TLE8366EV50XUMA1

TLE8366 1.8A DC/DC Step-Down Voltage Regulator TLE8366EV50 TLE8366EV TLE8366EV33 Data sheet Rev. 1.0, 2009-05-18 Automotive Power 1.8A DC/DC Step-Down Voltage Regulator 1 • • • • • • • • • • • • • • TLE8366 Overview 1.8A step down voltage regulator Output voltage versions: 5.0 V, 3.3 V and adjustable ± 2% output voltage tolerance (+-4% for full load current range) Integrated power transistor PWM regulation with feedforward Input voltage range from 4.75V to 45V 370 kHz switching frequency Synchronization input Very low shutdown current consumption ( 10s) may affect device reliability ESD susceptibility HBM according to EIA/JESD 22-A 114B (1.5kΩ,100pF). ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1 Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data sheet 5 Rev. 1.0, 2009-05-18 TLE8366 General Product Characteristics 4.2 Functional Range Pos. Parameter Symbol 4.2.1 Supply Voltage 4.2.2 Output Voltage adjust range 4.2.3 Buck inductor 4.2.4 Buck capacitor 4.2.5 Buck capacitor ESR 4.2.6 Junction Temperature VS VCC LBU CBU1 ESRBU1 Tj Limit Values Unit Conditions Min. Max. 4.75 45 V – 0.60 16 V TLE8366EV 18 56 µH – 33 120 µF – – 0.3 Ω – 1) -40 150 °C – 1) See section ““Application Information” on Page 14” for loop compensation requirements. Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Pos. Thermal Resistance Parameter Symbol 1) 4.3.1 Junction to Case 4.3.2 Junction to ambient1) RthJC RthJA Limit Values Unit Conditions Min. Typ. Max. – 10 12 K/W – – 52 – K/W 2) 1) Not subject to production test, specified by design. 2) According to Jedec JESD52-1,-5,-7 at natural convection on 2s2p FR4 PCB for 1W power dissipation. PCB 76.2x114.3x1.5mm3 with 2 inner copper layers of 70µm thickness. Thermal via array conected to the first inner copper layer under the exposed pad. Data sheet 6 Rev. 1.0, 2009-05-18 TLE8366 Buck Regulator 5 Buck Regulator 5.1 Description 5.1.1 Arrangement The step-down (or buck) regulator consists of several functional blocks, which shall be explained in the following: The oscillator, the regulator, the safety functions, the gate driver and the internal MOSFET. 5.1.1.1 Regulator Block The oscillator creates a saw-tooth signal, which is supplied to the PWM comparator and the Schmitt-Trigger 1. The frequency of the oscillator might be synchronized to an external frequency connected to pin sync. The Error Amplifier compares the feedback signal to the reference voltage. At the variable voltage version the feedback pin shall be connected to an external resistor divider, the fixed voltage versions contain an internal resistor divider. The soft start function is included by the ramp generator between the reference voltage source and the error amplifier. It generates a defined ramp after the initialization of the device. (The device is initialized after signal EN turns to high (with supply voltage at VS present) or with rising Supply voltage (with EN = H connected to VS) or at restarting after a thermal shutdown. The ramp starts, if the Buck Driver Supply (BDS) external capacitor is charged. Only for the variable voltage version: If the feedback signal at pin FB gets lost, an internal pull-up current source will pull the pin too high thus preventing the output voltage from overshooting. A compensation network needs to be connected to the output of the error amplifier using pin COMP. The PWM comparator creates the Pulse-Width Modulated (PWM) signal by comparing the error amplifier output with the saw-tooth signal from the oscillator. 5.1.1.2 Safety Functions Block The safety functions block consists of the Error-Flip Flop, the Nor1 Gate and the PWM-Flip-Flop. The Error Flip-Flop collects the failure events such as the over-current shutdown of the internal MOSFET, the output overvoltage shutdown and the temperature shutdown. The over-current shutdown signal is created by the OC comparator. It detects the voltage across an internal shunt resistor. If the current exceeds the reference level, the pulse is shut down and the MOSFET switched off. The bootstrap under-voltage shutdown is created by the BDS UV comparator, which compares the bootstrap capacitor voltage to a reference level. If the bootstrap capacitor voltage is too low, the pulse will be shut down