TLE9272QX
Hi gh- End System Basi s Chip Fami ly
1
Overview
Features
Key Features
•
Very low quiescent current consumption in SBC Stop and Sleep Mode
•
Periodic Cyclic Wake in SBC Normal and Stop Mode
•
SMPS 750mA (DC/DC buck) voltage regulator 5V to supply high current load with high efficiency
•
DC/DC Boost converter for low battery supply voltage
•
Low-Drop Voltage Regulator 5V/100mA, protected for off-board usage
•
High-Speed CAN Transceiver:
– fully compliant to ISO11898-2:2016
– supporting CAN FD communication up to 5Mbps
•
Up to 3 LIN Transceivers LIN2.2, SAE J2602 with programmable TXD timeout feature and LIN Flash Mode
•
Compliant with “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”
Revision 1.3, 2012-05-04
•
One universal High-Voltage Wake Input for voltage level monitoring
•
Configurable wake-up sources
•
Reset Output
•
Configurable timeout and window watchdog
•
Fail-Safe Input to monitor MCU hardware functionality
•
Up to three Fail-Safe Outputs (depending on configurations) to activate external loads in case of system
malfunctions are detected
•
Overtemperature and short circuit protection feature
•
Wide input voltage and temperature range
•
Software compatible with latest Infineon SBC families
•
Green Product (RoHS compliant) & AEC Qualified
•
PG-VQFN-48-31 leadless exposed-pad power package with Lead Tip Inspection (LTI)
Scalable System Basis Chip (SBC) Family
•
Product family with various products for complete scalable application coverage
•
Dedicated Datasheets are available for the different product variants
Datasheet
www.infineon.com
1
Rev. 1.5
2019-09-27
TLE9272QX
Overview
•
Complete compatibility (hardware and software) across the family
•
TLE9273 with 4 LIN transceivers, SMPS Boost with 2 output voltage configurations
•
TLE9272 with 3 LIN transceivers, SMPS Boost with 2 output voltage configurations
•
TLE9271 with 2 LIN transceivers, SMPS Boost with 2 output voltage configurations
•
Product variants for 5V (TLE927xQX) and 3.3V (TLE927xQXV33) output voltage for main voltage regulator
Potential applications
•
Body control modules
•
Gateway
•
HVAC ECU and Control panel
Product validation
Qualified for automotive applications. Product validation according to AEC-Q100/101.
Description
The TLE9272QX is a monolithic integrated circuit in an exposed pad PG-VQFN-48-31 (7mm x 7mm) leadless
package with Lead Tip Inspection (LTI) feature supporting Automatic Optical Inspection (AOI).
The device is designed for various CAN-LIN automotive applications as the main supply for the microcontroller
and as the interface for LIN and CAN bus networks.
The System Basis Chip (SBC) provides the main functions for supporting these applications, such as a Switch
Mode Power Supply regulator (SMPS) for on-board 5V supply, another 5V low-dropout voltage regulator with
off-board protection, e.g. sensor supply, a DC/DC Boost converter for low supply voltage, an HS-CAN
transceiver supporting CAN FD, a LIN transceiver for data transmission and a 16-bit Serial Peripheral Interface
(SPI) to control and monitor the device. Additional feature include a timeout / window watchdog circuit with
a reset feature, Fail-Safe Input and Fail-Safe Outputs and undervoltage reset features.
The device offers low-power modes in order to minimize current consumption on applications that are
connected permanently to the battery. A wake-up from the low-power mode is possible via a message on the
buses, via the bi-level sensitive monitoring/wake-up input as well as via cyclic wake.
The device is designed to withstand the severe conditions of automotive applications.
Type
Package
Marking
TLE9272QX
PG-VQFN-48-31
TLE9272QX
Datasheet
2
Rev. 1.5
2019-09-27
TLE9272QX
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
3.1
3.2
3.3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Hints for Unused Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
4.1
4.2
4.3
4.4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
13
14
15
5
5.1
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.2
5.2.1
5.2.2
5.3
System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
State Machine Description and SBC Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Init Mode and Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Development Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cyclic Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supervision Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
19
21
21
22
23
24
25
26
26
27
27
6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.3
6.3.1
6.3.2
6.3.2.1
6.4
6.4.1
6.4.2
6.4.2.1
DC/DC Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description Buck converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Startup Procedure (Soft Start) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buck regulator Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description Boost . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boost Regulator Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak Overcurrent Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buck and Boost in SBC Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buck and Boost in SBC Stop Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Automatic Transition from PFM to PWM in SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
28
29
30
30
31
32
33
33
33
34
34
34
34
Datasheet
3
Rev. 1.5
2019-09-27
TLE9272QX
6.4.2.2
6.4.2.3
6.4.3
6.4.3.1
6.5
Manual Transition from PFM to PWM in SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Stop to Normal Mode Transition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buck and Boost in SBC Sleep and Fail Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Sleep/Fail Safe Mode to Normal Mode Transition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
35
36
36
36
37
7
7.1
7.2
7.3
Voltage Regulator 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
40
40
41
42
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.3
High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN Wake Capable Mode (Wake-up Pattern) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TXDCAN Time-out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCAN Undervoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
44
44
44
46
46
47
47
48
49
49
50
9
9.1
9.1.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
9.2.7
9.2.8
9.2.9
9.3
LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Wake Capable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TXDLIN Time-Out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Undervoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Slope Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming via LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics of the LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
58
58
58
59
59
60
60
60
61
62
62
62
63
64
10
10.1
10.2
10.2.1
10.3
Wake Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
69
69
70
70
72
11
11.1
11.2
Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Block and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
12
12.1
12.2
Fail-Safe Outputs and Fail-Safe Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Fail-Safe Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Datasheet
4
Rev. 1.5
2019-09-27
TLE9272QX
12.3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
13
13.1
13.1.1
13.1.2
13.1.3
13.2
13.2.1
13.2.2
13.2.3
13.2.4
13.2.4.1
13.3
13.4
13.5
13.5.1
13.5.2
13.5.3
13.5.4
13.6
13.7
13.8
13.8.1
13.8.2
13.8.3
13.9
Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset Output Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset Clamp to high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soft Reset Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Time-Out Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Setting Check Sum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog during SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WD Start in SBC Stop Mode due to BUS Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VS Power ON Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under Voltage VLIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buck Regulator Monitoring Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC1 Under Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC1 Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC1 Short Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SMPS Status register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC2 Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCAN Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBC Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
SPI Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
SPI Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
SPI Status Information Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
15
15.1
15.2
15.3
15.4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Diagram with Boost Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Diagram without Boost Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
17
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Datasheet
5
79
79
79
80
80
81
82
82
83
83
84
86
86
87
87
87
88
88
88
88
89
89
89
89
90
115
115
118
121
122
Rev. 1.5
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TLE9272QX
Block Diagram
2
Block Diagram
VSENSE
VS
BSTD
VCC1
Buck
Boost
BSTG
BCKSW
VCC1
SNSP
SNSN
Vint.
VS2
FO1
FO2/FSI
Fail Safe
FO3/TEST
SDI
SDO
CLK
CSN
SPI
VCC2
VCC2
SBC
STATE
MACHINE
CFG
INT
Interrupt
Control
Window Watchdog
WK1
RO
RESET
GENERATOR
WK
VCAN
Vs
WAKE
REGISTER
CAN cell
VLIN
TXDCAN
RXDCAN
CANH
CANL
3
3
3
TXDLIN
RXDLIN
LIN cell 1
LIN1
TXDLIN
RXDLIN
LIN2
LIN cell 2
TXDLIN
RXDLIN
LIN3
LIN cell 3
GND
Figure 1
Datasheet
Block Diagram
6
Rev. 1.5
2019-09-27
TLE9272QX
Pin Configuration
Pin Configuration
3.1
Pin Assignment
36 WK
35 BSTD
34 BSTG
33 SNSP
32 SNSN
31 n.c.
30 VSENSE
29 VS
28 VS
27 BCKSW
26 GND
25 INT
3
CFG 37
CSN 38
SDO 39
SDI 40
CLK 41
GND 42
VCC2 43
VS2 44
VLIN 45
FO1 46
FO2/FSI 47
FO3/TEST 48
TLE9272QX
PG-VQFN-48
24
23
22
21
20
19
18
17
16
15
14
13
RO
VCC1
RXDCAN
TXDCAN
VCAN
N.U.
N.C.
RXDLIN3
TXDLIN3
RXDLIN2
TXDLIN2
RXDLIN1
12
11
10
9
8
7
6
5
4
3
2
1
TXDLIN1
GND
CANL
CANH
GND
n.c.
GND
LIN3
n.c.
LIN2
GND
LIN1
Figure 2
Datasheet
Pin Configuration
7
Rev. 1.5
2019-09-27
TLE9272QX
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Function
1
LIN1
LIN Bus 1. Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.1 as well as SAE J2602-2.
2
GND
Ground: LIN1 and LIN2 common ground.
3
LIN2
LIN Bus 2. Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.1 as well as SAE J2602-2.
4
n.c.
not connected. Not bonded internally
5
LIN3
LIN Bus 3. Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.1 as well as SAE J2602-2.
6
GND
Ground. LIN3 and LIN4 common ground.
7
n.c.
not connected. Not bonded internally
8
GND
Ground.
9
CANH
CAN High Bus Pin.
10
CANL
CAN Low Bus Pin.
11
GND
Ground. CAN common ground.
12
TXDLIN1
Transmit LIN1.
13
RXDLIN1
Receive LIN1.
14
TXDLIN2
Transmit LIN2.
15
RXDLIN2
Receive LIN2.
16
TXDLIN3
Transmit LIN3.
17
RXDLIN3
Receive LIN3.
18
N.U.
Not Used. Used for internal testing purpose. Do not connect, leave open.
19
N.U.
Not Used. Used for internal testing purpose. Do not connect, leave open.
20
VCAN
Supply Input for internal HS-CAN module.
21
TXDCAN
Transmit CAN.
22
RXDCAN
Receive CAN.
23
VCC1
Buck Regulator. Input feedback for Buck regulator
24
RO
Reset Output. Active LOW, internal pull-up
25
INT
Interrupt Output. Active LOW output
26
GND
Ground. Buck regulator ground
27
BCKSW
Buck regulator switch node output.
28
VS
Buck Supply Voltage. Connected to battery voltage or Boost output voltage
with reverse protection diode. Use a filter against EMC in case the Boost is not
used.
29
VS
Buck Supply Voltage. Connected to battery voltage or Boost output voltage
with reverse protection diode. Use a filter against EMC in case the Boost is not
used.
Datasheet
8
Rev. 1.5
2019-09-27
TLE9272QX
Pin Configuration
Pin
Symbol
Function
30
VSENSE
Sense Input Voltage for Boost.
Boost regulator feedback input. Connect with VS.
31
n.c.
not connected. Not bonded internally
32
SNSN
Ground. Boost regulator ground.
33
SNSP
Boost Transistor Source. Source connection for external MOSFET, sense
resistor connection. Connect to GND if Boost regulator is not used.
34
BSTG
Boost Transistor Gate. Gate connection for external MOSFET. Connect to GND
or leave open if Boost regulator is not used.
35
BSTD
Boost Transistor Drain. Drain connection for external MOSFET. Connect to VS if
Boost regulator is not used.
36
WK
Wake Input.
37
CFG
Hardware initialization pin.
external pull-up to VCC1 needed. Refer to Chapter 15.
38
CSN
SPI Chip Select Not Input.
39
SDO
SPI Data Output. Out of SBC (=MISO)
40
SDI
SPI Data Input. Into SBC (=MOSI)
41
CLK
SPI Clock Input.
42
GND
Ground.
43
VCC2
Voltage Regulator Output 2.
44
VS2
Supply Voltage for VCC2. Connected to battery voltage with reverse protection
diode and filter against EMC.
45
VLIN
Reference Voltage for LIN. Connected to battery voltage with reverse
protection diode and filter against EMC.
46
FO1
Fail Output 1. active LOW, open drain.
47
FO2/FSI
Fail Output 2 - Side Indicator. Side Indicator 1.25Hz 50% duty cycle output;
active LOW, open drain.
FSI. Fail-Safe Input (default configuration); connect to GND if not used.
48
FO3/TEST
Fail Output 3 - Pulsed Lighted Output. Break/rear light 100Hz 20% duty cycle
output; active LOW, open-drain.
TEST. Connect to GND to activate SBC Development Mode; integrated pull-up
resistor. Connect to VS with a pull-up resistor or leave open for normal operation.
Coolin
g Tab
GND
Cooling Tab - Exposed Die Pad; for cooling purposes, do not use as the only
electrical ground.1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB.
The exposed die pad is not connected to any active part of the IC. However it should be connected to GND for the best
EMC performance.
Datasheet
9
Rev. 1.5
2019-09-27
TLE9272QX
Pin Configuration
3.3
Hints for Unused Pins
It must be ensured that the correct configurations are also selected, i.e. in case functions are not used that
they are disabled via SPI:
•
WK: connected to GND and disable the WK input via SPI;
•
LINx, RXDLINx, TXDLINx, RXDCAN, TXDCAN, CANH, CANL: leave all pins open;
•
BSTD: connect to VS in case the Boost regulator is not used and keep disabled;
•
BSTG: connect to GND or leave open in case the Boost regulator is not used and keep disabled;
•
SNSP, SNSN: connect to GND in case the Boost regulator is not used;
•
RO / FOx: leave open;
•
INT: leave open;
•
TEST: connect to GND during power-up to activate SBC Development Mode; connect to VS or leave open
for normal user mode operation;
•
VCC2: leave open and keep disabled;
•
VCAN: connect to VCC1;
•
n.c.: not connected, not bonded internally, connected to GND;
•
Unused pins routed to an external connector which leaves the ECU should feature a zero ohm jumper
(depopulated if unused) or ESD protection.
Datasheet
10
Rev. 1.5
2019-09-27
TLE9272QX
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise
specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Voltages
Supply Voltage VS pin
VS, max
-0.3
–
28
V
–
P_4.1.1
Supply Voltage VS2 pin
VS2, max
-0.3
–
28
V
–
P_4.1.25
Supply Voltage VS pin
VS, max
-0.3
–
40
V
Load Dump,
max. 400 ms
P_4.1.2
Supply Voltage VS2 pin
VS2, max
-0.3
–
40
V
Load Dump,
max. 400 ms
P_4.1.26
LIN Supply Voltage VLIN pin VLIN, max
-0.3
–
40
V
–
P_4.1.12
Boost drain Voltage BSTD
pin
VBSTD, max
-0.3
–
28
V
–
P_4.1.19
Boost drain Voltage BSTD
pin
VBSTD, max
-0.3
–
40
V
Load Dump,
max. 400 ms
P_4.1.20
Boost Gate Voltage BSTG pin VBSTG, max
-0.3
–
40
V
–
P_4.1.21
Supply Voltage SNSP pin
VSNSP, max
-0.3
–
40
V
–
P_4.1.22
Sense Voltage VSENSE pin
VSENSE, max
-0.3
–
40
V
–
P_4.1.23
Buck switch BCKSW pin
VBCKSW, max
-0.3
–
VS+0.3
V
–
P_4.1.24
Buck Regulator feedback,
pin VCC1
VCC1, max
-0.3
–
5.5
V
–
P_4.1.3
Voltage Regulator 2 Output, VCC2, max
pin VCC2
-0.3
–
40
V
–
P_4.1.5
Wake Input
VWK, max
-0.3
–
40
V
–
P_4.1.6
Fail Pins FO1, FO2/FSI,
FO3/TEST
VFOx, max
-0.3
–
40
V
–
P_4.1.7
Configuration Pin CFG
VCFG, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.8
LINx, CANH, CANL
VBUS, max
-27
–
40
V
–
P_4.1.9
Vdiff=CANH-CANL
VDIFF
-5
–
10
V
–
P_4.1.28
Logic Input Voltage
VI, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.10
Datasheet
11
Rev. 1.5
2019-09-27
TLE9272QX
General Product Characteristics
Table 1
Absolute Maximum Ratings1) (cont’d)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise
specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Logic Output Voltage
VO, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.27
VCAN Input Voltage
VVCAN, max
-0.3
–
5.5
V
–
P_4.1.11
Junction Temperature
Tj
-40
–
150
°C
–
P_4.1.13
Storage Temperature
Tstg
-55
–
150
°C
–
P_4.1.14
VESD
-2
–
2
kV
HBM2)
Temperatures
ESD Susceptibility
ESD Resistivity to GND
3)2)
P_4.1.15
ESD Resistivity to GND,
CANH, CANL, LINx
VESD
-8
–
8
kV
HBM
P_4.1.16
ESD Resistivity to GND
VESD
-500
–
500
V
CDM4)
P_4.1.17
V
4)
P_4.1.18
ESD Resistivity Pin 1,
VESD1,12,13,24, -750
12,13,24,25,36,37,48 (corner 25,36,37,48
pins) to GND
–
750
CDM
1) Not subject to production test, specified by design.
2) ESD susceptibility, “HBM” according to ANSI/ESDA/JEDEC JS-001 (1.5kΩ, 100pF).
3) For ESD GUN Resistivity, tested at 6KV (according to IEC61000-4-2 “gun test” (330Ω, 150pF)), it is shown in Application
Information and test report, provided from IBEE, is available.
4) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1.
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Datasheet
12
Rev. 1.5
2019-09-27
TLE9272QX
General Product Characteristics
4.2
Functional Range
Table 2
Functional Range
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
1)
Number
Supply Voltage
VS,func
VPOR
–
28
V
LIN Supply Voltage (VLIN
pin)
VREF,LIN
5.5
–
18
V
CAN Supply Voltage
VCAN
4.75
–
5.25
V
–
P_4.2.3
CFG external pull-up
RCFG
10
–
22
kΩ
–
P_4.2.6
SPI frequency
fSPI
–
–
4
MHz
see
P_4.2.4
Chapter 14.7 for
fSPI,max
Junction Temperature
Tj
-40
–
150
°C
–
VPOR see section P_4.2.1
Chapter 13.9
P_4.2.2
P_4.2.5
1) Including Power-On Reset, Over- and Under voltage Protection
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
Device Behavior Outside of Specified Functional Range:
•
28V < VS,func < 40V: Device will still be functional; the specified electrical characteristics may not be ensured
anymore. The Buck and VCC2 will work, however, a thermal shutdown may occur due to high power
dissipation. The specified SPI communication speed is ensured. The absolute maximum ratings are not
violated, however the device is not intended for continuous operation of VS >28V. Operating the device at
high junction temperatures for prolonged periods of time may reduce the life of the device.
•
18V < VLIN VTEST,H
are active, SBC Restart Mode
0
1
Config 3
After missing the WD trigger for the second
time, the state of VCC1 remains unchanged,
FOx pins are active, SBC Restart Mode
Open or
>VTEST,H
0
0
An external pull-up resistor on CFG pin (RCFG) is needed for proper SBC configuration. The Config 1 or 3 is
selectable via SPI using CFG2 bit on HW_CTRL register.
The timing diagram for hardware configuration is shown in Figure 4.
The SBC starts up in SBC Init Mode after crossing the VPOR,r threshold (see also Chapter 13.3) or after a
software reset command. As soon as the VCC1 voltage reaches the rising reset threshold VRT1,r, the
configuration selection monitoring period starts for tRD1 (Reset Delay Time). After this time, the reset pin is
released and the window watchdog starts with a long open window tLW.
VS
VPOR,r
t
VCC1
VRT1,r
t
RO
tRD1
t
Configuration selection monitoring period
Figure 4
Hardware Configuration Selection Timing Diagram
During the long open window, the microcontroller shall finish its startup and initialization sequence. From this
transition mode, the SBC can be set, via SPI command, to SBC Normal Mode.
Any SPI command will bring the SBC to SBC Normal Mode even if it is an illegal SPI command (Chapter 14.2).
Datasheet
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No watchdog trigger during the long open window, will cause a watchdog failure and the device will enter in
SBC Restart Mode as shown in Table 5 and one reset event is generated.
In case of 3 consecutive reset events due to WD failures, it is possible not to generate additional reset by
setting the MAX_3_RST on WD_CTRL and the SBC will remain in SBC Normal or Stop Mode (SBC Restart Mode
not entered anymore). If the MAX_3_RST is set to 0, one reset event is generated for each missing watchdog
trigger.
Wake-up events are ignored during SBC Init Mode and will therefore be lost.
Note: Any SPI command will bring the SBC to SBC Normal Mode even if it is an illegal SPI command (see
Chapter 14.2)
Note:
For a safe start-up, it is recommended to use the first SPI commands to trigger and to configure the
watchdog
Note:
At power up no VCC1_UV will be issued nor will the FOx be triggered as long as VCC1 is below VRT1,r
threshold and below the VS threshold for VS under voltage time out VS,UV_TO. The RO pin will be kept low
as long as VCC1 is below the selected VRT1,r threshold. When VCC1 is above the VRT1,r threshold, the RO is
released after tRD1 (Reset Delay Time).
5.1.2
SBC Normal Mode
The SBC Normal Mode is the standard operating Mode for the SBC. All configurations have to be done in SBC
Normal Mode before entering a low-power mode. A wake-up event on CAN LIN1, LIN2, LIN3 and WK will create
an interrupt on pin INT however, no changes of SBC Mode will occur. The configuration options are listed
below:
•
VCC1 is active (Buck regulator in PWM Mode)
•
Boost Regulator can be configured and enabled or disabled. The module will start to work as soon as the
VS value is dropping below the selected threshold. For additional information, refer to Chapter 6.3.
•
VCC2 can be switched ON or OFF (default off)
•
CAN is configurable (OFF coming from SBC Init Mode; OFF or wake capable coming from SBC Restart Mode,
see also Chapter 5.1.5)
•
LIN is configurable (OFF coming from SBC Init Mode; OFF or wake capable coming from SBC Restart Mode,
see also Chapter 5.1.5)
•
Wake pin shows the input level and can be selected to be wake capable
•
Cyclic wake can be configured with Timer1
•
Watchdog is configurable
•
FO1 and FO3 are OFF and FSI is active by default. FSI can be configured to be Fail-Safe Output (see also
Chapter 12.2). Coming from SBC Restart Mode, the FOx can be active or inactive (see also Chapter 12.1)
In SBC Normal Mode, there is the possibility of testing the FO outputs, i.e. to verify if setting the FOx pins to low
will create the intended behavior within the system. The FO outputs can be enabled and then disabled again
by the microcontroller by setting the FO_ON SPI bit. The feature is only intended for testing purposes.
5.1.3
SBC Stop Mode
The SBC Stop Mode is the first level technique to reduce the overall current consumption. In this mode VCC1
regulator is still active and supplying the microcontroller, which can enter into a power down mode. The VCC2
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could be enabled or disabled, CAN & LIN can be configured as Receive Only Mode, or wake capable or disable.
All kind of settings have to be done before entering SBC Stop Mode. In SBC Stop Mode any kind of SPI WRITE
commands are ignored and the SPI_FAIL bit is set, except for changing to SBC Normal Mode, triggering a SBC
Soft Reset, refreshing the watchdog, write the SYS_STAT_CTRL register as well as reading and clearing the SPI
status registers. A wake-up event on CAN, LIN1, LIN2, LIN3 and WK will create an interrupt on pin INT however, no change of SBC Mode will occur. The configuration options are listed below:
•
VCC1 is ON (Buck regulator in PFM Mode)
•
Boost regulator is fixed as configured in SBC Normal Mode. The module will start to work as soon as the VS
value drops below the selected threshold.
•
VCC2 is fixed as configured in SBC Normal Mode
•
CAN is fixed as configured in SBC Normal Mode
•
LIN is fixed as configured in SBC Normal Mode
•
WK is fixed as configured in SBC Normal Mode
•
Cyclic wake is fixed as configured in SBC Normal Mode
Note: It is not possible to switch directly from SBC Stop Mode to SBC Sleep Mode. Doing so will also set the
SPI_FAIL flag and will bring the SBC into Restart Mode.
