Data Sheet, V1.3, Aug. 2006
XC167CI-16F
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
Edition 2006-08
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
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Data Sheet, V1.3, Aug. 2006
XC167CI-16F
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
XC167CI-16F
Derivatives
XC167
Revision History: V1.3, 2006-08
Previous Version(s):
V1.2, 2006-03
V1.1, 2003-06
V1.0, 2002-10
Page
Subjects (major changes since last revision)
13
Description of the TRST signal modified.
19
Footnote added about pins XTAL1/XTAL3 belonging to VDDI power domain.
53
Instructions Set Summary improved.
60
Footnote added about amplitude at XTAL1 pin.
85
Green package added.
85
Thermal Resistance: RTHA replaced by RΘJC and RΘJL because RTHA
strongly depends on the external system (PCB, environment). PDISS
removed, because no static parameter, but derived from thermal
resistance.
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet
V1.3, 2006-08
XC167CI-16F
Derivatives
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
2.1
2.2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Units (CAPCOM1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . .
The Capture/Compare Unit CAPCOM6 . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) . . . . . . . . . .
High Speed Synchronous Serial Channels (SSC0/SSC1) . . . . . . . . . . . .
TwinCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IIC Bus Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
22
24
26
28
33
34
37
38
42
44
45
46
47
48
49
50
50
52
53
4
4.1
4.2
4.3
4.4
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-chip Flash Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
56
56
59
65
68
68
72
73
74
75
5
5.1
5.2
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Data Sheet
3
V1.3, 2006-08
16-Bit Single-Chip Microcontroller with C166SV2 Core
XC166 Family
1
•
•
•
•
•
•
•
•
XC167
Summary of Features
High Performance 16-bit CPU with 5-Stage Pipeline
– 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution)
– 1-Cycle Multiplication (16 ×16 bit), Background Division (32 / 16 bit) in 21 Cycles
– 1-Cycle Multiply-and-Accumulate (MAC) Instructions
– Enhanced Boolean Bit Manipulation Facilities
– Zero-Cycle Jump Execution
– Additional Instructions to Support HLL and Operating Systems
– Register-Based Design with Multiple Variable Register Banks
– Fast Context Switching Support with Two Additional Local Register Banks
– 16 Mbytes Total Linear Address Space for Code and Data
– 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)
16-Priority-Level Interrupt System with 77 Sources, Sample-Rate down to 50 ns
8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via
Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space
Clock Generation via on-chip PLL (factors 1:0.15 … 1:10), or
via Prescaler (factors 1:1 … 60:1)
On-Chip Memory Modules
– 2 Kbytes On-Chip Dual-Port RAM (DPRAM)
– 4 Kbytes On-Chip Data SRAM (DSRAM)
– 2 Kbytes On-Chip Program/Data SRAM (PSRAM)
– 128 Kbytes On-Chip Program Memory (Flash Memory)
On-Chip Peripheral Modules
– 16-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and
Conversion Time (down to 2.55 µs or 2.15 µs)
– Two 16-Channel General Purpose Capture/Compare Units (32 Input/Output Pins)
– Capture/Compare Unit for flexible PWM Signal Generation (CAPCOM6)
(3/6 Capture/Compare Channels and 1 Compare Channel)
– Multi-Functional General Purpose Timer Unit with 5 Timers
– Two Synchronous/Asynchronous Serial Channels (USARTs)
– Two High-Speed-Synchronous Serial Channels
– On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects
(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality
– IIC Bus Interface (10-bit addressing, 400 kbit/s) with 3 Channels (multiplexed)
– On-Chip Real Time Clock, Driven by Dedicated Oscillator
Idle, Sleep, and Power Down Modes with Flexible Power Management
Programmable Watchdog Timer and Oscillator Watchdog
Data Sheet
4
V1.3, 2006-08
XC167CI-16F
Derivatives
Summary of Features
•
•
•
•
•
•
Up to 12 Mbytes External Address Space for Code and Data
– Programmable External Bus Characteristics for Different Address Ranges
– Multiplexed or Demultiplexed External Address/Data Buses
– Selectable Address Bus Width
– 16-Bit or 8-Bit Data Bus Width
– Five Programmable Chip-Select Signals
– Hold- and Hold-Acknowledge Bus Arbitration Support
Up to 103 General Purpose I/O Lines,
partly with Selectable Input Thresholds and Hysteresis
On-Chip Bootstrap Loader
Supported by a Large Range of Development Tools like C-Compilers,
Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers,
Simulators, Logic Analyzer Disassemblers, Programming Boards
On-Chip Debug Support via JTAG Interface
144-Pin Green TQFP Package, 0.5 mm (19.7 mil) pitch (RoHS compliant)
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
•
•
the derivative itself, i.e. its function set, the temperature range, and the supply voltage
the package and the type of delivery.
For the available ordering codes for the XC167 please refer to the “Product Catalog
Microcontrollers”, which summarizes all available microcontroller variants.
Note: The ordering codes for Mask-ROM versions are defined for each product after
verification of the respective ROM code.
This document describes several derivatives of the XC167 group. Table 1 enumerates
these derivatives and summarizes the differences. As this document refers to all of these
derivatives, some descriptions may not apply to a specific product.
For simplicity all versions are referred to by the term XC167 throughout this document.
Data Sheet
5
V1.3, 2006-08
XC167CI-16F
Derivatives
Summary of Features
Table 1
XC167 Derivative Synopsis
Derivative1)
Temp.
Range
SAK-XC167CI-16F40F,
SAK-XC167CI-16F20F
-40 °C to 128 Kbytes 2 Kbytes DPRAM,
125 °C
Flash
4 Kbytes DSRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1,
IIC
SAF-XC167CI-16F40F,
SAF-XC167CI-16F20F
-40 °C to 128 Kbytes 2 Kbytes DPRAM,
85 °C
Flash
4 Kbytes DSRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1,
IIC
Program
Memory
On-Chip RAM
Interfaces
1) This Data Sheet is valid for devices starting with and including design step BB.
Data Sheet
6
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
2
General Device Information
2.1
Introduction
The XC167 derivatives are high-performance members of the Infineon XC166 Family of
full featured single-chip CMOS microcontrollers. These devices extend the functionality
and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and
speed. They combine high CPU performance (up to 40 million instructions per second)
with high peripheral functionality and enhanced IO-capabilities. They also provide clock
generation via PLL and various on-chip memory modules such as program Flash,
program RAM, and data RAM.
VAREF
VAGND
VDDI/P
VSSI/P
PORT0
16 bit
XTAL1
PORT1
16 bit
XTAL2
XTAL3
Port 2
8 bit
XTAL4
NMI
Port 3
15 bit
RSTIN
RSTOUT
XC167
Port 4
8 bit
EA
Port 20 READY
6 bit
ALE
Port 6
8 bit
RD
Port 7
4 bit
WR/WRL
Port 5
16 bit
Port 9
6 bit
TRST
JTAG
5 bit
Debug
2 bit
MCA05554_7
Figure 1
Data Sheet
Logic Symbol
7
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
2.2
Pin Configuration and Definition
P1L.7/A7/CTRAP/CC22IO
P1L.6/A6/COUT63
P1L.5/A5/COUT62
P1L.4/A4/CC62
P1L.3/A3/COUT61
P1L.2/A2/CC61
P1L.1/A1/COUT60
P1L.0/A0/CC60
P0H.7/AD15
P0H.6/AD14
P0H.5/AD13
P0H.4/AD12
P0H.3/AD11
P0H.2/AD10
N.C.
N.C.
VSSP
VDDP
P1H.7/A15/CC27IO
P1H.6/A14/CC26IO
P1H.5/A13/CC25IO
P1H.4/A12/CC24IO
P1H.3/A11/SCLK1/E*)
P1H.2/A10/CC6POS2/MTSR1
P1H.1/A9/CC6POS1/MRST1
P1H.0/A8/CC6POS0/CC23IO/E*)
VSSI
VDDI
XTAL1
XTAL2
VSSI
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
BRKIN
BRKOUT
RSTIN
XTAL4
XTAL3
The pins of the XC167 are described in detail in Table 2, including all their alternate
functions. Figure 2 summarizes all pins in a condensed way, showing their location on
the 4 sides of the package. E*) and C*) mark pins to be used as alternate external
interrupt inputs, C*) marks pins that can have CAN interface lines assigned to them.
N.C.
N.C.
P20.12/RSTOUT
NMI
VSSP
VDDP
P6.0/CS0/CC0IO
P6.1/CS1/CC1IO
P6.2/CS2/CC2IO
P6.3/CS3/CC3IO
P6.4/CS4/CC4IO
P6.5/HOLD/CC5IO
P6.6/HLDA/CC6IO
P6.7/BREQ/CC7IO
P7.4/CC28IO/C*)
P7.5/CC29IO/C*)
P7.6/CC30IO/C*)
P7.7/CC31IO/C*)
VSSP
VDDP
P9.0/SDA0/CC16IO/C*)
P9.1/SCL0/CC17IO/C*)
P9.2/SDA1/CC18IO/C*)
P9.3/SCL1/CC19IO/C*)
P9.4/SDA2/CC20IO
P9.5/SCL2/CC21IO
VSSP
VDDP
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
XC167
N.C.
N.C.
P0H.1/AD9
P0H.0/AD8
VSSP
VDDP
P0L.7/AD7
P0L.6/AD6
P0L.5/AD5
P0L.4/AD4
P0L.3/AD3
P0L.2/AD2
P0L.1/AD1
P0L.0/AD0
P20.5/EA
P20.4/ALE
P20.2/READY
P20.1/WR/WRL
P20.0/RD
VSSP
VDDP
P4.7/A23/C*)
P4.6/A22/C*)
P4.5/A21/C*)
P4.4/A20/C*)
P4.3/A19
P4.2/A18
P4.1/A17
P4.0/A16
VSSI
VDDI
P3.15/CLKOUT/FOUT
P3.13/SCLK0/E*)
P3.12/BHE/WRH/E*)
TMS
TDO
Figure 2
Data Sheet
P3.0/T0IN/TxD1/E*)
P3.1/T6OUT/RxD1/E*)
P3.2/CAPIN
P3.3/T3OUT
P3.4/T3EUD
P3.5/T4IN
P3.6/T3IN
P3.7/T2IN
P3.8/MRST0
P3.9/MTSR0
P3.10/TxD0/E*)
P3.11/RxD0/E*)
TCK
TDI
VDDP
P2.8/CC8IO/EX0IN
P2.9/CC9IO/EX1IN
P2.10/CC10IO/EX2IN
P2.11/CC11IO/EX3IN
P2.12/CC12IO/EX4IN
P2.13/CC13IO/EX5IN
P2.14/CC14IO/EX6IN
P2.15/CC15IO/EX7IN/T7IN
TRST
VSSI
VDDI
P5.12/AN12/T6IN
P5.13/AN13/T5IN
P5.14/AN14/T4EUD
P5.15/AN15/T2EUD
VAREF
VAGND
P5.8/AN8
P5.9/AN9
P5.6/AN6
P5.7/AN7
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
P5.0/AN0
P5.1/AN1
P5.2/AN2
P5.3/AN3
P5.4/AN4
P5.5/AN5
P5.10/AN10/T6EUD
P5.11/AN11/T5EUD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
MCP06458
Pin Configuration (top view)
8
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions
Pin
Num.
