN GND_A 18 19 GND_A TLE 7368 E Pin Configuration Pin Definitions and Functions TLE7368E Pin Symbol Function 1 GND_A Analog ground connection; Connect to heatslug resp. exposed pad. 2 RT Reset and watchdog timing pin; Connect a ceramic capacitor to GND to determine the time base for the reset delay circuits and the watchdog cycle time 3 RO_1 Reset output Q_LDO1; Open drain output, active low. Connect an external 10 kΩ pull-up resistor to microcontroller I/O voltage. 4 RO_2 Reset output Q_LDO2 and FB_EXT; Open drain output, active low. Connect an external 10 kΩ pull-up resistor to microcontroller I/O voltage 5 IN_LDO2 LDO2 input; Connect this pin straight to the Buck converter output or add a dropper in between to reduce power dissipation on the chip. Data Sheet 5 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Pin Configuration Pin Symbol Function 6 Q_LDO2 Voltage regulator 2 output; 3.3 V or 2.6 V, depending on the state of SEL_LDO2. Block to GND with capacitor close to the IC pins for stable regulator operation; selection of capacitor CQ_LDO2 according to Chapter 4.4 and Chapter 6. 7 Q_T1 Tracking regulator 1 output; Block to GND with capacitor close to the IC pins for stable regulator operation; selection of capacitor CQ_T1 according to Chapter 4.4 and Chapter 6. 8 Q_T2 Tracking regulator 2 output; Block to GND with capacitor close to the IC pins for stable regulator operation; selection of capacitor CQ_T2 according to Chapter 4.4 and Chapter 6. 9 EN_uC Enable input microcontroller; High level enables / low level disables the IC except the stand-by regulators; Integrated pull-down resistor 10 EN_IGN Enable input ignition line; High level enables / low level disables the IC except the stand-by regulators; Integrated pull-down resistor 11 SEL_STBY Selection input for stand-by regulator; Connect to GND to select 2.6 V output voltage for Q_STBY; Connect straight to Q_STBY to select 1.0 V output voltage for Q_STBY 12 C1- Charge pump negative #1; Connect a ceramic capacitor 100 nF, to C1+ 13 C2- Charge pump negative #2; Connect a ceramic capacitor 100 nF, toC2+ 14 C1+ Charge pump positive #1; Connect a ceramic capacitor 100 nF, to C1- 15 C2+ Charge pump positive #2; Connect a ceramic capacitor 100 nF, to C2- 16 CCP Charge pump output; Connect a ceramic capacitor, 220 nF, to GND; Used for internal IC supply, do not use for other circuitry. 17 GND_P Power ground; Exclusive GND connection of charge pump; Connect this pin to the power ground star point on the PCB. 18, 19 GND_A Analog ground connection; Connect to exposed pad. 20, 21, 22 IN Buck regulator input; Connect to a pi-filter (or if not used to battery) with short lines; connect filter capacitors in any case with short lines; connect a small ceramic directly at the pin; For details refer to Chapter 6. Interconnect the pins. 23 SEL_LDO2 Selection input LDO2; Connect to GND to select 2.6 V output voltage for LDO2; Connect straight to Q_LDO2 to select 3.3 V output voltage for LDO2. Data Sheet 6 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Pin Configuration Pin Symbol Function 24 WDI Window Watchdog input; Apply a watchdog trigger signal to this pin 25 WDO Window Watchdog output; Open drain output, active low, connect external 10 kΩ pull-up resistor to microcontroller I/O voltage 26, 27 SW Buck power stage’s output; Connect both pins directly, on short lines, to the Buck converter circuit, i.e. the catch diode and the Buck inductance 28 BST Bootstrap driver supply input; Connect the buck power stage’s driver supply capacitor to the SW pins; For capacitor selection please refer to Chapter 6. 29 FB/L_IN Buck converter feedback input plus input for LDO1 and trackers; Connect the output of the buck converter circuit with short lines to these pins; For Buck output capacitor selection please refer to Chapter 6. 30 Q_LDO1 Voltage regulator 1 output; 5 V output; Block to GND with capacitor close to the IC pins for stable regulator operation; Selection of capacitor CQ_LDO1 according to Chapter 4.4 and Chapter 6. 31 FB_EXT External regulator feedback input; Feedback input of control loop for the external power stage regulator. Connect to the emitter of the regulating transistor; Block to GND with capacitor close to the IC pins for stable regulator operation; Selection of capacitor CQ_FB_EXT according to Chapter 4.4 and Chapter 6. 32 DRV_EXT Bipolar power stage driver output; Connect the base of an external NPN transistor directly to this pin; Regarding choice of the external power stage refer to Chapter 6. 33 Q_STBY Stand-by regulator output; Output voltage depending on the state of SEL_STBY; Block to GND with capacitor close to the IC pins for stable regulator operation; Selection of capacitor CQ_STBY according to Chapter 4.4 and Chapter 6. 34 IN_STBY Input to stand-by regulator; Always connect the reverse polarity protected battery line to this pin; Input to all IC internal biasing circuits; Block to GND directly at the IC with ceramic capacitor; For proper choice of input capacitors please refer to Chapter 6. 35 MON_STBY Monitoring output for stand-by regulator; power fail active low output with special timing, open drain, connect external pull-up resistor. 36 GND_A Data Sheet Analog ground connection; Connect to exposed pad. 7 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics 4 General Product Characteristics 4.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings1), Tj = -40°C to +150°C; all voltages with respect to ground. Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number Stand-by Regulator Input IN_STBY Voltage VIN_STBY -0.3 – 45 V – P_4.1.1 Current IIN_STBY – – – A Limited internally P_4.1.2 Voltage VSEL_STBY -0.3 – 5.5 V – P_4.1.3 Voltage VSEL_STBY -0.3 – 6.2 V t < 10 s2) P_4.1.4 Current ISEL_STBY – – – A Limited internally P_4.1.5 Voltage VIN VSW - 0.3 – 45 V – P_4.1.6 Voltage VIN -0.3 – 45 V – P_4.1.7 Current IIN – – – A Limited internally P_4.1.8 Voltage VWDI -0.3 – 5.5 V – P_4.1.9 Voltage VWDI -0.3 – 6.2 V t < 10 s2) P_4.1.10 Current IWDI – – – A Limited internally P_4.1.11 Voltage VWDO -0.3 – 5.5 V – P_4.1.12 Voltage VWDO -0.3 – 6.2 V t < 10 s P_4.1.13 Current IWDO – – – A Limited internally P_4.1.14 Selection Input SEL_STBY Buck Regulator Inputs IN Watchdog Input WDI Watchdog Output WDO 2) Charge Pump Positive C Voltage VC -0.3 – 18 V – P_4.1.15 Current IC – – – mA – P_4.1.16 Charge Pump Negative C Voltage VC -0.3 – 5.5 V – P_4.1.17 Current IC – – – mA – P_4.1.18 Voltage VCCP -0.3 – 18 V – P_4.1.19 Current ICCP – – – mA – P_4.1.20 Voltage VRO_1 -0.3 – 5.5 V – Voltage VRO_1 V t < 10 s Charge Pump Output CCP Reset Output RO_1 Data Sheet -0.3 – 6.2 8 P_4.1.21 2) P_4.1.22 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 1 Absolute Maximum Ratings1), Tj = -40°C to +150°C; all voltages with respect to ground. Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. IRO_1 – – – A Limited internally P_4.1.23 Voltage VRO_2 -0.3 – 5.5 V – P_4.1.24 Voltage VRO_2 -0.3 – 6.2 V t < 10 s P_4.1.25 Current IRO_2 – – – A Limited internally P_4.1.26 Voltage VRT -0.3 – 5.5 V – P_4.1.27 Voltage VRT -0.3 – 6.2 V t < 10 s P_4.1.28 Current IRT – – – A Limited internally P_4.1.29 Current Reset Output RO_2 2) Reset Timing RT 2) Tracking Regulator Outputs Q_T Voltage VQ_T -5 – 40 V VFB/L_IN = 5.5V P_4.1.30 Voltage VQ_T -5 – 35 V off mode; VFB/L_IN = 0V P_4.1.31 Current IQ_T – – – A Limited internally P_4.1.32 Voltage VEN_IGN -0.3 – 45 V – P_4.1.33 Current IEN_IGN – – – mA – P_4.1.34 Voltage VEN_uC -0.3 – 5.5 V – P_4.1.35 Voltage VEN_uC -0.3 – 6.2 V t < 10 s2) P_4.1.36 Current IEN_uC -5 – 5 mA – P_4.1.37 Enable Ignition EN_IGN Enable Micro EN_uC Voltage Regulator Outputs Q_LDO Voltage VQ_LDO1 -0.3 – VFB/L_IN + V 0.3 – P_4.1.38 Voltage VQ_LDO2 -0.3 – VIN_LDO2 + 0.3 V – P_4.1.39 Voltage VQ_LDO -0.3 – 5.5 V – Voltage VQ_LDO -0.3 – 6.2 V t < 10 s P_4.1.41 Current IQ_LDO – – – A Limited internally P_4.1.42 Voltage VSEL_LDO2 -0.3 – 5.5 V – P_4.1.43 Voltage VSEL_LDO2 -0.3 – 6.2 V t < 10 s P_4.1.44 Current ISEL_LDO2 – – – A Limited internally P_4.1.45 -0.3 – 5.5 V – P_4.1.46 P_4.1.40 2) Selection Input SEL_LDO2 2) External Driver Output DRV_EXT Voltage VDRV_EXT Voltage VDRV_EXT -0.3 – 6.2 V t < 10 s P_4.1.47 Current IDRV_EXT – – – A Limited internally P_4.1.48 Data Sheet 9 2) Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 1 Absolute Maximum Ratings1), Tj = -40°C to +150°C; all voltages with respect to ground. Parameter Symbol Values Min. Typ. Max. – 5.5 Unit Note or Test Condition Number V – P_4.1.49 External Regulator Feedback Input FB_EXT Voltage VFB_EXT Voltage VFB_EXT -0.3 – 6.2 V t < 10 s P_4.1.50 Current IFB_EXT – – – A Limited internally P_4.1.51 -0.3 2) Feedback and Post-Regulators Input FB/L_IN Voltage VFB/L_IN VQ_LDO1 - – 0.3 18 V – P_4.1.52 Voltage VFB/L_IN -0.3 – 18 V – P_4.1.53 Current IFB/L_IN – – – A Limited internally P_4.1.54 Linear Regulator 2 Input IN_LDO2 Voltage VIN_LDO2 VQ_LDO2 - – 0.3 18 V – P_4.1.55 Voltage VIN_LDO2 -0.3 – 18 V – P_4.1.56 Current IIN_LDO2 – – – A Limited internally P_4.1.57 Voltage VBST VSW - 0.3 – VSW + 5.5 V – P_4.1.58 Voltage VBST -0.3 – 51 V – P_4.1.59 Current IBST – – – A Limited internally P_4.1.60 Voltage VSW -2 – VIN + 0.3 V – P_4.1.61 Voltage VSW -2 – 45 V – P_4.1.62 Current ISW – – – A Limited internally P_4.1.63 Bootstrap Supply BST Buck Power Stage SW Stand-by Regulator Output Q_STBY Voltage VQ_STBY -0.3 – 5.5 V – P_4.1.64 Voltage VQ_STBY -0.3 – 6.2 V t < 10 s2) P_4.1.65 Current IQ_STBY – – – A Limited internally P_4.1.66 -0.3 – 5.5 V – P_4.1.67 Monitoring Output MON_STBY Voltage VMON_STBY Voltage VMON_STBY -0.3 – 6.2 V t < 10 s P_4.1.68 Current IMON_STBY – – – A Limited internally P_4.1.69 Junction Temperature Tj -40 – 150 °C – P_4.1.70 Storage Temperature Tstg -50 – 150 °C – P_4.1.71 -2 – 2 kV Human Body Model P_4.1.72 (HBM)3) 2) Temperatures ESD-Protection (Human Body Model) Electrostatic discharge voltage Data Sheet VESD 10 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 1 Absolute Maximum Ratings1), Tj = -40°C to +150°C; all voltages with respect to ground. Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. VESD -500 – 500 V Charged Device Model (CDM)4) P_4.1.73 Electrostatic discharge VESD voltage, corner pins to GND -750 – 750 V Charged Device Model (CDM)4) P_4.1.74 ESD-Protection (Charged Device Model) Electrostatic discharge voltage to GND 1) 2) 3) 4) Not subject to production test, specified by design. Exposure to those absolute maximum ratings for extended periods of time (t > 10 s) may affect device reliability. According to JEDEC standard EIA/JESD22-A114-B (1.5 kΩ, 100 pF) According to EIA/JESD22-C101 or ESDA STM5.3.1 Notes 1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. 4.2 Table 2 Functional Range Functional Range Parameter Symbol Values Min. Typ. Max. 3.0 – 45 Unit Note or Test Condition Number V 1) P_4.2.1 1) P_4.2.2 Stand-by input voltage VIN_STBY Buck input voltage VIN 4.5 – 45 V Peak to peak ripple voltage at FB/L_IN VFB/L_IN 0 – 150 mVpp – P_4.2.3 Junction temperature Tj -40 – 150 °C P_4.2.4 – 1) At minimum battery voltage regulators with higher nominal output voltage will not be able to provide the full output voltage. Their outputs follow the battery with certain drop. Note: Data Sheet Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 11 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics 4.3 Table 3 Thermal Resistance Thermal Resistance Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number PG-DSO-36 Junction to ambient RthJA – 54 – K/W Footprint only1) P_4.3.5 Junction to ambient RthJA – 42 – K/W Heat sink area 300mm2 1) P_4.3.6 Junction to ambient RthJA – 35 – K/W Heat sink area 600mm2 1) P_4.3.7 Junction to case RthJC – 5.6 – K/W – P_4.3.8 1) Worst case regarding peak temperature; zero airflow; mounted on FR4; 80 × 80 × 1.5 mm3; 35 µm Cu; 5 µm Sn 4.4 Electrical Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. Parameter Symbol Values Min. Typ. Max. 280 370 425 Unit Note or Test Condition Number kHz – P_4.4.1 Buck Regulator Switching frequency f Current transition rise/fall time tr, I – 50 – ns 1) Power stage on resistance RON, Buck – – 280 mΩ – Power stage peak current limit Ipeak, SW 2.5 – 4.6 A VIN = 5.0 V; P_4.4.4 VSW ramped down from 5.0 V to 3.7 V; VFB/L_IN = 5.0 V Buck converter output VFB/L_IN voltage 5.4 – 6.0 V IBuck = 2.0 A2) P_4.4.5 Buck converter output VFB/L_IN voltage 5.4 – 6.4 V IBuck = 100 mA2) P_4.4.6 Buck converter, turn on VIN, on threshold – – 4.5 V VIN increasing P_4.4.7 Buck converter, turn off VIN, off threshold 3.5 – – V VIN decreasing P_4.4.8 450 500 550 mV VIN, hyst = VIN, on - VIN, off P_4.4.9 Buck converter On/off hysteresis Data Sheet VIN, hyst 12 ; slope magnitude 1 A; fixed P_4.4.2 internally P_4.4.3 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. – VSW + V 5.0 Bootstrap voltage increasing P_4.4.10 Bootstrap undervoltage lockout, turn on threshold VBST_UV, on – Bootstrap undervoltage lockout, turn off threshold VBST_UV, off VSW + – 3.2 – V Bootstrap voltage decreasing P_4.4.11 Bootstrap undervoltage lockout, hysteresis VBST_UV, hyst 0.2 – 1 V VBST_UV, hyst = VBST_UV, on - VBST_UV, off P_4.4.12 Charge pump voltage VCCP 9 – 15 V CC1 = 100 nF; CC2 = 100 nF; CCCP = 220 nF P_4.4.13 Charge pump voltage VCCP 9 – 13.5 V VIN = 4.5 V; CC1 = 100 nF; CC2 = 100 nF; CCCP = 220 nF P_4.4.14 1.0 – 2.5 MHz – V Charge Pump Charge pump switching fCCP frequency P_4.4.15 Voltage Regulator Q_LDO1 Output voltage VQ_LDO1 4.9 – 5.1 Output current limitation IQ_LDO1, lim 800 – Drop voltage Vdr, Q_LDO1 – Drop voltage Vdr, Q_LDO1 Load regulation ∆VQ_LDO1 Power supply ripple rejection 1 mA < IQ_LDO1 < 700 mA3) P_4.4.16 1600 mA VQ_LDO1 = 4.0 V P_4.4.17 – 400 mV IQ_LDO1 = 500 mA; VFB/L_IN = 5.0 V;3) 4) P_4.4.18 – – 400 mV IQ_LDO1 = 250 mA; VIN = 4.5 V;3) 4) P_4.4.19 – 60 120 mV/A – PSRRQ_LD O1 26 – – dB VFB/L_IN = 5.6 V; VFB/L_IN, ripple pp = 150 mV; fFB/L_IN, ripple = 370 kHz; IQ_LDO1 = 250 mA; CQ_LDO1 = 4.7 µF, X7R1) P_4.4.21 Output capacitor CQ_LDO1 – 470 µF 1) 5) P_4.4.22 Output capacitor ESR CQ_LDO1 – 1 P_4.4.20 1) – 2 Ω at 10 kHz – 3.37 V SEL_LDO2 = Q_LDO2; IN_LDO2 = FB/L_IN; 1 mA < IQ_LDO2 < 500 mA P_4.4.23 Voltage Regulator Q_LDO2 Output voltage Data Sheet VQ_LDO2 3.23 13 P_4.4.24 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Number Output current limitation IQ_LDO2, lim 700 – 1400 mA SEL_LDO2 = Q_LDO2; IN_LDO2 = FB/L_IN; VQ_LDO2 = 2.8 V P_4.4.25 Drop voltage Vdr, Q_LDO2 – – 400 mV SEL_LDO2 = Q_LDO2; VCCP = 9 V; IQ_LDO2 = 500 mA;4) 6) P_4.4.26 Drop voltage Vdr, Q_LDO2 – – 400 mV SEL_LDO2 = Q_LDO2; VCCP = 9 V; IQ_LDO2 = 250 mA; VIN = 4.5 V; 4)6) P_4.4.27 Load regulation ∆VQ_LDO2 – – 80 mV/A 3.3 V mode 1 mA < IQ_LDO2 < 650 mA P_4.4.28 Output voltage VQ_LDO2 2.56 – 2.67 V SEL_LDO2 = GND; IN_LDO2 = FB/L_IN; 1 mA < IQ_LDO2 < 500 mA P_4.4.29 Output current limitation IQ_LDO2, lim 700 – 1400 mA SEL_LDO2 = GND; IN_LDO2 = FB/L_IN; VQ_LDO2 = 2.0 V P_4.4.30 Drop voltage Vdr, Q_LDO2 – – 400 mV SEL_LDO2 = GND; VCCP = 9 V; IQ_LDO2 = 500 mA;4)6) P_4.4.31 Drop voltage Vdr, Q_LDO2 – – 400 mV SEL_LDO2 = GND; VCCP = 9 V; IQ_LDO2 = 250 mA; VIN = 4.5 V;4)6) P_4.4.32 Load regulation ∆VQ_LDO2 – – 65 mV/A 2.6 V mode 1 mA < IQ_LDO2 < 650 mA Power supply ripple rejection PSRRQ_LDO2 