5.1.4
SBC Sleep Mode
The SBC Sleep Mode is the second level technique to reduce the overall current consumption to a minimum
needed to react on wake-up events. In this mode, VCC1 regulator is OFF and not supplying the microcontroller
anymore.The VCC2 supply can be configured to stay enabled. A wake-up event on CAN, LIN1, LIN2, LIN3 or WK
pin return the device to SBC Normal Mode via SBC Restart Mode and signal the wake source.
The configuration options are listed below:
•
VCC1 is OFF
•
Boost regulator is OFF
•
VCC2 is fixed as configured in SBC Normal Mode
•
Can must be set to CAN wake capable / CAN off before entering SBC Sleep Mode
•
LIN is fixed as configured in SBC Normal Mode
•
WK is fixed as configured in SBC Normal Mode
It is not possible to switch off all wake sources in SBC Sleep Mode. When a CAN or LIN transceiver is in its
Normal or Receive Only Mode, it counts as a wake source. In that case it changes automatically to Wake
Capable when the SBC enters SBC Sleep Mode.
All settings must be made before entering SBC Sleep Mode. If SPI configurations were sent to the SBC in SBC
Sleep Mode, the commands are ignored and there is no response from the SBC.
In order to enter SBC Sleep Mode successfully, all wake source signaling flags from WK_STAT_1 and
WK_STAT_2 need to be cleared. Otherwise, the device will immediately wake-up from SBC Sleep Mode by
going via SBC Restart to Normal Mode.
Note: As soon as the Sleep Command is sent, the Reset will go low to avoid any undefined behavior between SBC
and microcontroller
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5.1.5
SBC Restart Mode
There are multiple reasons to enter the SBC Restart Mode. The purpose of the SBC Restart Mode is to reset the
microcontroller:
•
From SBC Normal and Stop Mode:
– Undervoltage on VCC1;
– Overvoltage on VCC1 (if VCC1_OV_ RST is set);
– Incorrect Watchdog triggering.
•
From SBC Sleep and Fail-Safe Mode:
– Wake-up event on CAN or LINx or WK;
– After TDS2 (only from SBC Fail-Safe Mode. See also Chapter 13.8).
Table 6 contains detailed descriptions of the reason to restart.
Table 6
Reasons for Restart - State of SPI Status Bits after Return to Normal Mode
SBC Mode
Event
DEV_STAT WD_FAIL
VCC1_UV VCC1_OV
VCC1_SC
Normal
Watchdog failure
01
01 or 10
0
x
x
Normal
VCC1 undervoltage reset
01
xx
1
0
x
Normal
VCC1 overvoltage reset
01
xx
0
1
x
Sleep Mode
Wake-up event
10
00
0
x
x
Stop Mode
Watchdog failure
01
01 or 10
0
x
x
Stop Mode
VCC1 undervoltage reset
01
xx
1
0
x
Stop Mode
VCC1 overvoltage reset
01
xx
0
1
x
Fail-Safe
Wake-up event
01
see “Reasons for Fail-Safe,
Table 7”
It is possible to change the entering into SBC Restart Mode due to watchdog trigger failure using MAX_3_RST
on WD_CTRL register. If the MAX_3_RST is set, after three consecutive resets, no further reset events are
generated in case of missing watchdog trigger (see also Chapter 13.2).
From SBC Restart Mode, the SBC automatically enters to SBC Normal Mode, i.e. the mode is left automatically
by the SBC without any microcontroller influence once the reset condition is no longer present and when the
reset delay time (tRD1) has expired. The Reset Output (RO) is released at the transition.
Entering or leaving SBC Restart Mode will not disable the Fail outputs.
The following functions are activated / deactivated in SBC Restart mode:
•
VCC1 is ON or ramping up
•
Boost Regulator is fixed as configured in SBC Normal Mode. The module will start to work as soon as the
VS value drops below the selected threshold.
•
VCC2 will be disabled if it was activated
•
CAN is “woken” due to a wake-up event or OFF depending on previous SBC and transceiver mode (see also
Chapter 8). It is wake capable when it was in CAN Normal, Receive Only or wake capable mode before SBC
Restart Mode
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•
LINx are “woken” due to a wake-up event or OFF depending on previous SBC and transceiver mode (see
also Chapter 9). It is wake capable when it was in LINx Normal, Receive Only or wake capable mode before
SBC Restart Mode
•
RO is pulled low during SBC Restart Mode
•
SPI communication is ignored by the SBC, i.e. it is not interpreted
•
SBC Restart Mode is signalled in the SPI register DEV_STAT by DEV_STAT bits.
Note: The VCC1 overvoltage reset is by default disabled. To enable it, the VCC1_OV_ RST has to be set. For
additional information, refer to Chapter 13.5.2.
5.1.6
SBC Fail-Safe Mode
The purpose of this mode is to bring the system in a safe status after a failure condition by turning off the VCC1
regulator and the RO will be LOW. After a wake-up event, the system can restart.
The Fail-Safe Mode is automatically reached in case of following events:
•
overtemperature (TSD2) (see also Chapter 13.8);
•
VCC1 is shorted to GND (see also Chapter 13.5.3).
In this case, the default wake sources are activated and the voltage regulators are switched OFF.
The mode will be maintained for at least typical 1s (tTSD2) for a TSD2 event and typical 100ms (tFS,min) for the
other failure events to avoid any fast toggling behavior. All wake sources will be disabled during this time but
wake-up events will be stored. Stored wake-up events and wake-up events after this minimum waiting time
will lead to SBC Restart Mode. Leaving the SBC Fail-Safe Mode will not result in deactivation of the FOx pins.
The following functions are influenced during SBC Fail-Safe Mode:
•
FO outputs are activated (see also Chapter 12)
•
VCC1 is OFF
•
Boost Regulator is OFF
•
VCC2 is OFF
•
CAN is wake capable
•
LINx are wake capable
•
WK is wake capable
•
Cyclic wake is disabled, static sense is active with default filter time
•
SPI communication is disabled because VCC1 is OFF
Table 7
Reasons for Fail-Safe - State of SPI Status Bits after Return to Normal Mode
Mode
Config Event
DEV_STAT
TSD2
WD_FAIL
VCC1_UV
VCC1_SC
Normal
1, 3
TSD2
01
1
xx
x
0
Normal
1, 3, 4
VCC1 short to GND
01
x
xx
1
1
Stop Mode
1, 3
TSD2
01
1
xx
x
0
Stop Mode
1, 3
VCC1 short to GND
01
x
xx
1
1
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5.1.7
SBC Development Mode
The SBC Development Mode is used during development phase of the application, especially for software
development. The mode is reached by setting the FO3/TEST pin to LOW when the device is in SBC Init Mode
and by sending an arbitrary SPI command. The SBC Init Mode is reached after the power-up.
When sending a software reset, it is no longer possible to enter SBC Development Mode.
The software reset is the SPI command that set the MODE bits in M_S_CTRL register.
SBC Development Mode can only be left by a power-down while FO3/TEST pin is high or open, or by setting
the MODE bits on M_S_CTRL SBC Software Reset regardless of the state of FO3/TEST.
In this mode, the watchdog does not need to be triggered. No reset is triggered because of watchdog failure.
When the FO3/TEST pin is left open, or connected to Vs during the start-up, the SBC starts into normal
operation. The FO3 pin has an integrated pull-up resistor, RTEST, (switched ON only during SBC Init Mode) to
prevent the SBC device from starting in SBC Development Mode during normal life of the vehicle.
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5.2
Wake Features
The following wake sources are implemented in the device:
•
Static Sense: WK input is permanently active (see Chapter 10)
•
Cyclic Wake: internal wake source controlled via internal timer (see Chapter 5.2.1)
•
CAN wake: Wake-up via CAN pattern (see Chapter 8)
•
LIN wake: Wake-up via LIN bus (see Chapter 9)
The wake source must be set before entering in SBC Sleep Mode. In case of critical situation when the device
will be set into SBC Fail-Safe mode, all default wake sources will be activated.
5.2.1
Cyclic Wake
The cyclic wake feature is intended to reduce the quiescent current of the device and application.
For the cyclic wake feature, Timer 1 is configured as internal wake-up source and will periodically trigger an
interrupt in SBC Normal and Stop Mode based on the setting of TIMER1_CTRL.
The correct sequence to configure the cyclic wake is shown in Figure 5.
The sequence is as follows:
•
Configure the respective period of Timer1 in the register TIMER1_CTRL.
•
Enable Timer1 as a wake-up source in the register WK_CTRL_1.
Cyclic Wake Configuration
Select Timer Period in TIMER1_CTRL
Periods: 10, 20, 50, 100, 200ms, 1s, 2s
Select Timer1 as a wake source in
WK_CTRL_1
No interrupt will be generated,
if the timer is not enabled as a wake source
Cyclic Wake starts automatically
INT is pulled low at the end of every
period
Figure 5
Cyclic Wake: Configuration and Sequence
The cyclic wake function will start as soon as the Timer1 is enabled as wake-up source. An interrupt is
generated at the end of every period.
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5.2.2
Internal Timer
The integrated timer is typically used to wake up the microcontroller periodically (cyclic wake).
The following periods can be selected via the register TIMER1_CTRL:
•
Period: 10ms / 20ms / 50ms / 100ms / 200ms / 1s / 2s
5.3
Supervision Features
The device offers various supervision features to support functional safety requirements. Refer to Chapter 13
for more information.
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6
DC/DC Regulator
6.1
Block Description
The SMPS module in the TLE9272QX is implemented as a cascade of a step-up pre-regulator followed by a
step-down post-regulator. The step-up pre-regulator (DC/DC Boost converter) provides a VS level which
permits the step-down post-regulator (DC/DC Buck converter) to regulate without entering a low-drop
condition.
The SMPS module is active in SBC Normal, Stop and Restart Mode. In SBC Sleep and Fail-Safe Mode, the SMPS
module is disabled.
Comparator
VSENSE
L1
VSUP
D2
VS
C1
C2
Boost
Converter
C3
SPI
Logic
Vbat
D1
BSTD
BSTG
T1
Rsense
SNSP
SNSN
Feedforward
Buck
Converter
Bandgap
Reference
Soft Start
Ramp
Generator
Figure 6
BCKSW
GND
L2
C4
C5
VCC1
DC/DC Block Diagram
Functional Features:
•
5V SMPS (DC/DC) Buck converter with integrated high-side and low-side power switching transistor;
•
SMPS (DC/DC) Boost converter as pre-regulator for low VSUP supply voltage (down to 3V) with
configurable output voltage via SPI;
•
Fixed switching frequency for Buck and Boost converter in SBC Normal Mode in PWM (Pulse Width
Modulation);
•
PFM (Pulse Frequency Modulation) for Buck converter in SBC Stop Mode to reduce the quiescent current;
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•
Automatic transition PFM to PWM in SBC Stop Mode;
•
Soft start-up;
•
Edge Shaping for better EMC performances for Buck and Boost regulator;
•
Undervoltage monitoring on VCC1 with adjustable reset level (refer to Chapter 13.5.1);
•
Overvoltage detection on VCC1 (refer to Chapter 13.5.2);
•
Buck short circuit detection;
•
Boost current peak detection with external shunt resistor.
6.2
Functional Description Buck converter
Logic
Vbat
D1
L1
VSUP
SPI
VS
Feedforward
C1
C2
C3
Buck
Converter
Bandgap
Reference
Soft Start
Ramp
Generator
Figure 7
BCKSW
GND
L2
C4
C5
VCC1
Buck Block Diagram
The DC/DC Buck converter is intended as post-regulator (VCC1) and it provides a step down converter function
transferring energy from VS to a lower output voltage with high efficiency (typically more than 80%). The
output voltage is 5V in a current range up to 750mA. It is regulated via a digital loop with a precision of ±2%.
It requires an external inductor and capacitor filter on the output switching pin (BCKSW). The Buck regulator
has two integrated power switches. The compensation of the regulation loop is done internally and no
additonal external components are needed.
A typical application example and external components proposal is available in Chapter 15.
The Buck converter is active in SBC Normal, Stop and Restart Mode and it is disabled in SBC Sleep and Fail safe
Mode.
Depending on the SBC Mode, the Buck converter works in two different modes:
•
PWM Mode (Pulse Width Modulation): This mode is available in SBC Normal Mode, SBC Restart Mode and
SBC Stop Mode (only for automatic or manual PFM to PWM transitions. Please ref to Chapter 6.4.2). In
PWM, the Buck converter operates with a fix switching frequency (fBCK). The duty cycle is calculated
internally based on input voltage, output voltage and output current. The precision is ±2% or ±3% based
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on input supply and output current range (refer to Figure 12 for more information). In PWM Mode, the Buck
converter is capable of a 100% duty cycle in case of low VS conditions. In order to reduce EMC, edge
shaping feature has been implemented to control the activation and deactivation of the two power
switches.
•
PFM Mode (Pulse Frequency Modulation): This mode is activated automatically when the SBC Stop Mode
is entered. The PFM Mode is an asynchronous mode. PFM Mode does not have a controller switching
frequency. The switching frequency depends on conditions of the Buck regulator such as the following:
input supply voltage, output voltage, output current and external components. A typical timing diagram is
shown in Figure 8. The Buck converter in PFM Mode has a tolerance of ±4%. The transition from PFM mode
to PWM mode is described in Chapter 6.4.2.
Tristate
HS
LS
Tristate
Feedback Voltage VCC 1
LVL
UCL
LCL
Coil Current
start biasing
&
oscillator
PFM active
Quiescent Current
OFF
ON
OFF
Iq
Figure 8
Typical PFM timing diagram
6.2.1
Startup Procedure (Soft Start)
ON
Iq
PFM TIMING
The Startup Procedure (Soft Start) permits to achieve the Buck regulator output voltage avoiding large
overshoot on the output voltage. This feature is activated during the power-up, from SBC Sleep to Restart
Mode and from SBC Fail-Safe to SBC Restart Mode.
When the Buck regulator is activated, it starts with a minimum duty cycle and the regulation loop maintains it
for a limited number of switching periods. After this first phase, the duty cycle is increased by a fixed value and
kept for a limited number of switching periods. This procedure is repeated until the target output voltage
value of the Buck regulator is reached. As soon as the Buck regulator output voltage is reached, the regulation
loop starts to operate normally using PWM Mode adjusting the duty cycle according the Buck input and output
voltages and the Buck regulator output current.
6.2.2
Buck regulator Status register
The register SMPS_STAT contains information about the open or short conditions on BCKSW pin and if the
Buck regulator is outside the 12% nominal output voltage range. No SBC Mode or configuration is triggered if
one bit is set in the SMPS_STAT register.
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6.2.3
External components
The Buck converter needs one inductor and output capacitor filter. The inductor has a fixed value of 47µH.
Secondary parameter such as saturation current must be selected based on the maximum current capability
needed in the application.
The output capacitors filter are 47µF (typically, an electrolytic capacitor) in parallel with 10µF (ceramic
capacitor). This configuration is intended for Buck regulator functionary and keep the total ESR lower than 1Ω
in all temperature range. For additional information, refer to Chapter 15.1.
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6.3
Functional Description Boost
Comparator
VSENSE
L1
VSUP
D2
Boost
Converter
VS
C1
C2
SPI
C3
Logic
Vbat
D1
BSTD
BSTG
T1
Rsense
SNSP
SNSN
VS
Figure 9
Boost Block Diagram
The Boost converter is intended as pre-regulator and it provides a step up converter function. It transfers
energy from an input supply VSUP (battery voltage after the reverse protection circuit) to a higher output
voltage (VS) with high efficiency (typically more than 80%).
The regulator integrates the gate driver for external power switching and external passive components are
necessary in particular: input buffer capacitor on the battery voltage, inductor, power switching transistor,
sense resistor for overcurrent detection, freewheeling diode and filter capacitor. A typical application
example is available in Chapter 15.
In SBC Normal Mode and in SBC Stop Mode, the Boost regulator can be enabled via SPI (register HW_CTRL, bit
BOOST_EN). The boost output voltage has to be selected using BOOST_V bit. The BOOST_V on HW_CTRL
permits to select the minimum VBST1_1 or the output voltage VBST2_1.
The activation thresholds vary according to the output voltage selected. Table 8 shows the possible activation
thresholds and the hysteresis including the respective SPI setting.
Table 8
Boost activation thresholds
Boost Output Voltage Activation threshold Hysteresis
SPI Setting
VBST1_1
VBST,TH1
VBST,HYS1
BOOST_V = 1
VBST2_1
VBST,TH2
VBST,HYS2
BOOST_V = 0
If the Boost regulator is enabled, it switches ON automatically when VSENSE falls below the threshold voltage
VBST,TH1 or VBST,TH2 and switches OFF when crossing the threshold plus respective hysteresis. The bit BST_ACT
is set and it can be clear only if VSENSE is above the VBST,TH1 or VBST,TH2.
Figure 10 shows the typical timing for enabling the Boost converter.
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VSUP
VS
VBST,THx
VBST,HYSx
BST_ACT
0
1
0
BSTG
Figure 10
Boost converter activation
The Boost regulator works in PWM Mode with a fixed frequency (fBST) and a tolerance of ±5%.
If the Boost is enabled in SBC Stop Mode, the SBC quiescent current is increased.
6.3.1
Boost Regulator Status register
The register SMPS_STAT contains information about the open or short conditions on Boost pin’s including
loss of GND detection. No SBC mode or configuration is triggered if one bit is set on SMPS_STAT register.
6.3.2
External Components
The Boost converter requires a number of external components such as the following: input buffer capacitor
on the battery voltage, inductor, power switching transistor, sense resistor for overcurrent detection,
freewheeling diode and filter capacitors.
For recommend devices and values, refer to Chapter 15.1.
The inductor can be selected in one range from 22µH up to 47µH. The value and the secondary parameters
(e.g. saturation current) have to be selected in according to the maximum current capability required by the
application.
The characterization is performed with the suggested external power MOSFET Infineon BSS606N. Other
MOSFETs can be used. However, the functionality has to be checked in the application considering the gate
driver current capability (P_6.5.27 and P_6.5.9) and maximum output current requirements.
6.3.2.1
Peak Overcurrent Detection
The Boost converter implement one peak overcurrent detection using one external shunt resistor. For typical
application, refer to Chapter 15.1.
As soon as the Boost converter detects one peak overcurrent, the regulation loop reduces the duty cycle in
order to reduce the peak current on the external MOSFET.
The shunt resistor can be calculated based on VTH,SNS and using Equation (6.1).
R SENSE =
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I OC , peak
(6.1)
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Example: for an overcurrent peak detection of 2.1A, the resistor is typically 0.1Ω.
6.4
Power Scenarios
The chapter describes the features and performance of the Buck and Boost regulators according to SBC mode.
6.4.1
Buck and Boost in SBC Normal Mode
In SBC Normal Mode, the Buck regulator operates in PWM mode with fixed switching frequency. The
microcontroller and other loads on the ECU are typically supplied with a 5V output voltage. All supervision
functions for Buck regulator are available in SBC Normal Mode (for more details, refer to Chapter 13.5.1,
Chapter 13.5.2, Chapter 13.5.3 and Chapter 13.8).
6.4.2
Buck and Boost in SBC Stop Mode Operation
The SBC Stop Mode operation is intended to reduce the total amount of quiescent current while still providing
supply for microcontroller. In order to achieve this, the Buck regulator automatically changes the modulation
from PWM (Pulse Width Modulation) to PFM (Pulse Frequency Modulation) when entering SBC Stop Mode. In
case the Boost regulator in SBC Stop Mode is enabled and running, it operates only in PWM mode.
6.4.2.1
Automatic Transition from PFM to PWM in SBC Stop Mode
In SBC Stop Mode, the Buck converter operates in PFM mode by default to reduce current consumption. If
more current is needed, an automatic transition from PFM to PWM modulation is implemented. When the
Buck regulator output current exceeds the IPFM-PWM,TH threshold, the Buck module changes the modulation to
PWM and an INT event is generated. In addition, the PFM_PWM bit on WK_STAT_1 is set.
In order to set the Buck modulation again in PFM, it is necessary to write a Stop Mode command to M_S_CTRL
register. This command has to be sent when the required Buck output current is below the IPFM-PWM,TH
threshold.
When entering SBC Stop Mode, the automatic transition from PFM to PWM mode is activated after the time tlag,
which is the transition time where the Buck regulator loop changes the modulation technique. Two possible
values can be configured via SPI command.
The Figure 11 shows the timing transition from SBC Normal to SBC Stop Mode.
SPI Commands
Normal Mode
Buck modulation
PWM
Stop Mode
PWM
Auto PFM ↔ PWM t
t lag
Figure 11
Transition from SBC Normal to SBC Stop Mode
The tlag is always present in case of PWM to PFM transition.
The automatic transition can be disabled by setting the bit PWM_AUTO to 0 in the HW_CTRL register.
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6.4.2.2
Manual Transition from PFM to PWM in SBC Stop Mode
The PFM to PWM transition can also be controlled by the microcontroller or an external signal, directly by
using the WK pin as a trigger signal if a additional current is required in SBC Stop Mode.
When the PWM_BY_ WK bit is set to 1, the DC/DC regulator can be switched from PFM to PWM using the WK pin.
A LOW level at the WK pin will switch the Buck converter to PFM mode, a HIGH level will switch it to PWM Mode.
In this configuration, the filter time is not taken into account because a defined signal from µC or external
source is expected.
If the PWM_BY_ WK bit is set to 0, the PFM modulation is used.
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6.4.2.3
SBC Stop to Normal Mode Transition
The microcontroller sends an SPI command to switch from SBC Stop Mode to SBC Normal Mode. In this
transition, the Buck regulator changes the modulation from PFM to PWM.
Once the SPI command for the SBC Normal Mode transition is received the current is able to rise above the
specified maximum Stop Mode current (IPFM-PWM,TH).
If the transition from SBC Stop Mode to SBC Normal Mode is carried out when the Boost is enabled and
operating, it will continue to operate without any changes.
6.4.3
Buck and Boost in SBC Sleep and Fail Safe Mode
In SBC Sleep or Fail Safe Mode, the Buck and Boost converter are off and not operating. The lowest quiescent
current is achievable.
6.4.3.1
SBC Sleep/Fail Safe Mode to Normal Mode Transition
In case of a wake-up event from WK pin or transceivers, the SBC will be set SBC Restart Mode and as soon as
the reset is released, into SBC Normal Mode.
In SBC Restart Mode, the Buck regulator is activated and ramping. The Boost regulator is activated and
ramping again (in case the VS is below the selected threshold) in according the configuration selected in SBC
Normal Mode. As soon as the Buck output voltage exceeds the reset threshold, the RO pin is released.
Datasheet
36
Rev. 1.5
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TLE9272QX
DC/DC Regulator
6.5
Electrical Characteristics
Table 9
Electrical Characteristics
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
P_6.5.1
Buck Regulator
Output Voltage SBC Normal
Mode
VCC1,out1
4.9
5.0
5.1
V
Normal Mode (PWM)
1mA < IVCC1 < 750mA
6.3V < VS 3V
Boost enabled
P_6.5.27
BSTG Sink Current - Discharge IBSTG,sink
current
25
35
50
mA
VSUP > 3V
Boost enabled
P_6.5.9
BSTG rise switching time
tBSTG,rise
–
30
–
ns
2)
VSUP > 3V
20% - 80%
CBSTG = 470pF
P_6.5.28
BSTG fall switching time
tBSTG,fall
–
30
–
ns
2)
VSUP > 3V
20% - 80%
CBSTG = 470pF
P_6.5.29
Over current shunt voltage
threshold
VTH,SNS
199
210
221
mV
Boost enable
VSUP > 3V
P_6.5.21
Boost switching frequency
fBST
405
450
495
kHz
Normal Mode (PWM)
P_6.5.10
1) Typical maximum current capability is given in Figure 12. The external components are in accordance with the
application information (refer to Chapter 15).
2) Not subject to production test; specified by design.
3) Values verified in characterization with Boost converter specified in Chapter 15.1. Not subject to production test;
specified by design. Refer to Figure 13 for additional information.
Datasheet
38
Rev. 1.5
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TLE9272QX
DC/DC Regulator
800
VCC1 tolerance +/-3%
VCC1 tolerance +/-2%
750
700
IVCC1 (mA)
650
600
550
500
450
400
5.5
5.6
5.7
5.8
5.9
6
6.1
6.2
6.3
6.4
6.5
8
10
12
18
20
24
28
VS (V)
Figure 12
Maximum DCDC Buck current capability versus VS.
