XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Data Sheet
Revision 1.0
Quality Requirement Category: Industrial
Features
•
•
•
•
•
Universal AC input (90 - 305 VAC) or DC input (90 - 305 VDC)
Applicable power range of 20 W to 150 W
Small number of external parts optimizes Bill of Materials (BOM) and form factor
High efficiency (> 90%)
Multicontrol mode (Constant Current (CC)/Constant Voltage (CV)/Limited Power (LP)) reduces required
product variety
• Important parameters can be configured after manufacturing
• Low harmonic distortion (Total Harmonic Distortion (THD) < 15%)
• Low output ripple current
• Integrated startup cell ensures fast time to light (< 250 ms)
• Adaptive Temperature Protection
• Ambient operating temperature -40 °C to 85 °C
• Automatic switching between Quasi-Resonant Mode (QRM) and Discontinuous Conduction Mode (DCM)
• Wide output voltage range
• Pulse Width Modulation (PWM) dimming control
• Output dimming by analog reduction of driving current down to 5%
For safe operation, the XDPL8220 contains a comprehensive set of protection features:
• Output overvoltage protection (open load)
• Output undervoltage protection (output short)
• VCC over- and undervoltage lockout
• Input over- and undervoltage protection
• Bus over- and undervoltage protection
• Overcurrent protection for Power Factor Correction (PFC) and Flyback (FB) stage
Applications
• Integrated Electronic Control Gear (ECG) for Light Emitting Diode (LED) luminaires
Data Sheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Description
L
Input
voltage
GDPFC
LED+
CSPFC
GDFB
N
TEMP
CSFB
LED-
XDPL8220
HV
VCC
VS
ZCD
GND
UART
UART
Figure 1
PWM
PWM
GND
Vsupply
Typical Application for XDPL8220
Product Type
Package
XDPL8220
PG-DSO-16
Description
XDPL8220 is a highly integrated next-generation device combining a boundary mode PFC plus a quasi-resonant
FB controller with primary-side regulation. The integration of these functions enables saving of external parts
and optimizes performance by harmonized operation of the two stages.
XDPL8220 uses a constant on-time scheme with a THD improvement algorithm to provide a high power factor
and excellent THD performance.
With its unique control scheme of CV, CC and LP, the LED driver designer is provided with a large degree of
flexibility and can utilize the system hardware to its limits.
The on-chip One Time Programmable Memory (OTP) memory has an area for parameters that control the
behavior of the circuit, e. g. the output current or the maximum output power. This enables the user of the
device to create a platform concept with significantly fewer different hardware versions while still covering the
same application range.
The two-stage approach reduces any variation in the output current (flicker) to a non-visible level. By separating
the PFC from the power conversion part (FB), both stages operate in a more stable manner and require fewer
margins, which has a positive influence on the cost.
Lighting requires more and more 24/7 operation, making it necessary to have a stand-by mode with short wakeup times and low power consumption. The power consumption of less than 100 mW of the XDPL8220-based
systems defines the new standard for stand-by power in lighting ECGs.
XDPL8220 enables adaptive temperature protection using either the internal sensor or an external Negative
Temperature Coefficient Thermistor (NTC), or both.
Futureproof flexibility with application-oriented programmable operating windows enables management of
LED generations and portfolio complexity .
Data Sheet
2
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Table of contents
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3
3.1
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.5.1
3.1.6
3.1.6.1
3.1.6.2
3.1.7
3.1.8
3.1.9
3.1.10
3.1.11
3.1.12
3.2
3.2.1
3.2.1.1
3.2.1.2
3.2.1.3
3.2.1.4
3.2.1.5
3.2.1.6
3.2.2
3.2.3
3.2.3.1
3.2.3.2
3.2.3.3
3.2.3.4
3.2.3.5
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
PFC Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Shared CS/ZCD Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Quasi-resonant Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bus Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Input Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Control Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Multimode Control Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Frequency Law . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
THD Optimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Peak Current Limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Bus Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Bus Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Other PFC Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Flyback Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Primary Side Regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Primary Side Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Primary Side Output Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Flyback Bus Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Output Current Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Output Control Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Multimode Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Flyback Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Primary Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Output Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Output Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Output Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Output Overpower Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Data Sheet
3
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Table of contents
3.2.3.6
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.4.1
3.3.4.2
3.3.4.3
3.3.4.4
3.3.5
3.3.5.1
3.3.5.2
3.3.5.3
3.3.5.4
Other Flyback Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
General Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
External Temperature Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Adaptive Temperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
PWM Dimming Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Overtemperature Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
VCC Undervoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
VCC Overvoltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Other General Controller Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Protection Reactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Auto restart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fast Auto Restart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Latch Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4
4.1
4.2
4.3
Design Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Design Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
List of Configurable Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
List of Fixed Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5
5.1
5.2
5.3
5.4
Electrical Characteristics and Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
7
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Data Sheet
4
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Block Diagram
1
Functional Block Diagram
The functional block diagram shows the basic data flow from input pins via signal processing to the output pins.
Power Factor Correction
HV
Data Sheet
Output Voltage
Sensing and Zero
Crossing Detection
ZCD
GDPFC
PFC Control
Loop
Output Current
Calculation
CSFB
CSPFC
Current Sensing and
Zero Crossing
Detection
FB Control Loop
GDFB
PWM Dimming
Sensing
PWM
UART
VS
Figure 2
Flyback
Input Voltage
Sensing and
Startup
Bus Voltage
Sensing
Adaptive
Temperature
Protection
VCC
VCC
Management
UART
Parametrization
TEMP
External
Temperature
Sensing
Internal
Temperature
Sensing
XDPL8220 Simplified Functional Block Diagram
5
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Pin Configuration
2
Pin Configuration
Pin assignments and basic pin description information are shown below.
GDFB
1
16
N.C.
CSFB
2
15
N.C.
VCC
3
14
N.U.
GND
4
13
GDPFC
ZCD
5
12
UART
VS
6
11
CSPFC
N.U.
7
10
TEMP
HV
8
9
PWM
PG-DSO-16(150mil)
Figure 3
Pinning of XDPL8220
Table 1
Pin Definitions and Functions
Name
Pin
Type
Function
GDFB
1
O
Gate driver for FB:
The GDFB pin is an output for directly driving a power MOSFET of the FB
stage.
CSFB
2
I
Current sensing for FB:
The CSFB pin is connected to an external shunt resistor and the source of the
power MOSFET of the FB stage.
VCC
3
I
Voltage supply
GND
4
-
Power and signal ground
ZCD
5
I
Zero-crossing detection of the FB:
The ZCD pin is connected to an auxiliary winding of the FB stage for zerocrossing detection as well as primary-side output voltage and backup bus
voltage sensing for safety.
VS
6
I
Bus voltage sensing
N.U.
7
-
Not used. Externally to be connected to GND.
HV
8
I
High voltage:
The HV pin is connected to the rectified input voltage via an external resistor.
An internal 600 V HV startup-cell is used to initially charge VCC. In addition,
sampled high-voltage sensing is also used for synchronization with the input
frequency.
PWM
9
I
PWM dimming:
The PWM pin is used as a dimming input.
TEMP
10
I
External temperature sensor:
Measurement of external temperature using an NTC.
CSPFC
11
I
Current sensing for PFC:
The CSPFC pin is connected to an external shunt resistor and the source of
the power MOSFET of the PFC stage.
Data Sheet
6
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Pin Configuration
Table 1
Pin Definitions and Functions (continued)
Name
Pin
Type
Function
UART
12
I/O
Universal Asynchronous Receiver Transmitter (UART) communication:
The UART pin is used for the UART interface to support parameterization.
GDPFC
13
O
Gate driver for PFC:
The GDPFC pin is an output for directly driving a power MOSFET of the PFC
stage.
N.U.
14
-
Not used. Externally to be connected to GND.
N.C.
15
-
Not connected.
N.C.
16
-
Not connected.
Data Sheet
7
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3
Functional Description
This chapter provides a summary of the integrated functions and features, and describes the relationships
between them. The parameters and equations are based on typical values at TA = 25 °C.