26 – – dB VIN_LDO2 = 5.6 V; P_4.4.34 VIN_LDO2, ripple pp = 150 mV; fIN_LDO2, ripple = 370 kHz; IQ_LDO2 = 250mA; CQ_LDO2 = 4.7 µF ceramic X7R1) Selector Pull-down resistor RSEL_LDO2 0.7 1.2 1.9 MΩ – Output capacitor CQ_LDO2 1 – 470 µF 1)5) Output capacitor ESR CQ_LDO2 – – 2 Ω at 10 kHz; P_4.4.33 P_4.4.35 P_4.4.36 1) P_4.4.37 External Voltage Regulator Control Driver current limit IDRV_EXT, lim 75 – 150 mA TLE7368E VFB_EXT = 1.2 V P_4.4.38 Driver current limit IDRV_EXT, lim 75 – 150 mA TLE7368-2E VFB_EXT = 0.9V P_4.4.39 Data Sheet 14 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number Driver current limit IDRV_EXT, lim 75 – 150 mA TLE7368-3E VFB_EXT = 1.0V P_4.4.40 Feedback voltage VFB_EXT 1.505 – 1.55 V TLE7368E P_4.4.41 Feedback voltage VFB_EXT 1.19 – 1.23 V TLE7368-2E P_4.4.42 Feedback voltage VFB_EXT 1.30 – 1.34 V TLE7368-3E P_4.4.43 Feedback input current IFB_EXT -250 – – µA – P_4.4.44 Load regulation ∆VFB_EXT – – 20 mV/A VFB/L_IN = 5.4 V; VCCP = 9.0 V; IQ_LDO3 = 100 µA to 1 A;7) Output capacitor CFB_EXT 4.7 – – µF ESR CFB_EXT 0.006 – 0.1 Ω at 1 MHz;2) P_4.4.47 -10 – 10 mV 0 mA < IQ_T1 < 105 mA P_4.4.48 Output capacitor 2)5)7) P_4.4.45 P_4.4.46 IQ_LDO3 = 1 A Voltage Tracker Q_T1 Output voltage tracking ∆VQ_T1 accuracy to Q_LDO1 Output current limitation IQ_T1 120 – 240 mA VQ_T1 = 4.0 V P_4.4.49 Drop voltage Vdr, Q_T1 – – 400 mV IQ_T1 = 105 mA; VFB/L_IN = 5.3 V; VQ_LDO1 = 5.0 V4) P_4.4.50 Power supply ripple rejection PSRRQ_T1 26 – – dB VFB/L_IN = 5.6 V; VFB/L_IN, ripple pp = 150 mV; fFB/L_IN, ripple = 370 kHz; VQ_LDO1 = 5.0 V; IQ_T1 = 100 mA; CQ_T1 = 4.7 µF ceramic X7R;1) P_4.4.51 Output capacitor CQ_T1 4.7 – – µF 1)5) P_4.4.52 Output capacitor ESR CQ_T1 1) P_4.4.53 – – 3 Ω at 10 kHz; -10 – 10 mV 0 mA < IQ_T2 < 50 mA; P_4.4.54 Voltage Tracker Q_T2 Output voltage tracking ∆VQ_T2 accuracy to Q_LDO1 Output current limitation IQ_T2 60 – 110 mA VQ_T2 = 4.0 V P_4.4.55 Drop voltage Vdr, Q_T2 – – 400 mV IQ_T2 = 50 mA; VFB/L_IN = 5.3 V; VQ_LDO1 = 5.0 V4) P_4.4.56 Data Sheet 15 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Number Power supply ripple rejection PSRRQ_T2 26 – – dB VFB/L_IN = 5.6 V; VFB/L_IN, ripple pp = 150 mV; fFB/L_IN, ripple = 370 kHz; VQ_LDO1 = 5.0 V; IQ_T2 = 40 mA; CQ_T2 = 4.7 µF ceramic X7R;1) P_4.4.57 Output capacitor CQ_T2 4.7 – – µF 1)5) P_4.4.58 Output capacitor ESR CQ_T2 – – 3 Ω at 10 kHz; Output voltage VQ_STBY 0.93 1.02 1.08 V VIN_STBY > 3 V; 100 µA < IQ_STBY < 10 mA; SEL_STBY = Q_STBY P_4.4.60 Output voltage VQ_STBY 0.93 1.02 1.08 V VIN_STBY > 4.5 V; IQ_STBY = 30 mA; SEL_STBY = Q_STBY P_4.4.61 Output voltage VQ_STBY 2.51 2.62 2.73 V VIN_STBY > 3.0 V; 100 µA < IQ_STBY < 10 mA; SEL_STBY = GND P_4.4.62 Selector pull-up current ISEL_STBY -2 -5 -10 µA SEL_STBY = GND P_4.4.63 Output current limitation IQ_STBY, lim 31 – 90 mA VQ_ STBY = 0.5 V P_4.4.64 Load regulation ∆VQ_ STBY – – 5 V/A IQ_STBY = 100µA to 10 mA VIN_STBY > 4.5 V; SEL_STBY = Q_STBY VQ_STBY = 1.0V P_4.4.65 – – 10 V/A IQ_STBY = 100µA to 10 mA VIN_STBY > 4.5 V; SEL_STBY = GND VQ_STBY = 2.6V 1) P_4.4.59 Stand-by Regulator Line regulation ∆VQ_ STBY – – 5 mV/V – Power supply ripple rejection PSRRQ_STBY 60 – – dB VIN_STBY, ripple pp = 500 mV; fIN_STBY, ripple = 100 Hz; IQ_STBY = 5 mA; CQ_STBY = 1 µF ceramic X7R;1) P_4.4.67 Output capacitor CQ_STBY 0.47 – 2 µF 1) 5) P_4.4.68 Output capacitor ESR CQ_STBY – – P_4.4.66 1) 0.5 Ω at 10 kHz; 4.0 V Device operating P_4.4.69 Device Enable Blocks and Quiescent Current Ignition turn on threshold Data Sheet VEN_IGN, on – – 16 P_4.4.70 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Number Ignition turn off threshold VEN_IGN, off 2.0 – – V Only stand-by regulators are P_4.4.71 active if VEN_IGN < VEN_IGN, off and VEN_uC < VEN_uC, off Ignition pull-down resistor current IEN_IGN -100 – – µA VEN_IGN = 13.5 V P_4.4.72 Turn on threshold VEN_uC, on – – 2.0 V Device operating P_4.4.73 Turn off threshold VEN_uC, off 0.8 – – V Only stand-by regulators are P_4.4.74 active if VEN_IGN < VEN_IGN, off and VEN_uC < VEN_uC, off Pull-down resistor current IEN_uC -30 – – µA VEN_uC = 5 V P_4.4.75 Quiescent current Iq = IIN_STBY - -120 IQ_STBY – – µA VEN_uC = VEN_IGN = 0 V; SEL_STBY = Q_STBY; MON_STBY = H; IQ_STBY = 100 µA; Tj < 125 °C P_4.4.76 Quiescent current Iq = IIN_STBY - -130 IQ_STBY – – µA VEN_uC = VEN_IGN = 0 V; SEL_STBY = GND; MON_STBY = H; IQ_STBY = 100 µA; Tj < 125 °C P_4.4.77 Quiescent current Iq, IN – – µA VEN_uC = VEN_IGN = 0 V; VIN_STBY = 0 V; Tj < 125 °C P_4.4.78 4.50 – 4.75 V VQ_LDO1 decreasing; VFB/L_IN = open; P_4.4.79 Undervoltage Reset threshold on Q_LDO1 VURT Q_LDO1, in 4.55 – 4.90 V VQ_LDO1 increasing P_4.4.80 Undervoltage Reset hysteresis VURO_1, hyst 100 – 220 mV – P_4.4.81 Overvoltage Reset threshold on Q_LDO1 VORT Q_LDO1, in 5.40 – 5.65 V VQ_LDO1 increasing P_4.4.82 Overvoltage Reset threshold on Q_LDO1 VORT Q_LDO1, 5.25 – 5.60 V VQ_LDO1 decreasing P_4.4.83 80 – 180 mV – P_4.4.84 RO_1, Reset output low VRO_1, low voltage – – 0.4 V IRO_1 = -10 mA; VQ_LDO1 > 2.5 V P_4.4.85 RO_1, Reset output low VRO_1, low voltage – – 0.25 V VIN_STBY = 3.0 V; VQ_LDO1 = 2.5V; IRO_1 = -500 µA; P_4.4.86 -10 Reset Generator RO_1 Monitoring Q_LDO1 Undervoltage Reset threshold on Q_LDO1 Overvoltage Reset hysteresis Data Sheet VURT Q_LDO1, de de VORO_1, hyst 17 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Number RO_1, Reset output leakage IRO_1, high -1 – 1 µA VRO_1 = 5.0 V P_4.4.87 Reset delay time base Tcycle 41.6 50 62.5 µs CRT = 1 nF P_4.4.88 Reset timing capacitor range CRT 0.33 1.0 4.7 nF – P_4.4.89 Reset delay time RO_1 tRD, RO_1 – 160 – Tcycle – P_4.4.90 Undervoltage Reset reaction time tUVRR, RO_1 2 – 10 µs Voltage step at Q_LDO1 from P_4.4.91 5.00 V to 4.48 V Overvoltage Reset reaction time tOVRR, RO_1 20 – 80 µs Buck converter operating; P_4.4.92 Voltage step at Q_LDO1 from 5.00 V to 5.67 V Reset Generator RO_2 Monitoring Q_LDO2 and FB_EXT Undervoltage Reset threshold on Q_LDO2 Undervoltage Reset headroom on Q_LDO2 VURT Q_LDO2, 3.135 – 3.230 V de VURT Q_LDO2, SEL_LDO2 = Q_LDO2; VQ_LDO2 decreasing; VIN_LDO2 = open P_4.4.93 55 117.5 – mV SEL_LDO2 = Q_LDO2; VURT Q_LDO2, head = VQ_LDO2 - VURT Q_LDO2, de; VQ_LDO2 @ IQ_LDO2 = 500 mA P_4.4.94 15 – 55 mV SEL_LDO2 = Q_LDO2; VURO_2, hyst = VURT Q_LDO2, in - VURT Q_LDO2, de P_4.4.95 head Undervoltage Reset hysteresis Q_LDO2 VURO_2, hyst Overvoltage Reset threshold on Q_LDO2 VORT Q_LDO2, in 3.70 – 3.85 V SEL_LDO2 = Q_LDO2; VQ_LDO2 increasing P_4.4.96 Overvoltage Reset threshold on Q_LDO2 VORT Q_LDO2, 3.55 – 3.80 V SEL_LDO2 = Q_LDO2; VQ_LDO2 decreasing P_4.4.97 – 200 mV SEL_LDO2 = Q_LDO2; P_4.4.98 de Overvoltage Reset hysteresis VORO_2, hyst 50 Undervoltage Reset threshold on Q_LDO2 VURT Q_LDO2, 2.470 – 2.560 V SEL_LDO2 = GND; VQ_LDO2 decreasing; VIN_LDO2 = open P_4.4.99 47 – – mV SEL_LDO2 = GND; VURT Q_LDO2, head = VQ_LDO2 - VURT Q_LDO2, de; VQ_LDO2 @ IQ_LDO2 = 500 mA P_4.4.100 15 – 60 mV SEL_LDO2 = GND; VURO_2, hyst = VURT Q_LDO2, in - VURT Q_LDO2, de P_4.4.101 – 3.0 V SEL_LDO2 = GND; VQ_LDO2 increasing P_4.4.102 Undervoltage Reset headroom on Q_LDO2 de VURT Q_LDO2, head Undervoltage Reset hysteresis Q_LDO2 VURO_2, hyst Overvoltage Reset threshold on Q_LDO2 VORT Q_LDO2, in 2.85 Data Sheet 18 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Overvoltage Reset threshold on Q_LDO2 Symbol VORT Q_LDO2, Values Unit Note or Test Condition Number Min. Typ. Max. 2.73 – 2.95 V SEL_LDO2 = GND; VQ_LDO2 decreasing P_4.4.103 50 – 120 mV SEL_LDO2 = GND; P_4.4.104 de Overvoltage Reset hysteresis Q_LDO2 VORO_2, hyst Undervoltage Reset threshold on FB_EXT VURT FB_EXT, de 1.425 – 1.480 V TLE7368E VFB_EXT