Note: The Figure 12 is based on characterization results over temperature with external components specified
in Chapter 15.1.
1.4
1.2
IVS (A)
1
0.8
0.6
0.4
Boost Output 6.65V
Boost Output 8V
0.2
3
4
5
6
7
8
VSUP (V)
Figure 13
Maximum DCDC Boost current capability versus VSUP(TLE9271..3QX version).
Note: Figure 13 is based on simulation results (specified by design), with Boost converter external components
specified in Chapter 15.1.
Datasheet
39
Rev. 1.5
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TLE9272QX
Voltage Regulator 2
7
Voltage Regulator 2
7.1
Block Description
VS2
VCC2
Vref
1
Overtemperature
Shutdown
Bandgap
Reference
State
Machine
INH
GND
Figure 14
Module Block Diagram
Functional Features
•
5Vlow-drop voltage regulator
•
Protected against short to supply voltage, e.g. for off-board sensor supply
•
Can also be used for CAN supply
•
VCC2 undervoltage monitoring. Please refer to Chapter 13.6 for more information
•
Can be active in SBC Normal, SBC Stop, and SBC Sleep Mode (not SBC Fail-Safe Mode)
•
VCC2 switch off after entering SBC Restart Mode. Switch off is latched, LDO must be enabled via SPI after
shutdown.
•
Overtemperature protection
•
≥ 470nF ceramic capacitor at output voltage for stability, with ESR < 1Ω @ f = 10 kHz, to achieve the voltage
regulator control loop stability based on the safe phase margin (Bode diagram).
•
Output current capability up to IVCC2,lim.
Datasheet
40
Rev. 1.5
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TLE9272QX
Voltage Regulator 2
7.2
Functional Description
In SBC Normal Mode, VCC2 can be switched on or off via SPI.
For SBC Stop- or Sleep Mode, the VCC2 has to be switched on or off before entering the respective SBC mode.
The output current of VCC2 is limited at IVCC2,lim.
The VS2 pin is the dedicated supply pin for VCC2. VS2 can be connected to VS and therefore to the boost
output, or directly from battery after the reverse protection input diode.
For low-quiescent current, the output voltage tolerance is decreased in SBC Stop Mode because only a lowpower mode regulator (with lower accuracy VCC2,out5) will be active for small loads. If the load current on VCC2
increases (typ. more than 1.5mA), then the high-power mode regulator will also be enabled to support an
optimum dynamic load behavior. When both power mode regulators are active, the VCC2 quiescent current
will the typical increase by 2.9mA.
If the load current on VCC2 decreases (typically below 1.3mA), then the low-quiescent current mode is
resumed again disabling the high-power mode regulator.
Both regulators are active in SBC Normal Mode.
Note: If the VCC2 output voltage is supplying external off-board loads, the application must consider the series
resonance circuit built by cable inductance and decoupling capacitor at load. Sufficient damping must
be provided.
Datasheet
41
Rev. 1.5
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TLE9272QX
Voltage Regulator 2
7.3
Electrical Characteristics
Table 10
Electrical Characteristics
Tj = -40 °C to +150 °C; VS2 = 5.5 V to 28 V; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Output Voltage including line
and Load regulation
VCC2,out1
4.9
5.0
5.1
V
1)
SBC Normal Mode
10µA < IVCC2 < 100mA
6.5V < VS2 < 28V
P_7.3.1
Output Voltage including line
and Load regulation
VCC2,out2
4.9
5.0
5.1
V
1)
P_7.3.2
Output Voltage including line
and Load regulation
VCC2,out3
4.85
5.0
5.15
V
1)
Output Voltage including line
and Load regulation
VCC2,out4
4.97
–
5.07
V
2)
SBC Normal Mode
8V < VS2 < 18V
10µA < IVCC2 < 5mA
25°C< Tj 3mA but with increased current
consumption.
2) Not subject to production test, specified by design.
Datasheet
42
Rev. 1.5
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TLE9272QX
Voltage Regulator 2
Figure 15
Datasheet
VCC2 pass device on-resistance during low drop operation for ICC2= 30mA
43
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TLE9272QX
High Speed CAN Transceiver
8
High Speed CAN Transceiver
8.1
Block Description
VCAN
SPI Mode
Control
CANH
CANL
VCC1
RTD
Driver
Output
Stage
Temp.Protection
TXDCAN
+
timeout
To SPI diagnostic
VCAN
VCC 1
RXDCAN
MUX
Receiver
Vs
Wake
Receiver
can block .vsd
Figure 16
Functional Block Diagram
8.2
Functional Description
The Controller Area Network (CAN) transceiver part of the SBC provides HIGH-Speed (HS) differential mode
data transmission (up to 5Mbaud) and reception in automotive and industrial applications. It works as an
interface between the CAN protocol controller and the physical bus lines compatible with ISO 11898-2: 2016
as well as SAE J2284.
The CAN transceiver offers low power modes to reduce current consumption. This supports networks with
partially powered down nodes. To support software diagnostic functions, a CAN Receive-only Mode is
implemented.
It is designed to provide excellent passive behavior when the transceiver is switched off (mixed networks,
clamp 15/30 applications).
A wake-up from the CAN Wake capable Mode is possible via a message on the bus. Thus, the microcontroller
can be powered down or idled and will be woken up by the CAN bus activities.
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TLE9272QX
High Speed CAN Transceiver
The CAN transceiver is designed to withstand the severe conditions of automotive applications and to support
12V applications.
The transceiver can also be configured as wake-capable in order to save power and to ensure a safe transition
from SBC Normal to Sleep Mode (to avoid losing messages).
Figure 17 shows the possible transceiver mode transition when changing the SBC mode.
SBC Mode
CAN Transceiver Mode
SBC Stop Mode
Receive Only
Wake Capable
SBC Normal Mode
Receive Only
Wake Capable
SBC Sleep Mode
OFF
Normal Mode
OFF
Wake Capable 2)
OFF 2)
SBC Restart Mode
Woken 1)
OFF
SBC Fail-Safe Mode
Wake Capable
Behavior after SBC Restart Mode - not coming from SBC Sleep Mode due to a wake up of the respective transceiver:
If the transceivers were configured to Normal Mode, or Receive Only Mode, then the mode will be changed to Wake Capable.
If it was Wake Capable, then it will remain Wake Capable. If it was off before SBC Restart Mode, then it will remain off.
1)
2)
After a wake event on CAN Bus.
Must be set to CAN wake capable / CAN OFF mode before entering SBC Sleep Mode.
Figure 17
CAN Mode Control Diagram
CAN FD Support
CAN FD stands for ‘CAN with Flexible Data Rate’. It is based on the well established CAN protocol as specified
in ISO 11898-1. CAN FD still uses the CAN bus arbitration method. The benefit is that the bit rate can be
increased by switching to a shorter bit time at the end of the arbitration process and then returning to the
longer bit time at the CRC delimiter before the receivers transmit their acknowledge bits. See also Figure 18.
In addition, the effective data rate is increased by allowing longer data fields. CAN FD allows the transmission
of up to 64 data bytes compared to the 8 data bytes from the standard CAN.
Figure 18
Datasheet
Standard CAN
message
CAN Header
CAN FD with
reduced bit time
CAN Header
Data phase
(Byte 0 – Byte 7)
Data phase
(Byte 0 – Byte 7)
CAN Footer
CAN Footer
Example:
- 11 bit identifier + 8Byte data
- Arbitration Phase
500kbps
- Data Phase
2Mbps
à average bit rate
1.14Mbps
Bite rate Increase with CAN FD vs. Standard CAN
45
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TLE9272QX
High Speed CAN Transceiver
CAN FD has to be supported by both physical layer and the CAN controller. If the CAN controller cannot
support CAN FD, then the respective CAN node must at least tolerate CAN FD communication. This CAN FD
tolerant mode is implemented in the physical layer.
8.2.1
CAN OFF Mode
The CAN OFF Mode is the default mode after the SBC has powered up. It is available in all SBC Modes and is
used to completely stop CAN activities or when CAN communication is not needed. In CAN OFF Mode, a wakeup event on the bus will be ignored.
8.2.2
CAN Normal Mode
The CAN Transceiver is enabled via SPI. CAN Normal Mode is designed for normal data transmission/reception
within the HS CAN network. This mode is available in SBC Normal Mode.
Transmission
The signal from the microcontroller is applied to the TXDCAN input of the SBC. The bus driver switches the
CANH/L output stages to transfer this input signal to the CAN bus lines.
Enabling sequence
The CAN transceiver requires an enabling time tCAN,EN before a message can be sent on the bus. This means
that the TXDCAN signal can only be pulled LOW after the enabling time. If this is not ensured, then the TXDCAN
needs to be set back to HIGH (=recessive) until the enabling time is over. Only the next dominant bit will be
transmitted on the bus. Figure 19 shows different scenarios and explanations for CAN enabling.
VT XD CAN
CAN
Mode
t CAN,EN
t CAN,EN
t
t CAN,EN
CAN
NORM AL
CAN
OFF
t
VCAN DIFF
Dom inan t
Recessive
Correct sequence,
Bus is enabled after tC AN, EN
Figure 19
tC AN, EN not ensured, no
transmission on bus
recessive TXDCAN
level required before
start of transmission
tC AN, EN not ensured,
no transmission on bus
recessive
TXDCAN
level required
t
CAN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls CANH/L slopes symmetrically.
Reception
Analog CAN bus signals are converted into digital signals at RXDCAN via the differential input receiver.
Datasheet
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TLE9272QX
High Speed CAN Transceiver
8.2.3
CAN Receive Only Mode
In CAN Receive Only Mode (RX only), the driver stage is disabled but reception is still operational. This mode is
accessible by an SPI command in SBC Normal Mode and in SBC Stop Mode.
Note: The transceiver is still working properly in Receive Only mode even if VCAN is not available because of an
independent receiver supply.
8.2.4
CAN Wake Capable Mode (Wake-up Pattern)
This mode can be used in SBC Stop, Sleep, Restart and Normal Mode by programming via SPI and it is used to
monitor bus activities. It is automatically accessed in SBC Fail-Safe Mode. A wake-up pattern on the bus results
in a change of behavior of the SBC, as described in Table 11. As a signal to the microcontroller, the RXDCAN
pin is set to low and will stay low until the CAN transceiver changes to a different mode. After a wake-up
pattern event, the transceiver can be switched to CAN Normal Mode via SPI for bus communication.
As shown in Figure 20, a wake-up pattern is signaled on the bus by two consecutive dominant bus levels for
at least tWake1 (filter time t > tWake1) and less than tWake2, each separated by a recessive bus level greater than
tWake1 and shorter than tWake2.
Entering CAN wake
capable
Ini
Bus recessive > tWAKE1
Bias off
Wait
Bias off
Bus dominant > tWAKE1
tWAKE2 expired
1
Bias off
Bus recessive > tWAKE1
tWAKE2 expired
2
Bias off
Bus dominant > tWAKE1
Entering CAN Normal
or CAN Recive Only
Figure 20
3
Bias on
CAN Wake-up Pattern Detection (WUP) according to the Definition in ISO 11898-5
Rearming the Transceiver for Wake Capability
After a BUS wake-up pattern event, the transceiver is woken. However, the CAN transceiver mode bits will still
show wake capable (=‘01’) so the RXDCAN signal will be pulled LOW. There are two possibilities for enabling
the CAN transceiver’s wake capable mode again after a wake-up event:
Datasheet
47
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TLE9272QX
High Speed CAN Transceiver
•
The CAN transceiver mode must be toggled, i.e. switched from Wake Capable Mode to CAN Normal Mode,
CAN Receive Only Mode or CAN Off, before switching to CAN Wake Capable Mode again.
•
Rearming occurs automatically when the SBC changes to SBC Stop, or SBC Fail-Safe Mode to ensure wakeup capability.
•
If the SBC is in SBC Stop Mode, the CAN is rearmed automatically if the SBC is set again in SBC Stop Mode.
•
CAN must be set to CAN Wake Capable or CAN OFF mode before entering SBC Sleep Mode.
Notes
1. It is necessary to clear the CAN Wake-Up bit CAN_WU to become wake capable again. It is sufficient to toggle
the CAN Mode.
2. The CAN module is supplied by an internal voltage when in CAN Wake Capable Mode, i.e. the module must not
be supplied through the VCAN pin during this time. Before changing the CAN Mode to Normal Mode, the supply
of VCAN has to be activated first.
Wake-Up in SBC Stop and Normal Mode
In SBC Stop Mode, if a wake-up pattern is detected, it is always signaled by the INT output and in the
WK_STAT_1 SPI register. It is also signaled by RXDCAN pulled to LOW. The same applies for the SBC Normal
Mode. The microcontroller should set the device from SBC Stop Mode to SBC Normal Mode; there is no
automatic transition to Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in SBC Stop Mode after a bus wakeup event in case it was disabled before (if bit WD_EN_WK_BUS was configured to HIGH before).
Wake-Up in SBC Sleep Mode
Wake-up is possible via a CAN message. The wake-up pattern automatically transfers the SBC into the SBC
Restart Mode and from there to Normal Mode the corresponding RXDCAN pin is set to LOW. The
microcontroller is able to detect the LOW signal on RXDCAN and to read the wake source out of the
WK_STAT_1 register via SPI. No interrupt is generated when coming out of Sleep Mode. The microcontroller
can now, for example, switch the CAN transceiver into CAN Normal Mode via SPI to start communication.
Table 11
Action due to CAN Bus Wake-Up
SBC Mode
SBC Mode after Wake
VCC1
INT
RXDCAN
Normal Mode
Normal Mode
ON
LOW
LOW
Stop Mode
Stop Mode
ON
LOW
LOW
Sleep Mode
Restart Mode
Ramping Up
HIGH
LOW
Restart Mode
Restart Mode
ON
HIGH
LOW
Fail-Safe Mode
Restart Mode
Ramping Up
HIGH
LOW
8.2.5
TXDCAN Time-out Feature
If the TXDCAN signal is dominant for a time t > tTXDCAN_TO, in CAN Normal Mode, the TXDCAN time-out function
disables the transmission of the signal at the bus, setting the TXDCAN pin to recessive. This is implemented to
prevent the bus from being blocked permanently due to an error. The transmitter is disabled and fixed to
recessive. The CAN SPI control bits (CAN on BUS_CTRL_1) remain unchanged and the failure is stored in the
Datasheet
48
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TLE9272QX
High Speed CAN Transceiver
SPI flag CAN_FAIL. The CAN transmitter stage is activated again after the dominant time-out condition is
removed and the transceiver is automatically switched back to CAN Normal Mode.
8.2.6
Bus Dominant Clamping
If the HS CAN bus signal is dominant for a time t > tBUS_CAN_TO, in CAN Normal and Receiver Only Mode, a bus
dominant clamping is detected and the SPI bit CAN_FAIL is set. The transceiver configuration stays
unchanged.
8.2.7
VCAN Undervoltage Detection
The voltage at the VCAN supply pin is monitored in CAN Normal and Receive Only Mode. If the HS CAN
transceiver is set in CAN Wake Capable Mode, the VCAN supply pin is enable after that a valid WUP is detected.
In case of VCAN undervoltage a signalization via SPI bit VCAN_UV is triggered and the TLE9272QX disables the
transmitter stage. If the CAN supply reaches a higher level than the under voltage detection threshold (VCAN
> VCAN_UV), the transceiver is automatically switched back to CAN Normal Mode. The transceiver configuration
stays unchanged.
Datasheet
49
Rev. 1.5
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TLE9272QX
High Speed CAN Transceiver
8.3
Electrical Characteristics
Table 12
Electrical Characteristics
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
4.45
–
4.85
V
CAN Normal Mode,
hysteresis included
P_8.3.1
Differential Receiver
Vdiff,rd_N
Threshold Voltage,
recessive to dominant edge
–
0.80
0.90
V
Vdiff = VCANH - VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Normal Mode
P_8.3.2
Dominant state differential
input voltage range
0.9
–
8.0
V
1)
Vdiff = VCANH - VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Normal Mode
P_8.3.50
Differential Receiver
Vdiff,dr_N
Threshold Voltage,
dominant to recessive edge
0.50
0.60
–
V
Vdiff = VCANH -VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Normal Mode
P_8.3.3
Recessive state differential
input voltage range
Vdiff_R_range
-3.0
–
0.5
V
1)
Vdiff = VCANH - VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Normal Mode
P_8.3.51
Common Mode Range
CMR
-12
–
12
V
1)
P_8.3.4
CANH, CANL Input
Resistance
Ri
20
40
50
kΩ
CAN Normal / Wake
Capable Mode;
Recessive state
-2V ≤ VCANH/L ≤ +7V
P_8.3.5
Differential Input Resistance Rdiff
40
80
100
kΩ
CAN Normal / Wake
Capable Mode;
Recessive state
-2V ≤ VCANH/L ≤ +7V
P_8.3.6
Input Resistance Deviation
between CANH and CANL
DRi
-3
–
3
%
1)
Recessive state
VCANH=VCANL=5V
P_8.3.7
Input Capacitance CANH,
CANL versus GND
Cin
–
20
40
pF
2)
VTXDCAN = 5V
P_8.3.8
Differential Input
Capacitance
Cdiff
–
10
20
pF
2)
VTXDCAN = 5V
P_8.3.42
CAN Supply Voltage
CAN Supply undervoltage
detection threshold
VCAN_UV
CAN Bus Receiver
Datasheet
Vdiff_D_range
50
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TLE9272QX
High Speed CAN Transceiver
Table 12
Electrical Characteristics (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Vdiff, rd_W
Wake-up Receiver
Threshold Voltage,
recessive to dominant edge
Wake-up Receiver
Dominant state differential
input voltage range
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
–
0.8
1.15
V
-12V ≤ VCM(CAN) ≤
12V;
CAN Wake Capable
Mode
P_8.3.9
–
8.0
V
1)
Vdiff = VCANH - VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Wake Capable
Mode
P_8.3.52
0.7
–
V
-12V ≤ VCM(CAN) ≤
12V;
CAN Wake Capable
Mode
P_8.3.10
–
0.4
V
1)
Vdiff = VCANH - VCANL;
-12V ≤ VCM(CAN) ≤
12V;
CAN Wake Capable
Mode
P_8.3.53
Vdiff_D_range_ 1.15
W
Wake-up Receiver
Vdiff, dr_W
Threshold Voltage,
dominant to recessive edge
Wake-up Receiver
Recessive state differential
input voltage range
Values
0.4
Vdiff_R_range_ -3.0
W
CAN Bus Transmitter
CANH/CANL Recessive
Output Voltage
(CAN Normal Mode)
VCANL/H_NM
2.0
–
3.0
V
CAN Normal Mode
VTXDCAN = Vcc1;
no load
P_8.3.11
CANH/CANL Recessive
Output Voltage
(CAN Wake Capable Mode)
VCANL/H_LP
-0.1
–
0.1
V
CAN Wake Capable
Mode;
VTXDCAN = Vcc1;
no load
P_8.3.43
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
(CAN Normal Mode)
Vdiff_r_N
-500
–
50
mV
CAN Normal Mode;
VTXDCAN = Vcc1;
no load
P_8.3.12
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
(CAN Wake Capable Mode)
Vdiff_r_W
-200
–
200
mV
CAN Wake Capable
Mode;
VTXDCAN = Vcc1;
no load
P_8.3.44
CANL Dominant Output
Voltage
VCANL
0.5
–
2.25
V
3)
Datasheet
51
CAN Normal Mode; P_8.3.13
VTXDCAN = 0V;
VCAN = 5V;
50Ω ≤ RL ≤ 65Ω
Rev. 1.5
2019-09-27
TLE9272QX
High Speed CAN Transceiver
Table 12
Electrical Characteristics (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
CANH Dominant Output
Voltage
VCANH
2.75
–
4.5
V
3)
CAN Normal Mode;
VTXDCAN = 0V;
VCAN = 5V;
50Ω ≤ RL ≤ 65Ω
P_8.3.14
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_d_N
1.5
2.0
2.5
V
3)
P_8.3.15
CANH, CANL Output Voltage Vdiff_slope_rd
Difference Slope, recessive
to dominant
–
–
70
V/us
1)
CANH, CANL Output Voltage Vdiff_slope_dr
Difference Slope, dominant
to recessive
–
–
70
V/us
1)
CAN Normal Mode;
VTXDCAN = 0V;
VCAN = 5V;
50Ω ≤ RL ≤ 65Ω
30% to 70% of
P_8.3.54
measured
differential bus
voltage,
CL = 100 pF, RL = 60 Ω
70% to 30% of
P_8.3.55
measured
differential bus
voltage,
CL = 100 pF, RL = 60 Ω
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL on
extended bus load range
Vdiff_d_N_ext
1.5
–
5.0
V
1)
CAN Normal Mode;
VTXDCAN = 0V;
VCAN = 5V;
RL = 2240Ω
P_8.3.58
CANH Short Circuit Current
ICANHsc
-100
-80
-50
mA
CAN Normal Mode;
VCANHshort = -3 V
P_8.3.16
CANL Short Circuit Current
ICANLsc
50
80
100
mA
CAN Normal Mode;
VCANLshort = 18 V
P_8.3.17
Leakage Current
ICANH,lk
ICANL,lk
–
5
7.5
µA
VS = VCAN = 0V;
0V ≤ VCANH,L ≤ 5V;
4)
Rtest = 0 / 47kΩ
P_8.3.18
HIGH level Output Voltage
VRXDCAN,H
0.8 ×
VCC1
–
–
V
CAN Normal Mode;
IRXDCAN = -2 mA
P_8.3.19
LOW Level Output Voltage
VRXDCAN,L
–
–
0.2 ×
Vcc1
V
CAN Normal Mode;
IRXDCAN = 2 mA
P_8.3.20
VTXDCAN,H
–
–
0.7 ×
Vcc1
V
CAN Normal Mode;
recessive state
P_8.3.21
Receiver Output RXDCAN
Transmission Input TXDCAN
HIGH Level Input Voltage
Threshold
Datasheet
52
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TLE9272QX
High Speed CAN Transceiver
Table 12
Electrical Characteristics (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
LOW Level Input Voltage
Threshold
VTXDCAN,L
0.3 ×
Vcc1
–
–
V
CAN Normal Mode;
dominant state
P_8.3.22
TXDCAN Input Hysteresis
VTXDCAN,hys
–
0.12 ×
Vcc1
–
mV
1)
P_8.3.23
TXDCAN Pull-up Resistance
RTXDCAN
20
40
80
kΩ
-
P_8.3.24
13
18
µs
7)
4.5
–
5.5
V
5)
CAN Normal Mode; P_8.3.45
VTXDCAN = 0V / 5V;
VCAN = 5V;
CSPLIT = 4.7nF;
50Ω ≤ RL ≤ 60Ω
Min. Dominant Time for Bus tWake1
Wake-up
0.5
–
3.5
µs
-12V ≤ VCM(CAN) ≤
12V;
Vdiff ≤ 3V
CAN Wake capable
Mode
P_8.3.26
Wake-up Time-out,
Recessive Bus
tWake2
0.5
–
10
ms
7)
CAN Wake capable
Mode
P_8.3.27
BUS Bias reaction time
tbias
–
–
250
µs
7)
CAN Wake capable
Mode
VCAN = 5V;
CL = 100pF;
CGND = 100pF;
RL = 60Ω
P_8.3.57
Loop delay
(recessive to dominant)
tLOOP,f
–
150
255
ns
5)
CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5V;
CRXDCAN = 15 pF
P_8.3.28
Loop delay
(dominant to recessive)
tLOOP,r
–
150
255
ns
5)
P_8.3.29
CAN Transceiver Enabling
Time
tCAN,EN
8
CSN = HIGH to first P_8.3.25
valid transmitted
TXDCAN dominant
Dynamic CAN-Transceiver Characteristics
Driver Symmetry
VSYM = VCANH + VCANL
Datasheet
VSYM
53
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V;
CRXDCAN = 15 pF
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TLE9272QX
High Speed CAN Transceiver
Table 12
Electrical Characteristics (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Propagation Delay
TXDCAN LOW to bus
dominant
td(L),T
–
50
–
ns
CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5V
P_8.3.30
Propagation Delay
TXDCAN HIGH to bus
recessive
td(H),T
–
50
–
ns
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V
P_8.3.31
Propagation Delay
bus dominant to RXDCAN
LOW
td(L),R
–
100
–
ns
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V;
CRXDCAN = 15 pF
P_8.3.32
Propagation Delay
bus recessive to RXDCAN
HIGH
td(H),R
–
100
–
ns
CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5V;
CRXDCAN = 15 pF
P_8.3.33
Received Recessive bit width tbit(RXD)
400
–
550
ns
P_8.3.39
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V;
CRXD = 15pF;
tbit(TXD) = 500ns;
Parameter definition
in according to
Figure 22.