Input
Outp.
Function
P20.12 3
IO
For details, please refer to the description of P20.
NMI
I
Non-Maskable Interrupt Input. A high to low transition at this
pin causes the CPU to vector to the NMI trap routine. When
the PWRDN (power down) instruction is executed, the NMI
pin must be low in order to force the XC167 into power down
mode. If NMI is high, when PWRDN is executed, the part will
continue to run in normal mode.
If not used, pin NMI should be pulled high externally.
IO
Port 6 is an 8-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 6 is selectable (standard
or special).
The Port 6 pins also serve for alternate functions:
CS0
Chip Select 0 Output,
CC0IO
CAPCOM1: CC0 Capture Inp./Compare Output
CS1
Chip Select 1 Output,
CC1IO
CAPCOM1: CC1 Capture Inp./Compare Output
CS2
Chip Select 2 Output,
CC2IO
CAPCOM1: CC2 Capture Inp./Compare Output
CS3
Chip Select 3 Output,
CC3IO
CAPCOM1: CC3 Capture Inp./Compare Output
CS4
Chip Select 4 Output,
CC4IO
CAPCOM1: CC4 Capture Inp./Compare Output
HOLD
External Master Hold Request Input,
CC5IO
CAPCOM1: CC5 Capture Inp./Compare Output
HLDA
Hold Acknowledge Output (master mode) or
Input (slave mode),
CC6IO
CAPCOM1: CC6 Capture Inp./Compare Output
BREQ
Bus Request Output,
CC7IO
CAPCOM1: CC7 Capture Inp./Compare Output
4
P6
P6.0
7
P6.1
8
P6.2
9
P6.3
10
P6.4
11
P6.5
12
P6.6
13
P6.7
14
Data Sheet
O
IO
O
IO
O
IO
O
IO
O
IO
I
IO
I/O
IO
O
IO
9
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P7
P7.4
15
P7.5
16
P7.6
17
P7.7
18
Data Sheet
Input
Outp.
Function
IO
Port 7 is a 4-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 7 is selectable (standard
or special).
Port 7 pins provide inputs/outputs for CAPCOM2 and serial
interface lines.1)
CC28IO
CAPCOM2: CC28 Capture Inp./Compare Outp.,
CAN2_RxD CAN Node 2 Receive Data Input,
EX7IN
Fast External Interrupt 7 Input (alternate pin B)
CC29IO
CAPCOM2: CC29 Capture Inp./Compare Outp.,
CAN2_TxD CAN Node 2 Transmit Data Output,
EX6IN
Fast External Interrupt 6 Input (alternate pin B)
CC30IO
CAPCOM2: CC30 Capture Inp./Compare Outp.,
CAN1_RxD CAN Node 1 Receive Data Input,
EX7IN
Fast External Interrupt 7 Input (alternate pin A)
CC31IO
CAPCOM2: CC31 Capture Inp./Compare Outp.,
CAN1_TxD CAN Node 1 Transmit Data Output,
EX6IN
Fast External Interrupt 6 Input (alternate pin A)
I/O
I
I
I/O
O
I
I/O
I
I
I/O
O
I
10
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P9
P9.0
21
P9.1
22
P9.2
23
P9.3
24
P9.4
25
P9.5
26
Data Sheet
Input
Outp.
Function
IO
Port 9 is a 6-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 9 is selectable (standard
or special).
The following Port 9 pins also serve for alternate functions:1)
CC16IO
CAPCOM2: CC16 Capture Inp./Compare Outp.,
CAN2_RxD CAN Node 2 Receive Data Input,
SDA0
IIC Bus Data Line 0
CC17IO
CAPCOM2: CC17 Capture Inp./Compare Outp.,
CAN2_TxD CAN Node 2 Transmit Data Output,
SCL0
IIC Bus Clock Line 0
CC18IO
CAPCOM2: CC18 Capture Inp./Compare Outp.,
CAN1_RxD CAN Node 1 Receive Data Input,
SDA1
IIC Bus Data Line 1
CC19IO
CAPCOM2: CC19 Capture Inp./Compare Outp.,
CAN1_TxD CAN Node 1 Transmit Data Output,
SCL1
IIC Bus Clock Line 1
CC20IO
CAPCOM2: CC20 Capture Inp./Compare Outp.,
SDA2
IIC Bus Data Line 2
CC21IO
CAPCOM2: CC21 Capture Inp./Compare Outp.,
SCL2
IIC Bus Clock Line 2
I/O
I
I/O
I/O
O
I/O
I/O
I
I/O
I/O
O
I/O
I/O
I/O
I/O
I/O
11
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P5
P5.0
P5.1
P5.2
P5.3
P5.4
P5.5
P5.10
P5.11
P5.8
P5.9
P5.6
P5.7
P5.12
P5.13
P5.14
P5.15
29
30
31
32
33
34
35
36
37
38
39
40
43
44
45
46
Data Sheet
Input
Outp.
Function
I
Port 5 is a 16-bit input-only port.
The pins of Port 5 also serve as analog input channels for the
A/D converter, or they serve as timer inputs:
AN0
AN1
AN2
AN3
AN4
AN5
AN10,
T6EUD GPT1 Timer T4 Ext. Up/Down Ctrl. Inp.
AN11,
T5EUD GPT1 Timer T2 Ext. Up/Down Ctrl. Inp
AN8
AN9
AN6
AN7
AN12,
T6IN
GPT2 Timer T6 Count/Gate Input
AN13,
T5IN
GPT2 Timer T5 Count/Gate Input
AN14,
T4EUD GPT1 Timer T4 Ext. Up/Down Ctrl. Inp.
AN15,
T2EUD GPT1 Timer T2 Ext. Up/Down Ctrl. Inp.
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
12
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P2
P2.8
49
P2.9
50
P2.10
51
P2.11
52
P2.12
53
P2.13
54
P2.14
55
P2.15
56
TRST
57
Data Sheet
Input
Outp.
Function
IO
Port 2 is an 8-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 2 is selectable (standard
or special).
The following Port 2 pins also serve for alternate functions:
CC8IO
CAPCOM1: CC8 Capture Inp./Compare Output,
EX0IN
Fast External Interrupt 0 Input (default pin)
CC9IO
CAPCOM1: CC9 Capture Inp./Compare Output,
EX1IN
Fast External Interrupt 1 Input (default pin)
CC10IO
CAPCOM1: CC10 Capture Inp./Compare Outp.,
EX2IN
Fast External Interrupt 2 Input (default pin)
CC11IO
CAPCOM1: CC11 Capture Inp./Compare Outp.,
EX3IN
Fast External Interrupt 3 Input (default pin)
CC12IO
CAPCOM1: CC12 Capture Inp./Compare Outp.,
EX4IN
Fast External Interrupt 4 Input (default pin)
CC13IO
CAPCOM1: CC13 Capture Inp./Compare Outp.,
EX5IN
Fast External Interrupt 5 Input (default pin)
CC14IO
CAPCOM1: CC14 Capture Inp./Compare Outp.,
EX6IN
Fast External Interrupt 6 Input (default pin)
CC15IO
CAPCOM1: CC15 Capture Inp./Compare Outp.,
EX7IN
Fast External Interrupt 7 Input (default pin),
T7IN
CAPCOM2: Timer T7 Count Input
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I
I
Test-System Reset Input. For normal system operation, pin
TRST should be held low. A high level at this pin at the rising
edge of RSTIN activates the XC164CM’s debug system. In
this case, pin TRST must be driven low once to reset the
debug system.
13
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P3
Input
Outp.
Function
IO
I
O
I
O
I/O
I
I
O
I
I
I
I
I/O
I/O
O
I
I/O
I
O
O
I
I/O
I
O
O
Port 3 is a 15-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 3 is selectable (standard
or special).
The following Port 3 pins also serve for alternate functions:
T0IN
CAPCOM1 Timer T0 Count Input,
TxD1
ASC1 Clock/Data Output (Async./Sync),
EX1IN
Fast External Interrupt 1 Input (alternate pin B)
T6OUT
GPT2 Timer T6 Toggle Latch Output,
RxD1
ASC1 Data Input (Async.) or Inp./Outp. (Sync.),
EX1IN
Fast External Interrupt 1 Input (alternate pin A)
CAPIN
GPT2 Register CAPREL Capture Input
T3OUT
GPT1 Timer T3 Toggle Latch Output
T3EUD
GPT1 Timer T3 External Up/Down Control Input
T4IN
GPT1 Timer T4 Count/Gate/Reload/Capture Inp
T3IN
GPT1 Timer T3 Count/Gate Input
T2IN
GPT1 Timer T2 Count/Gate/Reload/Capture Inp
MRST0
SSC0 Master-Receive/Slave-Transmit In/Out.
MTSR0
SSC0 Master-Transmit/Slave-Receive Out/In.
TxD0
ASC0 Clock/Data Output (Async./Sync.),
EX2IN
Fast External Interrupt 2 Input (alternate pin B)
RxD0
ASC0 Data Input (Async.) or Inp./Outp. (Sync.),
EX2IN
Fast External Interrupt 2 Input (alternate pin A)
BHE
External Memory High Byte Enable Signal,
WRH
External Memory High Byte Write Strobe,
EX3IN
Fast External Interrupt 3 Input (alternate pin B)
SCLK0
SSC0 Master Clock Output/Slave Clock Input.,
EX3IN
Fast External Interrupt 3 Input (alternate pin A)
CLKOUT Master Clock Output,
FOUT
Programmable Frequency Output
P3.0
59
P3.1
60
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
P3.8
P3.9
P3.10
61
62
63
64
65
66
67
68
69
P3.11
70
P3.12
75
P3.13
76
P3.15
77
TCK
71
I
Debug System: JTAG Clock Input
TDI
72
I
Debug System: JTAG Data In
TDO
73
O
Debug System: JTAG Data Out
TMS
74
I
Debug System: JTAG Test Mode Selection
Data Sheet
14
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P4
P4.0
P4.1
P4.2
P4.3
P4.4
80
81
82
83
84
P4.5
85
P4.6
86
P4.7
87
Data Sheet
Input
Outp.
Function
IO
Port 4 is an 8-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output (configurable as push/pull or open drain
driver). The input threshold of Port 4 is selectable (standard
or special).