decreasing; VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V P_4.4.105 Undervoltage Reset headroom on FB_EXT VFB_EXT - VURT 40 60 – mV TLE7368E VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V; VFB_EXT @ IQ_LDO3 = 1 A P_4.4.106 – 45 mV TLE7368E P_4.4.107 FB_EXT, de Undervoltage Reset hysteresis FB_EXT VURO_2, hyst Overvoltage Reset threshold on FB_EXT VORT FB_EXT, in 1.65 – 1.72 V TLE7368E VFB_EXT increasing P_4.4.108 Overvoltage Reset threshold on FB_EXT VORT FB_EXT, de 1.55 – 1.67 V TLE7368E VFB_EXT decreasing P_4.4.109 Overvoltage Reset hysteresis FB_EXT VORO_2, hyst – 120 mV TLE7368E P_4.4.110 Undervoltage Reset threshold on FB_EXT VURT FB_EXT, de 1.08 – 1.15 V TLE7368-2E VFB_EXT decreasing; VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V; P_4.4.111 Undervoltage Reset headroom on FB_EXT VFB_EXT - VURT 40 60 – mV TLE7368-2E VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V; P_4.4.112 – 45 mV TLE7368-2E P_4.4.113 15 50 FB_EXT, de Undervoltage Reset hysteresis VURO_2, hyst Overvoltage Reset threshold on FB_EXT VORT FB_EXT, in 1.30 – 1.39 V TLE7368-2E VFB_EXT increasing; P_4.4.114 Overvoltage Reset threshold on FB_EXT VORT FB_EXT, de 1.23 – 1.38 V TLE7368-2E VFB_EXT decreasing; P_4.4.115 Overvoltage Reset hysteresis VORO_2, hyst – 70 mV TLE7368-2E P_4.4.116 Undervoltage Reset threshold on FB_EXT VURT FB_EXT, de 1.17 – 1.25 V TLE7368-3E VFB_EXT decreasing; VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V; P_4.4.117 Data Sheet 15 10 19 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Min. Undervoltage Reset headroom on FB_EXT VFB_EXT - VURT 40 Unit Note or Test Condition Number Typ. Max. 60 – mV TLE7368-3E VFB/L_IN = 5 V or VQ_LDO2 = 3.3/2.6 V; P_4.4.118 – 45 mV TLE7368-3E P_4.4.119 – 1.43 V TLE7368-3E VFB_EXT increasing; P_4.4.120 FB_EXT, de Undervoltage Reset hysteresis VURO_2, hyst Overvoltage Reset threshold on FB_EXT VORT FB_EXT, in 1.35 15 RO_2, Reset output low VRO_2, low voltage – – 0.4 V IRO_2 = -10 mA; VQ_LDO2 > 2.0 V P_4.4.121 RO_2, Reset output low VRO_2, low voltage – – 0.25 V IRO_2 = -500 µA; VQ_LDO2 = 1V P_4.4.122 VRO_2 = 5.0 V P_4.4.123 RO_2, Reset output leakage IRO_2, high -1 – 1 µA Reset delay time RO_2 tRD, RO_2 – 160 – Tcycle – Undervoltage Reset reaction time tUVRR, RO_2 2 – 10 µs Voltage step on Q_LDO2 from P_4.4.125 VQ_LDO2, nom to VURT Q_LDO2, de, min - 20 mV Undervoltage Reset reaction time tUVRR, RO_2 2 – 10 µs Voltage step on FB_EXT from P_4.4.126 VFB_EXT, nom to VURT FB_EXT, de, min - 20 mV Overvoltage Reset reaction time tOVRR, RO_2 20 – 80 µs Buck converter operating; P_4.4.127 Voltage step on Q_LDO2 from VQ_LDO2, nom to VORT Q_LDO2, in, max + 20 mV Overvoltage Reset reaction time tOVRR, RO_2 20 – 80 µs Buck converter operating; P_4.4.128 Voltage step on FB_EXT from VFB_EXT, nom to VORT FB_EXT, in, max + 20 mV Data Sheet 20 P_4.4.124 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Min. Unit Note or Test Condition Number Typ. Max. – – V VIN_STBY = 3.0 V; SEL_STBY = Q_STBY; VQ_STBY decreasing; P_4.4.129 – – mV VIN_STBY = 3.0 V; SEL_STBY = Q_STBY; VQ_STBY decreasing; P_4.4.129a – 30 mV SEL_STBY = Q_STBY P_4.4.130 – 2.50 V VIN_STBY = 3.0 V; SEL_STBY = GND; VQ_STBY decreasing; P_4.4.131 20 – 50 mV SEL_STBY = GND P_4.4.132 – – 0.4 V IMON_STBY1 < 10 mA; VIN_STBY > 3.0 V P_4.4.133 – 8 – tRD, P_4.4.134 RO_1 see diagram in section “Monitoring Circuit” on Page 30 µs – P_4.4.135 Monitoring Block VMON, Q_STBY, 0.90 MON_STBY, Threshold on Q_STBY de MON_STBY headroom VMON, Q_STBY, 10 head MON_STBY hysteresis VMON_STBY, 10 hyst VMON, Q_STBY, 2.36 MON_STBY, Threshold on Q_STBY de MON_STBY hysteresis VMON_STBY, hyst MON_STBY, Monitoring VMON_ STBY, output low voltage low MON_STBY time delay Monitor reaction time Data Sheet tMON_ STBY tRR, MON_STBY 3 – 6 21 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply General Product Characteristics Table 4 Electrical Characteristics, VIN = VIN_STBY = 13.5 V, Tj = -40°C to +150°C, VCCP = 9.0 V; SEL_STBY = Q_STBY; all voltages with respect to ground. (cont’d) Parameter Symbol Values Min. Typ. Max. Unit Note or Test Condition Number Window Watchdog H-input voltage threshold VWDI, high – – 2.0 V – P_4.4.136 L-input voltage threshold VWDI, low 0.8 – – V – P_4.4.137 WDI pull-up resistor RWDI 60 100 140 kΩ connected to Q_LDO2 P_4.4.138 Watchdog cycle time TWD – 2 – Tcycle – P_4.4.139 Window duration (OW, tWD, W CW, FW) – 512 – TWD – P_4.4.140 Window duration (IW) tWD, IW – 32 – TWD – P_4.4.141 Window watchdog initialization time tWD, start – 32 – TWD Watchdog will P_4.4.142 start/initialized if WDI is kept low for this period and RO_2 is released Watchdog output low voltage VWDO,low – – 0.4 V IWDO = 2 mA P_4.4.143 Watchdog output leakage current IWDO,leak – – 1 µA WDO state = High P_4.4.144 Overtemperature shutdown Tj, shtdwn 160 175 190 °C 1) 8) P_4.4.145 Overtemperature shutdown hysteresis ∆T 15 – 30 K 1) P_4.4.146 Thermal Shutdown 1) 2) 3) 4) 5) 6) 7) 8) Specified by design, not subject to production test. Tested according to measurement figure 10, application diagram VCCP supplied externally with a voltage according to the actual value of VCCP measurement. Vdr, Q_LDO1 = VFB/L_IN - VQ_LDO1; Vdr, Q_LDO2 = VIN_LDO2 - VQ_LDO2; Vdr, T = VFB/L_IN - VQ_T Minimum value given is needed for regulator stability; application might need higher capacitance than the minimum. Measured when VQ_LDO2 has dropped 100 mV from its nominal value obtained at VIN_LDO2 = 5.4 V. External power transistor type: Fairchild KSH200. Permanent operation of the device above 150 °C degrades lifetime; please refer to quality information. Data Sheet 22 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5 Detailed Internal Circuits Description In the following the main circuit blocks of the TLE7368, namely the Buck converter, the linear regulators, the trackers, the charge pump, the enable and reset circuits and the watchdog are described in more detail. 5.1 Buck Regulator The TLE7368’s DC to DC converter features all the functions necessary to implement a high efficient, low emission Buck regulator with minimum external components. The step down regulator in the TLE7368 follows a concept similar to the one of its predecessor, TLE6368, which allows operation over a battery voltage range from as low as 4.5 V up to a maximum of 45 V at peak currents of 2.5 A at minimum. Figure 3 shows the block diagram of the converter with its major components, i.e. the internal DMOS power stages, the high side driver including its supply scheme, the power stage slope control circuit for reduced EME, the current mode control scheme and various protection circuits for safe converter operation. 5.1.1 Buck Regulator Control Scheme The step down converter’s control method is based upon the current mode control scheme. Current mode control provides an inherent line feed forward, cycle by cycle current limiting and ease of loop compensation. No external compensation components are needed to stabilize the loop, i.e. the operation of the Buck converter. The slope compensation circuit in addition to the current sense amplifier and the error amplifier prevents instabilities/sub harmonic oscillations at duty cycles higher than 0.5. The cycle by cycle current limiting feature supports also a soft start feature during power up. Additional implemented current blanking prevents faulty DMOS turn off signals during switching operation. 