Product Information
January 2008
The Robust Path to
Automotive Networks
www.infineon.com/transceivers
* and representative offices
Edition 2008
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All rights reserved.
08-01-16 RZ Transceiver Umschlag.indd 16-1
Order no. B152-H8619-G1-X-7600
16.01.2008 12:22:06 Uhr
Yo u r P a r t n e r o f C h o i ce f o r A u t o m o t i v e
Communication Interfaces
Embedded Power – Relay Driver ICs – TLE78xx: Application Example
W O R L D L E A D E R I N A U T O M O T I V E electronics for 35 years, Infineon
focuses on the in-vehicle networking, a major driver today for innovation in the
LIN TRX
VBAT
VReg
automotive field, meeting the ever-increasing demands of consumers for comfort,
FUSE
performance and safety.
W I T H O V E R T E N Y E A R S ’ E X P E R I E N C E developing communication
M
interfaces, Infineon offers an extensive product line of transceivers, system basis
chips and Embedded Power solutions for CAN and LIN protocols, from the mature
to the advanced.
Relay Driver
C O N T I N U O U S L Y I M P R O V I N G its S P T chip technology, Infineon
provides solutions for the challenges faced by the automotive industry, featuring
the best ESD and EMC combined performances.
8-bit µC
XC8xx
I N T H I S B R O C H U R E Infineon introduces its transceivers and system
+ 5 V Supply
Position Detection
Hall Sensor
PWM (optional)
basis chips portfolio, with a detailed description of their distinctive key functions
and benefits.
T H E P R O D U C T B R I E F S I N C L U D E D provide a comprehensive overview
current sensing via
shunt (optional)
of current products, as well as the latest product proposals.
Reverse
Polarity
Protection
needed
F O R M O R E D E T A I L E D I N F O R M A T I O N visit the Infineon website
at www.infineon.com / transceivers or contact your sales partner listed on the back
of this brochure.
Tool Support for ePower Relay Driver
Evaluation Board TLE78xx
Application
Window Lift Module
Power & LIN Interface
Seat module
JTAG Connector (debugging / programming)
Sun-roof module
Switch Inputs, Relay, LEDs available
8-Bit μC XC8xx:
KEIL μVision C-Compiler, Assembler, Debugger and
Programmer for Flash Memory
2
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GNU “Open Source” Tools available
KEIL Real Time Operating System RTX51
15
16.01.2008 12:22:10 Uhr
Infineon Transceivers and System Basis Chips
The experience of a leading edge automotive electronics supplier
Comprehensive product portfolio of stand-alone transceivers and standard on-chip solutions
Outstanding ESD and EMC combined performances
Protocol
High Speed CAN
Low Speed CAN
Stand-alone
TLE6250G / GV33
transceivers
TLE6251DS
TLE7259-2G
TLE6251G
TLE7269G
TLE 6254-3G
LIN
High Speed CAN + LIN
TLE6258-2G
System
TLE6263-3G
TLE6285G
TLE7263E
Basis Chips
TLE6266G
TLE6286G
TLE826xE
TLE8458G
TLE7810
Embedded Power
Abbreviations
SPT Smart Power Technology
ESD Electro Static Discharge
SBC System Basis Chip
OEM Original Equipment Manufacturer
EMC Electro Magnetic Compatibility
LIN Local Interconnect Network
CAN Controller Area Network
ePower: Embedded Power
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The Benefits of an Automotive
Dedicated Technolog y
Living Automotive Excellence
B eca u se t r ansceive r s play a vital role in today’s more and more complex interconnected cars, developing
innovative solutions is not enough. With the “Automotive Excellence” program Infineon can ensure the highest safety possible,
implementing a zero-defect mind-set for processes, product development, production and logistics: no compromise
when it comes to quality! First results can be recognized already.