XDPL8220 is a digital dual-stage PFC and FB controller IC supporting PWM dimming functionality. Both stages
use configurable multimode operation to select the best mode of operation for every operation condition.
Multimode operation automatically switches between Quasi-Resonant Mode, switching in valley n (QRMn) and
DCM.
XDPL8220 features a comprehensive set of configurable protection modes to detect fault conditions.
XDPL8220 provides a high degree of flexibility in design-in of the application. A Graphic User Interface (GUI)
tool supports users in the configuration of the operational and protection parameters.
Data Sheet
8
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.1
PFC Controller Features
The PFC stage ensures high power quality by maximizing the power factor and minimizing harmonic distortion.
The PFC stage operates in Quasi-Resonant Mode, switching in valley 1 (QRM1) and QRMn, to support low load
conditions and ensure efficient operation.
The PFC stage is implemented as a boost converter. It drains a sinusoidal current from the single-phase line
supply and provides stabilized Direct Current (DC) voltage at the internal bus voltage rail. The power factor of
the single-phase line supply is almost one. Fluctuations in line voltage as well as voltage drops of short duration
are compensated.
3.1.1
Shared CS/ZCD Function
The PFC stage makes use of combined CS/ZCD functionality at the CSPFC pin.
During the gate driver on-time the pin acts as a current sense (CS), while during the gate driver off-time the pin
acts as a zero-crossing-detector (ZCD). The CS senses the on-time current and implements overcurrent
limitation; the ZCD exploits the quasi-resonant function to minimize conduction losses.
The CSPFC pin is connected via a resistor divider composed of RZCD,1,PFC and RZCD,2,PFC and a set of diodes to an
auxiliary winding of the PFC choke inductor. It is used for detecting the valleys of the quasi-resonant oscillation
to turn on the PFC MOSFET based on the desired valley computed by the multimode PFC control. The diode D1
allows positive voltage at the CSPFC pin as the valley detection is implemented by the internal hysteretic
comparator with a positive reference of nominal THRHYS for falling edges. The CSPFC pin senses the drain source
current of the switching MOSFET. The CS voltage is measured after a programmable blanking time after turn-on
of the switch. An appropriate current sensing resistor RCS,PFC is selected on the basis of the maximum current
flowing in the switching MOSFET and the dynamic voltage range of the input pin CSPFC.
Vg
L
Vbus
RZCD,1,PFC
D1
GDPFC
RCS,PFC
CSPFC
RZCD,2,PFC
VCC
Figure 4
3.1.2
Shared CS/ZCD Schematic
Quasi-resonant Mode
The quasi-resonant mode maintains a high efficiency level.
For PFC operating in QRM1, the main switch is turned on with a constant on-time for a line and load condition,
while the off-time/demagnetization time varies within an Alternating Current (AC) half-cycle depending on the
instantaneously rectified AC input voltage Vg. Subsequently, the switching frequency varies within each AC halfcycle with the lowest switching frequency at the peak of the AC input voltage and the highest switching
frequency near the zero crossings of the input voltage. A new switching cycle starts immediately when the first
QR valley is reached.
Data Sheet
9
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
QRM1 is ideal for full-load operation, where the on-time is large. However, the on-time reduces at light loads,
resulting in very high switching frequencies, particularly near the zero crossings of the input voltage. The high
switching frequency will increase switching losses, resulting in poor efficiency at light loads. The PFC
multimode control can lower the switching frequency by selecting further valleys to achieve QRM2 up to
Nvalley,max,PFC operation. The switching frequency is limited within a defined range and the efficiency at light
loads improves.
tsw
iL
1
iL , pk
2
0
ton
vCSPFC
vL,pk
vL,sampled
0
Figure 5
tsw
iL,pk
tw
iL,ave
t
t1stV
tosc
4
ton
2
t
tdisch
QRM1 QRM2
QRM1
PFC QRM2 Waveforms
The equations for the quasi-resonant operation are shown below, where tw is an additional delay in each
switching cycle when selecting subsequent valleys after the first QR valley and n is the valley number in QRMn.
V g · ton
L
iL, pk · L
tdisch =
V bus − V g
iL, pk =
t1stV = tdisch + tosc /2
tw = tosc · n − 1
tsw = ton + t1stV + tw
tof f = t1stV + tw
Equation 1
3.1.3
Bus Voltage Sensing
The bus voltage is measured at the VS pin.
The VS pin implements PFC bus voltage sensing for bus voltage regulation. The bus voltage is scaled down
using a simple resistor divider. A capacitor could in certain cases be added at the pin to ground to filter highfrequency switching noise. The bus voltage sensing is a low leakage input and no additional measures are
needed to reduce the current consumption.
Data Sheet
10
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Vbus
RVS,1
VS
RVS,2
Figure 6
Bus Voltage Sensing Schematic
The Analog-to-Digital Converter (ADC) input at the VS pin utilizes two voltage ranges. The wider voltage range
from 0 to VREF results in lower resolution. The narrower voltage range from 5/6 VREF to 7/6 VREF gives better
voltage resolution. Steady state operation therefore normally takes place in the high-resolution range and soft
start operation in the low-resolution range.
VS
7/6 VREF
High
resolution
range
VREF
5/6 VREF
Low
resolution
range
0V
Figure 7
3.1.4
t
Sensing Ranges
Input Voltage Sensing
The input voltage is sensed using the HV pin.
The input voltage is used for protection, to generate AC zero-crossing signals and to detect the AC/DC source.
Data Sheet
11
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
iac
vac
Input
voltage
Vin
{
RHV
C1
Figure 8
C2
HV
Input Voltage Sensing Schematic
The RHV probing resistor is usually split into two, or three or more resistors for safety purposes. In fact in case of
a resistor being shorted by damage, the high resistive path is maintained by the other resistors avoiding fire,
shock to the user and further damage to the application.
A RC filter structure making use of the split resistors filters the unwanted noise for the high voltage input voltage
measurement. The filtering effect is kept high due to the usage of the high impedance split resistors and the
addition of small capacitance high voltage capacitors.
3.1.5
Control Scheme
The PFC bus voltage controller embeds a PIT1 controller that calculates a control output representing load and
line conditions from the bus voltage error signal.
The bus voltage controller implements regulation during both soft start and steady states.
3.1.5.1
Startup
At system startup, the PFC initiates a soft start to minimize the switching stress for the power MOSFET, diode
and inductor.
The soft start is executed when the bus voltage is higher than the Vbus,start,PFC threshold. This is the brown-in
condition. The soft start is aborted if the input under- or overvoltage protection fire. During soft start, the PFC
stays in QRM1 operation. Once the Vbus,stdy,entr,UV threshold is reached, the steady state PFC operation starts.
Data Sheet
12
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Vbus
Vbus,set
Vbus,stdy,entr,UV
Vbus,start,PFC
VCC startup
passive charging
charging
Figure 9
3.1.6
steady state
t
Vbus Soft Start and Regulation
Multimode Control Scheme
The multimode control scheme provides a PFC option to dynamically change the operating point by switching
between the MOSFET Vds voltage valleys while following a frequency law and applying THD optimization.
The multimode controller uses two different modes of operation:
• QRM1: This operation maximizes the efficiency by switching on the 1st valley of the PFC ZCD signal. This
ensures zero current switching with a minimum of switching losses.
• QRMn: The controller will extend to the next switching valley after the 1st valley to control the bus voltage
following a frequency law.
The multimode optimization consists of the following:
• Frequency law
• THD optimization
3.1.6.1
Frequency Law
The output of the PFC PIT1 bus voltage controller gives the desired on-time, which is constant within each AC
half cycle. A PFC is used to emulate a resistive load re to the AC input such that iac follows vac in both wave shape
and phase. The output of the PFC bus voltage controller ton,des,PFC is inversely proportional to the emulated
resistive load re such that a smaller re or a higher Iac,rms will give a larger ton,des,PFC. Thus, ton,des,PFC is different
for the same load at different line voltages and is proportional to the RMS input current Iac,rms.