5.1.2 High Side Driver Supply and 100% Duty Cycle Operation The supply concept of the Buck converter’s power stage driver follows the Bootstrapping principle. A small external capacitor, placed between pins SW and BST, is used to provide the necessary charge at the gate of the power stage. The capacitor is refreshed at each switching cycle while the power stage is turned off resulting in the ability to power the gate at the next turn on of the power stage. In cases where the input/battery voltage approaches the nominal Buck converter output voltage, the duty cycle of the converter increases. At the point where the power stage is statically turned on (100% duty cycle) a refresh of the Bootstrap capacitor as described above is not possible. In this case the charge pump helps to accomplish the gate over drive in order to keep the power stage turned on with low Rdson. With decreasing input voltage, shortly before switching to 100% duty cycle, the device operates in pulse skipping mode. In this mode the device appears to be operating at much lower frequencies with very small duty cycles. In real, the device is doing a few 100% duty cycle periods followed by a period with a duty cycle smaller than 1. Data Sheet 23 Rev. 2.6 2019-12-09 24 Error amplifier Over temp. shutdown OTSD Q & Level shifter - + - Current comparator R S Oscillator Slope compensation + - + Current sense amplifier - Data Sheet + Figure 3 - + IN Over voltage shutdown Slope control Under voltage shutdown Charge pump Level shifter C1+ C1- C2+ C2- DMOS power stages Bootstrap charger High side driver CCP FB/L_IN SW BST TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description Buck Converter Block Diagram Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5.1.3 Electromagnetic Emission Reduction The Buck DMOS power stage is implemented as multiple cells. This allows to control the slope of the power stage’s current at turn on/off by sequentially turning on/off the cells, achieving a smooth turn on/off and therefore avoiding high frequency components in the electromagnetic emissions to the battery line. The current slope control is adjusted internally, the typical current slew rate is 50 ns/A. 5.1.4 Charge Pump The charge pump serves as support circuit for the Buck converter’s high side driver supply, the linear regulators drive circuits for low drop operation and the internal device biasing blocks. In order to guarantee full device operation at battery voltages as allow as even 4.5 V, the concept of a voltage tripler is chosen for the charge pump. It operates at a switching frequency of typical 2 MHz utilizing three small external capacitors, two pumping caps and one storage capacitor. The CCP circuit is equipped with a current limit function which avoids destruction in case of a short of one of the external CCP capacitors. The charge pump’s output, CCP, is designed to supply the circuitry described above, it should not be used as e.g. driver rail for external on board/PCB circuits. 5.1.5 Buck Converter Protection Circuits Besides the circuits mandatory for the Buck converter operation additional protection circuits are foreseen which help preventing false operation of the device. Undervoltage lockouts are foreseen at the battery input line1) and the high side driver supply rail to ensure the device operates only with proper voltages present. The overvoltage shutdown at the Buck converter output provides a safe high side shutdown for the case where the Buck control loop becomes messed up due to non predictable circumstances. At overtemperatures the thermal shutdown circuit disables the Buck converter until the device cools down to be enabled again. 5.2 Linear Regulators The TLE7368 features three linear voltage regulator circuits, two fully integrated DMOS low drop voltage regulators and one integrated linear control circuit to operate with an external NPN power stage. Integrated linear regulator one (LDO1) offers a 5 V output and the second integrated linear regulator (LDO2) can be configured with pin SEL_LDO2 either for 2.6 V or for 3.3 V. With SEL_LDO2 tied to GND 2.6 V will adjust at the output of LDO2, SEL_LDO2 being connected to Q_LDO2 gives the 3.3 V option. The external regulator will adjust its output to 1.5 V or 1.2 V or 1.3 V (depending on variant of TLE7368) with the emitter of the NPN power stage directly connected to pin FB_EXT, by using a voltage divider, higher output voltages can be achieved. The regulators are designed for low drop operation and offer high output voltage accuracies to meet the needs of current and next generation 32-bit microcontroller families. Additionally all regulators feature a short circuit protection, i.e. the integrated regulators contain a output current limit function whereas the control circuit for the external NPN power stage limits the maximum base current. For low on chip power dissipation the input of LDO1 is internally directly connected to the Buck converter output (FB/L_IN). LDO2’s input is on purpose externally accessible at IN_LDO2. This allows the insertion of a drop element between the Buck converter output and IN_LDO2 to split the power dissipation and avoid high losses on the TLE7368. Similar for the external NPN power stage regulator, the collector of the NPN can be either connected directly to the Buck converter output or a drop element can be inserted in between to split power dissipation. 1) Not shown in the schematic, Figure 3. Data Sheet 25 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5.3 Voltage Tracking Regulators For off board/off PCB supplies, i.e. sensors, two voltage tracking regulators are incorporated in the TLE7368. Their outputs follow the output of the main 5 V regulator, Q_LDO1, within a tight tolerance of ±10 mV. The tracking regulators are implemented with bipolar PNP power stages for improved ripple rejection to reduce emission when lead off board. Both tracker outputs can withstand short circuits to GND and battery in a range of -5 V to +40 V. When shorted to lower levels than the nominal output voltage level the current limit function prevents excessive current draw. 5.4 Power Up and Power Down Sequencing In a supply system with multiple outputs the sequence of enabling the individual regulators is important. Especially 32-bit microcontrollers require a defined power up and power down sequencing. Figure 4 shows the details for the power up and power down sequence of the TLE7368. At power up, the first circuit block to be enabled is the charge pump as it is mandatory for the other circuits to operate. With the charge pump reaching its nominal value, the Buck converter starts to power up its output. Also the output voltage the linear regulators are enabled. The three linear regulators power up simultaneously. The 5 V regulator acts as the master, the 3.3 V/2.6 V regulator and the 1.5 V regulator follow. As the 5 V regulator powers up also the tracking regulators follow. The ramp if the increasing output voltage of each line is determined by the connected output capacitance, the load current and the current limit of the regulator under consideration. In addition an integrated supervision circuit ensures the following two conditions during power-up: -0.3 V < (VQ_LDO1 - VQ_LDO2) < 3.1 V and (5.1) -0.3 V < (VQ_LDO2 - VFB_EXT) (5.2) The power down sequence is practically vice versa to the start up procedure. With the battery decreasing to zero the charge pump and Buck regulator will stop to operate at the minimum battery threshold, the Buck output voltage will fall down and so will the outputs of the linear regulators. In the event where the device is disabled, EN_IGN = low and EN_uC = low, the charge pump, the Buck converter and the linear regulators are disabled immediately. The linear regulators’ outputs are not discharged actively in any