Transmitted Recessive bit
width
435
–
530
ns
P_8.3.40
CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 500ns;
Parameter definition
in according to
Figure 22.
Datasheet
tbit(BUS)
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TLE9272QX
High Speed CAN Transceiver
Table 12
Electrical Characteristics (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; VCAN = 4.75 V to 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
-65
–
40
ns
P_8.3.41
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V;
CRXD = 15pF;
tbit(TXD) = 500ns;
Parameter definition
in according to
Figure 22.
Received Recessive bit width tbit(RXD)
120
–
220
ns
P_8.3.46
CAN Normal Mode;
CL = 100pF;
RL = 60Ω ;
VCAN = 5V;
CRXD = 15pF;
tbit(TXD) = 200ns;
Parameter definition
in according to
Figure 22.
Transmitted Recessive bit
width
155
–
210
ns
P_8.3.47
CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 200ns;
Parameter definition
in according to
Figure 22.
Receiver timing symmetry6) ΔtRec
-45
–
15
ns
P_8.3.48
CAN Normal Mode;
CL = 100pF;
RL = 60Ω;
VCAN = 5V;
CRXD = 15pF;
tbit(TXD) = 200ns;
Parameter definition
in according to
Figure 22.
TXDCAN Permanent
Dominant Time-out
tTXDCAN_TO
–
1.85
–
ms
7)
CAN Normal Mode
P_8.3.34
BUS Permanent Dominant
Time-out
tBUS_CAN_TO
–
1.85
–
ms
7)
CAN Normal Mode
P_8.3.35
Receiver timing symmetry
Datasheet
6)
ΔtRec
tbit(BUS)
55
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TLE9272QX
High Speed CAN Transceiver
1)
2)
3)
4)
5)
Not subject to production test, specified by design.
Not subject to production test, specified by design, S2P - Method; f = 10Mhz.
Voltage value valid for time < tTXDCAN_TO.
Rtests between (Vs /VCAN) and 0V (GND).
VSYM shall be observed during dominant and recessive state and also during the transition dominant to recessive and
vice versa while TxD is simulated by a square signal (50% duty cycle), a frequency of 1MHz.
6) tRec=tbit(RXD) -tbit(BUS).
7) Not subject to production test, tolerance defined by internal oscillator tolerance.
VTXDCAN
V IO
GND
V DIF F
t d(L),T
V diff, rd _N
V diff, dr_N
t d(L),R
VRXD CAN
VIO
t
t
t d(H ),T
t
t d(H), R
t loop,r
loop,f
0.8 x V IO
GND
0.2 x V IO
t
Figure 21
Datasheet
Timing Diagrams for Dynamic Characteristics
56
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TLE9272QX
High Speed CAN Transceiver
70%
TXDCAN
30%
5x tBit(TXD)
tBit(TXD)
Vdiff=CANH-CANL
500mV
tLoop_f
900mV
tBit(Bus)
70%
RXDCAN
30%
tLoop_r
Figure 22
Datasheet
tBit(RXD)
From ISO 11898-2: tloop, tbit(TXD), tbit(Bus), tbit(RXD) Definitions
57
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TLE9272QX
LIN Transceiver
9
LIN Transceiver
9.1
Block Description
VLIN
SPI Mode Control
Driver
R BUS
Output
Stage
TxD Input
VCC1
R TXD LIN
Temp.Protection
Current
Limit
TX DLIN
Timeout
LIN
To SPI Diagnostic
Receiver
VCC1
Filter
Vs
RX DLIN
Wake
Receiver
Figure 23
Block Diagram
9.1.1
LIN Specifications
The LIN network is standardized by international regulations. The device is compliant with the LIN2.2
specification. The physical layer specification LIN2.2 is a superset of the previous LIN specifications, like LIN
2.0, LIN2.1 or LIN 1.3. The integrated LIN transceivers are according to the LIN2.2 standard.
The device is compliant to the physical layer standard SAE-J2602-2. The SAE-J2602-2 standard differs from the
LIN2.2 standard mainly by the lower data rate (10.4 kbps).
Datasheet
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TLE9272QX
LIN Transceiver
9.2
Functional Description
The LIN Bus is a single wire, bidirectional bus, used for in-vehicle networks. The LIN transceivers implemented
inside the TLE9272QX are the interface between the microcontroller and the physical LIN Bus. The digital
output data from the microcontroller are driven to the LIN bus via the TXDLIN input pin on the TLE9272QX. The
transmit data stream on the TXDLIN input is converted to a LIN bus signal with an optimized slew rate to
minimize the EME level of the LIN network. The RXDLIN output sends back the information from the LIN bus to
the microcontroller. The receiver has an integrated filter network to suppress noise on the LIN Bus and to
increase the EMI (Electromagnetic Immunity) level of the transceiver.
Two logical states are possible on the LIN Bus according to the LIN Specification 2.2.
Every LIN network consists of a master node and one or more slave nodes. To configure the TLE9272QX for
master node applications, a resistor in the range of 1kΩ and a reverse diode must be connected between the
LIN bus and the power supply VS.
The different transceiver modes can be controlled using the SPI LIN1, LIN2, LIN3 bits.
The transceiver can also be configured to wake capable in order to save current and to ensure a safe transition
from SBC Normal to Sleep Mode (to avoid losing messages).
Figure 24 shows the possible transceiver mode transitions when changing the SBC Mode.
SBC Mode
LIN Transceiver Mode
SBC Stop Mode
Receive Only
Wake Capable
SBC Normal Mode
Receive Only
Wake Capable
OFF
Normal Mode
OFF
SBC Sleep Mode
Wake Capable
OFF
SBC Restart Mode
Woken 1
OFF
SBC Fail-Safe Mode
Wake Capable
1
after a wake event on LIN Bus
Behavior after SBC Restart Mode - not coming from SBC Sleep Mode due to a wake up of the respective transceiver :
If the transceivers had been configured to Normal Mode, or Receive Only Mode , then the mode will be changed to Wake
Capable. If it was Wake Capable, then it will remain Wake Capable . If it had been OFF before SBC Restart Mode , then it
will remain OFF .
Figure 24
LIN Mode Control Diagram
9.2.1
LIN OFF Mode
The LIN OFF Mode is the default mode after power-up of the SBC. It is available in all SBC Modes and is
intended to completely stop LIN activities or when LIN communication is not needed. In LIN OFF Mode, a
wake-up event on the bus will be ignored.
Datasheet
59
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TLE9272QX
LIN Transceiver
9.2.2
LIN Normal Mode
The LIN Transceiver is enabled via SPI in SBC Normal Mode. LIN Normal Mode is designed for normal data
transmission/reception within the LIN network. The Mode is available only in SBC Normal Mode.
Transmission
The signal from the microcontroller is applied to the TXDLIN input of the SBC. The bus driver switches the
LIN output stage to transfer this input signal to the LIN bus line.
Enabling sequence
The LIN transceiver requires an enabling time tLIN,EN before a message can be sent on the bus. This means that
the TXDLIN signal can only be pulled LOW after the enabling time. If this is not ensured, then the TXDLIN needs
to be set back to HIGH (=recessive) until the enabling time is completed. Only the next dominant bit will be
transmitted on the bus. Figure 25 shows different scenarios and explanations for LIN enabling.
VT XDLIN
LIN
Mode
t LIN ,EN
t
t
LIN ,EN
t
LIN ,EN
LIN
NORMAL
LIN OF F
t
VLIN_BUS
Recessive
Dominant
t
Correct sequence,
Bus is enabled aftertL IN, EN
t L IN, EN not ensured, no
transmission on bus
recessive TXDLIN level
required bevore start of
transmission
tL IN, EN not ensured, recessive TXDLIN
no transmission on bus level required
LIN_enabling_sequence.vsd
Figure 25
LIN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls LIN slopes symmetrically. The
configuration of the different slopes is described in Chapter 9.2.8.
Reception
Analog LIN bus signals are converted into digital signals at RXDLIN via the input receiver.
9.2.3
LIN Receive Only Mode
In LIN Receive Only Mode (RX only), the driver stage is disabled but reception is still possible. This mode is
accessible by an SPI command and is available in SBC Normal and SBC Stop Mode.
9.2.4
LIN Wake Capable Mode
This mode can be used in SBC Stop, Sleep, Restart and Normal Mode by programming via SPI and it is used to
monitor bus activities. It is automatically accessed in SBC Fail-Safe Mode. A wake up is detected, if a recessive
to dominant transition on the LIN bus is followed by a dominant level of longer than tWK,Bus, followed by a
Datasheet
60
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TLE9272QX
LIN Transceiver
dominant to recessive transition. The dominant to recessive transition will cause a wake up of the LIN
transceiver. A wake-up results different behavior of the SBC, as described in Table 13. As a signalization to the
microcontroller, the RXDLIN pin is set LOW and will stay LOW until the LIN transceiver is changed to any other
mode. After a wake-up event, the transceiver can be switched to LIN Normal Mode for communication.
Table 13
Action due to a LIN BUS Wake-up
SBC Mode
SBC Mode after Wake
VCC1
INT
RXDLIN
Normal Mode
Normal Mode
ON
LOW
LOW
Stop Mode
Stop Mode
ON
LOW
LOW
Sleep Mode
Restart Mode
Ramping Up
HIGH
LOW
Restart Mode
Restart Mode
ON
HIGH
LOW
Fail-Safe Mode
Restart Mode
Ramping up
HIGH
LOW
Rearming the transceiver for wake capability
After a BUS wake-up event, the transceiver is woken. However, the LIN1, LIN2, LIN3 transceiver mode bits will
still show wake capable (=‘01’) so that the RXDLIN signal will be pulled low. The wake-capable mode of the LIN
transceiver can be reenabled in one of two ways after a wake-up event:
•
By toggling the LIN transceiver mode, i.e. switched to LIN Normal Mode, LIN Receive Only Mode or LIN Off,
before switching to LIN Wake Capable Mode again.
•
Occurs automatically when the SBC changes to SBC Stop, SBC Sleep, or SBC Fail-Safe Mode to ensure
wake-up capability.
•
if the SBC is in SBC Stop Mode, the LIN’s are rearmed automatically if the SBC is set again in SBC Stop Mode.
Wake-Up in SBC Stop and SBC Normal Mode
In SBC Stop Mode, if a wake-up is detected, it is signaled by the INT output and in the WK_STAT_2 SPI register.
It is also signaled by RXDLIN put to LOW. The same applies for the SBC Normal Mode. The microcontroller
should set the device to SBC Normal Mode; there is no automatic transition to Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in SBC Stop Mode after a Bus wakeup event in case it was disabled before (if bit WD_EN_WK_BUS was configured to HIGH before).
Wake-Up in SBC Sleep Mode
Wake-up is possible via a LIN message (filter time t > tWK,Bus). The wake-up automatically transfers the SBC to
SBC Restart Mode and from there to Normal Mode. The corresponding RXDLIN pin in set to LOW. The
microcontroller is able to detect the low signal on RXDLIN and to read the wake source out of the WK_STAT_2
register via SPI. No interrupt is generated when coming out of Sleep Mode. The microcontroller can now
switch the LIN transceiver into LIN Normal Mode via SPI to start communication.
9.2.5
TXDLIN Time-Out Feature
If the TXDLIN signal is dominant for the time t >tBUS_LIN_TO, the TXDLIN time-out function deactivates the LIN
transmitter output stage temporarily. The transceiver remains in Recessive state. The TXDLIN time-out
function prevents the LIN bus from being blocked by a permanent LOW signal on the TXDLIN pin caused by a
Datasheet
61
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LIN Transceiver
failure. The failure is stored in the SPI flag LIN1_FAIL, LIN2_FAIL, LIN3_FAIL on BUS_STAT_1 and
BUS_STAT_2 registers. The LIN transmitter stage is activated again after the dominant time-out condition is
removed.
The TXDLIN Time-Out feature can be disabled with SPI bit LIN_TXD_ TO for all LINs at the same time.
TXDLIN Time-Out due to
microcontroller error
Normal Communication
t timeout
Recovery of the
microcontroller error
t torec
Release after TXDLIN
Time-out
Normal Communication
TXDLIN
t
LIN
t
Figure 26
TXDLIN Time-Out Function
9.2.6
Bus Dominant Clamping
If the LIN bus signal is dominant for a time t > tBUS_LIN_TO in LIN Normal or Receieve Only Mode, then a bus
dominant clamping is detected and the SPI bits LIN1_FAIL, LIN2_FAIL, LIN3_FAIL and are set. The
transceiver configuration stays unchanged.
9.2.7
Undervoltage Detection
In case the supply voltage VLIN is dropping below the VLIN undervoltage detection threshold (VLIN < VLIN,UVD),
the TLE9272QX will set the LINx in Receive Only Mode (the transmitter is disabled). The receiver stage is active.
If the power supply VLIN reaches a higher level than the VLIN undervoltage detection threshold (VLIN >
VLIN,UVD), the TLE9272QX continues with normal operation.
9.2.8
Slope Selection
The LIN transceiver offers a LIN Low-Slope Mode for 10.4kBaud communication and a LIN Normal-Slope Mode
for 20kBaud communication. The only difference is the behavior of the transmitter. In LIN Low-Slope Mode,
the
transmitter uses a lower slew rate to further reduce the EME compared to Normal-Slope Mode. This complies
with SAE J2602 requirements.
Datasheet
62
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TLE9272QX
LIN Transceiver
By default, the device works in LIN Normal-Slope Mode. The selection of LIN Low-Slope Mode is done by an SPI
bit LIN_LSM and will become effective as soon as CSN goes ‘HIGH’ for all LINx. Only the LIN Slope is changed.
The selection is accessible in SBC Normal Mode only.
9.2.9
Flash Programming via LIN
The device allows LIN flash programming, e.g. of another LIN Slave with a communication of up to 115 kbps.
This feature is enabled by de-activating the slope control mechanism via a SPI command (bit LIN_FLASH) and
will become effective as soon as CSN goes ‘HIGH’ for all LINx. The SPI bit can be set in SBC Normal Mode.
Note: It is recommended to perform flash programming only at nominal supply voltage VS = 13.5V to ensure
stable data communication.
Datasheet
63
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TLE9272QX
LIN Transceiver
9.3
Electrical Characteristics of the LIN Transceiver
Table 14
Electrical Characteristics: LIN Transceiver
Tj = -40 °C to +150 °C, VLIN = 5.5 V to 18 V, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note or Test Condition
Number
Receiver Output (RXDLIN pin)
HIGH Level Output Voltage
VRXDLIN,H
0.8 ×
VCC
–
–
V
IRXDLIN = -2 mA
Vbus = VS
P_9.3.1
LOW Level Output Voltage
VRXDLIN,L
–
–
0.2 ×
VCC
V
IRXDLIN = 2 mA
Vbus = 0 V
P_9.3.2
0.7 ×
VCC
–
–
V
Recessive State
P_9.3.3
0.2 ×
VCC
–
V
1)
P_9.3.4
Transmission Input (TXDLIN pin)
HIGH Level Input Voltage
VTXDLIN,H
TXDLIN Input Hysteresis
VTXDLIN,hys –
LOW Level Input Voltage
VTXDLIN,L
–
–
0.3 ×
VCC
V
Dominant State
P_9.3.5
TXDLIN Pull-up Resistance
RTXDLIN
20
40
80
kΩ
VTXDLIN = 0 V
P_9.3.6
Receiver Threshold Voltage, VBus,rd
Recessive to Dominant Edge
0.4 ×
VLIN
0.45 × –
VLIN
V
Receiver Dominant State
–
–
V
Receiver Threshold Voltage, VBus,dr
Dominant to Recessive Edge
–
0.55 × 0.60 × V
VLIN
VLIN
Receiver Recessive State
VBus,rec
0.6 ×
VLIN
–
Receiver Center Voltage
VBus,c
Receiver Hysteresis
LIN Bus Receiver (LIN Pin)
VBus,dom
0.4 ×
VLIN
LIN2.2 Param. 17
P_9.3.8
P_9.3.9
V
LIN2.2 Param 18
P_9.3.10
0.475 0.5 ×
× VLIN VLIN
0.525 V
× VLIN
LIN2.2 Param 19
P_9.3.11
VBus,hys
0.07 × 0.1 ×
VLIN
VLIN
0.175 V
× VLIN
Vbus,hys = Vbus,rec - Vbus,dom
LIN2.2 Param 20
P_9.3.12
Wake-up Threshold Voltage
VBus,wk
0.40 × 0.5 ×
VLIN
VLIN
0.6 ×
VLIN
V
–
P_9.3.13
Dominant Time for Bus
Wake-up
tWK,Bus
30
150
µs
2)
P_9.3.14
Datasheet
–
P_9.3.7
–
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TLE9272QX
LIN Transceiver
Table 14
Electrical Characteristics: LIN Transceiver (cont’d)
Tj = -40 °C to +150 °C, VLIN = 5.5 V to 18 V, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Unit Note or Test Condition
Min.
Typ.
Max.
Number
LIN Bus Transmitter (LIN Pin)
Bus Serial Diode Voltage
Drop
Vserdiode
0.4
0.7
1.0
V
1)
VTXDLIN = VCC1;
LIN2.2 Param 21
P_9.3.15
Bus Recessive Output
Voltage
VBUS,ro
0.8 ×
VLIN
–
VLIN
V
VTXDLIN = high Level
P_9.3.16
Bus Short Circuit Current
IBUS,sc
40
100
150
mA
VBUS = 18V;
LIN2.2 Param 12
P_9.3.20
Leakage Current
Loss of Ground
IBUS,lk1
-1000 -450
20
µA
VLIN = 0V;
-12V ≤ VBUS ≤ 6V;
LIN2.2 Param 15
P_9.3.21
Leakage Current
Loss of Battery
IBUS,lk2
–
–
20
µA
VLIN = 0 V;
0V ≤ VBUS ≤ 18V;
LIN2.2 Param 16
P_9.3.22
Leakage Current
Driver Off
IBUS,lk3
-1
–
–
mA
VLIN = 18 V;
VBUS = 0 V;
LIN2.2 Param 13
P_9.3.23
Leakage Current
Driver Off
IBUS,lk4
–
–
20
µA
VLIN = 8 V;
VBUS = 18 V;
LIN2.2 Param 14
P_9.3.24
Bus Pull-up Resistance
RBUS
20
30
47
kΩ
Normal Mode
LIN2.2 Param 26
P_9.3.25
LIN Input Capacitance
CBUS
20
25
ρF
1)
P_9.3.26
Receiver propagation delay
bus dominant to RXDLIN
LOW
td(L),R
–
1
6
µs
VCC = 5 V;
CRXDLIN = 20 pF;
LIN2.2 Param 31
P_9.3.27
Receiver propagation delay td(H),R
bus recessive to RXDLIN HIGH
–
1
6
µs
VCC = 5 V;
CRXDLIN = 20 pF;
LIN2.2 Param 31
P_9.3.28
Receiver delay symmetry
tsym,R
-2
–
2
µs
tsym,R = td(L),R - td(H),R;
LIN2.2 Param 32
P_9.3.29
LIN Transceiver Enabling
Time
tLIN,EN
8
13
18
µs
2)
Bus Dominant Time Out
tBUS_LIN
–
20
–
ms
1)2)
P_9.3.30
TXDLIN Dominant Time Out
tTXDLIN_LIN –
20
–
ms
1)2)
P_9.3.31
time from enabling LIN P_9.3.39
(CS HIGH) to first signal on
RXDLIN.
_TO
VTXDLIN = 0 V
_TO
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LIN Transceiver
Table 14
Electrical Characteristics: LIN Transceiver (cont’d)
Tj = -40 °C to +150 °C, VLIN = 5.5 V to 18 V, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Unit Note or Test Condition
Min.
Typ.
Max.
10
–
1)2)
TXDLIN Dominant Time Out
Recovery Time
ttorec
–
Duty Cycle D1
(For worst case at 20 kbit/s)
LIN2.2 Normal Slope
D1
0.396 –
–
THRec(max) = 0.744 × VS; P_9.3.33
THDom(max) = 0.581 × VS;
VLIN = 7.0 … 18 V;
tbit = 50 µs;
D1 = tbus_rec(min)/2 tbit;
LIN2.2 Param 27
Duty Cycle D2
(for worst case at 20 kbit/s)
LIN2.2 Normal Slope
D2
–
0.581
3)
THRec(min) = 0.422 × VS;
THDom(min) = 0.284 × VS;
VLIN = 7.0 … 18 V;
tbit = 50 µs;
D2 = tbus_rec(max)/2 tbit;
LIN2.2 Param 28
P_9.3.34
–
µs
Number
P_9.3.32
3)
Duty Cycle D3
D3
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
0.417 –
–
3)
THRec(max) = 0.778 × VS;
THDom(max) = 0.616 × VS;
VLIN = 7.0 … 18 V;
tbit = 96 µs;
D3 = tbus_rec(min)/2 tbit;
LIN2.2 Param 29
P_9.3.35
Duty Cycle D4
D4
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
–
0.590
3)
P_9.3.36
–
THRec(min) = 0.389 × VS;
THDom(min) = 0.251 × VS;
VLIN = 7.0 … 18 V;
tbit =96 µs;
D4 = tbus_rec(max)/2 tbit;
LIN2.2 Param 30
1) Not subject to production test, specified by design.
2) Not subject to production test, tolerance defined by internal oscillator tolerance
3) Bus load conditions concerning LIN spec 2.2 CLIN, RLIN = 1 nF, 1 kΩ / 6.8 nF, 660 Ω / 10 nF, 500 Ω
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LIN Transceiver
VLIN
TXDLIN
100 nF
RXDLIN
RLIN
CRXDLIN
LIN
CLIN
Figure 27
Datasheet
WK
GND
Simplified Test Circuit for Dynamic Characteristics
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LIN Transceiver
tBit
TXDLIN
t Bit
t Bit
(input to
transmitting node )
tBus _dom (max )
V SUP
(Transceiver supply
of transmitting
node )
t Bus_rec (min )
THRec (max)
THDom (max)
Thresholds of
receiving node 1
TH Rec(min )
TH Dom(min )
Thresholds of
receiving node 2
tBus _dom (min )
t Bus_ rec(max )
RXDLIN
(output of receiving
node 1)
t d(L ),R (1)
td (H),R(1 )
RXDLIN
(output of receiving
node 2)
t(L ),R (2)
td (H),r(2)
Duty Cycle1 = t BUS_ rec(min ) / (2 x tBIT )
Duty Cycle2 = t BUS_ rec(max ) / (2 x tBIT )
Figure 28
Datasheet
Timing Diagram for Dynamic Characteristics
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Wake Input
10
Wake Input
10.1
Block Description
Internal Supply
I PU_WK
+
WKx
I PD_WK
tWK
V Ref
Logic
MONx_Input_Circuit_ext.vsd
Figure 29
Wake Input Block Diagram
Features
•
One High-Voltage inputs with 3V (typ.) threshold voltage
•
Wake-up capability for power saving modes
•
Switch feature for DC/DC Mode (PFM/PWM) in Stop Mode
•
Sensitive to level changes LOW to HIGH and HIGH to LOW
•
Pull-up and Pull-down current, configurable via SPI
•
In SBC Normal and SBC Stop Mode, the level of WK pin can be read via SPI
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Wake Input
10.2
Functional Description
The wake input pin is edge-sensitive input with a switching threshold of typically 3V. This means that both
transitions, HIGH to LOW and LOW to HIGH, result in SBC signalling. The signal is created in one of the
following ways:
•
by triggering the interrupt in SBC Normal and SBC Stop Mode;
•
waking up the device in SBC Sleep and SBC Fail-Safe Mode.