The rule for selecting QRMn is based on the frequency law. A maximum switching frequency fswmax and a
minimum switching frequency fswmin are defined for the complete ton,des,PFC/Iac,rms range. The frequency law
ensures that the switching frequency is within the desired frequency range. The frequency law is depicted in the
figure below.
Data Sheet
13
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
fswmax
M1
QR 2
M
QR 3
M
QR 4
M
QRM5
QR
fsw
fswmin
sample
operating
point
Figure 10
ton,des,PFC
/ Iac,rms
PFC Frequency Law
As long as the PFC controller operating mode fulfills the frequency law, the operating mode does not change.
The QR-valley is increased when the highest frequency limit is reached. The QR-valley is decremented when the
lowest frequency limit is reached.
To ensure good ZCD detection before the ZCD signal becomes too small in amplitude, only the first up to
Nvalley,max,PFC valleys operations are supported.
3.1.6.2
THD Optimization
THD optimization reduces the THD in the case of light loads and in the case of high AC input voltages.
The selection of higher valleys helps to reduce the switching frequency but it also distorts the input current
waveform with constant on-time control and thus affects the PFC THD performance. The multimode PFC
control also consists of a THD optimization algorithm that optimizes the applied on-time in order to ensure
good input current shaping and improved PFC THD performance.
3.1.7
Peak Current Limitation
The peak current through the switching MOSFET is read via the PFC shunt resistor RCS,PFC to limit the maximum
current through the MOSFET, the choke, and freewheeling diode so as to avoid potential hard failure or lifetime
stress.
The OCP causes the current to be limited to cases in which an overcurrent condition occurs. Overcurrent
Protection Level 1 (OCP1) is implemented by hardware. If the voltage VCS,PFC across the shunt resistor exceeds
the overcurrent threshold VCS,OCP1, PFC for longer than the blanking time tblank,OCP1,PFC, the MOSFET is turned off.
The MOSFET is turned on when ZCD occurs or the PFC maximum period time-out signal triggers the start of the
next switching cycle. Overcurrent Protection Level 2 (OCP2) is a second-level overcurrent protection
implemented by hardware. The OCP2 overcurrent threshold is fixed. The OCP2 blanking time is tblank,OCP2,PFC.
3.1.8
Bus Undervoltage Protection
Undervoltage detection of the bus voltage Vbus is provided by measurement using the VS pin.
The bus voltage is compared to a configurable undervoltage protection threshold Vbus,UV. If the threshold is
exceeded for longer than the blanking time tblank,Vbus,UV, the protection will be triggered.
Data Sheet
14
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.1.9
Bus Overvoltage Protection
Overvoltage detection of the bus voltage Vbus is provided by the measurement using the VS pin.
The bus voltage is compared to a configurable overvoltage protection threshold Vbus,OVP1 in Firmware (FW). If a
threshold is exceeded for longer than the blanking time tblank,Vbus,OVP1, the gate driver stops. The gate driver
operation is resumed when Vbus falls below Vbus,stdy,entr,OV.
Vbus,OVP2 is implemented in Hardware (HW) and it is fixed at a voltage which is represented as 2.8 V at the bus
voltage sensing pin (VS). The HW permits a blanking time tblank,Vbus,OVP2 to be programmed.
Vbus
Vbus,ovp2
Vbus,ovp1
Vbus,stdy,entr,OV
Vbus,set
Vbus,uv
t
Figure 11
3.1.10
Vbus protections
Input Undervoltage Protection
Undervoltage detection of the input voltage Vin is provided by measurement using the HV pin.
Values of Vin,rms are compared to a configurable input undervoltage protection threshold Vin,UV. If the threshold
is exceeded for longer than the blanking time tblank,Vin,UV, the protection will be triggered. XDPL8220 features a
configurable startup threshold Vin,start,min to create hysteresis for flicker-free operation before the second stage
starts switching. After startup checks when trms,reset,PFC expires, the comparison is restored to the threshold
value Vin,UV.
3.1.11
Input Overvoltage Protection
Overvoltage detection of the input voltage Vin is provided by measurement using the HV pin.
Values of Vin,rms are compared to a configurable input overvoltage protection threshold Vin,OV. If the threshold is
exceeded for longer than the blanking time tblank,Vin,OV, the protection will be triggered. XDPL8220 features a
configurable startup threshold Vin,start,max to create hysteresis for flicker-free operation before the second stage
starts switching. After startup checks when trms,reset,PFC expires, the comparison is restored to the threshold
value Vin,OV.
Note:
Data Sheet
In the csv file the input OVP shall be disabled by default.
15
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Vin
Vin,OV
Vin,start,max
Vin,start,min
Vin,UV
t
trms,reset,PFC
Figure 12
Vin protections
3.1.12
Other PFC Protections
CS Resistor Short Protection
The input circuit breaker (fuse) shall be chosen appropriately in order to protect in case of current-sense resistor
short.
CS Resistor Open Protection
The external circuitry for shared CS/ZCD pulls the CSPFC pin high in case of CS resistor missing so that the OCP2
protection is triggered.
CSPFC Pin Short to GND Protection
In case of CSPFC pin short to ground the lack of quasi-resonant oscillations shall trigger the CCM Protection.
CCM Protection
Continuous conduction mode (CCM) operation may occur during PFC startup for a limited time. It is considered
as a failure in the system only if CCM operation of the PFC converter is observed over a longer period of time.
The PFC converter may run into CCM operation for a longer period due to a shorted bypass diode, a heavy load
step that is out of specification or very low input voltage outside the normal operating range.
When CCM occurs, the magnetizing current in the PFC choke does not have the chance to decay to zero before
the MOSFET turns on. No quasi-resonant oscillation will be seen at the ZCD signal before the maximum
switching period time-out is reached that turns the MOSFET on. This turn-on event without ZCD oscillation is
monitored to protect the PFC converter from continuous CCM operation. The CCM protection is implemented by
firmware.
If any quasi-resonant oscillation is seen at the ZCD signal for longer than the blanking time tblank,CCM,PFC, the
protection is triggered.
Soft Start Failure
The soft start may take a long time, potentially never reaching steady state operation due to heavy loads or very
low input voltages. If tstart,PFC reaches tstart,max,PFC before the soft start has ended, the protection is triggered.
Data Sheet
16
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.2
Flyback Controller Features
The FB stage provides primary side control that avoids secondary side control feedback loop circuitry usually
needed in isolated power converters. This approach supports a low part count to reduce costs.
The FB stage features multi-mode operation and it selects the best mode of operation based on operating
conditions.
3.2.1
Primary Side Regulation
The FB in XDPL8220 provides primary side control of output current and output voltage. No external feedback
components are necessary for the current control as the primary side regulation control loop is fully integrated.
Figure 13 shows typical current and voltage waveforms of the FB application operating in QRM1.
In DCM, the next switching cycle will not start at the first valley of VAUX, but is instead delayed. As a consequence,
the switching losses in DCM will be higher.
The primary peak current Ip,pk, the period of conduction of the output diode tdemag and the switching period
tsw,FB are used to calculate the average output current.
The voltage signal VAUX of the auxiliary winding of the transformer contains information on the reflected output
voltage Vout. The reflected output voltage is measured at the ZCD pin using a resistor divider.
Data Sheet
17
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
VAUX
Output voltage
sampling
Zero crossing detection
0V
Bus voltage
sampling
Valley switching
Ip
time
tCS,sample
Is
Vbus
Vout
tZCD,sample
Itransformer
Np
Na
tsw,FB
Ns
Ip,pk
Ip
VAUX
Ip
Is
time
tdemag
VGD
time
Figure 13
Typical Waveforms of a Flyback Converter
3.2.1.1
Primary Side Current Sensing
The primary side peak current Ip,pk is controlled by the control loop using the VCS,OCP1 level at the CSFB pin. This
control scheme ensures suppression of any variation in the bus voltage.