Average failure (ppm) for TLE6250G
1,60
DPM Field
Delivery
1,51
1,40
volume in pcs/BY quarter
1,20
dpm
1,00
0,80
0,60
0,55
0,40
0,30
0,19
0,18
0,20
0,13
0,11
0,09 0,07 0,06 0,08 0,08 0,09 0,07 0,08 0,06 0,06
0,06 0,05 0,04 0,04 0,03
0,03
II/
I/2
00
2
20
0
III 2
/2
00
IV 2
/2
00
2
I/2
00
II/ 3
20
0
III 3
/2
0
IV 03
/2
00
I/2 3
00
II/ 4
20
0
III 4
/2
0
IV 04
/2
00
4
I/2
00
II/ 5
20
05
III
/2
0
IV 05
/2
00
I/2 5
00
II/ 6
20
06
III
/2
0
IV 06
/2
00
6
I/2
00
II/ 7
20
0
III 7
/2
00
IV 7
/2
00
7
0,00
0,15
DPM Field
Delivery
4
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robust Package: for a safer lead-free processing
A N E L E M E N T O F T h E A u T O M O T I V E E x C E L L E N C E P r O G r A M , the robust package, significantly improves
the reliability of both, the component and the application. This new package concept enables Infineon to address the lead-free
requirements with improved quality, going beyond the today’s AEC Q101 specifications.
Green and Robust package
Solder Die Attach (PbSnAg)
Low Stress / Molding Compound MC
allowing increased solder
reflow (260 °C) due to
green requirement
halogen free
reducing thermomechanical
stress in package
Plating
Robust Passivation
lead free
reducing passivation
cracks and shifted
metallisation
Adhesion promoter
providing good adhesion
to all interfaces
Robust package
Stress test: Temperature Cycling (– 55 °C, + 150 °C)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Stress test: Autoclave (Temp. 121 °C, 100 % humidity)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Competition
Competition
Infineon Green & robust,
SPT Technology
Infineon Green & robust,
SPT Technology
Scanning acoustic microscope, ultrasonic images of the front, delamination in red (major) / yellow (minor)
5
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ESD Robustness: holding the leadership in performance and innovation
O ne of t h e specific c h allenges for a transceiver device is to withstand the harsh signals that occur on
the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust
transceiver also does not need expensive external protection components such a zener diodes or varistors.
O ve r t h e past y ea r s Infineon developed and improved an innovative integrated protection that enables the
dissipation of the energy, which is converted during an ESD event, through the chip from top to bottom. Silicon On Isolator (SOI)
type technologies where the active side of the chip is decoupled from its bottom by an insulator do not allow such concepts.
Infineons products can hold more than 10 kVolts of discharges using ISO 61000-4-2 test standard, an application oriented testing
method that applies an energy which is five times higher than the standard HBM (Human Body Model) test that simulates typical
handling events.
resistance at bus pins (kV)
Maximum ESD discharge
ESD Robustness of TLE7259-2G in comparison with the competition
+15 kV
+15 kV
Competition
+1 kV
+1 kV
ISO 61000-4-2 150 pF / 330 T
(without bus filter)
Infineon TLE7259-2G
ISO 61000-4-2 150 pF / 330 T
(with bus filter C = 3.3 nF)
resistance at bus pins (kV)
Maximum ESD discharge
ESD Robustness of TLE6251DS in comparison with the competition
+13 kV
+10 kV
Competition
+2 kV
ISO 61000-4-2 150 pF / 330 T
+1,5 kV
Infineon TLE6251DS
ISO 61000-4-2 150 pF / 2 kT
6
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Stand-alone Transceivers
High Speed CAN Transceivers
Excellent robustness dedicated to a broad range
TLE6251G – for permanently connected nodes
of applications
addition the supply for the entire node. Permanently powered
A t fi r st u sed for powertrain networks, the High
T h e T L E 6 2 5 1 G in a DSO-14 package controls in
Speed Controller Area Network (CAN) is now the most used
by the battery, it features a sleep mode with very low quiescent
automotive protocol within the car, with bus speeds from
current and an inhibit output to power up a voltage regulator,
125 kBauds to 1 Mbauds, offering an excellent cost to
when getting either a remote wake-up from the bus or a local
performance ratio.
wake-up on the wake-up pin. Functions include a set of fail-
Building on the success of the TLE6250, Infineon addresses
safe flags, and a network failure diagnosis.
the additional needs of today’s High Speed CAN automotive
Infineon presents herewith a solution for the most advanced
networks used for body and comfort applications. Thanks to its
High Speed CAN automotive concepts.
unique expertise, Infineon could even greatly improve the ESD
robustness of its new products.