case of power down. Diode circuitry (i.e. Schottky diodes) might be necessary to avoid violation of certain microcontrollers’ sequencing requirements. Data Sheet 26 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description VIN VIN, on VIN, off t VCCP VCCP, ok t VBST VBST, on t VSW t VFB/L_IN *) t VQ_LDO1 *) drop depending on application / setup *) t VQ_LDO2 VQ_LDO1 -0.3 < (Q_LDO1-Q_LDO2) < 3.1V *) t VFB_EXT VQ_LDO2 *) -0.3 < ( Q_LDO2 - FB_EXT) Linear regulators not actively discharged at power down; externa Schottky diodes required to meet uC”s sequencing requirements t VQ_T VQ_LDO1 *) t Figure 4 Data Sheet Power Sequencing of the TLE7368 27 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5.5 Stand-by Regulator The intention of the stand-by or keep alive regulator is to supply e.g. external memory even with the main microcontroller supply being disabled. Therefore the state of the stand-by regulator is not controlled by the enable block, but it is active all the time. The stand-by regulator starts to operate as soon as the battery voltage increases above its operating threshold. The current consumption during single operation of the stand-by regulator is reduced to a minimum. It can be configured for output voltages as either 1.0 V or 2.6 V through the SEL_STBY pin. 5.6 Overtemperature Protection At junction temperatures between 160 °C and 190 °C, which can be caused by e.g. excessive power dissipation or increased ambient temperatures, the overtemperature protection kicks in and disables the Buck converter. With the Buck converter disabled the linear regulators will most likely not be able to keep up their output voltage and a system reset can be expected. Due to the drop in power dissipation the junction temperature will decrease. The built in hysteresis circuit ensures that the junction temperature cools down by a certain temperature delta before the Buck converter is enabled again. 5.7 Device Enable Function The device enable block controls the operation of the Buck converter as well as of the linear regulators and tracker blocks. Two external signal inputs determine the state of those blocks, a high voltage input EN_IGN and a low voltage input EN_uC. Internally the two signals are logic OR-ed which means that with either signal the Buck and linear regulators can be turned on or held active, provided that the battery voltage is above its minimum operating range. In order to turn off the regulator blocks, the signals on both inputs, EN_IGN and EN_uC must be lower than their deactivating threshold. The stand-by regulator’s operation is not affected by the device enable block. 5.8 Reset Function The Reset concept of the TLE7368 is chosen to support multiple microcontroller platforms. Two open drain outputs, i.e. the Reset outputs, RO_1 and RO_2, indicate the states of the different regulators. Figure 5 gives the details on the Reset timing. RO_1 is tied to LDO1 and will indicate whenever its output, Q_LDO1, is crossing the under- or overvoltage threshold. The second Reset output, RO_2, turns low whenever one of the two outputs, Q_LDO2 or FB_EXT, are crossing their under- and overvoltage thresholds. At power up in order to avoid a faulty microcontroller start, a so called Reset delay function, i.e. the Reset release delay, is implemented. This delay until the reset is released, counted from the time where the regulator outputs cross the threshold, is determined by a small external delay capacitor at pin RT. The power up reset delay time tRD is directly proportional to the capacitance CRT within the capacitance range of 0.33 nF … 4.7 nF: tRD = 160 × 50 µs × CRT/nF (5.3) For the tolerance calculation please refer to the parameters P_4.4.81, P_4.4.82 and P_4.4.83. In order to find the worst case limits of tRD the capacitance tolerance should be taken into account. The Reset generators within the TLE7368 are supplied from multiple sources, VIN_STBY, VCCP, VFB_L/IN, VQ_LDO1 and VQ_LDO2, to fulfill next generation microcontroller requirements during power up and power down. Data Sheet 28 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description VFB/L_IN VQ_LDO1 t VORT Q_LDO1, in VORT Q_LDO1, de VURT Q_LDO1, in < tOVRR, RO_1 tRD, RO_1 tRD, RO_1 VRO_1 *) VURT Q_LDO1, de < tUVRR, RO_1 tRD, RO_1 tUVRR, RO_1 t tUVRR, RO_1 t VQ_LDO2 VORT Q_LDO2, in VORT Q_LDO2, de VURT Q_LDO2, in VFB_EXT < tOVRR, RO_2 < tUVRR, RO_2 VURT Q_LDO2, de VORT FB_EXT, in VORT FB_EXT, de VURT FB_EXT, in < tUVRR, RO_2 tRD, RO_2 VRO_2 tRD, RO_2 < tOVRR, RO_2 tRD, RO_2 VURT FB_EXT, de t tRD, RO_2 **) tUVRR, RO_2 tOVRR, RO_2 tOVRR, RO_2 tUVRR, RO_2 t *) Figure 5 Data Sheet pulled to e.g. Q_LDO1 by 10kOhm **) pulled to e.g. Q_LDO2 by 10kOhm Reset Timing TLE7368 29 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5.9 Monitoring Circuit The monitoring block within the TLE7368 detects an undervoltage at the stand-by regulator output and is able to distinguish between two different undervoltage situations. When the stand-by output gets back into regulation after an undervoltage event, the timing on the MON_STBY output signal indicates the kind of undervoltage scenario which has happened before. The behavior of the monitoring block is also described in Figure 6 and Figure 7 below. In case of an undervoltage at the stand-by regulator with the 5 V regulator LDO1 in regulation (which means that RO_1 = HIGH) the monitoring circuit has basically a power fail functionality which means that the MON_STBY output will be LOW just as long as the undervoltage at the stand-by output occurs. As soon as Q_STBY is coming back into regulation MON_STBY turns high again. When the 5 V regulator is out of regulation (RO_1 = LOW), e.g. in case of EN_uC = EN_IGN = LOW, the MON_STBY will turn LOW again if an undervoltage event happens at Q_STBY. The difference to the scenario described above is now that when Q_STBY gets back into regulation the toggling of the MON_STBY output to HIGH is coupled with the 5 V Reset line, RO_1, turning HIGH. In detail, the MON_STBY line turns high delayed by tMON_STBY after the Reset line RO_1 had gone high. MON = High VQ_STBY < V MON, Q_STBY, de and RO_1 = High V Q_STBY < V MON, Q_STBY, de and RO_1 = Low Monitor timing = don’t care V Q_STBY > V MON, Q_STBY, in and RO_1 = High VQ_STBY > V MON, Q_STBY, in and RO_1 = High MON = Low Monitor timing = no delay *) MON = Low *) power fail functionionality **) Figure 6 Data Sheet Monitor timing = delay **) V Q_STBY < V MON, Q_STBY, de and RO_1 = Low V Q_STBY > V MON, Q_STBY, in and RO_1 = Low power on reset functionality Stand by Monitor State Diagram 30 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description VIN t VIN_STBY t VQ_STBY VMON, Q_STBY, in VMON, Q_STBY, de < tRR, MON_STBY1 t VRO_1 *) VMON_STBY *) tMON_STBY tRR, MON_STBY Power on reset functionality, with RO_1 low during under voltage at Q_STBY *) Figure 7 Data Sheet t tRR, MON_STBY tRR, MON_STBY Power fail functionality, w/o delay, with RO_1 high during under voltage at Q_STBY t output pulled to e.g. Q_LDO1 by 10kOhm Stand by Monitor Timing Diagram 31 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description 5.10 Watchdog Circuit WDO = LOW Always Trigger During Closed Window Ignore Window No Trigger During Open Window Always Trigger Closed Window Open Window No Trigger AEA03533.VSD Figure 8 Window Watchdog State Diagram Principle of Operation: A Window Watchdog is integrated in the TLE7368 to monitor a microcontroller. The Window Watchdog duty cycle consists of an "Open window" and a "Closed window". The microcontroller that is being monitored has to send a periodic falling