Several delays exist from the time at which the OCP1 level VCS,OCP1 is exceeded at the CSFB pin until the gate
switches off and the transformer current finally reaches its peak value. For a higher accuracy, the primary peak
current VCS,SH is sampled a fixed time before turn-off of the gate. The primary side peak current is used to
calculate the secondary side current and for protection. The propagation delay compensation parameter tPDC
allows optimization of the accuracy of the primary side peak current:
Ip, pk =
V CS, SH
RCS, FB
⋅
ton, FB + tPDC
ton, FB − tCSFB, offset
Equation 2
Data Sheet
18
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Note:
If an RC low pass filter is added in front of the CSFB pin, the related low pass filter delay has to be
included in tPDC.
Ip
Ip,pk =
VCS,pk
RCS,FB
VCS,SH
RCS,FB
t
tPDC
VGD
tCSFB,offset
t
ton,FB
Figure 14
Propagation Delay Compensation for accurate Primary Peak Current Calculation
3.2.1.2
Primary Side Output Voltage Sensing
The output voltage is determined by measuring the reflected output voltage on the auxiliary winding. A resistor
divider adapts the voltage to the operating range of the ZCD pin.
The output voltage is measured at the ZCD pin using the voltage VZCD,SH at the end of the demagnetization time
at the time tZCD,sample. The voltage measured at the ZCD pin, the dimensioning of the resistor dividers RZCD,FB,1
and RZCD,FB,2 , transformer turns Ns and Na as well as an offset V out,offset (caused by the secondary diode, for
example) are used to calculate the output voltage Vout as follows:
V out = V ZCD, SH
RZCD, FB, 1 + RZCD, FB, 2 Ns
RZCD, FB, 2
Na
+ V out, offset
Equation 3
Vout is used for Primary Side Regulated (PSR) control loops in CV and LP modes as well as for output over- and
undervoltage protections.
Vout,offset
Na Ns
RZCD,FB,1
VOut
ZCD
VZCD,SH
RZCD,FB,2
Figure 15
Primary Side Output Voltage Sensing using ZCD S&H
Note:
Any relation between VCC and ZCD in self-supplied applications can be decoupled – e.g. by adding a
linear regulator for VCC.
Data Sheet
19
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Attention: Please note that the time (tdemag) has to be longer than 2.0 μs to ensure that the reflected output
voltage can be sensed correctly at the ZCD pin.
3.2.1.3
Flyback Bus Voltage Sensing
The FB can sense the bus voltage using the reflection of bus voltage on the auxiliary winding while the gate is
turned on. A resistor divider adapts the negative voltage to the operating range of the ZCD pin. This second
measurement path is required to protect against component failures in the VS measurement path (open loop
protection for the PFC stage).
The reflected bus voltage appears as a negative voltage at VAUX. This negative voltage is internally clamped at
the ZCD pin to the negative voltage VINPCLN. The internal clamping current IZCD is measured at the end of the ontime at the time tCS,sample. The measured clamping current of the ZCD pin, the dimensioning of the resistor
dividers RZCD,FB,1 and RZCD,FB,2 as well as the number of transformer turns Na and Np are used to calculate the
bus voltage Vbus,FB as follows:
V bus, FB = IZCD +
V INPCLN
RZCD, FB, 2
RZCD, FB, 1 + V INPCLN
Np
Na
Equation 4
Vbus,FB is used for plausibility checks with the voltage Vbus as measured using the VS pin.
Na
RZCD,FB,1
ZCD
Np
Vbus,FB
IZCD
VINPCLN
RZCD,FB,2
Figure 16
Voltage Sensing using ZCD Clamp Current
3.2.1.4
Output Current Calculation
The output current is calculated based on the primary side peak current and the timing of the switching cycle.
The output current Iout is calculated using the duration of conduction of the output diode tdemag, the switching
period tsw,FB as well as the number of transformer turns Np, Ns and the transformer coupling Kcoupling. The
following equation is valid both in QRM1 and DCM:
1
Iout = 2 Ip, pk ⋅
Np
Ns
⋅ K coupling ⋅
tdemag
tsw, FB
Equation 5
The coupling of the transformer can be approximated using the transformer primary inductance Lp and the
transformer primary leakage inductance Lp,lk as follows:
K coupling ≈
Lp
Lp + Lp, lk
Equation 6
The calculated current Iout is used for the control loop in the modes CC and LP. The calculated current is also
used for output overcurrent protection.
Data Sheet
20
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.2.1.5
Output Control Scheme
The XDPL8220 includes three different control schemes for a CC, CV or LP output.
Different use cases require the controller to operate according to different operation schemes:
• In the case of typical LED strings, the forward voltage of the LED string determines the output voltage of the
driver. XDPL8220 operates in CC and drives a constant output current Iout,full to the load. The forward voltage
of the connected LED string has to be below a configurable maximum value Vout,set.
• In the case of LED loads including a power stage (e.g. Infineon BCR linear regulators or Infineon DC/DC buck
ILD2111), XDPL8220 operates in CV, ensuring a constant voltage Vout,set to the load. The total output current
drawn by the load has to be below a configurable maximum value Iout,full.
• In the case of a high output current setpoint Iout,full and an overly long LED string which exceeds the
configurable power limit Pout,set, XDPL8220 operates in LP to ensure that the power limit of the driver is not
exceeded. The controller reduces the output current automatically, ensuring light output without any
interruption even for overly long LED strings. The forward voltage of the connected LED string has to be
below a configurable maximum value Vout,set.
For every update of the control loop, the control scheme is selected on the basis of the current operation
conditions (output voltage Vout and output current Iout) and their distance to the three limiting setpoints
(Vout,set, Pout,set and Iout,full):
• For CC schemes, the internal reference current Iout,full is weighted according to thermal management and a
dimming curve to yield Iout,set. The calculated output current Iout is compared with the weighted reference
current Iout,set to generate an error signal for the output current.
• For CV schemes, the sensed output voltage Vout at the ZCD pin is compared to a reference voltage Vout,set to
generate an error signal for the output voltage.
• For LP schemes, the output current is limited to a maximum of Iout,set = Pout,set / Vout.
Out of these three schemes, for each step the most critical error is selected (see Figure 17 ):
1. If any setpoint is exceeded, the largest error for power decrease is selected to bring the controller back to the
desired operating point as quickly as possible.
2. If the current operating conditions are below all three setpoints, the smallest error for power increase is
selected to avoid overshooting any setpoint.
The selected error signal is fed into a compensator to control the gate driver switching parameters (i.e. duty
cycle and frequency) for the power MOSFET of the FB.
Output
voltage
Vout,OV
Output
open
Pout,set
Pout,OPP
Vout,set
Constant voltage
Limited
power
Constant
current
Vout,start
Vout,UV
Iout,min
Figure 17
Output
short
Iout,full Iout,OCP
Output current
Control Scheme for CC/CV/LP Modes (Non-Dimmed)
In dimming cases, the output current setpoint Iout,set is located between Iout,min and Iout,full and varies according
to the sensed PWM duty cycle DDIM. Dimming can be visualized by moving the vertical line for the output current
setpoint in Figure 18 from right to left.
Data Sheet
21
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Note:
An operation in limited power mode can cause dimmer dead-travel until the controller enters
constant current mode.
Output
voltage
Output
open
Vout,OV
Legend:
Pout,set
Operating range
Constant voltage
Vout,set
Limited
power
Dimming
Vout,start
Vout,UV
Constant
current
Output
short
Dim-to-Off
Iout,min
Figure 18
Iout,full
Output current
Control Scheme for CC/CV/LP Modes (including Dimming)
One or more of the output control schemes can be deactivated by configuration of the setpoints. Some
examples are given below:
• The LP scheme is not active for Pout,set > Vout,set * Iout,full. For such a configuration, the controller will only
select between a CC and CV scheme.
• The CV scheme is not active for Vout,set = Vout,OV as the output overvoltage protection will be triggered.
• The CC scheme is not active for Iout,full = Iout,OC as the output overcurrent protection will be triggered.