Port 4 can be used to output the segment address lines, the
optional chip select lines, and for serial interface lines:1)
A16
Least Significant Segment Address Line
A17
Segment Address Line
A18
Segment Address Line
A19
Segment Address Line
A20
Segment Address Line,
CAN2_RxD CAN Node 2 Receive Data Input,
EX5IN
Fast External Interrupt 5 Input (alternate pin B)
A21
Segment Address Line,
CAN1_RxD CAN Node 1 Receive Data Input,
EX4IN
Fast External Interrupt 4 Input (alternate pin B)
A22
Segment Address Line,
CAN1_TxD CAN Node 1 Transmit Data Output,
EX5IN
Fast External Interrupt 5 Input (alternate pin A)
A23
Most Significant Segment Address Line,
CAN1_RxD CAN Node 1 Receive Data Input,
CAN2_TxD CAN Node 2 Transmit Data Output,
EX4IN
Fast External Interrupt 4 Input (alternate pin A)
O
O
O
O
O
I
I
O
I
I
O
O
I
O
I
O
I
15
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
P20
Input
Outp.
Function
IO
Port 20 is a 6-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance
state) or output. The input threshold of Port 20 is selectable
(standard or special).
The following Port 20 pins also serve for alternate functions:
External Memory Read Strobe, activated for
RD
every external instruction or data read access.
WR/WRL External Memory Write Strobe.
In WR-mode this pin is activated for every
external data write access.
In WRL-mode this pin is activated for low byte
data write accesses on a 16-bit bus, and for
every data write access on an 8-bit bus.
READY
READY Input. When the READY function is
enabled, memory cycle time waitstates can be
forced via this pin during an external access.
ALE
Address Latch Enable Output.
Can be used for latching the address into
external memory or an address latch in the
multiplexed bus modes.
EA
External Access Enable pin.
A low-level at this pin during and after Reset
forces the XC167 to latch the configuration from
PORT0 and pin RD, and to begin instruction
execution out of external memory.
A high-level forces the XC167 to latch the
configuration from pins RD, ALE, and WR, and
to begin instruction execution out of the internal
program memory. “ROMless” versions must
have this pin tied to ‘0’.
RSTOUT Internal Reset Indication Output.
Is activated asynchronously with an external
hardware reset. It may also be activated
(selectable) synchronously with an internal
software or watchdog reset.
Is deactivated upon the execution of the EINIT
instruction, optionally at the end of reset, or at
any time (before EINIT) via user software.
P20.0
90
O
P20.1
91
O
P20.2
92
I
P20.4
93
O
P20.5
94
I
P20.12 3
O
Note: Port 20 pins may input configuration values (see EA).
Data Sheet
16
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
PORT0
P0L.0 P0L.7,
P0H.0,
P0H.1,
P0H.2 P0H.7
95 102,
105,
106,
111 116
Input
Outp.
Function
IO
PORT0 consists of the two 8-bit bidirectional I/O ports P0L
and P0H. Each pin can be programmed for input (output
driver in high-impedance state) or output.
In case of an external bus configuration, PORT0 serves as
the address (A) and address/data (AD) bus in multiplexed
bus modes and as the data (D) bus in demultiplexed bus
modes.
Demultiplexed bus modes:
8-bit data bus: P0H = I/O, P0L = D7 - D0
16-bit data bus: P0H = D15 - D8, P0L = D7 - D0
Multiplexed bus modes:
8-bit data bus: P0H = A15 - A8, P0L = AD7 - AD0
16-bit data bus: P0H = AD15 - AD8, P0L = AD7 - AD0
Note: At the end of an external reset (EA = 0) PORT0 also
may input configuration values.
Data Sheet
17
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pin
Num.
PORT1
P1L.0
P1L.1
P1L.2
P1L.3
P1L.4
P1L.5
P1L.6
P1L.7
117
118
119
120
121
122
123
124
P1H.0
127
P1H.1
128
P1H.2
129
P1H.3
130
P1H.4
P1H.5
P1H.6
P1H.7
131
132
133
134
Data Sheet
Input
Outp.
Function
IO
PORT1 consists of the two 8-bit bidirectional I/O ports P1L
and P1H. Each pin can be programmed for input (output
driver in high-impedance state) or output.
PORT1 is used as the 16-bit address bus (A) in
demultiplexed bus modes (also after switching from a
demultiplexed to a multiplexed bus mode).
The following PORT1 pins also serve for alt. functions:
CC60
CAPCOM6: Input / Output of Channel 0
COUT60 CAPCOM6: Output of Channel 0
CC61
CAPCOM6: Input / Output of Channel 1
COUT61 CAPCOM6: Output of Channel 1
CC62
CAPCOM6: Input / Output of Channel 2
COUT62 CAPCOM6: Output of Channel 2
COUT63 Output of 10-bit Compare Channel
CTRAP
CAPCOM2: CC22 Capture Inp./Compare Outp.
CTRAP is an input pin with an internal pull-up
resistor. A low level on this pin switches the
CAPCOM6 compare outputs to the logic level
defined by software (if enabled).
CC22IO
CAPCOM2: CC22 Capture Inp./Compare Outp.
CC6POS0 CAPCOM6: Position 0 Input,
EX0IN
Fast External Interrupt 0 Input (alternate pin B),
CC23IO
CAPCOM2: CC23 Capture Inp./Compare Outp.
CC6POS1 CAPCOM6: Position 1 Input,
MRST1
SSC1 Master-Receive/Slave-Transmit In/Out.
CC6POS2 CAPCOM6: Position 2 Input,
MTSR1
SSC1 Master-Transmit/Slave-Receive Out/Inp.
SCLK1
SSC1 Master Clock Output / Slave Clock Input,
EX0IN
Fast External Interrupt 0 Input (alternate pin A)
CC24IO
CAPCOM2: CC24 Capture Inp./Compare Outp.
CC25IO
CAPCOM2: CC25 Capture Inp./Compare Outp.
CC26IO
CAPCOM2: CC26 Capture Inp./Compare Outp.
CC27IO
CAPCOM2: CC27 Capture Inp./Compare Outp.
I/O
O
I/O
O
I/O
O
O
I
I/O
I
I
I/O
I
I/O
I
I/O
I/O
I
I/O
I/O
I/O
I/O
18
V1.3, 2006-08
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Derivatives
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pin
Num.
Input
Outp.
Function
XTAL2
XTAL1
137
138
O
I
XTAL2:
XTAL1:
Output of the main oscillator amplifier circuit
Input to the main oscillator amplifier and input to
the internal clock generator
To clock the device from an external source, drive XTAL1,
while leaving XTAL2 unconnected. Minimum and maximum
high/low and rise/fall times specified in the AC
Characteristics must be observed.
Note: Input pin XTAL1 belongs to the core voltage domain.
Therefore, input voltages must be within the range
defined for VDDI.
XTAL3
XTAL4
140
141
I
O
XTAL3:
XTAL4:
Input to the auxiliary (32-kHz) oscillator amplifier
Output of the auxiliary (32-kHz) oscillator
amplifier circuit
To clock the device from an external source, drive XTAL3,
while leaving XTAL4 unconnected. Minimum and maximum
high/low and rise/fall times specified in the AC
Characteristics must be observed.
Note: Input pin XTAL3 belongs to the core voltage domain.
Therefore, input voltages must be within the range
defined for VDDI.
RSTIN
142
I
Reset Input with Schmitt-Trigger characteristics. A low-level
at this pin while the oscillator is running resets the XC167.
A spike filter suppresses input pulses < 10 ns. Input pulses
> 100 ns safely pass the filter. The minimum duration for a
safe recognition should be 100 ns + 2 CPU clock cycles.
Note: The reset duration must be sufficient to let the
hardware configuration signals settle.
External circuitry must guarantee low-level at the
RSTIN pin at least until both power supply voltages
have reached the operating range.
BRK
OUT
143
O
Debug System: Break Out
BRKIN
144
I
Debug System: Break In
NC
1, 2,
107 110
–
No connection.
It is recommended not to connect these pins to the PCB.
Data Sheet
19
V1.3, 2006-08
XC167CI-16F
Derivatives
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pin
Num.
Input
Outp.
Function
VAREF
VAGND
VDDI
41
–
Reference voltage for the A/D converter.
42
–
Reference ground for the A/D converter.
48, 78, –
135
Digital Core Supply Voltage (On-Chip Modules):
+2.5 V during normal operation and idle mode.
Please refer to the Operating Conditions.
VDDP
6, 20, –
28, 58,
88,
103,
125
Digital Pad Supply Voltage (Pin Output Drivers):
+5 V during normal operation and idle mode.
Please refer to the Operating Conditions.
VSSI
47, 79, –
136,
139
VSSP
5, 19, –
27, 89,
104,
126
Digital Ground
Connect decoupling capacitors to adjacent VDD/VSS pin pairs
as close as possible to the pins.
All VSS pins must be connected to the ground-line or groundplane.
1) The CAN interface lines are assigned to ports P4, P7, and P9 under software control.
Data Sheet
20
V1.3, 2006-08
XC167CI-16F
Derivatives
Functional Description
3
Functional Description
The architecture of the XC167 combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a very well-balanced way. In
addition, the on-chip memory blocks allow the design of compact systems-on-silicon with
maximum performance (computing, control, communication).
The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data
SRAM) and the set of generic peripherals are connected to the CPU via separate buses.
Another bus, the LXBus, connects additional on-chip resources as well as external
resources (see Figure 3).
This bus structure enhances the overall system performance by enabling the concurrent
operation of several subsystems of the XC167.
The following block diagram gives an overview of the different on-chip components and
of the advanced, high bandwidth internal bus structure of the XC167.
PSRAM
DP RAM
DSRAM
ProgM em
F lash
128 KB ytes
DMU
PMU
EBC
CPU
X B U S C o ntrol
E xternal B us
C on trol
C166SV2-Core
O CDS
D e b ug S u p po rt
XTAL
O sc / PLL
RTC
W DT
Interrupt & PE C
C lo ck G e ne ra tio n
Interrupt B us
P e rip h e ra l D a ta B u s
ADC
G P T ASC0 AS C1 SSC0 S SC1 CC1
8/10-B it
16
C hannels
(U S A R T ) (U S A R T )
T2
(S P I)
(S P I)
T3
CC2
IIC
CC6
T0
T7
T 12
T1
T8
T 13
Tw in
CAN
T4
A
T5
T6
B R G en
P 20 P ort 9 P 7
6
6
P ort 6
4
B R G en
P ort 5
8
16
B R G en
B R G en
B
B R G en
P ort 4
P ort 3
P ort 2
PORT1
PORT0
8
15
8
16
16
M C B 04323_x7.vsd
Figure 3
Data Sheet
Block Diagram
21
V1.3, 2006-08
XC167CI-16F
Derivatives
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC167 is configured in a Von Neumann architecture, which
means that all internal and external resources, such as code memory, data memory,
registers and I/O ports, are organized within the same linear address space. This
common memory space includes 16 Mbytes and is arranged as 256 segments of
64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each.
The entire memory space can be accessed bytewise or wordwise. Portions of the
on-chip DPRAM and the register spaces (E/SFR) have additionally been made directly
bitaddressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
accesses to the program memories, such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
accesses to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected via the high-speed system bus to exchange
data. This is required if operands are read from program memory, code or data is written
to the PSRAM, code is fetched from external memory, or data is read from or written to
external resources, including peripherals on the LXBus (such as TwinCAN). The system
bus allows concurrent two-way communication for maximum transfer performance.