edge trigger signal to the watchdog input pin WDI within the "Open Window". If a trigger signal is not sent or if it is sent during the "Closed Window", then Watchdog Output (WDO) switches from high to low signaling a potential microcontroller fault has occurred. The watchdog cycle time TWD is derived from the time base TCycle. An external capacitor connected between pins RT and GND determines TCycle. Initialization: The Watchdog is switched off per default and activated by pulling WDI to low at least for the time tWD,start after RO_2 has turned to high. Watchdog input pin WDI has an integrated pull-up resistor RWDI connected to Q_LDO2. If WDI transitions to high before tWD,start has elapsed, then the watchdog will not start operation. To initialize the Watchdog the watchdog input WDI should transition to high within the "Ignore Window". The WDI signal may also transition to high during the following "Open Window", but sufficient time must be left for a falling edge transition before the end of the "Open Window". The watchdog function is turned off following a RO_2 reset, and must be reinitialized to be turned back on. Normal Operation: Please refer to Figure 8. Data Sheet 32 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description The Watchdog starts operating in the "Ignore Window" state for a duration of tWD,IW. Within the "Ignore Window" the microcontroller is given time to initialize. Any signal to watchdog input WDI within the "Ignore Window" is ignored. After time tWD,IW, the watchdog transitions from the "Ignore Window" state to the "Open Window" state for a maximum duration of tWD,W. Within the "Open Window" a valid trigger signal must be applied to the watchdog input WDI. A valid trigger signal is a falling edge from VWDI,high to VWDI,low. After receiving a valid trigger signal within the "Open Window" the watchdog immediately terminates the "Open Window" and enters the "Closed Window" state. The "Closed Window" has a fixed duration tWD,W. During normal operation a trigger signal should not be applied during the "Closed Window. After the "Closed Window" time tWD,W an the watchdog returns back to the "Open Window" state. Within the "Open Window", a valid trigger signal must be applied to the watchdog input WDI. In normal operation, the watchdog continues to cycle between the "Open Window" and "Closed Window" state. If reset signal RO_2 is asserted and transitions to a low state, then the watchdog needs to be reinitialized as described in the Initialization section. The watchdog output WDO stays high as long as the watchdog input WDI is triggered correctly. Valid Trigger Signal: Please refer to Figure 9. Watchdog input WDI is periodically sampled with a period of TWD. A valid trigger signal is a falling edge from VWDI,high to VWDI,low. To improve immunity against noise or glitches on the WDI input, at least two high samples followed two low samples are required for a valid trigger signal. For example, if the first three samples (two HGH one LOW) of the trigger pulse at pin WDI are inside the closed window and only the fourth sample (the second LOW sample) is taken in the open window then the watchdog output WDO will remain High. Invalid Triggering: Please refer to Figure 8 and Figure 9. No trigger signal detected during the "Open Window" or a trigger signal detected during the "Closed Window", is considered invalid triggering. Watchdog output WDO switches to low for a duration of tWD,W immediately after no valid trigger during the "Open Window" or immediately if a trigger signal is detected during the "Closed Window". Fault Operation: If a capacitor failure on the watchdog timing pin RT causes a short circuit to GND during normal operation, there is no dedicated fault operation. The WDO, RO_1 and RO_2 pins keep their current status. At the following start up procedure, the RO_1 and RO_2 signals remain low without being released. An open circuit at pin RT causes WDO to switch from high to low. Data Sheet 33 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Detailed Internal Circuits Description Closed Window Open Window Watchdog Output (WDO) Open Window Closed Window WDI High (Normal) WDI WDI Low (Fault) WDI Watchdog Decoder Sample Point Figure 9 Data Sheet Window Watchdog Input Signal Validation 34 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Application Information 6 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. CC1 CCP BST INT.BIASING, CHARGE PUMP L01 Battery Input CC2 C_BST IN L02 D01 C01 C03 C02 PWM CONTROLLER 5.5V C05.x DO3 SW TLE 7368 FB/L_IN Q_T1 5V, to sensor TEMPERATURE SENSE C_T1 Q_T2 5V, to sensor EN_µC from µC EN_IGN from IGN C_T2 ENABLE ≥1 Q_LDO1 RO_1 5V C_LDO1 5.0V to µC RESET (WINDOW COMPARATOR) IN_LDO2 Q_LDO2 RT TIMING e.g. 3.3V 2.6/3.3V C_LDO2 C_RT to µC from µC Keep Alive Input RO_2 WDI SEL_LDO2 RESET (WINDOW COMPARATOR) 1.5/ 1.2/ 1.3V WINDOW WATCHDOG 1.0/2.6V Note: Data Sheet IFB_EXT WDO to µC IQ_LDO3 e.g. 1.5V C_LDO3 e.g. 1.0V C_STBY STANDBY MONITOR SEL_STBY GND_P GND_A Figure 10 FB_EXT Q_STBY D02 MON_STBY QO1 DRV_EXT IN_STBY to µC 5.5V C04 Application Diagram, Example This is a very simplified example of an application circuit. The function must be verified in the real application. 35 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Application Information C01 C02 C03 C04 C05.x CC1 CC2 CCP C_RT C_BST C_LDO1 C_LDO2 C_LDO3 C_STBY D01 D02 D03 L01 L02 Q01 Figure 11 Value 0.1 μF/50V 10 μF/50V 47 μF/50V 0.1 μF/50V 5 x 4.7 μF/16V (in parallell) 0.1 μF/16V 0.1 μF/16V 0.22 μF/25V 1 nF/10V 0.1 μF/10V 1 μF/10V 1 μF/10V 22 μF/10V 1 μF/10V 100V 12A, 3-Pin PowerDI 5 MMBD914LT1G 100V 12A, 3-Pin PowerDI 5 10 μH/2.1 A 33 μH/2.1 A KSH200TF Type Ceramic capacitor Electrolitic capacitor Electrolitic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Ceramic capacitor Tantalum capacitor Ceramic capacitor Schottky diode Diode Schottky diode Inductor Inductor NPN Bipolar transistor Remarks C3216X7R1E475K160AC - TDK C2012X7R1E105K125AB - TDK C2012X7R1E105K125AB - TDK Ceramic capacitor also possible C2012X7R1E105K125AB - TDK SMT Onsemi SMT Coilcraft Coilcraft Fairchild Application Diagram, Bill of Material This section intends to give hints for correct set up of the IC, i.e. to avoid misbehavior caused by the influence of other PCB board circuits and shows also how to calculate external components, power loss, etc. 6.1 Choosing Components for the Buck Regulator Stable operation of the Buck converter is ensured when choosing the external passive components according to the characteristics given below: • Buck inductance: 18 µH < LBuck < 220 µH • Buck output capacitor: CBuck > 20 µF • ESR of Buck output capacitor: ESR_CBuck < 150 mΩ 6.2 Setting up LDO1, LDO2 The linear regulators LDO1 and LDO2 need to be connected to appropriate output capacitors in order to keep the regulation loop stable and avoid oscillations. The essential parameters of the output capacitor are the minimum capacitance and the equivalent series resistance (ESR). The required ranges for each output are specified in Chapter 4.4 (Electrical Characteristics). Tantalum capacitors as well as multi layer ceramic capacitors are suitable for LDO1 and LDO2. Table 5 LDO2 Output Voltage Configuration No. SEL_LDO2 Q_LDO2 1 GND 2.6 V 2 Q_LDO2 3.3 V Data Sheet 36 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Application Information 6.3 Setting up of LDO3 LDO3 consists of an integrated regulator which needs to be equipped with an external power transistor (NPNType). The most important parameters to be checked when choosing the external transistor are the ‘current gain bandwidth product’ (fT), the ‘DC current gain’ (hFE) and the thermal resistance of the package. Darlington type transistors should not be used. For stability of the regulation loop a multi layer ceramic capacitor of min. 4.7 µF must be connected to the LDO3 output voltage (Emitter of the external power transistor). In order to improve suppression load current steps an additional capacitor of tantalum type can be connected in parallel. In case LDO3 voltage is not needed the external NPN transistor can be spared. For this configuration the pins ‘DRV_EXT’ and ‘FB_EXT’ should be directly connected to each other in order to ensure correct operation of Reset 2. Also in this case a small ceramic capacitor of 220 nF connected from pin ‘FB_EXT’ to GND is recommended in order to avoid oscillations of the regulation loop LDO3. 