Overall functional description, TLE6250G
TLE6250G and TLE6250GV33 – becoming market standards
A dopted b y most of the OEMs around the world,
Output stage
this device (TLE6250G for 5 V logic, TLE6250GV33 for 3.3 V
Transmitter + Mode logic
TLE6250G
3 Vcc
logic) is a new market standard due to its important benefits:
Excellent EMC performance
Outstanding ESD robustness (6 kV Human Body Model)
Receive-only mode
CAN H
7
6
CAN L
Driver
Output
stage
Temp.
protection
1 TxD
Mode
control
TLE6251DS – ideal for partially powered network concepts
5 RM
T h e T L E 6 2 5 1 D S in a standard DSO-8 package can
Receiver
be compared to the TLE6250 with an additional Bus wakeup capability. Bus reverse current is zero when the device is
8 INH
4 RxD
GND 2
unpowered, so that it does not affect the rest of the network
as an “invisible” node. This makes the TLE6251DS suitable
Receiver
for key-on nodes applications in partially powered networks.
7
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Stand-alone Transceivers
Low Speed CAN Transceivers
Setting up a new reference
T h e 1 2 5 k B a u d Fault Tolerant CAN physical layer
became a standard in Europe for body and convenience
networks because of its ability to switch from a differential
Application example TLE6254-3G
VBAT
CAN
Bus
communication mode to a single-wire mode in the event of
Choke1)
TLE6254-3G
an open or shorted bus wire. Infineon continuously improved
11
the performances and the functionalities of its Fault Tolerant
12
8
transceivers resulting in the advanced TLE6254-3G, establi-
9
shing a new reference on the Low Speed CAN transceiver
14
7
market.
1
CANH
RxD
CANL
TxD
RTH
ENT
RTL
NSTB
Vs
NERR
WK
INH
VCC
3
2
6
Microcontroller
5
4
10
GND
GND
TLE6254-3G – approved by most major car manufacturers
T h e T L E 6 2 5 4 - 3 G benefits from a zero-fail certification
Voltage
regulator
features such as:
Low quiescent current in sleep mode and standby mode
Receive-only mode preventing erratic messages
VCC
INH
of the ICT (International Conformance Testing) and enhanced
+
Vs
GND
+
6 kV (Human Body Model) ESD robustness
1) Optional,
according to car manufacturers’ requirements
8
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LIN Transceivers
Top performances for low-cost networking
TLE7269G – the first ever Twin-LIN device
L ocal I nte r connect N etwo r k (LIN) bus by
allowing a basic local network connection between the CAN
T h e T L E 7 2 6 9 G offers two LIN transceiver cells type
TLE7259-2 in a SO14 package, which gives additional benefits:
backbone and actuators, sensors or switches has tremendous
Smaller overall board area
ly reduced the design efforts and costs. It is thus used in a
Integrated pull-up resistors to Vcc for logic pins
fast-growing range of body and convenience applications. As
Reduced total quiescent current
an active member of the LIN consortium Physical Layer and
Layout single / twinLIN scalability
Conformance Tests working groups, Infineon has adapted its
portfolio to the latest applications and norms.