128 Kbytes of on-chip Flash memory store code or constant data. The on-chip Flash
memory is organized as four 8-Kbyte sectors, one 32-Kbyte sector, and one 64-Kbyte
sector. Each sector can be separately write protected1), erased and programmed (in
blocks of 128 Bytes). The complete Flash area can be read-protected. A password
sequence temporarily unlocks protected areas. The Flash module combines very fast
64-bit one-cycle read accesses with protected and efficient writing algorithms for
programming and erasing. Thus, program execution out of the internal Flash results in
maximum performance. Dynamic error correction provides extremely high read data
security for all read accesses.
For timing characteristics, please refer to Section 4.4.2.
2 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data.
The PSRAM is accessed via the PMU and is therefore optimized for code fetches.
4 Kbytes of on-chip Data SRAM (DSRAM) are provided as a storage for general user
data. The DSRAM is accessed via the DMU and is therefore optimized for data
accesses.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user
defined variables, for the system stack, and general purpose register banks. A register
bank can consist of up to 16 wordwide (R0 to R15) and/or bytewide (RL0, RH0, …, RL7,
1) Each two 8-Kbyte sectors are combined for write-protection purposes.
Data Sheet
22
V1.3, 2006-08
XC167CI-16F
Derivatives
Functional Description
RH7) so-called General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bitaddressable. When used by a GPR,
any location in the DPRAM is bitaddressable.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are wordwide registers which are
used for controlling and monitoring functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC166 Family. Therefore, they should
either not be accessed, or written with zeros, to ensure upward compatibility.
In order to meet the needs of designs where more memory is required than is provided
on chip, up to 12 Mbytes (approximately, see Table 3) of external RAM and/or ROM can
be connected to the microcontroller. The External Bus Interface also provides access to
external peripherals.
Table 3
XC167 Memory Map1)
Address Area
Start Loc.
End Loc.
Area Size2)
Notes
Flash register space
FF’F000H
FF’FFFFH
4 Kbytes
3)
Reserved (Access trap) F8’0000H
FF’EFFFH
< 0.5 Mbytes Minus Flash
registers
Reserved for PSRAM
E0’0800H
F7’FFFFH
< 1.5 Mbytes Minus PSRAM
Program SRAM
E0’0000H
E0’07FFH
2 Kbytes
Maximum
Reserved for pr. mem.
C2’0000H
DF’FFFFH
< 2 Mbytes
Minus Flash
Program Flash
C0’0000H
C1’FFFFH
128 Kbytes
–
Reserved
BF’0000H
BF’FFFFH
64 Kbytes
–
External memory area
40’0000H
BE’FFFFH
< 8 Mbytes
Minus reserved
segment
External IO area4)
20’0800H
3F’FFFFH
< 2 Mbytes
Minus TwinCAN
TwinCAN registers
20’0000H
20’07FFH
2 Kbytes
–
External memory area
01’0000H
1F’FFFFH
< 2 Mbytes
Minus segment 0
Data RAMs and SFRs
00’8000H
00’FFFFH
32 Kbytes
Partly used
External memory area
00’0000H
00’7FFFH
32 Kbytes
–
1) Accesses to the shaded areas generate external bus accesses.
2) The areas marked with “ 100 years).
Alarm interrupt for wake-up on a defined time
Data Sheet
43
V1.3, 2006-08
XC167CI-16F
Derivatives
Functional Description
3.10
A/D Converter
For analog signal measurement, a 10-bit A/D converter with 16 multiplexed input
channels and a sample and hold circuit has been integrated on-chip. It uses the method
of successive approximation. The sample time (for loading the capacitors) and the
conversion time is programmable (in two modes) and can thus be adjusted to the
external circuitry. The A/D converter can also operate in 8-bit conversion mode, where
the conversion time is further reduced.
Overrun error detection/protection is provided for the conversion result register
(ADDAT): either an interrupt request will be generated when the result of a previous
conversion has not been read from the result register at the time the next conversion is
complete, or the next conversion is suspended in such a case until the previous result
has been read.
For applications which require less analog input channels, the remaining channel inputs
can be used as digital input port pins.
The A/D converter of the XC167 supports four different conversion modes. In the
standard Single Channel conversion mode, the analog level on a specified channel is
sampled once and converted to a digital result. In the Single Channel Continuous mode,
the analog level on a specified channel is repeatedly sampled and converted without
software intervention. In the Auto Scan mode, the analog levels on a prespecified
number of channels are sequentially sampled and converted. In the Auto Scan
Continuous mode, the prespecified channels are repeatedly sampled and converted. In
addition, the conversion of a specific channel can be inserted (injected) into a running
sequence without disturbing this sequence. This is called Channel Injection Mode.
The Peripheral Event Controller (PEC) may be used to automatically store the
conversion results into a table in memory for later evaluation, without requiring the
overhead of entering and exiting interrupt routines for each data transfer.
After each reset and also during normal operation the ADC automatically performs
calibration cycles. This automatic self-calibration constantly adjusts the converter to
changing operating conditions (e.g. temperature) and compensates process variations.
These calibration cycles are part of the conversion cycle, so they do not affect the normal
operation of the A/D converter.
In order to decouple analog inputs from digital noise and to avoid input trigger noise
those pins used for analog input can be disconnected from the digital IO or input stages
under software control. This can be selected for each pin separately via register P5DIDIS
(Port 5 Digital Input Disable).
The Auto-Power-Down feature of the A/D converter minimizes the power consumption
when no conversion is in progress.
Data Sheet
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Derivatives
Functional Description
3.11
Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)
The Asynchronous/Synchronous Serial Interfaces ASC0/ASC1 (USARTs) provide serial
communication with other microcontrollers, processors, terminals or external peripheral
components. They are upward compatible with the serial ports of the Infineon 8-bit
microcontroller families and support full-duplex asynchronous communication and halfduplex synchronous communication. A dedicated baud rate generator with a fractional
divider precisely generates all standard baud rates without oscillator tuning. For
transmission, reception, error handling, and baudrate detection 5 separate interrupt
vectors are provided.
In asynchronous mode, 8- or 9-bit data frames (with optional parity bit) are transmitted
or received, preceded by a start bit and terminated by one or two stop bits. For
multiprocessor communication, a mechanism to distinguish address from data bytes has
been included (8-bit data plus wake-up bit mode). IrDA data transmissions up to
115.2 kbit/s with fixed or programmable IrDA pulse width are supported.
In synchronous mode, bytes (8 bits) are transmitted or received synchronously to a shift
clock which is generated by the ASC0/1. The LSB is always shifted first.
In both modes, transmission and reception of data is FIFO-buffered. An autobaud
detection unit allows to detect asynchronous data frames with its baudrate and mode
with automatic initialization of the baudrate generator and the mode control bits.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. A parity bit can automatically be generated on
transmission or be checked on reception. Framing error detection allows to recognize
data frames with missing stop bits. An overrun error will be generated, if the last
character received has not been read out of the receive buffer register at the time the
reception of a new character is complete.
Summary of Features
•
•
•
•
•
Full-duplex asynchronous operating modes
– 8- or 9-bit data frames, LSB first, one or two stop bits, parity generation/checking
– Baudrate from 2.5 Mbit/s to 0.6 bit/s (@ 40 MHz)
– Multiprocessor mode for automatic address/data byte detection
– Support for IrDA data transmission/reception up to max. 115.2 kbit/s (@ 40 MHz)
– Loop-back capability
– Auto baudrate detection
Half-duplex 8-bit synchronous operating mode at 5 Mbit/s to 406.9 bit/s (@ 40 MHz)
Buffered transmitter/receiver with FIFO support (8 entries per direction)
Loop-back option available for testing purposes
Interrupt generation on transmitter buffer empty condition, last bit transmitted
condition, receive buffer full condition, error condition (frame, parity, overrun error),
start and end of an autobaud detection
Data Sheet
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Derivatives
Functional Description
3.12
High Speed Synchronous Serial Channels (SSC0/SSC1)
The High Speed Synchronous Serial Channels SSC0/SSC1 support full-duplex and halfduplex synchronous communication. It may be configured so it interfaces with serially
linked peripheral components, full SPI functionality is supported.
A dedicated baud rate generator allows to set up all standard baud rates without
oscillator tuning. For transmission, reception and error handling three separate interrupt
vectors are provided.
The SSC transmits or receives characters of 2 … 16 bits length synchronously to a shift
clock which can be generated by the SSC (master mode) or by an external master (slave
mode). The SSC can start shifting with the LSB or with the MSB and allows the selection
of shifting and latching clock edges as well as the clock polarity.
A number of optional hardware error detection capabilities has been included to increase
the reliability of data transfers. Transmit error and receive error supervise the correct
handling of the data buffer. Phase error and baudrate error detect incorrect serial data.
Summary of Features
•
•
•
•
•
•
•
Master or Slave mode operation
Full-duplex or Half-duplex transfers
Baudrate generation from 20 Mbit/s to 305.18 bit/s (@ 40 MHz)
Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB-first or MSB-first
– Programmable clock polarity: idle low or idle high
– Programmable clock/data phase: data shift with leading or trailing clock edge
Loop back option available for testing purposes
Interrupt generation on transmitter buffer empty condition, receive buffer full
condition, error condition (receive, phase, baudrate, transmit error)
Three pin interface with flexible SSC pin configuration
Data Sheet
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Derivatives
Functional Description
3.13
TwinCAN Module
The integrated TwinCAN module handles the completely autonomous transmission and
reception of CAN frames in accordance with the CAN specification V2.0 part B (active),
i.e. the on-chip TwinCAN module can receive and transmit standard frames with 11-bit
identifiers as well as extended frames with 29-bit identifiers.
Two Full-CAN nodes share the TwinCAN module’s resources to optimize the CAN bus
traffic handling and to minimize the CPU load. The module provides up to 32 message
objects, which can be assigned to one of the CAN nodes and can be combined to FIFOstructures. Each object provides separate masks for acceptance filtering.
The flexible combination of Full-CAN functionality and FIFO architecture reduces the
efforts to fulfill the real-time requirements of complex embedded control applications.
Improved CAN bus monitoring functionality as well as the number of message objects
permit precise and comfortable CAN bus traffic handling.
Gateway functionality allows automatic data exchange between two separate CAN bus
systems, which reduces CPU load and improves the real time behavior of the entire
system.
The bit timing for both CAN nodes is derived from the master clock and is programmable
up to a data rate of 1 Mbit/s. Each CAN node uses two pins of Port 4, Port 7, or Port 9 to
interface to an external bus transceiver. The interface pins are assigned via software.