and the MOSFET switched off. If the output voltage exceeds a reference value, the pulse will also be shut down and the MOSFET switched off. Data sheet 7 Rev. 1.0, 2009-05-18 TLE8366 Buck Regulator An internal temperature sensor detects the temperature of the device, it will be switched off if the junction temperature exceeds 175 °C. The error Flip flop is set by the Schmitt Trigger 1 and will be reset by one of these signals. This will close the NOR1 gate and shutdown the pulse. The bootstrap capacitor monitoring is connected directly to the NOR1 gate. The bootstrap under-voltage shutdown is created by the BDS UV comparator, which compares the bootstrap capacitor voltage to a reference level. If the bootstrap capacitor voltage is too low, the pulse will be shut down. PWM pulses are passing through the NOR 1 gate. In case if one of the mentioned failures will occur this gate will be closed and the pulse switched immediately off. The PWM Flip-Flop is set by NAND2, which combines the clock from the Schmitt Trigger 1 with the output from NOR1. The PWM Flip-Flop is reset by the output of the NOR1. 5.1.1.3 Internal Power Stage The gate driver consists of the Gate driver itself, an inverter for the PWM signal and the gate driver supply. The gate Driver Supply is connected over pin BDS to the BDS capacitor. A charge pump is integrated to support the gate drive in cases of low input voltage, small differential voltage between input supply and output voltage and during start up. To minimize emissions the charge pump is switched off if the input voltage is high enough to charge the bootstrap capacitor. 5.1.2 Operation Mode The PWM pulses are voltage controlled. The error amplifier and the PWM comparator are creating the PWM pulses using the oscillator saw-tooth signal and the feedback voltage. The pulse-width modulation is done so that the feedback voltage (at pin FB for the adjustable version) is similar to the reference voltage (0.6 V). Between input voltages from 8.0 to 36 V the integrated feed forward path provides a fast line transient rejection. (feed-forward means sensing the input voltage and react on fluctuations before they influence the output) To achieve a stable output voltage even under low duty cycle conditions (light load down to zero output load and/or high input voltage) a pulse skipping mode is implemented. Pulse skipping is also used for operation with low supply voltages leading to duty cycles > 92%. Data sheet 8 Rev. 1.0, 2009-05-18 TLE8366 Buck Regulator COMP OC Comp. L when Overcurrent Error Amp. FB Soft start BDS PWM H when Comp. Error -Signal < Error -Signal Error -Ramp VRef Output Stage OFF when H L when Tj > 175 °C = OFF when H R & V max V min Ramp Vhigh t V low Clock tr tf tr S S H = INV Q OFF 1 Gate Driver Supply H= ON Power D-MOS Gate Driver BUO & Q PWM-FF & Schmitt-Trigger 1 & Q L when Output overvoltage Feedforward ∆V=k X VS Oscillator tr tf tr _ >1 R Ramp Generator SYNC Charge Pump NOR1 Error -Ramp 0.6 V VS = NAND 2 Q & Error -FF H when UV at V BDS t BDS UV Comp. = Figure 3 Block Diagram Buck Regulator 5.2 Electrical Characteristics Electrical Characteristics: Buck Regulator VS = 6.0 V to 40 V, Tj = -40 °C to +150 °C, all voltages with respect to ground (unless otherwise specified) Pos. 5.2.1 Parameter Output voltage Symbol VFB Limit Values Min. Typ. Max. 4.90 5.00 5.10 Unit Conditions V TLE8366EV50; VVEN = VS 0.1A < ICC < 1.0A VFB 5.2.2 5.2.3 Output voltage 5.2.4 5.2.5 Output voltage 5.2.6 Data sheet VFB 4.80 5.00 5.20 V TLE8366EV50; VVEN = VS; 3.23 VFB 3.17 VFB VFB 3.30 V 3.43 V 0.588 0.60 0.612 V 0.576 0.60 0.624 V 9 3.30 3.37 1mA < ICC < 1.8A TLE8366EV33; VVEN = VS; 0.1A < ICC < 1.0A TLE8366EV33; VVEN = VS; 1mA < ICC < 1.8A TLE8366EV; VVEN = VS; FB connected to VCC; VS = 12V 0.1A < ICC < 1.0A TLE8366EV; VVEN = VS; FB connected to VCC; VS = 12V 1mA < ICC < 1.8A Rev. 1.0, 2009-05-18 TLE8366 Buck Regulator Electrical Characteristics: Buck Regulator VS = 6.0 V to 40 V, Tj = -40 °C to +150 °C, all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions TLE8366EV501) TLE8366EV331) Min. Typ. Max. 0 – – mA 5.2.8 1 – – mA 5.2.9 1.5 5.2.7 Minimum output load requirement ICC,MIN mA TLE8366EV VCC > 3V1) 5.2.10 5 mA TLE8366EV VCC > 1.5V1) 5.2.11 10 – – mA TLE8366EV VCC ≥ 0.6V1) 