The WK pin can also be configured as a selection pin for PFM / PWM mode in Stop Mode using the PWM_BY_
WK bit of HW_CTRL register. In this case a LOW level at the WK pin will set the Buck converter modulation to
PFM mode, a HIGH level will set the Buck converter modulation to PWM Mode. In this configuration, the filter
time is not taken into account because a defined signal from µC is expected.
Two different wake detection modes can be selected via SPI:
•
Static sense: WK inputs are always active
•
Cyclic sense: WK inputs are only active for a certain time period (see Chapter 5.2.1)
The filtering time is tFWK. The wake-up capability can be enabled or disabled via SPI command.
Figure 30 shows a typical wake-up timing and parasitic filter.
VWK
VWK,th
VWK,th
t
VINT
tWK,f
tWK,f
t INT
t
No Wake Event
Figure 30
Wake Event
Wake-up Filter Timing for Static Sense
The state of the WK pin (LOW or HIGH) can always be read in SBC Normal and Stop Mode at the bit WK on
register WK_LVL_STAT.
When setting the bit WK_EN, to 1, the device wakes up from Sleep Mode with a HIGH to LOW or LOW to HIGH
transition on the selected WK input, in SBC Stop and SBC Normal Mode an Interrupt will be generated. From
SBC Fail-Safe Mode the device will always go to SBC Restart Mode with a HIGH to LOW or LOW to HIGH
transition. The wake source for a wake via wake pin can be read in the register WK_STAT_1 at the bit WK_WU.
10.2.1
Wake Input Configuration
To ensure a defined and stable voltage levels at the internal comparator input it is possible to configure
integrated
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Wake Input
current sources via the SPI register WK_PUPD_CTRL. The Table 15 shows the possible pull-up and pull-down
current.
Table 15
Pull-Up / Pull-Down Resistor
WK_PUPD_1 WK_PUPD_0 Output Current Note
0
0
no current
source
WK is floating if left open (default setting)
0
1
pull-down
current
WK input internally pulled to GND
1
0
pull-up current
WK input internally pulled to 5V
1
1
automatic
switching
If a HIGH level is detected the pull-up current is activated, if
LOW level is detected the pull down current is activated.
Note: if there is no pull-up or pull-down configured on the WK input, then the respective input should be tied to
GND or VS on board to avoid unintended floating and waking of the pin.
An example illustration of automatic switching configuration is shown in Figure 31.
I WK
IWKth_min
I WKth_max
VWKth
Figure 31
Datasheet
Illustration for Pull-Up / Down Current Sources with Automatic Switching Configuration
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Wake Input
10.3
Electrical Characteristics
Table 16
Electrical Characteristics
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note or
Test Condition
Number
2
3
4
V
P_10.3.1
–
0.7
V
P_10.3.2
WK Input Pin characteristics
Wake-up/monitoring
threshold voltage
VWKth
Threshold hysteresis
VWKNth,hys 0.1
WK pin Pull-up Current IPU_WK
-20
-10
-3
µA
VWK_IN = 4V
P_10.3.3
WK pin Pull-down
Current
IPD_WK
3
10
20
µA
VWK_IN = 2V
P_10.3.4
Input leakage current
ILK,l
-2
–
2
µA
0 V < VWK_IN < 28V
SBC Stop or Sleep
Mode
P_10.3.5
tFWK
-
16
-
µs
1)
P_10.3.6
Timing
Wake-up filter time
1) Not subject to production test, tolerance defined by internal oscillator tolerance
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TLE9272QX
Interrupt Function
11
Interrupt Function
11.1
Block and Functional Description
V cc1
Time
out
Interrupt logic
Figure 32
INT
Interrupt Block Diagram
The interrupt is used to signal wake-up events in real time to the microcontroller. The interrupt block is
designed as a push/pull output stage as shown in Figure 32. An interrupt is triggered and the INT pin is pulled
low (active low) for tINT in SBC Normal and Stop Mode and it is released again once tINT is expired. The minimum
HIGH-time of INT between two consecutive interrupts is tINTD. An interrupt does not automatically cause a SBC
mode change.
The following wake-up events will be signaled via INT:
•
all wake-up events stored in the wake status SPI register WK_STAT_1 and WK_STAT_2
•
an interrupt is only triggered if the respective function is also enabled as a wake source
•
the register WK_LVL_STAT is not generating interrupts
In addition to this behavior, an INT will be triggered when:
•
the SBC is sent to SBC Stop Mode and not all bits were cleared in the WK_STAT_1 and WK_STAT_2register
•
an automatic transition PFM to PWM in the Buck when the SBC is in SBC Stop Mode (for more details please
refer to Chapter 6.4.2.1)
The SPI status registers are updated at every falling edge of the INT pulse. All interrupt events are stored in the
respective register (except the register WK_LVL_STAT) until the register is read and cleared via SPI command.
A typical interrupt behavior is shown in Figure 33.
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Interrupt Function
WK event 1
WK event 2
INT
tINTD
tINT
Scenario 2
Scenario 1
Update of
WK_STAT register
Update of
WK_STAT register
optional
SPI
Read & Clear
WK_STAT
contents
SPI
Read & Clear
WK event 1
no WK
WK event 2
no WK
WK event 1 and WK
event 2
no WK
No SPI Read & Clear
Command sent
WK_STAT
contents
Interrupt_Behavior .vsd
Figure 33
Datasheet
Interrupt Signaling Behavior
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Interrupt Function
11.2
Electrical Characteristics
Table 17
Interrupt Output
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Interrupt output; Pin INT
INT HIGH Output Voltage
VINT,H
0.8 ×
VCC1
–
–
V
IINT = -2 mA;
INT = OFF
P_11.2.1
INT LOW Output Voltage
VINT,L
–
–
0.2 ×
VCC1
V
IINT = 2 mA;
INT = ON
P_11.2.2
INT Pulse Width
tINT
–
100
–
µs
1)
P_11.2.3
µs
1)
P_11.2.4
INT Pulse Minimum Delay tINTD
Time
–
100
–
between
consecutive pulses
1) Not subject to production test; tolerance defined by internal oscillator tolerance.
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Fail-Safe Outputs and Fail-Safe Input
12
Fail-Safe Outputs and Fail-Safe Input
12.1
Functional Description
FO1
Failure logic
5V_int
SBC Init
Mode
5V_int
SBC Init
Mode
T FSI
T test
RFSI
RTEST
FO2/FSI
FO3/TEST
T FO_PL
T FO_PL
Failure Logic
Figure 34
Failure Logic
Fail-Safe Input and Outputs Block Diagrams
The Fail Outputs consist of a failure logic block and three LOW-side switches. In case of a failure, the FO
outputs are activated and the SPI bit FO_ON_STATE in the register DEV_STAT is set.
The Fail Outputs are activated under the following failure conditions:
Failure Conditions
•
After one or two Watchdog Trigger failures depending on configuration
•
Thermal Shutdown TSD2
•
VCC1 short to GND
•
RO clamped to HIGH
Configurations
It is possible to configure the FOx activation after a Watchdog trigger using the CFG2 bit. Please refer to the
HW_CTRL register.
In order to deactivate the Fail Output, the failure conditions (e.g. TSD2) must not be present anymore and the
bit FO_ON_STATE needs to be cleared via SPI command. In case of Watchdog fail, the Fail Output may only be
disabled after the watchdog has been triggered successfully, i.e. the WD_FAIL bit must be cleared.
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Fail-Safe Outputs and Fail-Safe Input
Note: The Fail Outputs are triggered for any of the above described failures and not only for failures leading to
the Fail-Safe Mode.
The three Fail Outputs are activated in parallel. The FO1 gives a static LOW signal in case of Fail Output
activation. The FO2 provides a signal with a fixed frequency pulse and a duty cycle of 50% to generate an
indicator signal. The FO3 provides a PWM signal with a fixed frequency and duty cycle of 20%, e.g. to generate
a dimmed bulb signal.
Fail Outputs
•
FO1: Static Fail Output
•
FO2: 1.25Hz 50% duty cycle (typ.)
•
FO3: 100Hz 20% duty cycle (typ.)
12.2
Fail-Safe Input
The FO2 pin can be used as safety feature called Fail-Safe Input.
A digital signal has to be generated by the microcontroller and the TLE9272QX must detect the Low-to-High
transition whitin tFSI,W window time. The feature is enabled by default after power on. It can be disabled using
the SPI command (FSI_FO2=1 on HW_CTRL register).
If there is no signal from the microcontroller, the TLE9272QX sets the FSI_FAIL on DEV_STAT and both FO1
and FO3 are activated. The device remains in the same mode and neither reset nor interrupt will be triggered.
The SPI status bit FSI_FAIL can only be cleared after a new rising edge on the FSI pin.
The Figure 35 shows the timing diagram and level description of FSI input signal.
FSI (from µC)
FO1/FO3
t FSI ,W
t FSI ,W
tFSI , W
tFSI , W
t FSI ,W
t FSI ,W
t
t FSI ,W
ON
OFF
OFF
t
SPI “FSI_FAIL”
0
1
0
1
SPI cmd.
FO_ON=0
SPI cmd .
FSI_FAIL clear
Figure 35
FSI timing diagram and level description
The Fail-Safe Input feature is available only in SBC Normal Mode.
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Fail-Safe Outputs and Fail-Safe Input
12.3
Electrical Characteristics
Table 18
Interrupt Output
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Fail Output; Pin FO1, FO2, FO3
FO LOW output voltage
(active)
VFO,L
–
0.6
1
V
IFO = 5mA
P_12.3.1
FO HIGH output current
(inactive)
IFO,H
0
–
2
µA
VFO = 28V
P_12.3.2
FO3/TEST HIGH-input
voltage threshold
VTEST,H
–
–
0.7 x
VCC1
V
–
P_12.3.28
FO3/TEST LOW-input
voltage threshold
VTEST,L
0.3 x
VCC1
–
–
V
–
P_12.3.29
FO3/Hysteresis of TEST
input voltage
VTEST,Hys –
0.2 x
VCC1
–
V
1)
P_12.3.30
FO3 Test Mode Select
FO3/Pull-up Resistance at RTEST
pin TEST
–
5
–
kΩ
VTEST = 0.2 x VCC1
P_12.3.31
FO3/TEST Input Filter
Time
tTEST
–
16
–
µs
1)
P_12.3.32
FSI HIGH-input voltage
threshold
VFSI,H
–
–
0.7 x
VCC1
V
–
P_12.3.6
FSI LOW-input voltage
threshold
VFSI,L
0.3 x
VCC1
–
–
V
–
P_12.3.7
FSI Hysteresis of input
voltage
VFSI,Hys
–
0.2 x
VCC1
–
V
1)
P_12.3.8
FSI Pull-up Resistance
RFSI
–
40
–
kΩ
VFSI = 0.2 x VCC1
P_12.3.9
FSI Input Filter Time
tFSI
–
–
1.5
µs
1)
P_12.3.10
µs
1)
P_12.3.11
FO2/FSI input Select
FSI Window Time
tFSI,W
–
–
240
1) Not subject to production test; specified by design
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Supervision Functions
13
Supervision Functions
13.1
Reset Function
VCC1
RO
Reset logic
Incl. filter & delay
Figure 36
Reset Block Diagram
13.1.1
Reset Output Description
The reset output pin RO provides reset information to the microcontroller, for example, in the event that the
output voltage has fallen below the undervoltage threshold VRT1/2/3. In case of a reset event due to an
undervoltage on Buck regulator output voltage, the reset output RO is pulled to LOW after the filter time tRF
and stays LOW as long as the reset event is present plus a reset delay time tRD1. When connecting the SBC to
battery voltage, the reset signal remains LOW initially. When the Buck regulator output voltage has reached
the default reset threshold VRT1,f, the reset output RO is released to HIGH after the reset delay time tRD1 (for a
timing diagram, see also Figure 4). A reset can also occur due to a Watchdog trigger failure. The reset
threshold can be adjusted via SPI, the default reset threshold is VRT1,f. The RO pin has an integrated pull-up
resistor. If a reset is triggered, it will pull LOW for Buck regulator output voltage (VCC1) ≥ 1V and for VS ≥ VPOR,f.
RO trigger timing regarding Buck regulator undervoltage and watchdog trigger is shown in Figure 37.
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Supervision Functions
VCC
VRT1
t < tRF
The reset threshold can be
configured via SPI in SBC
Normal Mode , default is VRT1
undervoltage
t RD1
t CW
tLW
tCW
SPI
SPI
Init
tOW
t
tLW
tOW
WD
Trigger
t CW
t RD1
WD
Trigger
SPI
Init
t
tRF
RO
tLW = long open window
tCW = closed window
tOW= open window
t
SBC Init
Figure 37
Reset timing Diagram
13.1.2
Reset Clamp to high
SBC Normal
SBC Restart
SBC Normal
The RO pin is monitored internally. This feature detects if the RO pin is clamped to a high value from outside.
The Reset Clamp to High is detected if the SBC generates a Reset but the monitoring feedback senses a High
level. The Reset Clamp is stored in RO_CL_HIGH bit on the DEV_STAT register.
The feature is available in SBC Normal, Stop and Restart Mode. In SBC Sleep or Fail Safe Mode, the RO is not
monitored because the Buck regulator is disabled.
In case of watchdog failure, the Reset Clamp can be detected only if VCC1_UV on SUP_STAT register is 0 (no
Buck regulator undervoltage detected).
In case of a Buck regulator undervoltage event, the Reset Clamp can be detected only after the Buck regulator
output voltage rises above the reset threshold.
13.1.3
Soft Reset Description
In SBC Normal and Stop Mode, it is also possible to trigger a Soft Reset via an SPI command in order to bring
the SBC into a defined state in case of failures. In this case, the microcontroller must send an SPI command
and set the MODE bits to ‘11’ in the M_S_CTRL register. As soon as this command becomes valid, the SBC is
set back to SBC INIT Mode and all SPI registers are set to their default values (see SPI Chapter 14.5 and
Chapter 14.6).
No Reset (RO) is triggered when the soft reset is executed.
Note: The device has to be in SBC Normal Mode or SBC Stop Mode when sending this command. Otherwise, it
will be ignored.
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Supervision Functions
13.2
Watchdog Function
The watchdog is used to monitor the software execution of the microcontroller and to trigger a reset if the
microcontroller stops serving the watchdog due to a lock up in the software.
Two different types of watchdog functions are implemented and can be selected via the bit WD_WIN:
•
Time-Out Watchdog (default value);
•
Window Watchdog.
The respective watchdog function can be selected and programmed in SBC Normal Mode. The configuration
remains unchanged in SBC Stop Mode.
Refer to Table 19 to match the SBC Modes with the respective Watchdog Modes.
Table 19
Watchdog Functionality by SBC Modes
SBC Mode
Watchdog Mode
Remarks
INIT Mode
Start with Long Open Window Watchdog starts with Long Open Window after RO is
released.
Normal Mode
WD Programmable
Window Watchdog, Time-Out Watchdog
Stop Mode
Watchdog is fixed or OFF
Watchdog OFF must be performed in SBC Normal
Mode
Sleep Mode
OFF
SBC will start with Long Open Window when
entering SBC Normal Mode.
Restart Mode
OFF
SBC will start with Long Open Window when
entering Normal Mode.
Fail-Safe Mode
OFF
SBC will start with Long Open Window when
entering SBC Normal Mode.
The watchdog timing is programmed using an SPI command. As soon as the watchdog is programmed, the
timer starts with the new setting and the watchdog must be served.The watchdog is triggered by sending a
valid SPI-write
command to the watchdog configuration register. The trigger SPI command is executed when the Chip Select
input (CSN) becomes HIGH.
When coming from SBC Init or Restart Mode the watchdog timer is always started with a long open window.
The long open window (tLW) allows the microcontroller to run its initialization sequences and then to trigger
the watchdog via the SPI.
The watchdog timer period can be selected via the watchdog timing bit field (WD_TIMER) and is in the range of
10 ms to 1000 ms. This setting is valid for both watchdog types.
The following watchdog timer periods are available:
•
WD Setting 1: 10ms
•
WD Setting 2: 20ms
•
WD Setting 3: 50ms
•
WD Setting 4: 100ms
•
WD Setting 5: 200ms (reset value)
•
WD Setting 6: 500ms
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Supervision Functions
•
WD Setting 7: 1000ms
In case of a Watchdog reset, SBC Restart Mode is started and the SPI bits WD_FAIL are set. Once the RO goes
HIGH again the watchdog immediately starts with a long open window and the SBC enters automatically SBC
Normal Mode.
In SBC Development Mode, no reset is generated due to a watchdog failure, the watchdog is OFF.
After 3 consecutive resets due to watchdog failures, additional resets can be prevented by setting the
MAX_3_RST bit on WD_CTRL register. The SBC will then remain in SBC Normal or Stop Mode (the device will
not reenter SBC Restart Mode).
13.2.1
Time-Out Watchdog
The time-out watchdog is an easier and less secure watchdog than a window watchdog as the watchdog
trigger can be done at any time within the configured watchdog timer period.
A correct watchdog service immediately results in starting a new watchdog timer period. Taking the
tolerances of the internal oscillator into account leads to the safe trigger area as defined in Figure 38.
If the time-out watchdog period elapses, a watchdog reset is created by setting the reset output RO low and
the SBC switches to SBC Restart Mode.
Typical timout watchdog trigger period
t WD x 1.50
open window
uncertainty
Watchdog Timer Period (WD_TIMER)
tWD x 1.20
t / [tWD_TIMER]
safe trigger area
Figure 38
Time-Out Watchdog Definitions
13.2.2
Window Watchdog
t WD x 1.80
Compared to the time-out watchdog, the characteristic of the window watchdog is that the watchdog timer
period is divided between a closed and an open window. The watchdog must be triggered inside the open
window.
A correct watchdog trigger results in starting the window watchdog period by a closed window followed by an
open window.
The watchdog timer period is at the same time the typical trigger time and defines the middle of the open
window.
Taking the oscillator tolerances into account leads to a safe trigger area of:
tWD x 0.72 < safe trigger area < tWD x 1.20.
The typical closed window is defined to a width of 60% of the selected window watchdog timer period. Taking
the tolerances of the internal oscillator into account leads to the timings as defined in Figure 39.
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Supervision Functions
A correct watchdog service immediately results in starting the next closed window.
Should the trigger signal meet the closed window or should the watchdog timer period elapse, then a
watchdog reset is created by setting the reset output RO LOW. The SBC switches to SBC Restart Mode.
tWD x 0.6
tWD x 0.9
Typ. closed window
Typ. open window
tWD x 0.48
closed window
tWD x 0.72
uncertainty
tWD x 1.0
tWD x 1.20
open window
tWD x 1.80
uncertainty
Watchdog Timer Period (WD_TIMER)
t / [tWD _TIMER ]
safe trigger area
Figure 39
Window Watchdog Definitions
13.2.3
Watchdog Setting Check Sum
A check sum bit is part of the SPI command to trigger the watchdog and to set the watchdog setting.
The sum of the 8 bits in the register WD_CTRL needs to be even. This is realized by either setting the bit
CHECKSUM to “0” or “1”.
If the check sum is wrong the SPI command is ignored, i.e. the watchdog is not triggered or the settings are not
changed and the bit SPI_FAIL is set.
The checksum is calculated by taking all 8 data bits into account.
(13.1)
CHKSUM = Bit15 ⊕ … ⊕ Bit8
13.2.4
Watchdog during SBC Stop Mode
The watchdog can be disabled for SBC Stop Mode in SBC Normal Mode. For safety reasons, there is a special
sequence to be ensured in order to disable the watchdog. The sequence can be implemented only if the FSI
feature is disabled (FSI_FO2 = 1 on HW_CTRL register). The sequence is shown in Figure 40.
Two different bits (WD_STM_ EN_0 and WD_STM_ EN_1) in the registers WD_CTRL and WK_CTRL_1 need to
be set.
If a sequence error occurs, then the bit WD_STM_ EN_1 is cleared and the sequence has to be started again.
The watchdog can be enabled by triggering the watchdog in SBC Stop Mode or by switching back to SBC
Normal Mode via SPI. In both cases, the watchdog will start with a long open window and the bits WD_STM_
EN_1 and WD_STM_ EN_0 are cleared. After the long open window, the watchdog has to be served as
configured in WD_CTRL register.
Note: The bit WD_STM_ EN_0 will be cleared automatically when the sequence is started and it was “1” before.
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Supervision Functions
Correct WD disabling
sequence
Sequence Errors
•
Not setting the
WD_STM_EN_0 bit with the
next watchdog trigger after
having set WD_STM_EN_1
•
Staying in Normal Mode
Set bit
WD_STM_EN_1 = 1
with next WD Trigger
Set bit
WD_STM_EN_0 = 1
Before subsequent WD Trigger
Will enable the WD:
Change to
SBC Stop Mode
•
Switching back to SBC
Normal Mode
•
Triggering the watchdog
WD is switched off
Figure 40
Watchdog Disabling Sequence in SBC Stop Mode
13.2.4.1 WD Start in SBC Stop Mode due to BUS Wake
In SBC Stop Mode, the WD can be disabled. In addition, a feature can be enabled to start the watchdog with
any BUS wake during SBC Stop Mode. The feature is enabled by setting the bit WD_EN_WK_BUS. This bit can
only be changed in SBC Normal Mode and needs to be programmed before entering SBC Stop Mode. It is not
reset by the SBC. The sequence described in Chapter 13.2.4 needs to be followed to disable the watchdog.
With this function enabled, the WD will be restarted by any wake event on CAN or LINx. The wake event on CAN
or LINx will generate an interrupt and the RXDLINx or RXDCAN will be pulled to LOW. The watchdog starts with
long open window. The watchdog can be triggered in SBC Stop Mode or the SBC can be switched to SBC
Normal Mode. To disable the watchdog again, the SBC needs to be switched to SBC Normal Mode and the
sequence must be sent again. The sequence is shown in Figure 41.
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Supervision Functions
Correct WD disabling
sequence
Set bit
WD_EN_WK_BUS = 1
Set bit
WD_STM_EN_1 = 1
Sequence Errors
•
Missing to set bit
WD_STM_EN_0 with the
next watchdog trigger after
having set WD_STM_EN_1
•
Staying in Normal Mode
with next WD Trigger
Set bit
WD_STM_EN_0 = 1
Will enable the WD :
•
Switching back to SBC
Normal Mode
Before subsequent WD Trigger
•
Triggering the watchdog
Change to
SBC Stop Mode
•
Wake on CAN
•
Wake on LIN
WD is switched off
Figure 41
Datasheet
Watchdog Disabling Sequence (with wake via BUS)
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13.3
VS Power ON Reset
When powering up, the device detects the VS Power on Reset when VS > VPOR,r, and the SPI bit POR is set to
indicate that all SPI registers are set to POR default settings. The Buck regulator starts up. The reset output is
kept LOW and is only released when VCC1 has exceeded VRT1,r and after tRD1 has elapsed.
If VS < VPOR,f, an internal reset is generated and the SBC is switched OFF. The SBC will restart in INIT mode when
VS > VPOR,r rising. Timing behavior is shown in Figure 42.
VS
VPOR,r
VPOR,f
t
VCC1
VRT1,r
The reset threshold can be
configured via SPI in SBC
Normal Mode , default is VRT1
VRTx,f
t
RO
SBC Restart Mode is
entered whenever the
Reset is triggered
t
SBC Mode
SBC OFF
tRD1
SBC INIT MODE
Any SBC MODE
Restart
SBC OFF
t
SPI
Command
Figure 42
Ramp up / down example of Supply Voltage
13.4
Under Voltage VLIN
When the supply voltage VLIN reaches the undervoltage threshold (VLIN,UVD) the SBC does the following
actions:
•
The SPI bit VLIN_UV is set. No other error bits are set. The bit can be cleared once the condition is no longer
present;
•
LIN is set to LIN Receive Only Mode.