TwinCAN Module Kernel
Clock
Control
Address
Decoder
Interrupt
Control
fCAN
CAN
Node A
CAN
Node B
Message
Object
Buffer
TxDCA
RxDCA
Port
Control
TxDCB
RxDCB
TwinCAN Control
MCB05567
Figure 10
Data Sheet
TwinCAN Module Block Diagram
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Functional Description
Summary of Features
•
•
•
•
•
•
•
CAN functionality according to CAN specification V2.0 B active
Data transfer rate up to 1 Mbit/s
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality and Basic CAN functionality for each message object
32 flexible message objects
– Assignment to one of the two CAN nodes
– Configuration as transmit object or receive object
– Concatenation to a 2-, 4-, 8-, 16-, or 32-message buffer with FIFO algorithm
– Handling of frames with 11-bit or 29-bit identifiers
– Individual programmable acceptance mask register for filtering for each object
– Monitoring via a frame counter
– Configuration for Remote Monitoring Mode
Up to eight individually programmable interrupt nodes can be used
CAN Analyzer Mode for bus monitoring is implemented
Note: When a CAN node has the interface lines assigned to Port 4, the segment address
output on Port 4 must be limited. CS lines can be used to increase the total amount
of addressable external memory.
3.14
IIC Bus Module
The integrated IIC Bus Module handles the transmission and reception of frames over
the two-line IIC bus in accordance with the IIC Bus specification. The IIC Module can
operate in slave mode, in master mode or in multi-master mode. It can receive and
transmit data using 7-bit or 10-bit addressing. Up to 4 send/receive data bytes can be
stored in the extended buffers.
Several physical interfaces (port pins) can be established under software control. Data
can be transferred at speeds up to 400 kbit/s.
Two interrupt nodes dedicated to the IIC module allow efficient interrupt service and also
support operation via PEC transfers.
Note: The port pins associated with the IIC interfaces must be switched to open drain
mode, as required by the IIC specification.
Data Sheet
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Derivatives
Functional Description
3.15
Watchdog Timer
The Watchdog Timer represents one of the fail-safe mechanisms which have been
implemented to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can be disabled
until the EINIT instruction has been executed (compatible mode), or it can be disabled
and enabled at any time by executing instructions DISWDT and ENWDT (enhanced
mode). Thus, the chip’s start-up procedure is always monitored. The software has to be
designed to restart the Watchdog Timer before it overflows. If, due to hardware or
software related failures, the software fails to do so, the Watchdog Timer overflows and
generates an internal hardware reset and pulls the RSTOUT pin low in order to allow
external hardware components to be reset.
The Watchdog Timer is a 16-bit timer, clocked with the system clock divided by
2/4/128/256. The high byte of the Watchdog Timer register can be set to a prespecified
reload value (stored in WDTREL) in order to allow further variation of the monitored time
interval. Each time it is serviced by the application software, the high byte of the
Watchdog Timer is reloaded and the low byte is cleared. Thus, time intervals between
13 µs and 419 ms can be monitored (@ 40 MHz).
The default Watchdog Timer interval after reset is 3.28 ms (@ 40 MHz).
Data Sheet
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Derivatives
Functional Description
3.16
Clock Generation
The Clock Generation Unit uses a programmable on-chip PLL with multiple prescalers
to generate the clock signals for the XC167 with high flexibility. The master clock fMC is
the reference clock signal, and is used for TwinCAN and is output to the external system.
The CPU clock fCPU and the system clock fSYS are derived from the master clock either
directly (1:1) or via a 2:1 prescaler (fSYS = fCPU = fMC / 2). See also Section 4.4.1.
The on-chip oscillator can drive an external crystal or accepts an external clock signal.
The oscillator clock frequency can be multiplied by the on-chip PLL (by a programmable
factor) or can be divided by a programmable prescaler factor.
If the bypass mode is used (direct drive or prescaler) the PLL can deliver an independent
clock to monitor the clock signal generated by the on-chip oscillator. This PLL clock is
independent from the XTAL1 clock. When the expected oscillator clock transitions are
missing the Oscillator Watchdog (OWD) activates the PLL Unlock/OWD interrupt node
and supplies the CPU with an emergency clock, the PLL clock signal. Under these
circumstances the PLL will oscillate with its basic frequency.
The oscillator watchdog can be disabled by switching the PLL off. This reduces power
consumption, but also no interrupt request will be generated in case of a missing
oscillator clock.
Note: At the end of an external reset (EA = ‘0’) the oscillator watchdog may be disabled
via hardware by (externally) pulling the RD line low upon a reset, similar to the
standard reset configuration.
3.17
Parallel Ports
The XC167 provides up to 103 I/O lines which are organized into nine input/output ports
and one input port. All port lines are bit-addressable, and all input/output lines are
individually (bit-wise) programmable as inputs or outputs via direction registers. The I/O
ports are true bidirectional ports which are switched to high impedance state when
configured as inputs. The output drivers of some I/O ports can be configured (pin by pin)
for push/pull operation or open-drain operation via control registers. During the internal
reset, all port pins are configured as inputs (except for pin RSTOUT).
The edge characteristics (shape) and driver characteristics (output current) of the port
drivers can be selected via registers POCONx.
The input threshold of some ports is selectable (TTL or CMOS like), where the special
CMOS like input threshold reduces noise sensitivity due to the input hysteresis. The
input threshold may be selected individually for each byte of the respective ports.
All port lines have programmable alternate input or output functions associated with
them. All port lines that are not used for these alternate functions may be used as general
purpose IO lines.
Data Sheet
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Functional Description
Table 7
Summary of the XC167’s Parallel Ports
Port
Control
Alternate Functions
PORT0
Pad drivers
Address/Data lines or data lines1)
PORT1
Pad drivers
Address lines2)
Capture inputs or compare outputs,
Serial interface lines
Port 2
Pad drivers,
Open drain,
Input threshold
Capture inputs or compare outputs,
Timer control signal,
Fast external interrupt inputs
Port 3
Pad drivers,
Open drain,
Input threshold
Timer control signals, serial interface lines,
Optional bus control signal BHE/WRH,
System clock output CLKOUT (or FOUT)
Port 4
Pad drivers,
Open drain,
Input threshold
Segment address lines3)
CAN interface lines4)
Port 5
–
Analog input channels to the A/D converter,
Timer control signals
Port 6
Open drain,
Input threshold
Capture inputs or compare outputs,
Bus arbitration signals BREQ, HLDA, HOLD,
Optional chip select signals
Port 7
Open drain,
Input threshold
Capture inputs or compare outputs,
CAN interface lines4)
Port 9
Pad drivers,
Open drain,
Input threshold
Capture inputs or compare outputs
Port 20
Pad drivers,
Open drain
CAN interface lines4),
IIC bus interface lines4)
Bus control signals RD, WR/WRL, READY, ALE,
External access enable pin EA,
Reset indication output RSTOUT
1) For multiplexed bus cycles.
2) For demultiplexed bus cycles.
3) For more than 64 Kbytes of external resources.
4) Can be assigned by software.
Data Sheet
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Functional Description
3.18
Power Management
The XC167 provides several means to control the power it consumes either at a given
time or averaged over a certain timespan. Three mechanisms can be used (partly in
parallel):
•
•
•
Power Saving Modes switch the XC167 into a special operating mode (control via
instructions).
Idle Mode stops the CPU while the peripherals can continue to operate.
Sleep Mode and Power Down Mode stop all clock signals and all operation (RTC may
optionally continue running). Sleep Mode can be terminated by external interrupt
signals.
Clock Generation Management controls the distribution and the frequency of
internal and external clock signals. While the clock signals for currently inactive parts
of logic are disabled automatically, the user can reduce the XC167’s CPU clock
frequency which drastically reduces the consumed power.
External circuitry can be controlled via the programmable frequency output FOUT.
Peripheral Management permits temporary disabling of peripheral modules (control
via register SYSCON3). Each peripheral can separately be disabled/enabled.
The on-chip RTC supports intermittent operation of the XC167 by generating cyclic
wake-up signals. This offers full performance to quickly react on action requests while
the intermittent sleep phases greatly reduce the average power consumption of the
system.
Data Sheet
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Derivatives
Functional Description
3.19
Instruction Set Summary
Table 8 lists the instructions of the XC167 in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation
of the instructions, parameters for conditional execution of instructions, and the opcodes
for each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 8
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise exclusive OR, (word/byte operands)
2/4
BCLR/BSET
Clear/Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR
Shift left/right direct word GPR
2
Data Sheet
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Functional Description
Table 8
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
ROL/ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS/Z
Move byte operand to word op. with sign/zero extension
2/4
JMPA/I/R
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
JB(C)
Jump relative if direct bit is set (and clear bit)
4
JNB(S)
Jump relative if direct bit is not set (and set bit)
4
CALLA/I/R
Call absolute/indirect/relative subroutine if condition is met 4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH/POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET(P)
Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS
Return from inter-segment subroutine
2
RETI
Return from interrupt service subroutine
2
SBRK
Software Break
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
Enter Power Down Mode (supposes NMI-pin being low)
4
SRVWDT
Service Watchdog Timer
4
DISWDT/ENWDT
Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
Data Sheet
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Functional Description
Table 8
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
NOP
Null operation
2
CoMUL/CoMAC
Multiply (and accumulate)
4
CoADD/CoSUB
Add/Subtract
4
Co(A)SHR
(Arithmetic) Shift right
4
CoSHL
Shift left
4
CoLOAD/STORE
Load accumulator/Store MAC register
4
CoCMP
Compare
4
CoMAX/MIN
Maximum/Minimum
4
CoABS/CoRND
Absolute value/Round accumulator
4
CoMOV
Data move
4
CoNEG/NOP
Negate accumulator/Null operation
4
Data Sheet
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Electrical Parameters
4
Electrical Parameters
4.1
General Parameters
Table 9
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
TST
TJ
VDDI
-65
150
°C
1)
-40
150
°C
under bias
-0.5
3.25
V
–
Voltage on VDDP pins with
respect to ground (VSS)
VDDP
-0.5
6.2
V
–
Voltage on any pin with
respect to ground (VSS)
VIN
-0.5
VDDP +
V
2)
Input current on any pin
during overload condition
–
-10
10
mA
–
Absolute sum of all input
currents during overload
condition
–
–
|100|
mA
–
Storage temperature
Junction temperature
Voltage on VDDI pins with
respect to ground (VSS)
0.5
1) Moisture Sensitivity Level (MSL) 3, conforming to Jedec J-STD-020C for 260 °C for PG-TQFP-144-7, and
240 °C for P-TQFP-144-19.
2) Input pins XTAL1/XTAL3 belong to the core voltage domain. Therefore, input voltages must be within the
range defined for VDDI.
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
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Electrical Parameters
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC167. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Table 10
Operating Condition Parameters
Parameter
Symbol
Limit Values
Min.
Max.
Unit Notes
Digital supply voltage for
the core
VDDI
2.35
2.7
V
Active mode,
fCPU = fCPUmax1)2)
Digital supply voltage for
IO pads
VDDP
4.4
5.5
V
Active mode2)
-0.5
–
V
VDDP - VDDI3)
V
Reference voltage
Supply Voltage Difference ∆VDD
Digital ground voltage
VSS
IOV
0
-5
5
mA
Per IO pin4)5)
-2
5
mA
Per analog input
pin4)5)
Overload current coupling KOVA
factor for analog inputs6)
–
1.0 × 10-4 –
–
1.5 × 10-3 –
Overload current coupling KOVD
factor for digital I/O pins6)
–
5.0 × 10-3 –
–
1.0 × 10-2 –
Absolute sum of overload
currents
Σ|IOV|
–
50
mA
5)
External Load
Capacitance
CL
–
50
pF
Pin drivers in
default mode7)
Ambient temperature
TA
–
–
°C
see Table 1
Overload current
IOV > 0
IOV < 0
IOV > 0
IOV < 0
1) fCPUmax = 40 MHz for devices marked … 40F, fCPUmax = 20 MHz for devices marked … 20F.