3.2.1.6
Multimode Scheme
The control loop of XDPL8220 uses two different switching modes. QRM1 is optimized for high efficiency at high
loads while DCM is used in light load conditions.
Power
VCS,max,FB
Peak-current controlled
Pmax
QRM1
VCS,min,FB
tsw,min,FB
Frequency controlled
DCM
tsw,max,FB
Bus Voltage
Pmin
Vbus,UV
Figure 19
Vbus,OVP1
Flyback Multimode Operation Scheme
• QRM1: This mode maximizes the efficiency by switching on the 1st valley of the VAUX signal. This ensures zero
current switching with a minimum of switching losses. The power is controlled by regulating the primary
peak current using VCS,OCP1.
• DCM: This mode is used if VCS,OCP1has reached its minimum value VCS,min,FB. To allow lower output power, the
controller extends the switching period later than the 1st valley .
Data Sheet
22
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
The minimum power is limited by the transformer primary inductance Lp, maximum switching period
tsw,max,FB and minimum primary peak current Ip,pk,min:
Pmin =
1
2
⋅ Lp ⋅ Ip, pk, min2 ⋅
1
tsw, max, FB
Equation 7
The minimum primary peak current Ip,pk,min is restricted by:
Ip, pk, min = tdemag, min ⋅
Np
Ns
⋅
V out, OV
Lp
Equation 8
Note:
3.2.2
If the load drops below the minimum load of Pmin, the output voltage will rise up to the output
overvoltage threshold Vout,OV and trigger the protection. An auto-restart can be used to keep the
output voltage close to Vout,OV until the load increases again.
Flyback Startup
After startup, the FB of the XDPL8220 initiates a soft start to minimize the switching stress for the power
MOSFET and secondary diode.
The cycle-by-cycle current limit is increased in steps of VCS,step with a configurable duration tsoftstart for each
step. After the final VCS,OCP1,start limit level has been reached, the output will be charged until the minimum
output voltage Vout,start, which ensures self-supply has been reached. At this condition, Continuous Conduction
Mode (CCM) protection as well as output undervoltage protection are activated and the control loop takes over.
The starting point for the control loop is to operate in DCM at lowest switching frequency and shortest on-time.
These switching parameters avoid any overshoot of output current for short LED string in dimmed conditions.
Output voltage
Peak current
Startup
Soft start phase
Output
charging
phase
Control loop
active
Vout
Vout,start
VCS,OCP1
VCS,OCP1,start
Startup Check
VCS,step
time
tsoftstart
Figure 20
Data Sheet
Flyback Startup Sequence
23
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.2.3
Protection Features
Protections ensure the operation of the controller under restricted conditions. Protections are triggered if fault
conditions are present longer than the blanking times configured for each protection3). The controller will react
to a triggered protection as configured.
Attention: The controller may continue operation after exceeding protection thresholds because of
blanking times. All protection thresholds have to be set with respect to tolerances, blanking
times and worst case transients.
Value
Value
Upper
Threshold
Lower
Threshold
Time
Time
tblank
Figure 21
3.2.3.1
tblank
Blanking Times cause Excess of Threshold
Primary Overcurrent Protection
The primary side overcurrent protection implemented in hardware covers fault conditions like a short in the
transformer primary winding or an open CS pin.
The primary side current is compared to a configurable overcurrent protection threshold VCS,OCP2. If the
threshold is exceeded for longer than the blanking time tOCP2,FB, the protection will be triggered.
3.2.3.2
Output Undervoltage Protection
In the case of a short in the output, the output voltage may drop to a very low level. Detection of undervoltage
in the output voltage Vout is enabled by measurement of the reflected voltage at the ZCD pin.
During operation, the output voltage is compared to a configurable undervoltage protection threshold Vout,UV. If
the threshold is exceeded for longer than the blanking time tblank,out,UV, the protection will be triggered. This
protection threshold Vout,UV is disabled during startup.
During startup, the protection operates differently: In case the FB cannot charge the output voltage to Vout,start
during a timeout of tstart,max,FB, the protection will be triggered. This timeout starts when the FB is started.
Note:
3.2.3.3
The startup threshold Vout,start has to be configured over and above the undervoltage threshold Vout,UV
to allow undershoots at startup which may occur, especially for resistive loads.
Output Overvoltage Protection
In case of a open output, the output voltage may rise to a high level. Overvoltage detection of the output
voltage Vout is provided by measurement at the ZCD pin.
The output voltage is compared to a configurable overvoltage protection threshold Vout,OV. If the threshold is
exceeded for longer than the blanking time tblank,out,OV, the protection will be triggered.
3
except VCC undervoltage protection
Data Sheet
24
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Note:
The blanking time tblank,Vout,OV should be set to the minimum value to minimize overshoots of the
output voltage above the protection threshold.
Note:
This protection is usually triggered if the output is open or the output load drops below the minimum
load Pmin.
3.2.3.4
Output Overcurrent Protection
Overcurrent detection in the output current Iout is provided on the basis of the calculated output current.
The calculated output current is compared to a configurable overcurrent protection threshold Iout,OC. If the
threshold is exceeded for longer than the blanking time tblank,out,OC, the protection will be triggered.
3.2.3.5
Output Overpower Protection
Overpower detection in the output power Pout is provided on the basis of the calculated output power.
The calculated output power is compared to a configurable overpower protection threshold Pout,OP. If the
threshold is exceeded for longer than the blanking time tblank,out,OP, the protection will be triggered.
3.2.3.6
Other Flyback Protections
XDPL8220 includes additional protections to ensure the integrity and correct flow of the firmware.
• A hardware weak pull-up protects against an open CSFB pin.
• A firmware watchdog protects against the CSFB pin becoming shorted to GND.
• A firmware state monitor supervises correct operation of the flyback in QRM1 or DCM. A protection is
triggered if the flyback enters CCM.
• A firmware check ensures that the PFC has already boosted the bus voltage sufficiently before the FB starts.
• A firmware plausibility check ensures that the bus voltage measurement using the VS pin is correct.
Data Sheet
25
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.3
General Controller Features
XDPL8220 provides general features for firmware task scheduling, VCC control and temperature control which
are independent of the target application.
3.3.1
External Temperature Sensing
The external temperature is measured by measuring the voltage of an NTC with respect to the internal VREF
voltage.
Controller
VREF
RPU
TEMP
VTEMP
Figure 22
RNTC
External Temperature Sensing using NTC
The controller calculates the resistance of the NTC based on the measured voltage VTemp, the internal reference
voltage VREF and the internal pull-up resistance RPU:
RNTC =
V Temp ⋅ RPU
V REF − V Temp
Equation 9
3.3.2
Adaptive Temperature Protection
XDPL8220 offers adaptive temperature protection using internal and/or external temperature sensors. This
feature reduces the output current according to temperature to protect the load and driver against
overtemperature.
Whenever the temperature Thot is exceeded, the current is gradually reduced from the maximum current Iout,set,
as shown in Figure 23 . If the temperature drops below Thot, the output current is increased again. This allows
the controller to ensure operation at or below a temperature of Thot.
If a reduction down to a minimum current Iout,red is not able to compensate for any continued increase in
temperature, XDPL8220 will eventually trigger overtemperature protection if Tcritical is exceeded. If the
controller is configured to react with auto-restart to the overtemperature protection, it will only restart after the
temperature dropped below Thot.
Output Current
Output Current
Iout,full
Iout,full
Iout,red
Iout,red
T≤Thot
Thot Tcritical
Figure 23
Data Sheet
Temperature
T>Thot
T=Thot T≤Thot T=Thot
Time
Adaptive Temperature Protection
26
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Note:
Please note that the internal temperature sensor can only protect external components which have
sufficient thermal coupling to XDPL8220. The external temperature sensor can be used to protect the
temperature of external components (e.g. power MOSFETs or linear regulators).
3.3.3
PWM Dimming Interface
The duty cycle sensed at the PWM pin is used to determine the output current level. The XDPL8220 can be
configured to use either a linear or a quadratic dimming curve. Either normal or inverted dimming curves can
be selected.