TLE6258-2G – a standard k-Line (ISO9141) and LIN transceiver
Pin out TLE7269G
T h e T L E 6 2 5 8 - 2 G is a cost-optimized solution suiting
a broad range of designs:
TLE7269G
(P-DSO-14)
Compatible to the LIN norms LIN 1.3, 2.1
TLE7259G
Bus wake-up capability with low power mode (standby)
Bus short to ground and battery protection
TLE7259-2G – the enhanced Infineon LIN transceiver
RxD1
1
14
INH1
EN
2
13
VS
WK
3
12
BUS1
TxD1
4
11
GND
TxD2
5
10
BUS2
Vio
6
9
W2O
RxD2
7
8
INH2
T h e T L E 7 2 5 9 - 2 G offers a sleep mode in conjunction
with an inhibit output pin to control the voltage regulator,
mastering the whole node supply for an optimized overall
consumption. The TLE7259-2G is a leading product combining
outstanding benefits:
Excellent EMC coupled to a strong ESD robustness
Very low quiescent current and
bus leakage current in sleep mode
Compatibility to 3.3 V and 5 V logic
Specific LIN 1.3, 2.1 version: TLE7259-2GE
Specific SAE J 2602 version: TLE7259-2GU
9
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System Basis Chips
I nfineon h as developed several integrated
components to enable the design of cost-effective, robust and
Customer’s Benefit
high-performance modules, to meet the harsh requirements of
the automotive industry for quiescent current, system area and
the design-in time significantly. The hardware is herewith
costs.
simplified, and the software can be adapted to fit to new
Using a standa r d integrated solution, reduces
requirements, enabling an efficient reuse of the running
A s a well - establis h ed automotive supplier,
designs.
Infineon combines its experience with a wide portfolio of transceivers, voltage regulators, high side and low side switches,
to design standard integrated solutions meeting the specific
all the functions requiring a permanent connection to
demands of its customers.
the battery are integrated in one chip. The system cost can
A ve r y low quiescent current is achieved, because
be significantly reduced due to the fact that none of the
T h e fle x ibilit y and performance of the SPT
technology allows Infineon to use a systematic cell block
additional external components required in a discrete solution
are needed.
approach, up-integrating already approved and qualified
circuits. This allows a fast and reliable concept phase, and
reduces the product time to market.
early warning, window watchdog, temperature warning flag
I nteg r ated f u nctions including low battery
and over-temperature protection, meet the increasing need
Typical car application
for safety in the applications, with a minimum increase of
cost or system area.
Switches
5 V LDO
Supervision
CAN
Bridges
T h e devices can wo r k within wide battery
voltage and temperature ranges. Fail-safe outputs allow
the implementation of a “limp-home” hardware, in case of
malfunctions in the vehicle.
Microcontroller
Sensor
LIN
SBC
Common function
of any automotive
module
Application
dependent
T h e I nfineon p r od u ct po r tfolio offers
a wide range of protocols currently used by OEMs, High Speed
CAN, Low Speed Fault Tolerant CAN and LIN. All products fit
the relevant ISO standard and have ICT certification.
10
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The Low Speed CAN SBCs
A s a pionee r of System Basis Chips solutions,
Block diagram TLE6266G
Infineon has offered SBCs with Fault Tolerant Low Speed CAN
OUTL1
interface since 1998, dedicated to body and convenience
Charge
pump
modules. The products below benefit from the performances
of the latest transceiver cell generation.
Drive
OUTL2
Drive
VS
TLE6263-3G – the universal body IC
OUTH1
Switch
fall defect
Protection + Drive
PWM
OUTH2
T h e T L E 6 2 6 3 - 3 G meets the main smart power and
Drive
supply requirements, among the most important features:
Fault Tolerant Low Speed CAN transceiver
VCC
Drive
UVLO
Voltage regulator (5 V / 150 mA)
SPI
Window watchdog
module control, offering:
Fault Tolerant Low Speed CAN transceiver
Voltage regulator (5 V / 45 mA)
2 Low Side drivers
LDO
VCC
RTL
CANH
Reset
generator
+
Window
watchdog
RO
Mode control
WK
H Output stage
CANL
RTH
L Output stage
Filter
Receiver
Fail management
TLE6266G – the dedicated door module IC
T h e T L E 6 2 6 6 G reflects the specific needs for door
Timer Oscillator
Band
gap
VS
TxD
Driver
Temp.