For additional information, please refer to Chapter 9.2.7.
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Supervision Functions
13.5
Buck Regulator Monitoring Features
13.5.1
VCC1 Under Voltage
As described in Chapter 13.1, and Figure 43, a reset will be triggered (RO pulled ‘LOW’) when the VCC1 output
voltage reaches the undervoltage threshold (VRTx) and the SBC enters SBC Restart Mode. The bit VCC1_UV is
set. The threshold can be configured using VCC1_RT bits.
The VCC1 under voltage can be disabled by setting VCC1_RT to 11B. With this configuration no reset is issued
due to VCC1 under voltage and no VCC1_UV bit is set. The under voltage detection has to be performed
outside of the SBC when required.
VCC1
VRTx
tRF
t
tRD1
RO
t
SBC Normal
Figure 43
SBC Restart
SBC Normal
VCC1 Undervoltage Timing Diagram
Note: The VCC1_UV bit is not set in SBC Sleep and Fail Safe Mode as VCC1 is known to be 0V in these cases.
13.5.2
VCC1 Overvoltage
For fail-safe reasons, a VCC1 over voltage detection feature is implemented. It is active in SBC Init, Normal, and
Stop Mode.
If VCC1 voltage exceeds the VCC1,OV,r threshold, the SBC triggers following actions:
•
The bit VCC1_OV is always set.
•
If the bit VCC1_OV_ RST is set, SBC Restart Mode is entered. A reset event is generated. The SBC exits the
SBC Restart Mode and SBC Normal Mode is resumed after the VCC1 over voltage is not present anymore
(see also Figure 44).
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Supervision Functions
VCC1
VCC1,OV
t
tOV_filt
RO
tRD1
t
SBC Normal
Figure 44
VCC1 Overvoltage Timing Diagram
13.5.3
VCC1 Short Circuit
SBC Restart
SBC Normal
The short circuit protection feature for Buck regulator is implemented as follows:
•
When VCC1 stays below the undervoltage threshold VRTx for more than tVCC1,SC and at the same time VS is
above the threshold VS,UV_TO, the SBC enters SBC Fail-Safe Mode and turns OFF the Buck regulator. The FOx
are activated and the SPI status bits VCC1_SC, VCC1_UV and BCK_SH are set. The SBC can be reactivated
by a wake event on CAN, LINx or WK.
13.5.4
SMPS Status register
The TLE9272QX has a dedicated SMPS status register which provides information about the Buck and Boost
regulators. No SBC Mode changes and no transceivers configurations changes are triggered when an
SMPS_STAT register bit is set.
13.6
VCC2 Undervoltage
An undervoltage warning is implemented for VCC2 as follows:
•
In case VCC2 drops below the VCC2,UV,f threshold for t > tVCC2,UV, the SPI bit VCC2_UV is set and can be only
cleared via SPI.
Note: The VCC2_UV flag is not set during turn-on or turn-off of VCC2.
13.7
VCAN Undervoltage
The CAN module has a dedicated feature to detect undervoltage condition on the VCAN supply pin. Refer to
Chapter 8.2.7 for additional information.
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Supervision Functions
13.8
Thermal Protection
Three independent and different thermal protection features are implemented in the SBC according to the
system impact:
•
Individual thermal shutdown of specific blocks;
•
Temperature prewarning of Buck regulator;
•
SBC thermal shutdown due to Buck regulator overtemperature.
13.8.1
Individual Thermal Shutdown
As a first-level protection measure, the output stages VCC2, CAN and LINx are independently switched OFF
when the respective block reaches the temperature threshold TjTSD1. Then the TSD1 bit is set. This bit can only
be cleared via SPI once the overtemperature is not present anymore. Regardless of the SBC Mode, the thermal
shutdown protection is only active when the respective block is ON.
The different modules behave as follows:
•
VCC2: it is switched OFF and the control bits VCC2_ON are cleared. The status bit VCC2_OT is set. Once the
over temperature condition is not present anymore, the VCC2 must be reconfigured by SPI. The thermal
protection in VCC2 is available only in SBC Normal Mode or SBC Stop Mode with watchdog activated.
•
CAN: The transmitter is disabled and stays in CAN Normal Mode acting like CAN Receive Only Mode. The
status bits CAN_FAIL = 01B are set. Once the overtemperature condition is not present anymore, the CAN
transmitter is automatically switched on.
•
LIN1, LIN2, LIN3: The transmitter is disabled and stays in LIN Normal Mode acting like LIN Receive Only
Mode. The respective status bits LINx_FAIL are set to 01B. Once the overtemperature condition is not
present anymore, the LIN transmitter is automatically switched on.
Note: The diagnosis bits are not cleared automatically and have to be cleared via SPI once the overtemperature
condition is not present anymore.
13.8.2
Temperature Prewarning
As a next level of thermal protection, a temperature prewarning is implemented if the Buck regulator reaches
the temperature prewarning threshold TjPW. The status bit TPW is set. This bit can only be cleared via SPI once
the overtemperature is not present anymore. Regardless of the SBC Mode the temperature prewarning is
active only if the Buck converter is ON.
13.8.3
SBC Thermal Shutdown
As a highest level of thermal protection, a temperature shutdown of the SBC occurs if the Buck regulator
reaches the thermal shutdown temperature threshold TjTSD2. The temperature protection is available only in
case that the Buck regulator works in PWM modulation. The thermal protection is not available if the Buck
regulator works in PFM mode.
Once a TSD2 event is detected, SBC Fail-Safe Mode is entered for at least tTSD2. The default wake sources (CAN,
LINx, WK pin) are enabled together with the Fail Safe Outputs.
When a TSD2 event is detected, the status bit TSD2 is set. This bit can only be cleared via SPI in SBC Normal
Mode once the overtemperature is not present anymore. Regardless of the SBC Mode the thermal shutdown
is only active if the Buck converter is ON.
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Supervision Functions
13.9
Electrical Characteristics
Table 20
Electrical Specification
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Unit
Note or
Test Condition
Number
Max.
VCC1 Monitoring, Reset Generator; Pin RO TLE9272QX
Reset Threshold
Voltage RT1,f
VRT1,f
4.5
4.6
4.75
V
default setting;
VCC1 falling
P_13.9.1
Reset Threshold
Voltage RT1,r
VRT1,r
4.6
4.7
4.85
V
default setting;
VCC1 rising
P_13.9.2
Reset Threshold
Voltage RT2,f
VRT2,f
3.7
3.9
4.0
V
SPI option; VCC1
falling
P_13.9.3
Reset Threshold
Voltage RT2,r
VRT2,r
3.8
4.0
4.1
V
SPI option; VCC1
rising
P_13.9.4
Reset Threshold
Voltage RT3,f
VRT3,f
3.0
3.15
3.3
V
SPI option;
VS ≥ 4V;
VCC1 falling
P_13.9.5
Reset Threshold
Voltage RT3,r
VRT3,r
3.1
3.25
3.4
V
SPI option;
VS ≥ 4V;
VCC1 rising
P_13.9.6
Reset Threshold Hysteresis
VRT,hys
20
100
200
mV
VCC1 Overvoltage Detection
Threshold
VCC1,OV,r
5.2
5.4
5.5
V
VCC1 Overvoltage Detection
hysteresis
VCC1,OV,hys
20
100
200
mV
–
4
VCC1 Short to GND Filter Time tVCC1,SC
VCC1 Overvoltage Filter Time tOV,filt
–
7
P_13.9.33
rising VCC1
P_13.9.50
P_13.9.74
ms
2)
P_13.9.11
µs
2)
P_13.9.58
VS threshold for VCC1
Undervoltage time out
detection
VS,UV_TO
5.3
5.6
6.0
V
VS needs to be
P_13.9.13
above to activate
VCC1_SC timeout
Reset LOW Output Voltage
VRO,HIGH
–
0.2
0.4
V
IRO = 1 mA for
VCC1≥ 1 V
P_13.9.14
Reset HIGH Output Voltage
VRO,LOW
0.7 ×
VCC1µC
–
VCC1µC + V
0.3 V
IRO = -20µA
P_13.9.15
Reset Pull-up Resistor
RRO
10
20
40
kΩ
P_13.9.16
Reset Filter Time
tRF
4
10
26
µs
VRO = 0 V
2)
VCC1 < VRT1×
Datasheet
P_13.9.17
to RO = LOW
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Supervision Functions
Table 20
Electrical Specification (cont’d)
Tj = -40 °C to +150 °C; VS = 5.5 V to 28 V; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin (unless otherwise specified).
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
tRD1
1.5
2
2.5
ms
1) 2)
P_13.9.18
VCC2 Undervoltage
threshold (falling)
VCC2,UV,f
4.5
–
4.75
V
VCC2 falling
P_13.9.21
VCC2 Undervoltage
threshold (rising)
VCC2,UV,r
4.6
–
4.9
V
VCC2 rising
P_13.9.55
VCC2 Undervoltage
detection hysteresis
VCC2,UV,hys
20
100
250
mV
–
P_13.9.56
VCC2 Undervoltage Filter
Time
tVCC2,UV
–
7
–
µs
2)
P_13.9.22
Long Open Window
tLW
240
300
360
ms
4)
P_13.9.34
Internal Oscillator
fCLKSBC
0.8
1.0
1.2
MHz
–
ms
2)3)
P_13.9.41
Reset Delay Time
VCC2 Monitoring
Watchdog Generator
P_13.9.24
Minimum Waiting Time during SBC Fail-Safe Mode
Min. waiting time in Fail-Safe tFS,min
–
100
Power-ON Reset, Over / Under Voltage Protection
Vs Power ON reset rising
VPOR,r
4.5
5
V
Vs increasing
P_13.9.25
Vs Power ON reset falling
VPOR,f
–
3
V
Vs decreasing
BOOST=OFF
P_13.9.26
VLIN undervoltage detection VLIN,UVD
threshold
4.8
5.5
V
Hysteresis
included
P_13.9.27
VLIN undervoltage detection VLIN,UVD,hys
hysteresis
–
200
–
mV
4)
P_13.9.57
Over Temperature Shutdown4)
Thermal Pre-warning ON
Temperature
TjPW
125
145
165
°C
4)
P_13.9.37
Thermal Shutdown TSD1
TjTSD1
165
185
200
°C
4)
P_13.9.38
P_13.9.39
P_13.9.40
Thermal Shutdown TSD2
TjTSD2
165
185
200
°C
4)
Deactivation time after
thermal shutdown TSD2
tTSD2
–
1
–
s
2)
1)
2)
3)
4)
The reset delay time will start when VCC1 crosses above the selected Vrtx threshold
Not subject to production tests. Tolerance defined by internal oscillator tolerance.
This time applies for all failure entries except a device thermal shutdown (TSD2 has a 1s waiting time tTSD2)
Not subject to production test, specified by design.
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Serial Peripheral Interface
14
Serial Peripheral Interface
14.1
SPI Description
The 16-bit wide Control Input Word is read via the data input SDI, which is synchronized with the clock input
CLK provided by the microcontroller. The output word appears synchronously at the data output SDO (see
Figure 45).
The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After
the CSN input returns from LOW to HIGH, the word that has been read is interpreted according to the content.
The SDO output switches to tristate status (HIGH impedance) at this point, thereby releasing the SDO bus for
other use.
The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is shifted out
of the output register after every rising edge on CLK. The SPI of the SBC is not daisy chain capable.
CSN high to low: SDO is enabled. Status information transferred to output shift register
CSN
time
CSN low to high: data from shift register is transferred to output functions
CLK
time
Actual data
SDI
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SDI: will accept data on the falling edge of CLK signal
Actual status
SDO
ERR 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
-
New data
0 1
+ +
time
New status
ERR 0
+
1
+
time
SDO: will change state on the rising edge of CLK signal
Figure 45
Datasheet
SPI Data Transfer Timing (note the reversed order of LSB and MSB shown in this figure
compared to the register description)
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14.2
Failure Signalization in the SPI Data Output
When the microcontroller sends a wrong SPI command to the SBC, the SBC ignores the information. Wrong
SPI commands can be either an invalid control command requesting to go to an SBC mode which is not
allowed by the state machine, for example from SBC Stop Mode to SBC Sleep Mode. In this case the diagnosis
bit ‘SPI_FAIL’ is set. This bit can be only reset by actively clearing it using an SPI command.
Invalid SPI commands are listed below:
•
Illegal state transitions: Going from SBC Stop to SBC Sleep Mode. In this case, the SBC enters in addition
the SBC Restart Mode;
Trying to go to SBC Stop or SBC Sleep Mode from SBC Init Mode. In this case, the SBC enters SBC Normal
Mode;
•
Attempting to change the Watchdog settings during Stop Mode ;
only WD trigger, returning to SBC Normal Mode, select Software Reset, set to SBC Stop mode to return from
PWM to PFM when automatic Buck mode transition has happened and Read & Clear commands are valid
SPI commands in SBC Stop Mode;
•
Attempt to go to Sleep Mode when all bits in the BUS_CTRL_1 and WK_CTRL_2 registers are cleared. In
this case, the SPI_FAIL bit is set and the SBC enters Restart Mode.
Note: At least one wake source must be activated in order to avoid a deadlock situation in Sleep Mode, i.e.
the SBC would not be able to wake up anymore. There is no signalling or failure handling for the attempt
to go to SBC Stop Mode when all bits in the registers BUS_CTRL_1 and WK_CTRL_2 are cleared because
the microcontroller can leave this mode via SPI.
Signalization of the ERR flag in the SPI data output (see Figure 45):
In addition, the number of received input clocks is supervised to be 0- or 16 clock cycles and the input word is
discarded in case of a mismatch (0 clock cycle to enable ERR signalization). Both errors - 0 bit and 16 bit CLK
mismatch or CLK high during CSN edges - are flagged in the following SPI output by a “HIGH” at the data
output (SDO pin, bit ERR) before the first rising edge of the clock is received. The error logic also recognizes if
CLK was HIGH during CSN edges. The complete SPI command is ignored in these cases.
Note: It is also possible (no ERR flag is set) to quickly check for the ERR flag without sending any data bits. i.e.
no SPI clocks are sent in this case.
14.3
SPI Programming
For the TLE9272QX, 7 bits are used for the address selection (6...0). Bit 7 is used to decide between Read Only
and Read_Clear for the status bits, and between Write and Read Only for configuration bits. For the actual
configuration and status information, 8 data bits (BIT15...8) are used.
Writing, clearing and reading is done byte wise. SPI configuration and status bits are not cleared automatically
and must be cleared by the microcontroller, e.g. if the TSD2 was set due to overtemperature. The
configuration bits will be partially automatically cleared by the SBC - please refer to the individual registers
description for detailed information. During SBC Restart Mode or Sleep Mode or Fail-Safe mode, the SPI
communication is ignored by the SBC, i.e. it is not interpreted.
There are two types of SPI registers:
•
Control registers: The registers used to configure the SBC, e.g. SBC mode, watchdog trigger, etc.
•
Status registers: The registers used to signal the status of the SBC, e.g. wake-up events, warnings, failures,
etc.
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Serial Peripheral Interface
For the status registers, the requested information is given in the same SPI command in DO.
For the control registers, the status of the respective bit is also shown in the same SPI command, but if the
setting is changed this is only shown with the next SPI command (it is only valid after CSN HIGH) of the same
register.
The SBC status information from the SPI status registers is transmitted in a compressed format with each SPI
response on SDO in the so-called Status Information Field register (see also Figure 46). The purpose of this
register is to quickly signal the information to the microcontroller if there was a change in one of the SPI status
registers. In this way, the microcontroller does not need to constantly read all the SPI status registers but only
those registers that have changed. Each bit in the Status Information Field represents an SPI status register
(see Table 21). As soon as one bit is set in one of the status registers, the respective bit in the Status
Information Field register is set. The register WK_LVL_STAT is not included in the status Information field. This
is shown in Table 21.
For example, if bit 0 in the Status Information Field is set to 1, one or more bits of the register 100 0001
(SUP_STAT) are set to 1. Then this register needs to be read in a second SPI command. The bit in the Status
Information Field will be set to 0 when all bits in the register 100 0001 are set back to 0.
Table 21
Status Information Field
Status Information Bit
Symbol Address Bit
Status Register
0
100 0001
SUP_STAT: Supply Status -Vs fail, Vccx fail, POR
1
100 0010
THERM_STAT: Thermal Protection Status
2
100 0011
DEV_STAT: Device Status - Mode before Wake, WD Fail,
SPI Fail, Failure
3
100 0100
BUS_STAT_1: Bus Failure Status: CAN, LIN
4
100 0101
BUS_STAT_2: Bus Failure Status: CAN, LIN
5
100 0110
WK_STAT_1: Wake Source Status
6
100 0111
WK_STAT_2: Wake Source Status
7
100 1100
SMPS_STAT: SMPS Status
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Serial Peripheral Interface
LSB
DI
0
MSB
1
2
3
4
5
6
Address Bits
7
8
9
10
11
12
13
14
15
x
x
x
x
12
13
14
15
x
x
x
Data Bits
R/W
x
x
x
x
Register content of
selected address
DO
0
1
2
3
4
5
6
7
8
9
10
Status Information Field
11
Data Bits
x
x
x
x
x
time
LSB is sent first in SPI message
Figure 46
SPI Operation Mode
14.4
SPI Bit Mapping
Figure 47 and Figure 1 show the mapping of the SPI bits and the respective registers.
The control registers ‘000 0001’ to ‘001 1110’ are READ/WRITE register. Depending on bit 7 the bits are only
read or also written. The new setting of the bit after write can be seen with a new read / write command.
The registers ‘100 0001’ to ‘111 1110’ are Status Registers and can be read or read with clearing the bit (if
possible) depending on bit 7. To clear a data byte of one of the Status Registers, bit 7 must be set to 1. The
register WK_LVL_STAT is an exception as it shows the actual voltage level at the respective WK pin
(LOW/HIGH) and can thus not be cleared.
When changing to a different SBC Mode, certain configurations and status bits will be cleared:
•
The SBC Mode bits are updated to the actual status, e.g. when returning to Normal Mode
•
In Sleep Mode, the CAN and LIN control bits will be changed to CAN/LIN wake capable if they were ON
before. FOx will stay activated if it was triggered before.
•
VCC2 can be active in Low power mode (Stop/Sleep). The configuration can only be done in Normal Mode.
Diagnosis is active (UV, OT).
•
Depending on the respective configuration, CAN/LIN transceivers will be either OFF, woken or still wake
capable.
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Serial Peripheral Interface
7
Register Short Name
6...0
Address
A6…A0
Read-Only (1)
CONTROL REGISTERS
Control Registers
STATUS
SUP_STAT
THERM_STAT
DEV_STAT
BUS_STAT_1
BUS_STAT_2
WK_STAT_1
WK_STAT_2
WK_LVL_STAT
SMPS_STAT
FAM_PROD_STAT
Status Registers
Figure 47
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
M_S_CTRL
HW_CTRL
WD_CTRL
BUS_CTRL_1
BUS_CTRL_2
WK_CTRL_1
WK_CTRL_2
WK_PUPD_CTRL
TIMER1_CTRL
SYS_STATUS_CTRL
0000001
0000010
0000011
0000100
0000101
0000110
0000111
0001000
0001100
0011110
REGI S TERS
read/clear
1000001
read/clear
1000010
read/clear
1000011
read/clear
1000100
read/clear
1000101
read/clear
1000110
read/clear
1000111
read
1001000
read/clear
1001100
read
1111110
SPI Bit Mapping
15
14
13
D7
D6
D5
M_S_CTRL
HW_CTRL
WD_CTRL
BUS_CTRL_1
BUS_CTRL_2
WK_CTRL_1
WK_CTRL_2
WK_PUPD_CTRL
TIMER1_CTRL
SYS_STATUS_CTRL
MODE_1
FSI_FO2
CHECKSUM
LIN_FLASH
reserved
reserved
reserved
reserved
reserved
SYS_STAT_7
MODE_0
PWM_TLAG
WD_STM_EN_0
LIN_LSM
reserved
TIMER1_WK_EN
reserved
reserved
reserved
SYS_STAT_6
reserved
FO_ON
WD_WIN
LIN_TXD_TO
reserved
reserved
reserved
reserved
reserved
SYS_STAT_5
SUP_STAT
THERM_STAT
DEV_STAT
BUS_STAT_1
BUS_STAT_2
WK_STAT_1
WK_STAT_2
WK_LVL_STAT
SMPS_STAT
FAM_PROD_STAT
POR
reserved
DEV_STAT_1
reserved
reserved
PFM_PWM
reserved
TEST
BST_ACT
FAM_3
VLIN_UV
reserved
DEV_STAT_0
LIN1_FAIL_1
reserved
reserved
reserved
reserved
BST_SH
FAM_2
VCC1_OV
reserved
RO_CL_HIGH
LIN1_FAIL_0
reserved
CAN_WU
reserved
CFG2_STATE
BST_OP
FAM_1
Register Short Name
12
Data Bit 15…8
D4
11
10
9
8
D3
D2
D1
D0
7
VCC1_OV_RST
BOOST_V
WD_TIMER_2
reserved
reserved
WD_STM_EN_1
reserved
reserved
TIMER1_PER_2
SYS_STAT_2
VCC1_RT_1
BOOST_EN
WD_TIMER_1
CAN_1
LIN2_1
reserved
reserved
WK_PUPD_1
TIMER1_PER_1
SYS_STAT_1
VCC1_RT_0
CFG2
WD_TIMER_0
CAN_0
LIN2_0
reserved
WK_EN
WK_PUPD_0
TIMER1_PER_0
SYS_STAT_0
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
read/write
0000001
0000010
0000011
0000100
0000101
0000110
0000111
0001000
0001100
0011110
VCC1_SC
TSD2
WD_FAIL_0
CAN_FAIL_1
LIN2_FAIL_1
reserved
LIN3_WU
reserved
BCK_SH
PROD_2
reserved
TSD1
SPI_FAIL
CAN_FAIL_0
LIN2_FAIL_0
reserved
LIN2_WU
reserved
BCK_OP
PROD_1
VCC1_UV
TPW
FO_ON_STATE
VCAN_UV
reserved
WK_WU
LIN1_WU
WK
BCK_OOR
PROD_0
read/clear
read/clear
read/clear
read/clear
read/clear
read/clear
read/clear
read
read/clear
read
1000001
1000010
1000011
1000100
1000101
1000110
1000111
1001000
1001100
1111110
Read-Only (1)
6...0
Address
A6…A0
Status Registers
Control Registers
CONTROL REGISTERS
Figure 48
Datasheet
VCC2_ON_1
PWM_BY_WK
WD_EN_WK_BUS
LIN1_1
LIN3_1
reserved
reserved
reserved
reserved
SYS_STAT_4
VCC2_ON_0
PWM_AUTO
MAX_3_RST
LIN1_0
LIN3_0
reserved
reserved
reserved
reserved
SYS_STAT_3
STATUS REG IS TERS
VCC2_OT
VCC2_UV
reserved
reserved
FSI_FAIL
WD_FAIL_1
reserved
reserved
LIN3_FAIL_1
LIN3_FAIL_0
TIMER_WU
reserved
reserved
reserved
reserved
reserved
BST_GSH
reserved
FAM_0
PROD_3
Detailed SPI Bit Mapping
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14.5
SPI Control Registers
Read-/Write Operation (see Chapter 14.3):
•
The ‘POR / Soft Reset Value’ defines the register content after POR or SBC Reset.
•
The ‘Restart Value’ defines the register content after SBC Restart, where ‘x’ means the bit is unchanged.
•
One 16-bit SPI command consist of two bytes:
- the 7-bit address and one additional bit for the register access mode and
- following the data byte
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...15 (see also Figure 1).
•
There are three different bit types:
– ‘r’ = READ; read only bits (or reserved bits)
– ‘rw’ = READ/WRITE; readable and writable bits.
– ‘rwh’ = READ/WRITE/HARDWARE; as rw with the possibility that the hardware can change the bits.