Figure 24 shows the relationship of the PWM duty cycle to the output current target value. Configurable levels
DDIM,min and DDIM,max ensure that the minimum current Iout,min and maximum current Iout,set can always be
achieved, thereby making the application robust against component tolerances.
An optional hysteresis can be enabled for the sensing of the PWM signal. This hysteresis can suppress jitter in
the PWM signal. Any change of the PWM duty cycle within the hysteresis will not affect the output current.
Output current
Output current
Iout,full
Iout,full
Iout,min
DDIM,off
DDIM,on
DDIM,min
DDIM,max
Iout,min
PWM duty cycle
DDIM,off
PWM duty cycle
Output current
Output current
Iout,full
Iout,full
Iout,min
DDIM,max
Figure 24
DDIM,on
DDIM,max
DDIM,min
DDIM,min
PWM duty cycle
DDIM,on
DDIM,off
Iout,min
DDIM,max
DDIM,min
DDIM,on
PWM duty cycle
DDIM,off
Selectable Dimming Curves
Using the optional Dim-to-Off feature, the light output can be stopped without removal of input voltage. In Dimto-Off, the controller will enter auto-restart operation to minimize power consumption. The auto-restart
recharges the output voltage to a minimum output voltage of Vout,start to measure the PWM duty cycle. With this
feature, the output voltage can be maintained in a specific range by configuration of the startup voltage Vout,start
and auto-restart time tAR, and by dimensioning of an active or passive output bleeder. If Vout,start is configured to
be low enough below the minimum forward voltage of the LED string, the LEDs will show no light in this state.
Note:
Data Sheet
Either an active or passive output bleeder is required to allow the controller to maintain the output
voltage if the Dim-to-Off feature is enabled.
27
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
Dim-to-Off is entered if the PWM duty cycle exceeds the configurable threshold DDIM,off (see purple line in Figure
24 ). As soon as the duty cycle exceeds DDIM,on, the controller will start to continuously regulate output voltage
or output current again.
3.3.4
Protection Features
Protections ensure the operation of the controller under restricted conditions. Protections are triggered if fault
conditions are present longer than the blanking times configured for each protection4). The controller will react
to a triggered protection as configured.
Attention: The controller may continue operation after exceeding protection thresholds because of
blanking times. All protection thresholds have to be set with respect to tolerances, blanking
times and worst case transients.
Value
Value
Upper
Threshold
Lower
Threshold
Time
Time
tblank
Figure 25
3.3.4.1
tblank
Blanking Times cause Excess of Threshold
Overtemperature Protection
Overtemperature protection initiates a shutdown once the critical temperature level Tcritical is exceeded.
Figure 26 shows the temperature hysteresis formed by the critical temperature Tcritical and maximum turn-on
threshold Thot if auto-restart is enabled for temperature protection.
If latch mode is selected instead, the IC will turn off and only restart after recycling of input power with a
temperature below Tcritical.
Output current
Iout,full
Thot T critical
Figure 26
4
Temperature
Temperature Protection
except VCC undervoltage protection
Data Sheet
28
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.3.4.2
VCC Undervoltage Protection
A Undervoltage Lockout (UVLO) is implemented in hardware. It ensures defined enabling and disabling of the
Integrated Circuit (IC) operation depending on the supply voltage VVCC at the VCC pin in accordance with
defined thresholds.
The UVLO contains a hysteresis with the voltage thresholds VVCC,on for enabling the IC and VVCC,off for disabling
the IC. Once the mains input voltage is applied, current flows through an external resistor into the HV pin via the
integrated depletion cell and diode to the VCC pin. The IC is enabled once VVCC exceeds the threshold VVCC,on and
enters normal operation if no fault condition is detected. In this phase, VVCC will drop until either external supply
or the self-supply via the auxiliary winding takes over the supply at the VCC pin.
In the case of output short or strong capacitive loading, the auxiliary winding cannot provide power to VVCC. A
timeout of tstart,max is available to respond to this failure condition.
Note:
The self-supply via the auxiliary winding must be in place before the output short timeout occurs or
before VVCC falls below the VVCC,off threshold. Otherwise, the system will perform a fast restart.
Note:
It is possible to supply VCC externally from an auxiliary power supply. In this case, the VCC also needs
initially to ramp to VVCC,on to enable the IC.
3.3.4.3
VCC Overvoltage Protection
Overvoltage protection ensures that the voltage at the VCC pin is not exceeded.
The VCC voltage is compared to a configurable overvoltage protection threshold VVCC,OV. If the threshold is
exceeded for longer than the blanking time tblank,VCC,OV, the protection will be triggered.
Note:
3.3.4.4
The reaction to this protection is fixed to stop mode to ensure a discharge of VCC.
Other General Controller Protections
XDPL8220 includes several protections to ensure the integrity and correct flow of the firmware.
• A hardware watchdog checks correct execution of firmware. A protection is triggered in the event that the
firmware does not service the watchdog within a defined period.
• A hardware Random Access Memory (RAM) parity check triggers a protection if a bit in the memory changes
unintentionally.
• A hardware clock check watchdog checks that no clock oscillator is failing.
• A firmware Cyclic Redundancy Check (CRC) at each startup verifies the integrity of firmware code and its
parameters.
• A firmware task execution watchdog triggers a protection if the firmware tasks are not executed as expected.
3.3.5
Protection Reactions
The reaction to each protection can be separately selected. Available reactions may include auto restart, fast
auto restart, latch or stop mode.
Figure 27 depicts the timing of an auto-restart reaction:
1. If a protection threshold is exceeded for longer than the related blanking time tblank, the protection is
triggered.
2. Within a maximum t1 = 4 * 32 µs, the gate driver of the power stage related to the protection is disabled.
3. Within a maximum t2 = 4 * 32 µs, the gate drivers of other stages are disabled.
4. The reaction depends on the configuration of the protection:
• In case of latch mode, the application will enter latch mode at this time. No further steps are done, the
reaction ends here.
Data Sheet
29
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
• In case of stop mode, the application will stop and enter UART parametrization mode which allows to
read out the error code. No further steps are done, the reaction ends here.
• In case of a (fast) auto-restart reaction, the controller will enter a power saving mode for the auto-restart
time tAR or tAR,fast respectively.
5. The auto restart may include a new VCC charging cycle. The time t3 typically depends on the input voltage.
6. The first power stage will enable its gate driver according to its startup sequence (soft start) again.
7. The second power stage will enable its gate driver according to its startup sequence (soft start) again. The
startup of a subsequent power stage may be delayed by a time t4 depending on any startup condition for the
subsequent stage.
Threshold is exceeded
Protection is triggered
Related gate driver is disabled
Other gate drivers are disabled
Startup, charging of VCC
Restart of the first stage
Restart of the second stage
Value
Threshold
Other gate driver
Related gate driver
Time
tblank t1
Figure 27
3.3.5.1
t2
tAR
t3
t4
Protection Reaction for auto-restart
Auto restart
When auto restart mode is activated, XDPL8220 stops switching at the GD pins. After a configurable auto restart
time tAR, XDPL8220 initiates a new startup with soft start.
During the time in which the gate is not switching, the internal HV startup cell is automatically enabled and
disabled to keep the VCC voltage between the VUVLO and VOVLO thresholds for the supply of XDPL8220.
3.3.5.2
Fast Auto Restart
When fast auto restart mode is activated, XDPL8220 stops switching at the GD pins. After a configurable fast auto
restart time tAR,fast, XDPL8220 initiates a new startup with soft start.
During the time in which the gate is not switching, the internal HV startup cell is automatically enabled and
disabled to keep the VCC voltage between the VUVLO and VOVLO thresholds for the supply of XDPL8220.
Data Sheet
30
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Functional Description
3.3.5.3
Latch Mode
When latch mode is activated, XDPL8220 stops switching at the GD pins. The device stays in this state until input
voltage is completely removed and the VCC voltage drops below the VUVLO threshold. Only then can XDPL8220
be restarted by applying input voltage.