protect Input
stage
Window watchdog
VCC
VCC
RxD
3 High Side drivers
Local wake-up pin(s)
DO
VCC
-
+
CLK
DI
1 High Side driver (150 mA)
Local wake-up pin(s)
OUTH3
CSN
CAN fail defect
GND
11
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The LIN SBCs
I N F I N E O N P r O V I D E D one of the first LIN SBCs on
TLE6285G and TLE6286G – smart cost and space optimization
the market and is now extending its portfolio to provide ideal
T W O F u N C T I O N S in one package covering standard
alternative to common discrete component sets of LIN slave
requirements:
LIN Transceiver, LIN2.1 compliant
control units.
Voltage regulator (5 V / 150 mA)
TLE8458G – for the simplest LIN applications
Watchdog (TLE6286G)
A C O S T E F F I C I E N T solution for LIN slave modes with
Adjustable under-voltage reset (TLE6285G)
SO16 standard package
low power needs:
LIN transceiver LIN 2.1 and J2602 compliant
Voltage regulator (5 V / 40 mA)
Local wake-up pin
SO8 standard package
Pin out TLE8458G
TLE8458G
rxD
1
8
VCC
EN
2
7
VS
Wk
3
6
uN
TxD
4
5
GND
12
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The high Speed CAN SBCs
A M O N G T h E L A S T product developments, Infineon
sets its know-how to meet the growing demand for high Speed
TLE8261/2/3/4E – for flexible and scalable designs
T h I S N E W P r O D u C T F A M I L y combines a cost
CAN body networking, with higher supply capacity as well as
optimized concept with a flexible supply capability and a
optimized low power current consumption and extended safety
scalable number of LIN cells over the four pin compatible
benefits.
family members:
high Speed CAN Transceiver (with bus wake-up, bus failure
TLE7263E – serves the most demanding needs
diagnostics), ISO 11898-5 compliant
for CAN to LIN gateways
Multiple LIN cells from 0 (TLE8261E) to 3 (TLE8264E)
T h E T L E 7 2 6 3 E meet the requirements for CAN to LIN
Dual integrated voltage regulator (each 5 V / 150 mA)
gateways commonly needed on Central Body Modules, climate
External power transistor tracking (up to 5 V / 400 mA)
or door modules, with enhanced safety features and a quies-
1 Local wake-up pin
cent current als low as 60 µA :
Window watchdog
high Speed CAN Transceiver (with bus wake-up, bus failure
Configurable Limp home output
diagnostics), ISO11898-5 compliant
LIN Transceiver, LIN2.1 and SAEJ2602 compliant
Dual Voltage regulator
Block diagram TLE7263
V1 (5 V / 150 mA) for microcontroller
Vbat
V2 (5 V / 150 mA) for internal CAN and external devices
HS-CAN bus
1 high Side driver (150 mA)
4 Local wake-up pins
Window watchdog
Sense Input and fail-safe output
HS-CAN
Voltage reg. 2
SPI
diagnostic/ctrl.
Wake-up
control
Voltage reg. 1
Watchdog
High-side
switch
LIN
Fail safe
output
LIN-bus
13
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Embedded Power
E mbedded P owe r is a System in a Package (SiP) solution. It incorporates an 8-bit microcontroller compatible to the
standard 8051 core with On-Chip debug Support (OCDS) and a System-Basis-Chip (SBC). The SBC is equipped with LIN / SAE J2602
compliant LIN Transceiver, low-dropout voltage regulator (LDO) as well as two low-side switches (relay driver) and supply (+ 5 V),
e.g. to supply hall sensors (TLE4966). An additional high-side driver for driving LEDs is also available.