5.2.12 FB input current IFB -1 -0.1 0 µA TLE8366EV VFB = 0.6V 5.2.13 FB input current IFB – – 900 µA TLE8366EV50, TLE8366EV33 5.2.14 Power stage on-resistance – – 500 mΩ tested at 300 mA 5.2.15 Current transition rise/fall time – 50 – ns 5.2.16 Buck peak over current limit 2.2 – 3.6 A ICC=1 A 2) – 5.2.17 Bootstrap under voltage lockout, turn-off threshold Ron tr IBUOC VBDS,off – V Bootstrap voltage decreasing VS = 12V; VBUO = VBDS = GND (VBDS - VBUO) increasing VBUO – +3.3 5.2.18 Charge pump current ICP 2 – – mA 5.2.19 Charge pump switch-off threshold – – 5 V 5.2.20 Maximum duty cycle – – 100 % 3) 5.2.21 Soft start ramp VBDS VBUO Dmax tstart 350 500 750 µs VFB rising from 5% to 95% of VFB,nom 5.2.22 Input under voltage shutdown threshold VS,off 3.75 – – V VS decreasing 5.2.23 Input voltage startup threshold – – 4.75 V VS increasing 5.2.24 Input under voltage shutdown hysteresis VS,on VS,hyst 150 – – mV – 1) Not subject to production test, application related parameter 2) Not subject to production test; specified by design. 3) Consider “Chapter 4.2, Functional Range” Data sheet 10 Rev. 1.0, 2009-05-18 TLE8366 Buck Regulator 5RQ PŸ PŸ 7M ƒ& Figure 4 Data sheet ƒ& ƒ& Ron 11 Rev. 1.0, 2009-05-18 TLE8366 Module Enable and Thermal Shutdown 6 Module Enable and Thermal Shutdown 6.1 Description With the enable pin the device can be set in off-state reducing the current consumption to less than 2µA. The enable function features an integrated pull down resistor which ensures that the IC is shut down and the power switch is off in case the pin EN is left open. The integrated thermal shutdown function turns the power switch off in case of overtemperature. The typ. junction shutdown temperature is 175°C, with a min. of 160°C. After cooling down the IC will automatically restart operation. The thermal shutdown is an integrated protection function designed to prevent IC destruction when operating under fault conditions. It should not be used for normal operation. 6.2 Electrical Characteristics Module Enable, Bias and Thermal Shutdown Electrical Characteristics: Enable, Bias and Thermal Shutdown VS = 6.0 V to 40 V, Tj = -40 °C to +150 °C, all voltages with respect to ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Typ. Max. Unit Conditions VEN = 0.8V; Tj < 105°C; VS = 16V VEN = 5.0V; ICC = 0mA; VS = 16V FB connected to VOUT VEN = 5.0V; ICC = 1.8A; VS = 16V FB connected to VOUT1) 6.2.1 Current Consumption, shut down mode Iq,OFF – 0.1 2 µA 6.2.2 Current Consumption, active mode Iq,ON – – 7 mA 6.2.3 Current Consumption, active mode Iq,ON – – 10 mA 6.2.4 VEN,lo VEN,hi Enable hysteresis VEN,HY Enable high input current IEN,hi Enable low input current IEN,lo Over temperature shutdown Tj,sd Over temperature shutdown Tj,sd_hyst 6.2.5 6.2.6 6.2.7 6.2.8 6.2.9 6.2.10 Enable high signal valid 3.0 – – V – Enable low signal valid – – 0.8 V – 50 200 400 mV 1) – – 30 µA – 0.1 1 µA VEN = 16V VEN = 0.5V 160 175 190 °C 1) – 15 – K 1) hysteresis 1) Specified by design. Not subject to production test. Data sheet 12 Rev. 1.0, 2009-05-18 TLE8366 Module Oscillator 7 Module Oscillator 7.1 Description The oscillator supplies the device with a constant frequency. The power switch will be switched on and off with a constant frequency. The duty-cycle is derived from this frequency and some safety functions are synchronized to this frequency. The internal sawtooth signal used for the PWM generation has an amplitude proportional to the input supply voltage (feedforward). The turn-on frequency can optionally be set externally via the ’SYNC’ pin. In this case the synchronization of the PWM-on signal refers to the falling edge of the ’SYNC’-pin input signal. In case the synchronization to an external clock signal is not needed the ’SYNC’ pin should be connected to GND. Leaving pin SYNC open or short-circuiting it to GND leads to normal operation with the internal switching frequency. 