•
Reading a register is done byte wise by setting the SPI bit 7 to “0” (= Read Only).
•
Writing to a register is done byte wise by setting the SPI bit 7 to “1”.
•
SPI control bits are in general not cleared or changed automatically. This must be done by the
microcontroller via SPI programming.
M_S_CTRL
Mode- and Supply Control (Address 000 0001B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0000 0xxxB
7
6
5
4
3
2
1
0
MODE_1
MODE_0
Reserved
VCC2_ON_1
VCC2_ON_0
VCC1_OV_
RST
VCC1_RT_1
VCC1_RT_0
rw
rw
r
rw
rw
rw
rw
rw
R
Field
Bits
Type
Description
MODE
7:6
rw
SBC Mode Control
00B , SBC Normal Mode
01B , SBC Sleep Mode
10B , SBC Stop Mode
11B , SBC Reset: Soft Reset is executed (RO is not triggered)
Reserved
5
r
Reserved, always reads as 0
VCC2_ON
4:3
rw
VCC2 Mode Control
00B , VCC2 OFF
01B , VCC2 ON in Normal Mode
10B , VCC2 ON in Normal and Stop Mode
11B , VCC2 ON in Normal, Stop and Sleep Mode
VCC1_OV_
RST
2
rw
Vcc1 Over Voltage Reset enable
0B , Over voltage on VCC1 will not trigger a reset
1B , Over voltage on VCC1 will trigger a reset, SBC goes to SBC
Restart Mode
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Field
Bits
Type
Description
VCC1_RT
1:0
rw
VCC1 Reset Threshold Control
00B , Vrt1 selected (highest threshold)
01B , Vrt2 selected
10B , Vrt3 selected
11B , Undervoltage Reset disabled
Note: Trying to enter SBC Sleep Mode without any of the wake sources enabled will result in entering SBC
Restart Mode and triggering a Reset.
HW_CTRL
Hardware Control (Address 000 0010B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: xx0x xxxxB
7
6
5
FSI_FO2
PWM_TLAG
FO_ON
rw
rw
rw
4
3
PWM_BY_WK PWM_AUTO
rw
rw
2
1
0
BOOST_V
BOOST_EN
CFG2
rw
rw
rw
R
Field
Bits
Type
Description
FSI_FO2
7
rw
Failure Safe Input activation
This bit is used to activate the Fail-Safe Input by software.
0B , FSI active.
1B , FSI disable. The pin is set as output (FO2)
PWM_TLAG
6
rw
PWM Lag time
This bit permits to set the time between the PWM to PFM transition.
0B , 100µs
1B , 1ms
FO_ON
5
rw
Failure Outputs activation
This bit is used to activate the Fail Outputs by software.
0B , FOx not activated by software, FOx can be activated by
defined failure
1B , FOx activated by software.
PWM_BY_
WK
4
rw
PWM of Buck converter enabled by WK pin in SBC Stop Mode
0B , Buck converter uses PFM in Stop Mode
1B , Buck converter can be switched between PFM and PWM by
the level of the WK pin in SBC Stop Mode.
PWM_AUTO 3
rw
Automatic transition PFM-PWM in SBC Stop Mode
This bit is used to activate the automatic transition PFM to PWM in
SBC Stop Mode.
0B , Buck converter always uses PFM in SBC Stop Mode
1B , Buck converter uses automatic transition PFM to PWM in
case large current needed in SBC Stop Mode. To come back in
PFM, write a SBC Stop Mode command to M_S_CTRL.
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Field
Bits
Type
Description
BOOST_V
2
rw
Boost Voltage selection
0B , Boost Voltage 8V typical
1B , Boost Voltage 6.65V typical
BOOST_EN
1
rw
Boost converter enable
0B , Boost Off
1B , Boost enabled, automatic switch ON for VS Voltage lower
than VBST,THx
CFG2
0
rw
Configuration Select 2
0B , Fail Outputs (FOx) are active after 2nd watchdog trigger fail
Config 3
1B , Fail Outputs (FOx) are active after 1st watchdog trigger fail
Config 1
Note: The selection between Config 1 respectively Config 3 is done by the pin CFG. The CFG pin defines if the
SBC goes to Fail-Safe Mode with VCC1 OFF in case of a watchdog failure.
WD_CTRL
Watchdog Control (Address 000 0011B)
POR / Soft Reset Value: 0001 0100B;
Restart Value: x00x x100B
7
6
5
CHECKSUM
WD_STM_
EN_0
WD_WIN
rw
rwh
rw
Field
Bits
4
3
2
1
0
WD_EN_WK_
MAX_3_RST WD_TIMER_2 WD_TIMER_1 WD_TIMER_0
BUS
rwh
rw
rwh
r
rwh
rwh
Type
Description
CHECKSUM 7
rw
Checksum Bit
The sum of bit 7...0 needs to be even. Otherwise the bit SPI_FAIL is
set and the command ignored,
0B , Counts as 0 for checksum calculation
1B , Counts as 1 for checksum calculation
WD_STM_
EN_0
6
rwh
Watchdog activation during SBC Stop Mode
0B , Watchdog is active in SBC Stop Mode
1B , Watchdog is deactivated in SBC Stop Mode
WD_WIN
5
rw
Watchdog Window Time-out feature enabled
0B , Watchdog works as Time-Out Watchdog
1B , Watchdog works as Window Watchdog
rwh
Enable the Watchdog after transceiver (CAN/LIN) wake-up in
SBC Stop Mode
0B , Watchdog will not start after a CAN/LIN1/LIN2/LIN3/ wake
1B , Watchdog starts with a long open window after
CAN/LIN1/LIN2/LIN3 wake
WD_EN_WK 4
_BUS
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Serial Peripheral Interface
Field
Bits
Type
Description
MAX_3_RST 3
rw
Limit number of Resets due to a Watchdog failure
0B , Always generate a reset in case of WD fail
1B , After 3 consecutive resets due to WD fail, no further reset is
generated
WD_TIMER
rwh
Watchdog Timer Period
000B , 10ms
001B , 20ms
010B , 50ms
011B , 100ms
100B , 200ms
101B , 500ms
110B , 1s
111B , reserved
2:0
Note: See also Chapter 13.2.4 for more information on disabling the watchdog SBC Stop Mode.
BUS_CTRL_1
Bus Control (Address 000 0100B)
POR / Soft Reset Value: 0010 0000B;
Restart Value: xxxx x0xxB
7
6
5
4
3
2
1
0
LIN_FLASH
LIN_LSM
LIN_TXD_TO
LIN1_1
LIN1_0
reserved
CAN_1
CAN_0
rw
rw
rw
rwh
rwh
r
rwh
rwh
r
Field
Bits
Type
Description
LIN_FLASH
7
rw
LIN Flash Programming Mode
0B , Slope control mechanism active
1B , Deactivation of slope control for baud rates up to 115kBaud
LIN_LSM
6
rw
LIN LOW-Slope Mode Selection
0B , LIN Normal-Slope Mode is activated
1B , LIN Low-Slope Mode is activated
LIN_TXD_
TO
5
rw
LIN TXD Time-Out Control
0B , TXDLIN Time-Out feature disabled
1B , TXDLIN Time-Out feature enabled
LIN1
4:3
rwh
LIN-Module Mode
00B , LIN1 OFF
01B , LIN1 is wake capable
10B , LIN1 Receive Only Mode
11B , LIN1 Normal Mode
Reserved
2
r
Reserved, always reads as 0
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Serial Peripheral Interface
Field
Bits
Type
Description
CAN
1:0
rwh
HS-CAN Module Mode
00B , CAN OFF
01B , CAN is wake capable
10B , CAN Receive Only Mode
11B , CAN Normal Mode
Note: In case CAN transceiver is configured to ‘11’ while going to SBC Stop or Sleep Mode, it will be
automatically set to wake capable (‘01’). However, the SPI bits will stay unchanged, i.e. once the SBC returns
to Normal Mode, the previous state is recovered again (‘11’). The Receive Only Mode (‘10’) has to be selected
by purpose before entering SBC Stop Mode. For more details, refer to Figure 17.
In case of entering SBC Sleep Mode, the CAN transceiver has to be set to CAN wake capable or CAN OFF Mode
before.
In case LIN transceiver is configured to ‘11’ while going to SBC Stop or Sleep Mode, it will be automatically set
to wake capable (‘01’). However, the SPI bits will stay unchanged, i.e. once the SBC returns to Normal Mode,
the previous state is recovered again (‘11’).The Receive Only Mode (‘10’) has to be selected by purpose before
entering SBC Stop Mode. For more details, refer to Figure 24.
BUS_CTRL_2
Bus Control (Address 000 0101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 000x x0xxB
7
6
5
4
3
2
1
0
reserved
reserved
reserved
LIN3_1
LIN3_0
reserved
LIN2_1
LIN2_0
r
r
r
rwh
rwh
r
rwh
rwh
Field
Bits
Type
Description
Reserved
7:5
r
Reserved, always reads as 0
LIN3
4:3
rwh
LIN-Module Mode
00B , LIN3 OFF
01B , LIN3 is wake capable
10B , LIN3 Receive Only Mode
11B , LIN3 Normal Mode
Reserved
2
r
Reserved, always reads as 0
LIN2
1:0
rwh
LIN-Module Mode
00B , LIN2 OFF
01B , LIN2 is wake capable
10B , LIN2 Receive Only Mode
11B , LIN2 Normal Mode
r
Note: In case either CAN or LIN transceivers are configured to ‘11’ while going to SBC Stop or Sleep Mode, they
will be automatically set to wake capable (‘01’). However, the SPI bits will stay unchanged, i.e. once the SBC
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Serial Peripheral Interface
returns to Normal Mode, the previous state is recovered again (‘11’).The Receive Only Mode (‘10’) has to be
selected by purpose before entering SBC Stop Mode. For more details, refer to Figure 24.
WK_CTRL_1
Wake Input Control (Address 000 0110B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0x00 0000B
7
6
5
4
3
2
1
0
reserved
TIMER1_WK_
EN
reserved
reserved
reserved
WD_STM_
EN_1
reserved
reserved
r
rw
r
r
r
rwh
r
r
r
Field
Bits
Type
Description
Reserved
7
r
Reserved, always reads as 0
TIMER1_WK 6
_EN
rw
Timer1 wake source control
0B , Timer1 wake disabled
1B , Timer1 is enabled as a wake source
Reserved
5:3
r
Reserved, always reads as 0
WD_STM_
EN_1
2
rwh
Watchdog activation during SBC Stop Mode
0B , Watchdog is active in Stop Mode
1B , Watchdog is deactivated in Stop Mode
Reserved
1:0
r
Reserved, always reads as 0
WK_CTRL_2
Wake Source Control (Address 000 0111B)
Restart Value: 0000 000xB
POR / Soft Reset Value: 0000 0001B;
7
6
5
4
3
2
1
0
reserved
reserved
reserved
reserved
reserved
reserved
reserved
WK_EN
r
r
r
r
r
r
r
rw
Field
Bits
Type
Description
Reserved
7:1
r
Reserved, always reads as 0
WK_EN
0
rw
WK wake source control
0B , WK wake disabled
1B , WK is enabled as a wake source
Datasheet
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Serial Peripheral Interface
WK_PUPD_CTRL
Wake Input Level Control (Address 000 1000B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0000 00xxB
7
6
5
4
3
2
reserved
reserved
reserved
reserved
reserved
reserved
r
r
r
r
r
r
1
WK_PUPD_1 WK_PUPD_0
r
rw
Field
Bits
Type
Description
Reserved
7:2
r
Reserved, always reads as 0
WK_PUPD
1:0
rw
WK Pull-Up / Pull-Down Configuration
00B , No pull-up / pull-down selected
01B , Pull-down resistor selected
10B , Pull-up resistor selected
11B , Automatic switching to pull-up or pull-down
TIMER1_CTRL
Timer1 Control and Selection (Address 000 1100B)
POR / Soft Reset Value: 0000 0000B;
rw
Restart Value: 0000 0xxxB
7
6
5
4
3
reserved
reserved
reserved
reserved
reserved
r
r
r
r
r
2
Bits
Type
Description
Reserved
7:3
r
Reserved, always reads as 0
TIMER1_PE
R
2:0
rw
Timer1 Period configuration
000B , 10ms
001B , 20ms
010B , 50ms
011B , 100ms
100B , 200ms
101B , 1s
110B , 2s
111B , reserved
103
1
0
TIMER1_PER TIMER1_PER TIMER1_PER
_2
_1
_0
Field
Datasheet
0
rw
r
rw
rw
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
SYS_STATUS_CTRL
System Status Control (Address 001 1110B)
POR Value: 0000 0000B;
7
6
5
Restart Value/Soft Reset Value: xxxx xxxxB
4
3
2
1
0
SYS_STAT_7 SYS_STAT_6 SYS_STAT_5 SYS_STAT_4 SYS_STAT_3 SYS_STAT_2 SYS_STAT_1 SYS_STAT_0
rw
rw
rw
rw
rw
rw
r
rw
Field
Bits
Type
Description
SYS_STAT
7:0
rw
System Status Control Byte (bit0=LSB; bit7=MSB)
Dedicated byte for system configuration, access only by
microcontroller. No SBC functions
rw
Note: The SYS_STATUS_CTRL register is an exception for the default values, i.e. it will keep its configured
value even after a Soft Reset.
Note: This byte is intended for storing system configurations of the ECU by the microcontroller and it is
writable in SBC Normal and Stop Mode. The byte is not accessible by the SBC and is also not cleared after FailSafe or SBC Restart Mode. It allows the microcontroller to quickly store system configuration without losing
the data.
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14.6
SPI Status Information Registers
Read-/Write Operation (see Chapter 14.3):
•
One 16-bit SPI command consists of two bytes:
- the 7-bit address and one additional bit for the register access mode and
- following the data byte will be ignored when accessing a status register
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...15 (see also Figure 1).
•
There are two different bit types:
- ‘r’ = READ: read only bits (or reserved bits)
- ‘rc’ = READ/CLEAR: readable and clearable bits
•
Reading a register is done byte wise by setting the SPI bit 7 to “0” (= Read Only)
•
Clearing a register is done byte wise by setting the SPI bit 7 to “1”
•
SPI status registers are in general not cleared or changed automatically (an exception are the WD_FAIL
bits). This must be done by the microcontroller via SPI command
SUP_STAT
Supply Voltage Fail Status (Address 100 0001B)
POR / Soft Reset Value: x000 0000B;
Restart Value: xxxx xx0xB
7
6
5
4
3
2
1
0
POR
VLIN_UV
VCC1_OV
VCC2_OT
VCC2_UV
VCC1_SC
reserved
VCC1_UV
rc
rc
rc
rc
rc
rc
r
rc
Field
Bits
Type
Description
POR
7
rc
Power-On Reset Detection
0B , No POR
1B , POR occurred
VLIN_UV
6
rc
VLIN Under-Voltage Detection
0B , No VLIN_UV
1B , VLIN_UV detected
VCC1_OV
5
rc
Vcc1 Over-Voltage Detection
0B , No VCC1 OV
1B , VCC1 OV detected
VCC2_OT
4
rc
VCC2 Over Temperature Detection
0B , No overtemperature
1B , VCC2 overtemperature detected
VCC2_UV
3
rc
VCC2 under voltage detection
0B , No VCC2 undervoltage
1B , VCC2 undervoltage detected
VCC1_SC
2
rc
VCC1 Short to GND Detection
0B , No short
1B , VCC1 short to GND detected
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Serial Peripheral Interface
Field
Bits
Type
Description
Reserved
1
r
Reserved, always reads 0
VCC1_UV
0
rc
VCC1 UV-detection
0B , No VCC1-UV detection
1B , VCC1-UV detected
Notes
1. When VCC1 is OFF (for example in SBC Sleep Mode), the bits VCC1_SC and VCC1_UV will not be set.
2. When Vcc2 is OFF, the bit VCC2_UV and VCC2_OT will not be set.
3. When all LIN’s are wake capable or OFF, VLIN_UV will not be set.
THERM_STAT
Thermal Protection Status (Address 100 0010B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0000 0xxxB
7
6
5
4
3
2
1
0
reserved
reserved
reserved
reserved
reserved
TSD2
TSD1
TPW
r
r
r
r
r
rc
rc
rc
r
Field
Bits
Type
Description
Reserved
7:3
r
Reserved, always reads as 0
TSD2
2
rc
TSD2 Thermal Shutdown detection
0B , No TSD2 fail
1B , TSD2 thermal shutdown detected (leading to SBC Fail Safe
Mode)
TSD1
1
rc
TSD1 Thermal Shutdown detection
0B , No TSD1 fail
1B , TSD1 thermal shutdown detected
TPW
0
rc
Thermal Pre warning
0B , No Thermal Pre warning
1B , Thermal Pre warning detected
DEV_STAT
Device Information Status (Address 100 0011B)
POR / Soft Reset Value: 0000 0000B;
7
6
5
DEV_STAT_1 DEV_STAT_0 RO_CL_HIGH
rc
Datasheet
rc
rc
Restart Value: xxxx xxxxB
4
3
2
1
0
FSI_FAIL
WD_FAIL_1
WD_FAIL_0
SPI_FAIL
FO_ON_
STATE
rc
rh
rh
rc
rc
106
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TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
DEV_STAT
7:6
rc
Device Status before Restart Mode
00B , Cleared (Register must be actively cleared)
01B , Restart after failures (WD fail, TSD2, VCC1_UV and
VCC1_OV); also wake from SBC Fail Safe Mode
10B , Wake from Sleep Mode
11B , Not used
RO_CL_HIG 5
H
rc
Reset PIN Clamped to HIGH level detected
0B , No Reset Clamped to HIGH detected
1B , Reset Clamped to HIGH detected
FSI_FAIL
4
rc
FSI Fail information
0B , No FSI fail
1B , Failure on FSI pattern recognized
WD_FAIL
3:2
rh
Number of WD-Fail event
00B , No WD Fail
01B , 1x WD Fail, causing SBC activates FOx in Config1
10B , 2x WD Fails, causing SBC activates FOx in Config3
11B , Reserved (never achieved)
SPI_FAIL
1
rc
SPI Fail Information
0B , No SPI fail
1B , Invalid SPI command detected, SPI command is not
executed
FO_ON_STA 0
TE
rc
Fail Outputs On Status
0B , FO outputs are not activated
1B , FO outputs are activated
Notes
1. The bits DEV_STAT show the status of the device before it went through Restart. Either the device came from
regular Sleep Mode (‘10’) or a failure (‘01’ - SBC Restart or SBC Fail-Safe Mode: WD fail, TSD2 fail, VCC1_UV fail
or VCC1_OV if bit VCC1_OV_ RST is set) occurred.
2. The WD_FAIL bits are configured as a counter and are the only status bits which are cleared automatically by
the SBC. They are cleared after a successful watchdog trigger. See also Chapter 12.1.
3. The SPI_FAIL bit is cleared only by SPI command
BUS_STAT_1
Bus Communication Status (Address 100 0100B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0xx0 0xxxB
7
reserved
r
Datasheet
6
5
LIN1_FAIL_1 LIN1_FAIL_0
rc
rc
4
3
reserved
reserved
r
r
107
2
1
CAN_FAIL_1 CAN_FAIL_0
rc
r
rc
0
VCAN_UV
rc
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
Reserved
7
r
Reserved, always reads as 0
LIN1_FAIL
6:5
rc
LIN Failure Status
00B , No error
01B , LIN TSD shutdown, also TSD1 is signaled
10B , LIN_TXD_DOM: TXDLIN dominant time out
11B , LIN_BUS_DOM: BUS dominant time out
Reserved
4:3
r
Reserved, always reads as 0
CAN_FAIL
2:1
rc
CAN Failure Status
00B , No error
01B , CAN TSD shutdown, also TSD1 signaled
10B , CAN_TXD_DOM: TXDCAN dominant time out
11B , CAN_BUS_DOM: BUS dominant time out
VCAN_UV
0
rc
Under voltage VCAN Supply
0B , Normal operation
1B , VCAN Supply under voltage detected. Transmitter disabled
Notes
1. CAN and LIN Recovery Conditions:
1.) TXD Time Out: TXD goes HIGH or transmitter is set to wake capable or switched off;
2.) Bus dominant time out: Bus will become recessive or transceiver is set to wake capable or switched off.
3.) Supply undervoltage: as soon as the threshold is crossed again, i.e. VLIN > VS_UV for LIN and VCAN >
VCAN_UV for CAN
4.) In all cases (also for TSD shutdown): to enable the Bus transmission again, TXD needs to be HIGH for a
certain time (transmitter enable time).
2. The VCAN_UV comparator is enabled if the CAN is CAN Normal Mode or CAN Receive Only Mode or CAN Wake
Capable after one valid WUP is detected.
BUS_STAT_2
Bus Communication Status (Address 100 0101B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 000x xxx0B
7
6
5
reserved
reserved
reserved
r
r
r
4
3
1
LIN3_FAIL_1 LIN3_FAIL_0 LIN2_FAIL_1 LIN2_FAIL_0
rc
rc
Field
Bits
Type
Description
Reserved
7:5
r
Reserved, always reads as 0
Datasheet
2
108
rc
r
rc
0
reserved
r
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
LIN3_FAIL
4:3
rc
LIN Failure Status
00B , No error
01B , LIN TSD shutdown, also TSD1 signaled
10B , LIN_TXD_DOM: TXDLIN dominant time out
11B , LIN_BUS_DOM: BUS dominant time out
LIN2_FAIL
2:1
rc
LIN Failure Status
00B , No error
01B , LIN TSD shutdown, also TSD1 signaled
10B , LIN_TXD_DOM: TXDLIN dominant time out
11B , LIN_BUS_DOM: BUS dominant time out
Reserved
0
r
Reserved, always reads as 0
Notes
1. LIN Recovery Conditions:
1.) TXD Time Out: TXD goes HIGH or transmitter is set to wake capable or switched off;
2.) Bus dominant time out: Bus will become recessive or transceiver is set to wake capable or switched off.
3.) Supply undervoltage: as soon as the threshold is crossed again, i.e. VLIN > VS_UV
4.) In all cases (also for TSD shutdown): to enable the Bus transmission again, TXD needs to be HIGH for a
certain time (transmitter enable time).
WK_STAT_1
Wake-up Source and Information Status (Address 100 0110B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: x0xx 000xB
7
6
5
4
3
2
1
0
PFM_PWM
reserved
CAN_WU
TIMER_WU
reserved
reserved
reserved
WK_WU
rc
r
rc
rc
r
r
r
rc
r
Field
Bits
Type
Description
PFM_PWM
7
rc
PFM_PWM automatic transition detected
0B , No automatic PFM_PWM transition detected
1B , Automatic PFM_PWM transition detected
Reserved
6
r
Reserved, always reads as 0
CAN_WU
5
rc
Wake up via CAN Bus
0B , No Wake up
1B , Wake up
TIMER_WU
4
rc
Wake up via Timer
0B , No Wake up
1B , Wake up
Reserved
3:1
r
Reserved, always reads as 0
Datasheet
109
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
WK_WU
0
rc
Wake up via WK
0B , No Wake up
1B , Wake up
WK_STAT_2
Wake-up Source and Information Status (Address 100 0111B)
POR / Soft Reset Value: 0000 0000B;
Restart Value: 0000 xxxxB
7
6
5
4
3
2
1
0
reserved
reserved
reserved
reserved
reserved
LIN3_WU
LIN2_WU
LIN1_WU
r
r
r
r
r
rc
rc
rc
Field
Bits
Type
Description
Reserved
7:3
r
Reserved, always reads as 0
LIN3_WU
2
rc
Wake up via LIN3 Bus
0B , No Wake up
1B , Wake up
LIN2_WU
1
rc
Wake up via LIN2 Bus
0B , No Wake up
1B , Wake up
LIN1_WU
0
rc
Wake up via LIN1 Bus
0B , No Wake up
1B , Wake up
WK_LVL_STAT
WK Input Level (Address 100 1000B)
POR / Soft Reset Value: x100 000xB;
r
Restart Value: x1x0 000xB
7
6
5
4
3
2
1
0
TEST
reserved
CFG2_STATE
reserved
reserved
reserved
reserved
WK
r
r
r
r
r
r
r
r
r
Field
Bits
Type
Description
TEST
7
r
Status of TEST Pin
0B , LOW Level (=0)
1B , HIGH Level (=1), SBC Development Mode is enabled, No
reset triggered due to wrong watchdog trigger
reserved
6
r
Reserved, always reads as 1
Datasheet
110
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
CFG2_
STATE
5
r
Status of CFG2 bit on HW_CTRL register
This bit shows the setting in bit CFG2
0B , LOW Level; Fail Outputs (FOx) are active after 2nd watchdog
trigger fail Config 3
1B , HIGH Level; Fail Outputs (FOx) are active after 1st watchdog
trigger fail Config 1
Reserved
4:1
r
Reserved, always reads as 0
WK
0
r
Status of WK
0B , LOW Level (=0)
1B , HIGH Level (=1)
SMPS_STAT
SMPS state (Address 100 1100B)
POR / Soft Reset Value: 0000 0xxxB;
Restart Value: xxxx 0xxxB
7
6
5
4
3
2
1
0
BST_ACT
BST_SH
BST_OP
BST_GSH
reserved
BCK_SH
BCK_OP
BCK_OOR
rc
rc
rc
rc
r
rc
rc
rc
r
Field
Bits
Type
Description
BST_ACT
7
rc
Boost Regulator Active
0B , Boost not active
1B , Boost active
BST_SH
6
rc
BSTD and SNSP short detection
0B , No short detected on BSTD and SNSP pins
1B , BSTD or SNSP pins short to GND
BST_OP
5
rc
BSTD, SNSP SNSN open detection
0B , No open detection in BSTD, SNSP and SNSN pins
1B , Or operation between: BSTD loss of diode detected, SNSP
loss of resistor detected, SNSN loss of GND detected.