2) External circuitry must guarantee low level at the RSTIN pin at least until both power supply voltages have
reached their operating range.
3) This limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down,
and power-save modes.
4) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VDDP + 0.5 V (IOV > 0) or VOV < VSS - 0.5 V (IOV < 0). The absolute sum of
input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the
specified limits.
Proper operation is not guaranteed if overload conditions occur on functional pins such as XTAL1, RD, WR,
etc.
5) Not subject to production test - verified by design/characterization.
Data Sheet
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Electrical Parameters
6) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pin’s leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.
The total current through a pin is |ITOT| = |IOZ| + (|IOV| × KOV). The additional error current may distort the input
voltage on analog inputs.
7) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
Parameter Interpretation
The parameters listed in the following partly represent the characteristics of the XC167
and partly its demands on the system. To aid in interpreting the parameters right, when
evaluating them for a design, they are marked in column “Symbol”:
CC (Controller Characteristics):
The logic of the XC167 will provide signals with the respective characteristics.
SR (System Requirement):
The external system must provide signals with the respective characteristics to the
XC167.
Data Sheet
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Electrical Parameters
4.2
Table 11
DC Parameters
DC Characteristics (Operating Conditions apply)1)
Parameter
Symbol
Limit Values
Min.
Max.
Unit Test Condition
Input low voltage TTL
(all except XTAL1,
XTAL3)
VIL
SR
-0.5
0.2 × VDDP V
- 0.1
–
Input low voltage for
XTAL1, XTAL32)3)
VILC
SR
-0.5
0.3 × VDDI
V
–
Input low voltage
(Special Threshold)
VILS
SR
-0.5
0.45 ×
V
4)
Input high voltage TTL VIH
(all except XTAL1,
XTAL3)
SR
0.2 × VDDP
+ 0.9
VDDP
VDDP + 0.5 V
–
Input high voltage
XTAL1, XTAL32)3)
VIHC
SR
0.7 × VDDI
VDDI + 0.5 V
–
Input high voltage
(Special Threshold)
VIHS
SR
0.8 × VDDP VDDP + 0.5 V
- 0.2
4)
Input Hysteresis
(Special Threshold)
HYS
0.04 ×
VDDP in [V],
Output low voltage
VOL
CC –
–
Output high voltage7)
–
V
VDDP
VOH
Series resistance = 0 Ω4)
1.0
V
0.45
V
CC VDDP - 1.0 –
VDDP -
V
–
V
±300
nA
0 V < VIN < VDDP,
TA ≤ 125 °C
±200
nA
0 V < VIN < VDDP,
TA ≤ 85 °C15)
±500
nA
0.45 V < VIN <
0.45
Input leakage current
(Port 5)8)
IOZ1
Input leakage current
(all other9))8)
IOZ2
Configuration pull-up
current10)
ICPUH11)
ICPUL12)
Data Sheet
CC –
CC –
–
-10
µA
-100
–
µA
59
IOL ≤ IOLmax5)
IOL ≤ IOLnom5)6)
IOH ≥ IOHmax5)
IOH ≥ IOHnom5)6)
VDDP
VIN = VIHmin
VIN = VILmax
V1.3, 2006-08
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Derivatives
Electrical Parameters
Table 11
DC Characteristics (Operating Conditions apply)1) (cont’d)
Parameter
Symbol
Limit Values
Unit Test Condition
Min.
Max.
ICPDL11)
ICPDH12)
ILHI11)
–
10
µA
120
–
µA
–
-10
µA
Level active hold
current14)
ILHA12)
-100
–
µA
VIN = VILmax
VIN = VIHmin
VOUT = 0.5 ×
VDDP
VOUT = 0.45 V
XTAL1, XTAL3 input
current
IIL
CC –
±20
µA
0 V < VIN < VDDI
Pin capacitance15)
(digital inputs/outputs)
CIO
CC –
10
pF
–
Configuration pulldown current13)
Level inactive hold
current14)
1) Keeping signal levels within the limits specified in this table, ensures operation without overload conditions.
For signal levels outside these specifications, also refer to the specification of the overload current IOV.
2) If XTAL1 is driven by a crystal, reaching an amplitude (peak to peak) of 0.4 × VDDI is sufficient.
3) If XTAL3 is driven by a crystal, reaching an amplitude (peak to peak) of 0.25 × VDDI is sufficient.
4) This parameter is tested for P2, P3, P4, P6, P7, P9.
5) The maximum deliverable output current of a port driver depends on the selected output driver mode, see
Table 12, Current Limits for Port Output Drivers. The limit for pin groups must be respected.
6) As a rule, with decreasing output current the output levels approach the respective supply level (VOL → VSS,
VOH → VDDP). However, only the levels for nominal output currents are guaranteed.
7) This specification is not valid for outputs which are switched to open drain mode. In this case the respective
output will float and the voltage results from the external circuitry.
8) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to
the definition of the overload coupling factor KOV.
9) The driver of P3.15 is designed for faster switching, because this pin can deliver the reference clock for the
bus interface (CLKOUT). The maximum leakage current for P3.15 is, therefore, increased to 1 µA.
10) This specification is valid during Reset for configuration on RD, WR, EA, PORT0.
The pull-ups on RD and WR (WRL/WRH) are also active during bus hold.
11) The maximum current may be drawn while the respective signal line remains inactive.
12) The minimum current must be drawn to drive the respective signal line active.
13) This specification is valid during Reset for configuration on ALE.
The pull-down on ALE is also active during bus hold.
14) This specification is valid during Reset for pins P6.4-0, which can act as CS outputs.
The pull-ups on CS outputs are also active during bus hold.
The pull-up on pin HLDA is active when arbitration is enabled and the EBC operates in slave mode.
15) Not subject to production test - verified by design/characterization.
Data Sheet
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Derivatives
Electrical Parameters
Table 12
Current Limits for Port Output Drivers
Port Output Driver
Mode
Maximum Output Current
(IOLmax, -IOHmax)1)
Nominal Output Current
(IOLnom, -IOHnom)
Strong driver
10 mA
2.5 mA
Medium driver
4.0 mA
1.0 mA
Weak driver
0.5 mA
0.1 mA
1) An output current above |IOXnom| may be drawn from up to three pins at the same time.
For any group of 16 neighboring port output pins the total output current in each direction (ΣIOL and Σ-IOH) must
remain below 50 mA.
Table 13
Power Consumption XC167 (Operating Conditions apply)
Parameter
SymLimit Values
bol
Min.
Max.
Unit Test Condition
Power supply current (active)
with all peripherals active
IDDI
–
15 +
2.6 × fCPU
mA
fCPU in [MHz]1)2)
Pad supply current
IDDP
IIDX
–
5
mA
3)
–
15 +
1.2 × fCPU
mA
fCPU in [MHz]2)
128,000
× e-α
mA
VDDI = VDDImax6)
TJ in [°C]
0.6 +
0.02 × fOSC
+ IPDL
mA
VDDI = VDDImax
fOSC in [MHz]
0.1 + IPDL
mA
VDDI = VDDImax
Idle mode supply current
with all peripherals active
Sleep and Power down mode
supply current caused by
leakage4)
IPDL5) –
Sleep and Power down mode IPDM7) –
supply current caused by
leakage and the RTC running,
clocked by the main oscillator4)
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the auxiliary
oscillator at 32 kHz4)
IPDA
–
α=
4670 / (273 + TJ)
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in Figure 11.
These parameters are tested at VDDImax and maximum CPU clock frequency with all outputs disconnected and
all inputs at VIL or VIH.
3) The pad supply voltage pins (VDDP) mainly provides the current consumed by the pin output drivers. A small
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the VDDP supply.
Data Sheet
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Derivatives
Electrical Parameters
4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage
current and the frequency dependent current for RTC and main oscillator or auxiliary oscillator (if active).
5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the
junction temperature (see Figure 13). The junction temperature TJ is the same as the ambient temperature TA
if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be
taken into account.
6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP, all outputs (including
pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for TJ ≥ 25 °C.
7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see
Figure 12). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The
given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.
Data Sheet
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Derivatives
Electrical Parameters
I [mA]
IDDImax
140
120
IDDItyp
100
80
IIDXmax
60
IIDXtyp
40
20
10
Figure 11
Data Sheet
20
30
40
fCPU [MHz]
Supply/Idle Current as a Function of Operating Frequency
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Electrical Parameters
I [mA]
3.0
2.0
IPDMmax
IPDMtyp
1.0
IPDAmax
0.1
32 kHz
Figure 12
4
8
12
16
fOSC [MHz]
Sleep and Power Down Supply Current due to RTC and Oscillator
Running, as a Function of Oscillator Frequency
IPDL
[mA]
1.5
1.0
0.5
-50
Figure 13
Data Sheet
0
50
100
150
TJ [°C]
Sleep and Power Down Leakage Supply Current as a Function of
Temperature
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Electrical Parameters
4.3
Table 14
Analog/Digital Converter Parameters
A/D Converter Characteristics (Operating Conditions apply)
Parameter
Symbol
Limit Values
Min.
Analog reference supply
VAREF
SR 4.5
Max.
Unit Test
Condition
VDDP
V
1)
VSS + 0.1
VAREF
V
–
V
2)
20
MHz
3)
+ 0.1
VAGND
Analog input voltage range VAIN
Basic clock frequency
fBC
Conversion time for 10-bit tC10P
result4)
tC10
Conversion time for 8-bit
tC8P
result4)
tC8
Calibration time after reset tCAL
SR VSS - 0.1
CC 484
11,696
tBC
5)
Total unadjusted error
TUE
CC –
±2
LSB
1)
Total capacitance
of an analog input
CAINT
CC –
15
pF
6)
Switched capacitance
of an analog input
CAINS
CC –
10
pF
6)
Resistance of
the analog input path
RAIN
CC –
2
kΩ
6)
Total capacitance
of the reference input
CAREFT CC –
20
pF
6)
Switched capacitance
of the reference input
CAREFS CC –
15
pF
6)
Resistance of
the reference input path
RAREF
1
kΩ
6)
Analog reference ground
SR VAGND
0.5
CC 52 × tBC + tS + 6 × tSYS –
Post-calibr. on
CC 40 × tBC + tS + 6 × tSYS –
Post-calibr. off
CC 44 × tBC + tS + 6 × tSYS –
Post-calibr. on
CC 32 × tBC + tS + 6 × tSYS –
Post-calibr. off
CC –
1) TUE is tested at VAREF = VDDP + 0.1 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range.