To maintain this state, the internal HV startup cell is automatically enabled and disabled to keep the VCC
voltage between the VUVLO and VOVLO thresholds for the supply of XDPL8220. The current consumption is
reduced to a minimum.
3.3.5.4
Stop Mode
When stop mode is activated, XDPL8220 stops switching at the GD pins. XDPL8220 enters UART communication
mode to allow debugging of the system state.
Note:
Data Sheet
The VCC for XDPL8220 needs to be supplied by an external source. Without an external supply, VCC will
drain to VUVLO and XDPL8220 performs a restart.
31
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
4
Design Support
XDPL8220 is a configurable digital platform product. It can be configured to meet a wide range of application
requirements.
4.1
Design Procedure
Infineon provides support of the design procedure for lighting applications using Infineon's digital platform ICs.
A lighting application is designed in a few simple steps using Infineon's digital platform ICs as follows:
1. The Infineon XDPL8220 reference board and the XDPL8220 Reference Board Test Report demonstrate the
features and performance of the XDPL8220 in a typical application.
2. Parameters of the XDPL8220 reference board can easily be fitted to any application's requirements. The
isolated .dp Interface Gen2 is connected to XDPL8220 via Universal Serial Bus (USB). The GUI tool .dp Vision
is included with the .dp Interface Gen2. .dp Vision allows interactive changing of parameters. The usage of .dp
Vision is explained in the .dp Vision User Manual.
3. To further adapt the XDPL8220 to application requirements, customers can design their own specific boards.
The steps used to design a board are explained in the XDPL8220 Design Guide. .dp Vision can be used
together with the .dp Interface Gen2 to connect to customer-specific designs based on XDPL8220. This setup
can be used for rapid prototyping. The tooling allows fine-tuning of parameters and development of multiple
parameter sets – e.g. to reuse the same for different product variants of an application.
4. For mass production, the XDPL8220 Programming Manual documents the necessary interfacing and
procedures to integrate the parameter configuration of XDPL8220 into the production line. Figure 28 shows
two options to easily apply the configuration of the IC during production tests:
• One option is to use the isolated .dp Interface Gen2, which can be accessed with USB commands.
• Another option is to directly use the UART interface of the XDPL8220. The correct VCC voltage and UART
communication have to be controlled by the production process in this case.
PC with
GUI tool
Production
process
USB
USB
Isolated .dp
Interface Gen2
VCC
Isolated .dp
Interface Gen2
VCC
4.2
IC
GND
UART
IC
GND
VCC
Production
process
Figure 28
UART
UART
IC
GND
Setup for Parametrization using .dp Interface Gen2 for Interactive Development (top) and
Production (middle and bottom)
List of Configurable Parameters
This list provides information about configurable parameters, including their permitted range and granularity.
Typical example values are also provided.
Table 2
Parameters for Hardware Configuration
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Na
FB auxiliary winding turns
34
1
300
1
Np
FB primary winding turns
60
1
300
1
Data Sheet
32
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 2
Parameters for Hardware Configuration (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Ns
FB secondary winding turns
44
1
300
1
RCS,FB
FB current sense resistance
410/2048 Ω
200/2048 Ω
3Ω
1/2048 Ω
RZCD,FB,1
FB ZCD upper resistor
120 kΩ
50 Ω
200 kΩ
50 Ω
RZCD,FB,2
FB ZCD shunt resistor
7.5 kΩ
50 Ω
100 kΩ
50 Ω
RVS,1
VS upper resistor for bus voltage
measurement
9.96 MΩ
500 kΩ
15 MΩ
500 Ω
RVS,2
VS shunt resistor for bus voltage
measurement
52.3 kΩ
22 kΩ
100 kΩ
50 Ω
RHV
HV resistor
100 kΩ
47 kΩ
130 kΩ
50 Ω
Vout,offset
Output voltage offset (e.g. voltage drop
from secondary diode)
-0.625 V
-4.000 V
4.000 V
0.125 V
VGBFB
FB gate driver voltage high level
10.5 V
4.5 V
15 V1)
1.5 V
IGBFB
FB gate driver strength
100 mA
100 mA
500 mA
Selected
steps
VGBPFC
PFC gate driver voltage high level
10.5 V
4.5 V
15 V2)
1.5 V
IGBPFC
PFC gate driver strength
100 mA
30 mA
150 mA
Selected
steps
Table 3
Parameters for PFC Protections
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
tblank,Vbus,OVP
2
Blanking time for bus overvoltage
threshold, level 2
200 ns
0s
640 ns
1 / fmclk
tblank,Vbus,OVP Blanking time for bus overvoltage
threshold, level 1
1
400 us
0s
1 ms
tslot
Vbus,OVP1
490 V
Vbus,stdy,entr,
600 V3)
1/16 V
1 ms
tslot
Bus overvoltage threshold, level 1
OV
tblank,Vbus,UV
Blanking time for bus undervoltage
threshold
500 us
0s
Vbus,UV
Bus undervoltage threshold
300 V
Vbus,start,PFC
Vbus,stdy,entr,U 1/16 V
V
tstart,max,PFC
Maximum PFC soft start time to settle
the bus voltage at startup
200 ms
0s
500 ms
tslot
tblank,Vin,OV
Blanking time for input overvoltage
threshold
100 ms
0s
200 ms
tslot
tblank,Vin,UV
Blanking time for input undervoltage
threshold
100 ms
0s
200 ms
tslot
1
2
3
Limited by VCC - 0.5 V
Limited by VCC - 0.5 V
Limited by the voltage rating of the bus capacitors
Data Sheet
33
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 3
Parameters for PFC Protections (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Vin,OV
Input overvoltage threshold
319 Vrms
Vin,start,max
424 Vrms
1/16 Vrms
Vin,UV
Input undervoltage threshold
76 Vrms
0V
Vin,start,min
1/16 Vrms
Vin,start,max
Maximum input voltage at startup
307 Vrms
Vin,start,min
Vin,OV
1/16 Vrms
Vin,start,min
Minimum input voltage at startup
88 Vrms
Vin,UV
Vin,start,max
1/16 Vrms
tblank,OCP2,PFC Blanking time for the peak current
limitation, level 2
200 ns
1 / fmclk
600 ns
1 / fmclk
tblank,OCP1,PFC Blanking time for the peak current
limitation, level 1
200 ns
1 / fmclk
600 ns
1 / fmclk
VCS,OCP1, PFC
Maximum peak current voltage
0.75 V
0.1 V
1.08 V
0.125 mV
tblank,CCM,PFC
Blanking time for CCM protection
12 ms
0s
30 ms
tslot
ProtectionPF Bit-coded enabling per protection: If set
to 1, protection is enabled.
C,EN
0
65535
One-hot
coded
ProtectionPF Bit-coded reaction per protection: If set
to 1, auto-restart is selected. If set to 0,
C,conf1
either latch mode or stop is selected.
0
65535
One-hot
coded
ProtectionPF Bit-coded reaction per protection: If set
to 1, fast auto restart or stop is selected.
C,conf2
If set to 0, normal auto-restart or latch
mode is enabled.
0
65535
One-hot
coded
ProtectionPF Bit-coded reaction per protection: If set
to 1, limited number of restarts are
C,conf3
enabled. If set to zero, unlimited restarts
will be done.
0
65535
One-hot
coded
ProtectionPF Bit-coded reaction per protection: If set
to 1, VCC charging will be enabled for
C,conf4
auto-restarts.