BST_GSH
4
rc
BSTG pin short detection
0B , BSTG no short detected
1B , BSTG short detected to GND or internal supply
Reserved
3
r
Reserved, always reads as 0
BCK_SH
2
rc
BCKSW pin short detection
0B , No short detected
1B , Short to GND or short to VS detected on BCKSW pin
BCK_OP
1
rc
BCKSW pin open detection
0B , No BCKSW open detected
1B , BCKSW open detected
Datasheet
111
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Field
Bits
Type
Description
BCK_OOR
0
rc
VCC1 Out of Range
0B , VCC1 inside VCC1,out1±12%
1B , VCC1 outside VCC1,out1±12%
FAM_PROD_STAT
SWK Data0 Register (Address 111 1110B)
POR / Soft Reset Value: 0010 xxxxB;
Restart Value: 0010 xxxxB
7
6
5
4
3
2
1
0
FAM_3
FAM_2
FAM_1
FAM_0
PROD_3
PROD_2
PROD_1
PROD_0
r
r
r
r
r
r
r
r
Field
Bits
Type
Description
FAM
7:4
r
FAMILY of Products
0010B , TLE927x Family, High End SBC
PROD
3:0
r
Product Variant
0100B , LIN1/2 available, VCC1=5V
0101B , LIN1/2 available, VCC1=3.3V
1000B , LIN1-3 available, VCC1=5V
1001B , LIN1-3 available, VCC1=3.3V
1100B , LIN1-4 available, VCC1=5V
1101B , LIN1-4 available, VCC1=3.3V
Datasheet
112
r
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
14.7
Electrical Characteristics
Table 22
Electrical Characteristics: Power Stage
Tj = -40 °C to +150 °C, VS = 5.5 V to 28 V, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
–
–
4.0
MHz
1)
P_14.8.1
SPI frequency
Maximum SPI frequency
fSPI,max
SPI Interface; Logic Inputs SDI, CLK and CSN
H-input Voltage Threshold
VIH
–
–
0.7*
VCC1
V
–
P_14.8.2
L-input Voltage Threshold
VIL
0.3*
VCC1
–
–
V
–
P_14.8.3
Hysteresis of input Voltage
VIHY
–
0.2*
VCC1
–
V
–1)
P_14.8.4
Pull-up Resistance at pin
CSN
RICSN
20
40
80
kΩ
VCSN = 0.7 x VCC1
P_14.8.5
Pull-down Resistance at pin RICLK/SDI
SDI and CLK
20
40
80
kΩ
VSDI/CLK =
0.2 x VCC1
P_14.8.6
Input Capacitance at pin
CSN, SDI or CLK
CI
–
10
–
pF
1)
P_14.8.7
H-output Voltage Level
VSDOH
VCC1 0.4
VCC1 0.2
–
V
IDOH = -1.6 mA
P_14.8.8
L-output Voltage Level
VSDOL
–
0.2
0.4
V
IDOL = 1.6 mA
P_14.8.9
Tri-state Leakage Current
ISDOLK
-10
–
10
µA
VCSN = VCC1;
0 V < VDO < VCC1
P_14.8.10
–
10
15
pF
1)
P_14.8.11
Logic Output SDO
‘Tri-state Input Capacitance CSDO
Data Input Timing1)
Clock Period
tpCLK
250
–
–
ns
–
P_14.8.12
Clock HIGH Time
tCLKH
125
–
–
ns
–
P_14.8.13
Clock LOW Time
tCLKL
125
–
–
ns
–
P_14.8.14
Clock LOW before CSN LOW tbef
125
–
–
ns
–
P_14.8.15
CSN Setup Time
tlead
250
–
–
ns
–
P_14.8.16
CLK Setup Time
tlag
250
–
–
ns
–
P_14.8.17
Clock LOW after CSN HIGH
tbeh
125
–
–
ns
–
P_14.8.18
SDI Set-up Time
tDISU
100
–
–
ns
–
P_14.8.19
SDI Hold Time
tDIHO
50
–
–
ns
–
P_14.8.20
Datasheet
113
Rev. 1.5
2019-09-27
TLE9272QX
Serial Peripheral Interface
Table 22
Electrical Characteristics: Power Stage (cont’d)
Tj = -40 °C to +150 °C, VS = 5.5 V to 28 V, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
Input Signal Rise Time at pin trIN
SDI, CLK and CSN
–
–
50
ns
–
P_14.8.21
Input Signal Fall Time at pin tfIN
SDI, CLK and CSN
–
–
50
ns
–
P_14.8.22
tDel,Mode
–
–
10
µs
–
P_14.8.23
tCSN(high)
3
–
–
µs
–
P_14.8.24
SDO Rise Time
trSDO
–
30
80
ns
CL = 100 pF
P_14.8.25
SDO Fall Time
tfSDO
–
30
80
ns
CL = 100 pF
P_14.8.26
SDO Enable Time
tENSDO
–
–
50
ns
LOW impedance P_14.8.27
SDO Disable Time
tDISSDO
–
–
50
ns
HIGH impedance P_14.8.28
SDO Valid Time
tVASDO
–
–
50
ns
CL = 100 pF
Delay Time for Mode
Changes2)
CSN HIGH Time
Data Output Timing
1)
P_14.8.29
1) Not subject to production test; specified by design
2) Applies to all mode changes triggered via SPI commands
24
CSN
15
16
13
17
14
18
CLK
19
SDI
not defined
27
SDO
Figure 49
20
LSB
MSB
28
29
Flag
LSB
MSB
SPI Timing Diagram
Note: Numbers in drawing correlate to the last 2 digits of the Number field in the Electrical Characteristics table.
Datasheet
114
Rev. 1.5
2019-09-27
TLE9272QX
Application Information
15
Application Information
15.1
Application Diagram with Boost Module
Note: The following information is given as a hint for the implementation of the device only and should not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
D1
VBAT
Vsup
C1
VS
D2
L1
CVSUP
C2
VSENSE
VS
VS
VS2
L2
BCKSW
C4
C3
VCC1
BSTD
VCC2
BSTG
T BOOST
CVCC2
SNSP
RCFG
Rsense
SNSN
VS
VS
VS
TLE9272
T3
T2
R4
C9
R5
DLIN2
DLIN3
R LIN1
RLIN2
RLIN3
LIN1
LIN2
LIN3
RO
INT
TXDCAN
RXDCAN
TXDCAN
RXDCAN
VCAN
VCC2
CANH
RCANH
R CANL
Figure 50
CLIN2
VSS
CVCAN
CANH
LIN1
LIN2
LIN3
CLIN1
µC
VLIN
VSUP
DLIN1
RO
INT
WK
Sdev
S3
CLK
CSN
SDI
SDO
TXDLIN1
RXDLIN1
TXDLIN2
RXDLIN2
TXDLIN3
RXDLIN3
TXDLIN4
RXDLIN4
FO1
FO2/FSI
FO3/TEST
VS
VDD
CFG
CLK
CSN
SDI
SDO
TXDLIN1
RXDLIN1
TXDLIN2
RXDLIN2
TXDLIN3
RXDLIN3
TXDLIN4
RXDLIN4
T1
LH1
LH2
LH3
C5
CLIN3
GND
CANL
CCAN
CANL
Application Diagram
Note: This is a very simplified example of an application circuit. The function must be verified in the real
application.
Datasheet
115
Rev. 1.5
2019-09-27
TLE9272QX
Application Information
Table 23
Ref.
Bill of Material for Figure 15.1
Typical Value
Purpose / Comment
Capacitances
C1
47µF ± 20% Electrolytic
Buffering capacitor to cut off battery spikes, depending on the
application.
CVSUP
100nF ± 20% Ceramic
Input filter battery capacitor for optimum EMC behavior.
C2
100µF ± 20%, 50V
Electrolytic
Output Boost capacitor. ESR ≤ 1Ω over the temperature range.
C3
1µF..10µF ± 20%, 50V
Ceramic
Input Buck Capacitor. Low ESR.
C4
10µF ± 20%, 16V Ceramic
1)
C5
47µF ± 20%, 16V
Electrolytic
1)
CVCC2
2.2µF±20%, 16V Ceramic Blocking capacitor, min. 470nF for stability. Low ESR.
C9
10nF±20% Ceramic
CVCAN
100nF±20%, 16V Ceramic Input filter CAN supply. The capacitor must be placed close to the VCAN
pin. One additional buffer capacitor ≥1µF shall be placed for optimum
EMC and CAN FD performances.
CCAN
47nF / OEM dependent
Split termination stability.
CLIN1
1nF / OEM dependent
LIN master termination.
CLIN2
1nF / OEM dependent
LIN master termination.
CLIN3
1nF / OEM dependent
LIN master termination.
CLIN4
1nF / OEM dependent
LIN master termination.
Output Buck capacitor, for cost optimization. Low ESR.
Output Buck capacitor, for cost optimization. ESR ≤ 4Ω over the
temperature range.
Spikes filtering, as required by application. Mandatory protection for offboard connection.
Resistances
RSENSE
100mΩ ± 1%
Boost regulator current sense. Depending on required current limitation.
RCFG
10kΩ..22kΩ ± 5%
Required for hardware initialization.
R4
10kΩ ± 20%
Wetting current of the switch, as required by application.
R5
10kΩ ± 20%
Limit the WK pin current, e.g. for ISO pulses.
RCANH
60Ω / OEM dependent
CAN bus termination.
RCANL
60Ω / OEM dependent
CAN bus termination.
RLIN1
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
RLIN2
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
RLIN3
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
Inductors
L1
L2
Datasheet
22µH..47µH ± 20%2)
47µH ± 20%
2)
Boost regulator Coil. The saturation current depends on the application.
Buck regulator Coil. The saturation current depends on the application.
116
Rev. 1.5
2019-09-27
TLE9272QX
Application Information
Table 23
Ref.
Bill of Material for Figure 15.1 (cont’d)
Typical Value
Purpose / Comment
Active Components
D1
e.g. SS34HE3/9AT
(Vishay)
Reverse polarity protection. Depending for the application.
D2
e.g. SL04-GS08 or
SS34HE3/9AT (Vishay)
Boost regulator power diode. Forward current depends on the
application.
DLIN1
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN2
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN3
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN4
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
TBOOST
e.g. BSS606N
Boost regulator external MOSFET. Maximum Rds_on ≤ 100mΩ, Drain
current max ≤ 3A, Drain-Source max voltage ≤ 60V.
T1
e.g. BCR191W
High active FO1 control.
T2
e.g. BCR191W
High active FO2 control.
T3
e.g. BCR191W
High active FO3 control.
µC
e.g. XC2xxx
Microcontroller.
1) For for optimum dynamic behavior, C4 and C5 = 22µF±20%, 16V ceramic low ESR.
2) The saturation current has to be define in according with the maximum current required by the application.
Datasheet
117
Rev. 1.5
2019-09-27
TLE9272QX
Application Information
15.2
Application Diagram without Boost Module
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
D1
VBAT
Vsup
C1
VS
L1
C2
CVSUP
C3
VSENSE
VS
VS
VS2
L2
BCKSW
C4
VCC1
BSTD
VCC2
BSTG
CVCC2
SNSP
RCFG
SNSN
VS
VS
VS
TLE9272
T3
T2
R4
C9
R5
DLIN2
RLIN1
RLIN2
RO
INT
TXDCAN
RXDCAN
TXDCAN
RXDCAN
DLIN3
VCAN
VCC2
CVCAN
CANH
LIN1
LIN2
LIN3
CANH
RCANH
R CANL
Figure 51
CLIN2
VSS
RLIN3
LIN1
LIN2
LIN3
CLIN1
µC
VLIN
VSUP
DLIN1
RO
INT
WK
Sdev
S3
CLK
CSN
SDI
SDO
TXDLIN1
RXDLIN1
TXDLIN2
RXDLIN2
TXDLIN3
RXDLIN3
TXDLIN4
RXDLIN4
FO1
FO2/FSI
FO3/TEST
VS
VDD
CFG
CLK
CSN
SDI
SDO
TXDLIN1
RXDLIN1
TXDLIN2
RXDLIN2
TXDLIN3
RXDLIN3
TXDLIN4
RXDLIN4
T1
LH1
LH2
LH3
C5
CLIN3
GND
CANL
CCAN
CANL
Application Diagram
Note: This is a very simplified example of an application circuit. The function must be verified in the real
application.
Datasheet
118
Rev. 1.5
2019-09-27
TLE9272QX
Application Information
Table 24
Ref.
Bill of Material for Figure 15.2
Typical Value
Purpose / Comment
1)
EMI Filter components
C1
47µF ± 20%, 50V
Electrolytic
Input EMI filter capacitor, depending on the application.
L1
2.2µH ± 20%2)
Input EMI filter inductor, depending on the application.
C2
4.7µF ± 20%, 50V Ceramic Input EMI filter capacitor, depending on the application.
low ESR
Capacitances
CVSUP
100nF ± 20% Ceramic
Input filter battery capacitor for optimum EMC behavior.
C3
1µF..10µF ± 20% Ceramic Input Buck Capacitor. Low ESR.
C4
10µF ± 20%, 16V Ceramic
3)
C5
47µF ± 20%, 16V
Electrolytic
3)
CVCC2
2.2µF ± 20% Ceramic
Blocking capacitor, min. 470nF for stability. Low ESR.
C9
10nF Ceramic
Spikes filtering, as required by application. Mandatory protection for offboard connection.
CVCAN
100nF ± 20%, 16VCeramic Input filter CAN supply. The capacitor must be placed close to the VCAN
pin. One additional buffer capacitor ≥1µF shall be placed for optimum
EMC and CAN FD performances.
CCAN
47nF / OEM dependent
Split termination stability.
CLIN1
1nF / OEM dependent
LIN master termination.
CLIN2
1nF / OEM dependent
LIN master termination.
CLIN3
1nF / OEM dependent
LIN master termination.
CLIN4
1nF / OEM dependent
LIN master termination.
Output Buck capacitor, for cost optimization. Low ESR.
Output Buck capacitor, for cost optimization. ESR ≤ 4Ω over the
temperature range.
Resistances
RCFG
10kΩ..22kΩ ± 5%
Required for hardware initialization.
R4
10kΩ ± 5%
Wetting current of the switch, as required by application.
R5
10kΩ ± 5%
Limit the WK pin current, e.g. for ISO pulses.
RCANH
60Ω / OEM dependent
CAN bus termination.
RCANL
60Ω / OEM dependent
CAN bus termination.
RLIN1
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
RLIN2
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
RLIN3
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
RLIN4
1kΩ / OEM dependent
LIN master termination (if configured as a LIN master).
Inductors
L2
Datasheet
47µH ± 20%2)
Buck regulator Coil. The saturation current depends on the application.
119
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Application Information
Table 24
Ref.
Bill of Material for Figure 15.2 (cont’d)
Typical Value
Purpose / Comment
Active Components
D1
e.g. SS34HE3/9AT
(Vishay)
Reverse polarity protection. Depending for the application.
DLIN1
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN2
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN3
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
DLIN4
e.g. BAS70
Requested by LIN standard; reverse polarity protection of network.
T1
e.g. BCR191W
High active FO1 control.
T2
e.g. BCR191W
High active FO2 control.
T3
e.g. BCR191W
High active FO3 control.
µC
e.g. XC2xxx
Microcontroller.
1) The input EMI filter has to be evaluated in according with the final application. The values are only given as hint.
2) The saturation current has to be define in according with the maximum current required by the application.
3) For optimum dynamic behavior, C4 and C5 = 22µF ± 20%, 16V ceramic low ESR.
5V_int
SBC Init
Mode
Ttest
RTEST
FO3/
TEST
TFO_PL
Connector/
Jumper
REXT
Failure Logic
Figure 52
Datasheet
Hint for Increasing the Robustness of pin FO3/TEST during Debugging or Programming
120
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Application Information
15.3
ESD Tests
Note: Tests for ESD robustness according to IEC61000-4-2 “gun test” (150pF, 330Ω) have been performed. The
results and test condition are available in a test report. The minimum values for the test are listed in
Table 25 below.
Table 25
ESD “Gun Test”
Performed Test
Result
Unit
Remarks
ESD at pin CANH, CANL,
LIN, versus GND
>6
kV
1)2)
ESD at pin CANH, CANL,
LIN, versus GND
< -6
kV
1)2)
positive pulse
negative pulse
1) ESD susceptibility “ESD GUN” according to LIN EMC 1.3 Test Specification, Section 4.3 (IEC 61000-4-2). Tested by
external test house (IBEE, EMC Test report Nr. 01-03-17).
2) ESD Test “Gun Test” is specified with external components for pins VS, WK, BKSW, VCC2. Refer to application diagram
in Chapter 15.2 for more information.
EMC and ESD susceptibility tests according to SAE J2962-2 (2010) have been performed. Tested by external
test house (UL LLC, Test report Nr. 2017-327).
Datasheet
121
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Application Information
15.4
Thermal Behavior of Package
The figure below shows the thermal resistance (Rth_JA) of the device vs. the cooling area on the bottom of the
PCB for Ta = 85°C. Every line reflects a different PCB and thermal via design.
80
Tamb=85°C
70
RthJA (°K/W)
60
2s0p - 25 vias (standard)
50
40
2s2p - 16 vias (standard)
2s2p - 16 vias (solder filled)
30
2s2p - 25 vias (standard)
20
0
100
200
300
400
500
600
Bottom Cooling area (mm2)
Figure 53
Thermal Resistance (Rth_JA) vs. Cooling Area
Cross Section (JEDEC 2s2p) with Cooling Area
Cross Section (JEDEC 2s0p) with Cooling Area
1,5 mm
70µm modelled (traces)
1,5 mm
35µm, 90% metalization*
35µm, 90% metalization*
70µm / 5% metalization + cooling area
*: means percentual Cu metalization on each layer
PCB (top view)
Figure 54
PCB (bottom view)
standard solder pads
Board Setup
Board setup is defined according to JESD 51-2,-5,-7.
Board: 76.2 x 114.3 x 1.5mm3 with 2 inner copper layers (35µm thick), with thermal via array under the exposed
pad contacting the first inner copper layer and 300mm2 cooling area on the bottom layer (70µm).
Datasheet
122
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TLE9272QX
Package Outlines
Package Outlines
0.1±0.03
0.
13
±
0.05 MAX.
1) Vertical burr 0.03 max., all sides
2) These four metal areas have exposed diepad potential
Figure 55
1
12
(0.2)
(6)
48
13
)
35
C
2)
37
.
(0
Index Marking
0.15 ±0.05
0.1 ±0.05
24
SEATING PLANE
7 ±0.1
6.8
48x
0.08
0.4 x 45°
36
25
0.
+0.03
0.5
26
B
1)
0.
6.8
11 x 0.5 = 5.5
0.5 ±0.07
A
(5.2)
7 ±0.1
0.9 MAX.
(0.65)
05
16
0.23 ±0.05
(5.2)
Index Marking
48x
0.1 M A B C
(6)
PG-VQFN-48-29, -31-PO V05
PG-VQFN-48-31
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant
with government regulations the device is available as a green product. Green products are RoHS-Compliant
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Datasheet
123
Dimensions in mm
Rev. 1.5
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TLE9272QX
Revision History
17
Revision History
Revision
Date
Changes
1.5
2019-09-27
Datasheet updated:
•
Editorial changes
•
General
– changed “SBC Software Development Mode” to “SBC Development
Mode”
•
Updated Table 12
– added P_8.3.54 and P_8.3.55 (no product change)
– tightened P_8.3.15
– tightened P_8.3.8 and P_8.3.42 by additional footnote
•
Added Figure 52
1.4
2018-11-20
Datasheet updated:
Updated CAN description (Figure 3, Figure 5.1.4, Figure 17, Chapter 8.2.4).
1.3
2017-11-17
First Revision of Datasheet:
Updated description Chapter 13.8.1.
Datasheet
124
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TLE9272QX
Revision History
Revision
Date
Changes
1.2
2017-10-22
Preliminary Datasheet:
Updated the Figure 3 on SBC Normal Mode.
Update the description of Figure 20.
Removed the “optional” on Figure 20.
Added P_8.3.58 (according to ISO11898-2:2016).
Added P_4.1.28 (according to ISO11898-2:2016).
Correct description Chapter 13.5.1.
Correct description Chapter 13.5.2 and updated Figure 44.
Corrected the bit type of SMPS_STAT register.
Corrected description on Chapter 13.8.3 and Figure 3.
Updated P_8.3.7 test conditions.
Updated P_8.3.6 test conditions.
Updated P_8.3.5 test conditions.
Updated P_8.3.16 test conditions.
Updated the description about LIN rearming in Chapter 9.2.4.
Updated the description about CAN rearming in Chapter 8.2.4.
Updated SYS_STAT_CTRL register note description.
Updated Chapter 9.2.6 description.
Update Chapter 8.2.7 description.
Added chapter outcome pre and system tests verification.
Added P_8.3.50, P_8.3.51, P_8.3.52 and P_8.3.53.
Change description on WK_LVL_STAT and Table 5 regarding the Fail Safe
Output behavior in case of watchdog trigger issue.
Added the VCC2,UV Blanking time as internal parameter.
Modified description Chapter 8.2.6.
Add additional Note in SUP_STAT, BUS_STAT_1 and BUS_STAT_2 regarding
the register content after one software reset.
Update LIN wake-up description.
Updated description Chapter 13.8.3.
Updated parameter P_13.9.34.
Updated FSI in Stop Mode and Restart Mode description.
Updated max limit of P_12.3.11.
Updated description DEV_STAT register Notes.
Update test condition P_8.3.26.
1.1
2016-10-17
Target Datasheet updated:
Added CAN FD timing parameters up to 5Mbps.
Corrected the naming of Figure 21 (tLOOP,f and tLOOP,r).
Updated the title of Figure 40 and Figure 41.
Improve the description of LIN wake-up pattern detection (Chapter 9.2.4).
Updated footnote 5) on Chapter 8.3 according to ISO11898-2.
Added description 11B on WD_FAIL: reserved (never achieved).
Updated description Chapter 13.2.3.
1.0
2015-10-08
First Revision of Datasheet.
Datasheet
125
Rev. 1.5
2019-09-27
Trademarks
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Edition 2019-09-27
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2020 Infineon Technologies AG.
All Rights Reserved.
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