F o r M ic r ocont r olle r supervision and additional protection of the circuit a programmable window watchdog circuit
with a reset feature, supply voltage supervision and integrated temparture sensor is implemented.
S B C , M ic r ocont r olle r and L I N module offer power modes in order to support terminal 30 connected
automotive applications. A wake-up from the low power mode is possible via a LIN bus message or wake-up inputs.
T h is integ r ated ci r c u it is realized as Multi-Chip-Module (MCM) in a P-DSO-28 and in P-DSO-52 package in the
future, and is designed to withstand the severe conditions of automotive and industrial applications.
Customer’s benefits:
Cost efficiency and quality
Embedded Power Product Family – Relay Driver TLE78xx
VBAT
Space saving
Zero defect
Features:
8-bit µController
8051 compatible
Flash / EEPROM
10-bit A/D Converter
16-bit Timers
On-Chip-Debug System
Voltage Regulator
LIN Transceiver
High-Side Switches (Hall & SED Supply)
SBC
8-bit µC
Supply Output
(Hall Sensor)
Voltage
Regulator
16/24/32 KB
JTAG
Flash
Low-Side
Switch 1
SPI
Diagnostic / Ctrl.
GPIOs
Hall Sensor I/F
Low-Side
Switch 2
Watchdog
Reset
wake-up
inputs
Temp. / VBAT
Measurement I/F
10-bit ADC
LED-Driver
LIN
Serial I/F
2 x Low-Side Switch
5 x wake-up inputs
Standard SPI Interface
LIN-Bus
14
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Yo u r P a r t n e r o f C h o i ce f o r A u t o m o t i v e
Communication Interfaces
Embedded Power – Relay Driver ICs – TLE78xx: Application Example
W O R L D L E A D E R I N A U T O M O T I V E electronics for 35 years, Infineon
focuses on the in-vehicle networking, a major driver today for innovation in the
LIN TRX
VBAT
VReg
automotive field, meeting the ever-increasing demands of consumers for comfort,
FUSE
performance and safety.
W I T H O V E R T E N Y E A R S ’ E X P E R I E N C E developing communication
M
interfaces, Infineon offers an extensive product line of transceivers, system basis
chips and Embedded Power solutions for CAN and LIN protocols, from the mature
to the advanced.
Relay Driver
C O N T I N U O U S L Y I M P R O V I N G its S P T chip technology, Infineon
provides solutions for the challenges faced by the automotive industry, featuring
the best ESD and EMC combined performances.
8-bit µC
XC8xx
I N T H I S B R O C H U R E Infineon introduces its transceivers and system
+ 5 V Supply
Position Detection
Hall Sensor
PWM (optional)
basis chips portfolio, with a detailed description of their distinctive key functions
and benefits.
T H E P R O D U C T B R I E F S I N C L U D E D provide a comprehensive overview
current sensing via
shunt (optional)
of current products, as well as the latest product proposals.
Reverse
Polarity
Protection
needed
F O R M O R E D E T A I L E D I N F O R M A T I O N visit the Infineon website
at www.infineon.com / transceivers or contact your sales partner listed on the back
of this brochure.
Tool Support for ePower Relay Driver
Evaluation Board TLE78xx
Application
Window Lift Module
Power & LIN Interface
Seat module
JTAG Connector (debugging / programming)
Sun-roof module
Switch Inputs, Relay, LEDs available
8-Bit μC XC8xx:
KEIL μVision C-Compiler, Assembler, Debugger and
Programmer for Flash Memory
2
08-01-16 RZ Transceiver Umschlag.indd 2-15
GNU “Open Source” Tools available
KEIL Real Time Operating System RTX51
15
16.01.2008 12:22:10 Uhr
Product Information
January 2008
The Robust Path to
Automotive Networks
www.infineon.com/transceivers
* and representative offices
Edition 2008
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All rights reserved.
08-01-16 RZ Transceiver Umschlag.indd 16-1
Order no. B152-H8619-G1-X-7600
16.01.2008 12:22:06 Uhr