6.4 Setting up the Stand-by Regulator The stand by regulator provides an output current up to 30 mA sourced via linear regulation directly from Battery even when the main regulator is disabled. This low quiescent current regulator is commonly used as supply for stand by memory. The output voltage can be selected as 1.0 V or 2.6 V. For stability of the regulation loop the output Q_STBY should be connected via a ceramic capacitor (470 nF to 2 µF) to GND. 6.4.1 Stand-by Regulator’s Output Voltage Configuration The stand by regulator provides an output voltage of nominal 1.0 V or 2.6 V which is associated with an appropriate stand-by monitoring threshold. The output voltage level is selected by the SEL_STBY configuration. Connecting SEL_STBY to GND results in a voltage level of 2.6 V at Q_STBY, while connecting SEL_STBY with Q_STBY leads to 1.0 V configuration. An integrated pull-up current ensures that the system will turn in the lower stand-by voltage mode in case of open mode at the SEL_STBY pin. However the SEL_STBY pin should be connected either to Q_STBY or to GND in order to select the appropriate Q_STBY voltage level. Intermediate voltage levels at SEL_STBY should be avoided. Table 6 Stand-by Regulator’s Output Voltage Configuration No. SEL_STBY Q_STBY 1 GND 2.6 V 2 Q_STBY 1.0 V Data Sheet 37 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Package Outlines Package Outlines 8° MAX. 1.1 7.6 -0.2 1) 0.65 0.7 ±0.2 C 17 x 0.65 = 11.05 0.33 ±0.08 2) 0.23 +0.09 0.35 x 45° 2.55 MAX. 3) 0...0.10 STAND OFF 2.45 -0.2 7 0.1 C 36x SEATING PLANE 10.3 ±0.3 0.17 M A-B C D 36x D Bottom View A 19 1 18 19 Ejector Mark 36 Exposed Diepad 1 Index Marking Ey 36 18 B Ex 12.8 -0.21) Index Marking Exposed Diepad Dimensions 4) Ex Package Leadframe PG-DSO-36 A6901-C003 7 Ey 5.1 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.05 max. per side 3) Distance from leads bottom (= seating plane) to exposed diepad 4) Excluding the mold flash allowance of 0.3 max per side Figure 12 PG-DSO-36 (Plastic Green - Dual Small Outline Package) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 38 Dimensions in mm Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Revision History 8 Revision History Rev Date 2.6 2.1 2.0 1.2 Changes 2019-12-09 • • style template updated editorial changes • figure 12: Package outline drawing updated • chapter 6.3: sentence “Suitable NPN power transistors types are e.g. KSH 200 from Fairchild semiconductor or NJD 2873T4 from ON semiconductor.” removed • P_4.4.47, test specification for capacitor changed from 10 kHz to 1 MHz. • P_4.4.45, P_4.4.46, and P_4.4.106: Output current of Q_LDO3 is corrected to IQ_LDO3 • chapter 4.4, table 4: footnote 2, Reference to figure 10 inserted • chapter 6.3: typo corrected • figure 10 application diagram updated • figure 11, bill of material included. • Feedback voltage VFB_EXT 4.4.41: updated minimum value from 1.51V to 1.505V. • Undervoltage Reset threshold on Q_LDO2 VURT Q_LDO2,de 4.4.99: updated minimum value from 2.485V to 2.470V. • G-version deleted, as TLE7368G is discontinued. • ESR CQ_LDO1 4.4.23: updated minimum value . • ESR CQ_LDO2 4.4.37: updated minimum value . • ESR CFB_EXT 4.4.47: updated minimum value . • ESR CQ_T1 4.4.53: updated minimum value . • ESR CQ_T2 4.4.59: updated minimum value . • ESR CQ_STBY 4.4.69: updated minimum value . • Pin Configuration table update for Q_LDO1, Q_LDO2, FB_EXT, Q_T1, Q_T2 and Q_STBY: Block to GND with capacitor close to the IC pins for stable regulator operation. • chapter 5.10 Watchdog circuit: Fault Operation: short circuit on pin RT, description reviewed and changed 2010-11-22 • • Final datasheet for TLE7368G, TLE368E, TLE7368-2E and TLE7368-3E 2009-12-16 • • Final datasheet for TLE7368G and TLE7368E Target Datasheet for TLE7368-2E and TLE7368-3E • Overview updated • Figure 1 and Figure 10 updated • Electrical characteristics: LDO_3 for variants TLE7368-2E and TLE7368-3E included 2009-04-27 • • Data Sheet No modification of component or change of electrical parameters page 1 updated coverpage page 37: updated package outline PG-DSO-36-24 39 Rev. 2.6 2019-12-09 TLE7368 Next Generation Microcontroller Supply Revision History Rev Date 1.1 1.0 Changes 2007-11-08 • • Page 3, Overview: Updated package pictures. • Page 3, Overview: Updated table: Status Final/Target removed. • Page 12, Thermal resistance table: Inserted values for version TLE7368E. • Page 12, Thermal resistance table: Updated values for version TLE7368G. • 4.4.72/4.4.73: Condition described more precise: Inserted “MON_STBY = H”. • Figure 9: Modified graph for better description of the window watchdog function. • Chapter 5.10 Watchdog: Revised phrasing for better understanding 2007-08-13 • • Final Datasheet Version TLE7368G; Target Datasheet Version TLE7368E “Features section”: AEC certified statement added • “Features section”: RoHS compliance statement and Green product feature added (TLE7368-2E) • Page 38: Package changed to RoHS compliant version (TLE7368-2E) • Generally: Improved wording for better understanding • Application and Block Diagrams: Updated to show more details. • Pin Description: Added exposed pad version pinout. • 4.1.30/31: Specified conditions. • Thermal Resistance Table: Modified. Added exposed pad package. • 4.4.51: Voltage Tracker T2: Modified output current limitation to min. 60mA, max 110mA (was min. 50mA, max 100mA) • Selector Pull-down resistor RSEL_LDO2: Max. value changed to 1.9 MOhm. Typ. value changed • 4.4.56/57: Standby Regulator Output Voltage VQ_STBY: Minimum limit changed to 0.93V. Added max. value. • 4.4.60: Standby Regulator Output Current Limitation IQ_STBY, lim: Added test condition • 4.4.61: Standby Regulator Load Regulation DVQ_ STBY: Modified max. limits and defined condition: a) max 5 V/A (was 10 V/A) @ IQ_STBY = 100µA to 10 mA; SEL_STBY = Q_STBY b) max 10 V/A @ IQ_STBY = 100µA to 10 mA; SEL_STBY = GND • 4.4.82, 4.4.108: Updated test conditions. • 4.4.84: Reset delay time base Tcycle: Removed comment “equivalent +/-20%” since it makes no sense here. • 4.4.115: MON_STBY, Threshold on Q_STBY VMON, Q_STBY, de: Removed max. limit because headroom specification was added. • 4.4.115a: New spec line for MON_STBY headroom VMON,Q_STBY,head @ SEL_STBY = Q_STBY. Min. limit 10mV. • 4.4.116: MON_STBY hysteresis VMON,Q_STBY,hy: inserted max. limit of 30mV 0.61 2006-12-18 • Data Sheet Final datasheet for both versions, TLE7368G and TLE7368E. Target Datasheet 40 Rev. 2.6 2019-12-09 Please read the Important Notice and Warnings at the end of this document Trademarks of Infineon Technologies AG µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™. Trademarks updated November 2015 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners. 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