If the analog reference supply voltage drops below 4.5 V (i.e. VAREF ≥ 4.0 V) or exceeds the power supply
voltage by up to 0.2 V (i.e. VAREF = VDDP + 0.2 V) the maximum TUE is increased to ±3 LSB. This range is not
subject to production test.
The specified TUE is guaranteed only, if the absolute sum of input overload currents on Port 5 pins (see IOV
specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the respective period of
time. During the reset calibration sequence the maximum TUE may be ±4 LSB.
2) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
Data Sheet
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Derivatives
Electrical Parameters
3) The limit values for fBC must not be exceeded when selecting the peripheral frequency and the ADCTC setting.
4) This parameter includes the sample time tS, the time for determining the digital result and the time to load the
result register with the conversion result (tSYS = 1/fSYS).
Values for the basic clock tBC depend on programming and can be taken from Table 15.
When the post-calibration is switched off, the conversion time is reduced by 12 × tBC.
5) The actual duration of the reset calibration depends on the noise on the reference signal. Conversions
executed during the reset calibration increase the calibration time. The TUE for those conversions may be
increased.
6) Not subject to production test - verified by design/characterization.
The given parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) reduced values can be used for calculations. At room temperature and nominal
supply voltage the following typical values can be used:
CAINTtyp = 12 pF, CAINStyp = 7 pF, RAINtyp = 1.5 kΩ, CAREFTtyp = 15 pF, CAREFStyp = 13 pF, RAREFtyp = 0.7 kΩ.
RSource
V AIN
R AIN, On
C AINT - C AINS
C Ext
A/D Converter
CAINS
MCS05570
Figure 14
Data Sheet
Equivalent Circuitry for Analog Inputs
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Electrical Parameters
Sample time and conversion time of the XC167’s A/D Converter are programmable. In
compatibility mode, the above timing can be calculated using Table 15.
The limit values for fBC must not be exceeded when selecting ADCTC.
Table 15
A/D Converter Computation Table1)
ADCON.15|14
(ADCTC)
A/D Converter
Basic Clock fBC
ADCON.13|12
(ADSTC)
00
fSYS / 4
fSYS / 2
fSYS / 16
fSYS / 8
00
01
10
11
01
10
11
Sample Time
tS
tBC × 8
tBC × 16
tBC × 32
tBC × 64
1) These selections are available in compatibility mode. An improved mechanism to control the ADC input clock
can be selected.
Converter Timing Example:
Assumptions:
Basic clock
Sample time
fSYS
fBC
tS
= 40 MHz (i.e. tSYS = 25 ns), ADCTC = ‘01’, ADSTC = ‘00’
= fSYS / 2 = 20 MHz, i.e. tBC = 50 ns
= tBC × 8 = 400 ns
Conversion 10-bit:
With post-calibr. tC10P
= 52 × tBC + tS + 6 × tSYS = (2600 + 400 + 150) ns = 3.15 µs
tC10
= 40 × tBC + tS + 6 × tSYS = (2000 + 400 + 150) ns = 2.55 µs
With post-calibr. tC8P
= 44 × tBC + tS + 6 × tSYS = (2200 + 400 + 150) ns = 2.75 µs
Post-calibr. off
Conversion 8-bit:
Post-calibr. off
Data Sheet
tC8
= 32 × tBC + tS + 6 × tSYS = (1600 + 400 + 150) ns = 2.15 µs
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Electrical Parameters
4.4
AC Parameters
4.4.1
Definition of Internal Timing
The internal operation of the XC167 is controlled by the internal master clock fMC.
The master clock signal fMC can be generated from the oscillator clock signal fOSC via
different mechanisms. The duration of master clock periods (TCMs) and their variation
(and also the derived external timing) depend on the used mechanism to generate fMC.
This influence must be regarded when calculating the timings for the XC167.
Phase Locked Loop Operation (1:N)
f OSC
f MC
TCM
Direct Clock Drive (1:1)
f OSC
f MC
TCM
Prescaler Operation (N:1)
f OSC
f MC
TCM
MCT05555
Figure 15
Generation Mechanisms for the Master Clock
Note: The example for PLL operation shown in Figure 15 refers to a PLL factor of 1:4,
the example for prescaler operation refers to a divider factor of 2:1.
The used mechanism to generate the master clock is selected by register PLLCON.
CPU and EBC are clocked with the CPU clock signal fCPU. The CPU clock can have the
same frequency as the master clock (fCPU = fMC) or can be the master clock divided by
two: fCPU = fMC / 2. This factor is selected by bit CPSYS in register SYSCON1.
Data Sheet
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Derivatives
Electrical Parameters
The specification of the external timing (AC Characteristics) depends on the period of the
CPU clock, called “TCP”.
The other peripherals are supplied with the system clock signal fSYS which has the same
frequency as the CPU clock signal fCPU.
Bypass Operation
When bypass operation is configured (PLLCTRL = 0xB) the master clock is derived from
the internal oscillator (input clock signal XTAL1) through the input- and outputprescalers:
fMC = fOSC / ((PLLIDIV+1) × (PLLODIV+1)).
If both divider factors are selected as ‘1’ (PLLIDIV = PLLODIV = ‘0’) the frequency of fMC
directly follows the frequency of fOSC so the high and low time of fMC is defined by the duty
cycle of the input clock fOSC.
The lowest master clock frequency is achieved by selecting the maximum values for both
divider factors:
fMC = fOSC / ((3 + 1) × (14 + 1)) = fOSC / 60.
Phase Locked Loop (PLL)
When PLL operation is configured (PLLCTRL = 11B) the on-chip phase locked loop is
enabled and provides the master clock. The PLL multiplies the input frequency by the
factor F (fMC = fOSC × F) which results from the input divider, the multiplication factor, and
the output divider (F = PLLMUL+1 / (PLLIDIV+1 × PLLODIV+1)). The PLL circuit
synchronizes the master clock to the input clock. This synchronization is done smoothly,
i.e. the master clock frequency does not change abruptly.
Due to this adaptation to the input clock the frequency of fMC is constantly adjusted so it
is locked to fOSC. The slight variation causes a jitter of fMC which also affects the duration
of individual TCMs.
The timing listed in the AC Characteristics refers to TCPs. Because fCPU is derived from
fMC, the timing must be calculated using the minimum TCP possible under the respective
circumstances.
The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is
constantly adjusting its output frequency so it corresponds to the applied input frequency
(crystal or oscillator) the relative deviation for periods of more than one TCP is lower than
for one single TCP (see formula and Figure 16).
This is especially important for bus cycles using waitstates and e.g. for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
Data Sheet
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Derivatives
Electrical Parameters
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler (K = PLLODIV+1) to generate the master clock signal fMC. Therefore,
the number of VCO cycles can be represented as K × N, where N is the number of
consecutive fMC cycles (TCM).
For a period of N × TCM the accumulated PLL jitter is defined by the deviation DN:
DN [ns] = ±(1.5 + 6.32 × N / fMC); fMC in [MHz], N = number of consecutive TCMs.
So, for a period of 3 TCMs @ 20 MHz and K = 12: D3 = ±(1.5 + 6.32 × 3 / 20) = 2.448 ns.
This formula is applicable for K × N < 95. For longer periods the K × N = 95 value can be
used. This steady value can be approximated by: DNmax [ns] = ±(1.5 + 600 / (K × fMC)).
Acc. jitter DN
K = 12
K=8
K = 15 K = 10
ns
±8
K=6 K=5
±7
±6
±5
10 MHz
20 MHz
±4
±3
±2
±1
0
40 MHz
0 1
5
10
15
20
25
N
MCD05566
Figure 16
Approximated Accumulated PLL Jitter
Note: The bold lines indicate the minimum accumulated jitter which can be achieved by
selecting the maximum possible output prescaler factor K.
Different frequency bands can be selected for the VCO, so the operation of the PLL can
be adjusted to a wide range of input and output frequencies:
Data Sheet
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Electrical Parameters
Table 16
VCO Bands for PLL Operation1)
PLLCON.PLLVB
VCO Frequency Range
Base Frequency Range
00
100 … 150 MHz
20 … 80 MHz
01
150 … 200 MHz
40 … 130 MHz
10
200 … 250 MHz
60 … 180 MHz
11
Reserved
1) Not subject to production test - verified by design/characterization.
Data Sheet
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Electrical Parameters
4.4.2
On-chip Flash Operation
The XC167’s Flash module delivers data within a fixed access time (see Table 17).
Accesses to the Flash module are controlled by the PMI and take 1+WS clock cycles,
where WS is the number of Flash access waitstates selected via bitfield WSFLASH in
register IMBCTRL. The resulting duration of the access phase must cover the access
time tACC of the Flash array. Therefore, the required Flash waitstates depend on the
actual system frequency.
Note: The Flash access waitstates only affect non-sequential accesses. Due to
prefetching mechanisms, the performance for sequential accesses (depending on
the software structure) is only partially influenced by waitstates.
In typical applications, eliminating one waitstate increases the average
performance by 5% … 15%.
Table 17
Flash Characteristics (Operating Conditions apply)
Parameter
Symbol
Flash module access time
Programming time per 128-byte block
Erase time per sector
tACC
tPR
tER
Limit Values
Unit
Min.
Typ.
Max.
CC
–
–
50
ns
CC
–
21)
5
ms
500
ms
CC
–
200
1)
1) Programming and erase time depends on the system frequency. Typical values are valid for 40 MHz.
Example: For an operating frequency of 40 MHz (clock cycle = 25 ns), devices can be
operated with 1 waitstate: ((1+1) × 25 ns) ≥ 50 ns.
Table 18 indicates the interrelation of waitstates and system frequency.
Table 18
Flash Access Waitstates
Required Waitstates
Frequency Range for
0 WS (WSFLASH = 00B)
fCPU ≤ 20 MHz
fCPU ≤ 40 MHz
1 WS (WSFLASH = 01B)
Note: The maximum achievable system frequency is limited by the properties of the
respective derivative, i.e. 40 MHz (or 20 MHz for xxx-16F20F devices).
Data Sheet
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Electrical Parameters
4.4.3
Table 19
External Clock Drive XTAL1
External Clock Drive Characteristics (Operating Conditions apply)
Parameter
Symbol
tOSC
t1
t2
t3
t4
Oscillator period
High time2)
Low time2)
Rise time2)
Fall time2)
Limit Values
Unit
Min.
Max.
SR
25
2501)
ns
SR
6
–
ns
SR
6
–
ns
SR
–
8
ns
SR
–
8
ns
1) The maximum limit is only relevant for PLL operation to ensure the minimum input frequency for the PLL.
2) The clock input signal must reach the defined levels VILC and VIHC.
t3
t1
t4
V IHC
V ILC
0.5 V DDI
t2
t OSC
MCT05572
Figure 17
External Clock Drive XTAL1
Note: If the on-chip oscillator is used together with a crystal or a ceramic resonator, the
oscillator frequency is limited to a range of 4 MHz to 16 MHz.
It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimum
parameters for the oscillator operation. Please refer to the limits specified by the
crystal supplier.
When driven by an external clock signal it will accept the specified frequency
range. Operation at lower input frequencies is possible but is verified by design
only (not subject to production test).