7.2 Electrical Characteristics Module Oscillator Electrical Characteristics: Buck Regulator VS = 6.0 V to 40 V, Tj = -40 °C to +150 °C, all voltages with respect to ground (unless otherwise specified) Pos. 7.2.1 Parameter Oscillator frequency 7.2.2 Synchronization capture range 7.2.3 SYNC signal high level valid 7.2.4 SYNC signal low level valid 7.2.5 SYNC input internal pull-down Symbol fosc fsync VSYNC,hi VSYNC,lo RSYNC Limit Values Unit Conditions VSYNC = 0V Min. Typ. Max. 330 370 420 kHz 530 kHz 200 V 1) 0.8 V 1) 1.4 MΩ VSYNC = 5V 2.9 0.60 1.0 1) Synchronization of PWM-on signal to falling edge. Data sheet 13 Rev. 1.0, 2009-05-18 TLE8366 Application Information 8 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. 8.1 Frequency Compensation The stability of the output voltage can be achieved with a simple RC connected between pin COMP and GND. The standard configuration using the swiching frequency of the internal oscillator is a ceramic capacitor CCOMP = 22nF and RCOMP = 22kΩ. By slight modifications to the compensation network the stability can be optimized for different application needs, such as varying switching frequency (using the sychronizing function), different types of buck capacitor (ceramic or tantalum) etc. The compensation network is essential for control loop stability. Leaving pin COMP open might lead to instable operation. 8.2 Compensating a tantalum buck capacitor CBU1 The control loop is optimized for use of ceramic buck capacitors CBU. In order to maintain stability also for tantalum capacitors with ESR up to 300mΩ, an additional compensation capacitance CCOMP2 at pin COMP to GND is required. It’s value calculates: CCOMP2 = CBU * ESR(CBU) / RCOMP , whereas CCOMP2 needs to stay below 5nF. Application _C-COMP2.vsd COMP 3 TLE8366 CCOMP CCOMP2 2 RCOMP GND Figure 5 High-ESR buck capacitor compensation 8.3 Catch Diode In order to minimize losses and for fast recovery, a schottky catch diode is required. Disconnecting the catch diode during operation might lead to destruction of the IC. Data sheet 14 Rev. 1.0, 2009-05-18 TLE8366 Application Information 8.4 TLE8366EV50, TLE8366EV33 with fixed Output Voltage LI 22…47µH D1 VBatt Ignition Key Terminal 15 7 EN 8 VS Enable Charge Pump Over Temperature Shutdown 5 BDS Feedforward COMP 3 CBOT 220nF Buck Converter 6 BUO DBU CCOMP SYNC 1 Oscillator 4 FB LBU VCC 47µH CBU1 CBU2 100µF 220nF RCOMP Bandgap Reference Soft start ramp generator TLE8366EV50 TLE8366EV33 ApplicationDiagram _8366 -fix.vsd Figure 6 2 GND Application Diagram TLE8366EV50 or TLE8366EV33 Note: This is a very simplified example of an application circuit. The function must be verified in the real application Data sheet 15 Rev. 1.0, 2009-05-18 TLE8366 Application Information 8.5 Adjustable Output Voltage Device LI 22…47µH D1 VBatt Ignition Key Terminal 15 7 EN 8 Biasing & Enable VS Charge Pump Over Temperature Shutdown 5 BDS Feedforward COMP 3 CBOT Buck Converter 220nF 6 BUO DBU CCOMP SYNC 1 Oscillator LBU VOUT 47µH R1 4 FB RCOMP Bandgap Reference Soft start ramp generator CFB CBU1 CBU2 100µF 220nF R2 TLE8366EV ApplicationDiagram _8366 -var.vsd Figure 7 2 GND Application Diagram TLE8366EV Note: This is a very simplified example of an application circuit. The function must be verified in the real application The output voltage of the TLE8366EV can be programmed by a voltage divider connected to the feedback pin FB. The divider cross current should be 300 µA at minimum, therefore the maximum R2 calculates: R2 ≤ VFB / IR2 --> R2 ≤ 0.6V / 300 µA = 2 kΩ For the desired output voltage level VCC, R1 calculates then (neglecting the small FB input current): V CC  R 1 = R 2  ---------–1 . V  FB Add a 0.5 nF capacitor close to FB pin. Data sheet 16 Rev. 1.0, 2009-05-18 TLE8366 Package Outlines 9 Package Outlines 0.35 x 45˚ 1.27 0.41±0.09 2) 0.2 M 0.08 C Seating Plane C A-B D 8x 0˚...8˚ 0.64 ±0.25 D 1 5 1 6 ±0.2 0.2 M D 8x Bottom View 3 ±0.1 A 8 0.19 +0.06 8˚ MAX. 8˚ MAX. C 0.1 C D 2x 4 8 4 5 2.65 ±0.1 0˚...8˚ 1.7 MAX. Stand Off (1.45) 0.2 +0 -0.1 8˚ MAX. 0.1+0 -0.1 3.9 ±0.11) B 4.9 ±0.11) 0.1 C A-B 2x Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area 3) JEDEC reference MS-012 variation BA Figure 9 GPS01206 Outline PG-DSO-8 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further package information, please visit our website: http://www.infineon.com/packages. Data sheet 18 Dimensions in mm Rev. 1.0, 2009-05-18 TLE8366 Revision History 10 Revision History Rev Version Date Rev.1.0 2009-05-18 Final data sheet Data sheet Changes 19 Rev. 1.0, 2009-05-18 Edition 2009-05-18 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.