Data Sheet
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Electrical Parameters
4.4.4
Testing Waveforms
Output delay
Output delay
Hold time
2.0 V
Hold time
Input Signal
(driven by tester)
Output Signal
(measured)
0.8 V
0.45 V
Output timings refer to the rising edge of CLKOUT.
Input timings are calculated from the time, when the input signal reaches
VIH or VIL, respectively.
MCD05556
Figure 18
Input Output Waveforms
VLoad + 0.1 V
Timing
Reference
Points
V Load - 0.1 V
V OH - 0.1 V
V OL + 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 19
Data Sheet
Float Waveforms
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Electrical Parameters
4.4.5
External Bus Timing
Table 20
CLKOUT Reference Signal
Parameter
Symbol
Limits
Min.
tc5
tc6
tc7
tc8
tc9
CLKOUT cycle time
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fall time
Unit
Max.
40/30/251)
CC
ns
CC
8
–
ns
CC
6
–
ns
CC
–
4
ns
CC
–
4
ns
1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to fCPU = 25/33/40 MHz).
For longer periods the relative deviation decreases (see PLL deviation formula).
t C9
t C5
tC6
t C7
tC8
CLKOUT
MCT05571
Figure 20
Data Sheet
CLKOUT Signal Timing
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Electrical Parameters
Variable Memory Cycles
External bus cycles of the XC167 are executed in five subsequent cycle phases (AB, C,
D, E, F). The duration of each cycle phase is programmable (via the TCONCSx
registers) to adapt the external bus cycles to the respective external module (memory,
peripheral, etc.).
The duration of the access phase can optionally be controlled by the external module via
the READY handshake input.
This table provides a summary of the phases and the respective choices for their
duration.
Table 21
Programmable Bus Cycle Phases (see timing diagrams)
Bus Cycle Phase
Parameter
Address setup phase, the standard duration of this tpAB
phase (1 … 2 TCP) can be extended by 0 … 3 TCP
if the address window is changed
tpC
tpD
tpE
tpF
Command delay phase
Write Data setup/MUX Tristate phase
Access phase
Address/Write Data hold phase
Valid Values Unit
1 … 2 (5)
TCP
0…3
TCP
0…1
TCP
1 … 32
TCP
0…3
TCP
Note: The bandwidth of a parameter (minimum and maximum value) covers the whole
operating range (temperature, voltage) as well as process variations. Within a
given device, however, this bandwidth is smaller than the specified range. This is
also due to interdependencies between certain parameters. Some of these
interdependencies are described in additional notes (see standard timing).
Data Sheet
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Electrical Parameters
Table 22
External Bus Cycle Timing (Operating Conditions apply)
Parameter
Symbol
Limits
Min.
Max.
Unit
Output valid delay for:
RD, WR(L/H)
tc10
CC
1
13
ns
Output valid delay for:
BHE, ALE
tc11
CC
-1
7
ns
Output valid delay for:
A23 … A16, A15 … A0 (on PORT1)
tc12
CC
1
16
ns
Output valid delay for:
A15 … A0 (on PORT0)
tc13
CC
3
16
ns
Output valid delay for:
CS
tc14
CC
1
14
ns
Output valid delay for:
D15 … D0 (write data, MUX-mode)
tc15
CC
3
17
ns
Output valid delay for:
D15 … D0 (write data, DEMUX-mode)
tc16
CC
3
17
ns
Output hold time for:
RD, WR(L/H)
tc20
CC
-3
3
ns
Output hold time for:
BHE, ALE
tc21
CC
0
8
ns
Output hold time for:
A23 … A16, A15 … A0 (on PORT0)
tc23
CC
1
13
ns
Output hold time for:
CS
tc24
CC
-3
3
ns
Output hold time for:
D15 … D0 (write data)
tc25
CC
1
13
ns
Input setup time for:
READY, D15 … D0 (read data)
tc30
SR
24
–
ns
Input hold time
READY, D15 … D0 (read data)1)
tc31
SR
-5
–
ns
1) Read data are latched with the same (internal) clock edge that triggers the address change and the rising edge
of RD. Therefore address changes before the end of RD have no impact on (demultiplexed) read cycles. Read
data can be removed after the rising edge of RD.
Note: The shaded parameters have been verified by characterization.
They are not subject to production test.
Data Sheet
77
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
tp AB
tpC
tp D
tp E
tp F
CLKOUT
tc 21
tc 11
ALE
tc 11/tc 14
A23-A16,
BHE, CSx
High Address
tc 20
tc 10
RD
WR(L/H)
tc 31
tc 13
AD15-AD0
(read)
AD15-AD0
(write)
tc 23
Low Address
tc 30
Data In
tc 13
tc 15
Low Address
tc 25
Data Out
MCT05557
Figure 21
Data Sheet
Multiplexed Bus Cycle
78
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
tp AB
tp C
tp D
tp E
tp F
CLKOUT
tc 21
tc 11
ALE
tc 11 /tc 14
A23-A0,
BHE, CSx
Address
tc 20
tc 10
RD
WR(L/H)
tc 31
tc 30
D15-D0
(read)
Data In
tc 16
D15-D0
(write)
tc 25
Data Out
MCT05558
Figure 22
Data Sheet
Demultiplexed Bus Cycle
79
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
Bus Cycle Control via READY Input
The duration of an external bus cycle can be controlled by the external circuitry via the
READY input signal. The polarity of this input signal can be selected.
Synchronous READY permits the shortest possible bus cycle but requires the input
signal to be synchronous to the reference signal CLKOUT.
Asynchronous READY puts no timing constraints on the input signal but incurs one
waitstate minimum due to the additional synchronization stage. The minimum duration
of an asynchronous READY signal to be safely synchronized must be one CLKOUT
period plus the input setup time.
An active READY signal can be deactivated in response to the trailing (rising) edge of
the corresponding command (RD or WR).
If the next following bus cycle is READY-controlled, an active READY signal must be
disabled before the first valid sample point for the next bus cycle. This sample point
depends on the programmed phases of the next following cycle.
Data Sheet
80
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
tpD
tp E
tpRDY
tpF
CLKOUT
tc 10
tc 20
RD, WR
tc 31
tc 30
D15-D0
(read)
Data In
tc 25
D15-D0
(write)
Data Out
tc31
READY
Synchronous
READY
Asynchron.
tc 31
tc 30
tc 30
Not Rdy
READY
tc 31
tc 31
tc 30
tc 30
Not Rdy
READY
MCT05559
Figure 23
READY Timing
Note: If the READY input is sampled inactive at the indicated sampling point (“Not Rdy”)
a READY-controlled waitstate is inserted (tpRDY),
sampling the READY input active at the indicated sampling point (“Ready”)
terminates the currently running bus cycle.
Note the different sampling points for synchronous and asynchronous READY.
This example uses one mandatory waitstate (see tpE) before the READY input is
evaluated.
Data Sheet
81
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
External Bus Arbitration
Table 23
Bus Arbitration Timing (Operating Conditions apply)
Parameter
Symbol
Limits
Min.
Max.
Unit
Input setup time for:
HOLD input
tc40
SR
24
–
ns
Output delay rising edge for:
HLDA, BREQ
tc41
CC
1
6
ns
Output delay falling edge for:
HLDA
tc42
CC
1
10
ns
Note: The shaded parameters have been verified by characterization.
They are not subject to production test.
Data Sheet
82
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
CLKOUT
tc 40
HOLD
tc 42
HLDA
BREQ
2)
tc 10 /tc 14
CSx, RD,
WR(L/H)
3)
Addr, Data,
BHE
1)
Figure 24
MCT05560
External Bus Arbitration, Releasing the Bus
Notes
1. The XC167 will complete the currently running bus cycle before granting bus access.
2. This is the first possibility for BREQ to get active.
3. The control outputs will be resistive high (pull-up) after being driven inactive (ALE will
be low).
Data Sheet
83
V1.3, 2006-08
XC167CI-16F
Derivatives
Electrical Parameters
3)
CLKOUT
tc 40
HOLD
tc 41
HLDA
tc 41
BREQ
1)
tc 10 /tc 14
CSx, RD,
WR(L/H)
2)
tc 11/tc 12 /tc 13/tc 15 /tc 16
Addr, Data,
BHE
MCT05561
Figure 25
External Bus Arbitration, Regaining the Bus
Notes
1. This is the last chance for BREQ to trigger the indicated regain-sequence.
Even if BREQ is activated earlier, the regain-sequence is initiated by HOLD going
high. Please note that HOLD may also be deactivated without the XC167 requesting
the bus.
2. The control outputs will be resistive high (pull-up) before being driven inactive (ALE
will be low).
3. The next XC167 driven bus cycle may start here.
Data Sheet
84
V1.3, 2006-08
XC167CI-16F
Derivatives
Package and Reliability
5
Package and Reliability
5.1
Packaging
Table 24
Package Parameters
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
Thermal resistance junction to case RΘJC
–
9
K/W
–
Thermal resistance junction to leads RΘJL
–
41
K/W
–
Thermal resistance junction to case RΘJC
–
7
K/W
–
Thermal resistance junction to leads RΘJL
–
19
K/W
–
Green Package PG-TQFP-144-7
Standard Package P-TQFP-144-19
0.5
0.22 ±0.05
17.5
H
7˚ MAX.
0.15 +0.05
-0.06
0.1 ±0.05
1.4 ±0.05
1.6 MAX.
Package Outlines
0.6 ±0.15
C
0.08
0.08
M
A-B D C 144x
22
20 1)
0.2 A-B D 4x
0.2 A-B D H 4x
D
22
B
20 1)
A
144
1
Index Marking
1)
Does not include plastic or metal protrusion of 0.25 max. per side
Figure 26
PG-TQFP-144-7 (Plastic Green Thin Quad Flat Package)
Data Sheet
85
GPP05616
V1.3, 2006-08
XC167CI-16F
Derivatives
0.5
0.22 ±0.05 2)
17.5
7˚ MAX.
H
0.6 ±0.15
C
0.08
0.08 M A-B D C 144x
22
+0.08
0.12 -0.03
0.1 ±0.05
1.4 ±0.05
1.6 MAX.
Package and Reliability
0.2 A-B D 144x
0.2 A-B D H 4x
20 1)
D
22
B
20 1)
A
144
1
Index Marking
1)
2)
Does not include plastic or metal protrusion of 0.25 max. per side
Does not include dambar protrusion of 0.08 max. per side
GPP09243
Figure 27
P-TQFP-144-19 (Plastic Thin Quad Flat Package)
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
86
Dimensions in mm
V1.3, 2006-08
XC167CI-16F
Derivatives
Package and Reliability
5.2
Flash Memory Parameters
The data retention time of the XC167’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Table 25
Flash Parameters (XC167, 128 Kbytes)
Parameter
Data retention time
Symbol
tRET
Flash Erase Endurance NER
Data Sheet
Limit Values
Unit
Notes
103 erase/program
cycles
Min.
Max.
15
–
years
20 × 103
–
cycles Data retention time
5 years
87
V1.3, 2006-08
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