0
65535
One-hot
coded
Table 4
Parameters for Flyback Protections
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Vout,UV
Output undervoltage threshold
15 V
0V
Vout,start
0.125 V
tblank,Vout,UV
Blanking time for output undervoltage
500 us
0s
1 ms
tslot
tstart,max,FB
Maximum FB startup time to detect an
output short at startup
5 ms
0s
200 ms
tslot
Vout,OV
Output overvoltage threshold
55 V
Vout,start
200 V
0.125 V
tblank,Vout,OV
Blanking time for output overvoltage
500 us
0s
1 ms
tslot
tblank,CCM
Blanking time for CCM protection
500 us
0s
1 ms
tslot
Iout,OC
Output overcurrent threshold
3A
Iout,full
10 A
0.5 mA
tblank,Iout,OC
Blanking time for output overcurrent
500 us
0s
1 ms
tslot
Pout,OP
Output overpower threshold
120 W
Pout,set
300 W
0.5 W
tblank,Pout,OP
Blanking time for output overpower
500 us
0s
1 ms
tslot
Data Sheet
34
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 4
Parameters for Flyback Protections (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
tblank,Vbus,FB
Blanking time for bus voltage
plausibility check
500 us
0s
1 ms
tslot
tblank,CSFB2GN Blanking time for the CSFB-to-GNDshort check
D
100 us
0s
500 us
tslot
tblank,TOSC,FB
40 ms
0 ms
100 ms
20 ms
ProtectionFB, Bit-coded enabling per protection: If set
to 1, protection is enabled.
0
65535
One-hot
coded
ProtectionFB, Bit-coded reaction per protection: If set
to 1, auto-restart is selected. If set to 0,
conf1
either latch mode or stop is selected.
0
65535
One-hot
coded
ProtectionFB, Bit-coded reaction per protection: If set
to 1, Fast Auto-restart or Stop is
conf2
selected. If set to 0, normal Auto-restart
or latch mode is enabled)
0
65535
One-hot
coded
ProtectionFB, Bit-coded reaction per protection: If set
to 1, limited number of restarts are
conf3
enabled. If set to zero, unlimited restarts
are enabled.
0
65535
One-hot
coded
ProtectionFB, Bit-coded reaction per protection: If set
to 1, VCC charging will be enabled for
auto-restarts.
0
65535
One-hot
coded
Blanking time for the tOSC,FB being
overly long check
EN
conf4
Table 5
Parameters for General Protections
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
VVCC,OV
VCC overvoltage threshold
24.75 V
6V
24.75 V
0.125 V
tblank,VCC,OV
Blanking time for VCC overvoltage
5 ms
0s
10 ms
tslot
Protectionge Bit-coded enabling per protection: If set
to 1, protection is enabled.
n,EN
0
65535
One-hot
coded
Protectionge Bit-coded reaction per protection: If set
to 1, auto-restart is selected. If set to 0,
n,conf1
either latch mode or stop is selected.
0
65535
One-hot
coded
Protectionge Bit-coded reaction per protection: If set
to 1, fast auto-restart or stop is selected.
n,conf2
If set to 0, normal auto-restart or latch
mode is enabled)
0
65535
One-hot
coded
Protectionge Bit-coded reaction per protection: If set
to 1, limited number of restarts are
n,conf3
enabled. If set to zero, unlimited restarts
are enabled.
0
65535
One-hot
coded
Protectionge Bit-coded reaction per protection: If set
to 1, VCC charging will be enabled for
n,conf4
auto-restarts.
0
65535
One-hot
coded
Data Sheet
35
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 5
Parameters for General Protections (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
tAR
Auto-restart time
1s
250 ms
4s
250 ms
tAR,fast
Fast auto-restart time
40 ms
5 ms
4s
5 ms
NAR,max
Maximum number of restarts,
afterwards latch
10
0
15
1
Table 6
Parameters for Adaptive Temperature Protection
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Tcritical
Shutoff temperature
110°C
Thot
125°C
1°C
Thot
Temperature for thermal management
100°C
60°C
Tcritical
1°C
RNTC,hot
NTC resistance at Thot
1500 Ω
1Ω
30000 Ω
1Ω
RNTC,critical
NTC resistance at Tcritical
800 Ω
1Ω
30000 Ω
1Ω
tstep
Current reduction time step
2s
1s
20 s
214tslot
Iout,red
Lowest reduced current for thermal
management
200 mA
Iout,min
Iout,full
0.5 mA
Iout,step
Output current step
5 mA
0.5 mA
Iout,full Iout,red
0.5 mA
Table 7
Parameters for Startup and Shutdown
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
tsoftstart
Soft start time step
0.5 ms
0.1 ms
2 ms
tslot
V
Maximum peak current voltage during
startupCS, max,start,FB
0.9 V
VCS,min,FB
VCS,max,FB
0.125 mV
VCS,CS,step
Soft start voltage limit step
0.3 V
0.1 V
VCS,OCP1, start 0.125 mV
Vout,start
Output startup voltage
10 V
Vout,UV
Vout,set
0.125 V
tsw,start,FB
Minimum switching period during
startup
1 / 20 kHz
tsw,min
tsw,max,FB
1 / fmclk
Vbus,start,FB
Bus voltage FB startup threshold
350 V
0V
Vbus,set
1/16 V
Vbus,start,PFC
Bus voltage PFC startup threshold in
case of DC input
75 V
0V
Vbus,UV
1/16 V
Table 8
Parameters for PFC Control Loop
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
SVPstartup
PIT1 proportional gain in soft start
4
0
15
1
SVIstartup
PIT1 integral gain in soft start
7
0
15
1
SVPstdy
PIT1 proportional gain in steady state
4
0
15
1
SVIstdy
PIT1 integral gain in steady state
7
0
15
1
Data Sheet
36
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 8
Parameters for PFC Control Loop (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
SVT
PIT1 gain of the T1 filter
6
0
15
1
ESAT
PIT1 error limitation in soft start
16384
0
32767
1
ton,max,PFC
PIT1 maximum on-time limit
35 us
15 us
40 us
1 / fmclk
ton,min,PFC
PIT1 minimum on-time limit
200 ns
0 us
tLEB,PFC
1 / fmclk
tsw,max,PFC
Maximum switching period
1 / 22 kHz
tsw,min,PFC
1 / 20 kHz
1 / fmclk
tsw,min,PFC
Minimum switching period
1 / 120 kHz
1 / 200 kHz
tsw,max,PFC
1 / fmclk
Nvalley,max,PFC Upper boundary for valley number
5
1
5
1
tvalley,blanking,
PFC
Blanking time for valley change
500 us
0s
1 ms
tslot
Vbus,set
Bus voltage setpoint
460 V
Vbus,UV
Vbus,OVP1
1/16 V
Vbus,stdy,entr,O Bus voltage steady state entry
overvoltage threshold
472 V
Vbus,set
Vbus,OVP1
1/16 V
Vbus,stdy,entr,U Bus voltage steady state entry undervoltage threshold
V
448 V
Vbus,UV
Vbus,set
1/16 V
V
Table 9
Parameters for Flyback Control Loop
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
b0,DCM
b0 gain of control loop in DCM
5353 /
fmclk/256
0
8192 /
fmclk/256
1 / fmclk/256
b1,DCM
b1 gain of control loop in DCM
-53 /
fmclk/256
-8192 /
fmclk/256
0
1 / fmclk/256
b0,QRM1
b0 gain of control loop in QRM1
6060 / 65536 0 V
V
16384 /
65536 V
1 / 65536 V
b1,QRM1
b1 gain of control loop in QRM1
-60 / 65536
V
-16384 /
65536 V
0V
1 / 65536 V
KP,CV
Proportional gain for CV mode
1.9
0
16
0.125
KD,CV
Derivative gain for CV mode
28
128
0.125
Pout,set
Output power limit
100 W
0
150 W
0.5 W
Iout,full
Non-dimmed output current
2.0 A
Iout,min
3A
0.5 mA
Vout,set
Output voltage setpoint
48 V
Vout,UV
Vout,OV
0.125 V
ton,max,FB
Maximum on-time limit
15 us
VCS,max,FB /
RCS,FB * Lp /
Vbus,UV4)
25 us
1 / fmclk
tsw,max,FB
Maximum switching period
1 / 20 kHz
tsw,min,FB
1 / 16 kHz
1 / fmclk
tsw,min,FB
Minimum switching period
1 / 150 kHz
1 / 150 kHz
tsw,max,FB
1 / fmclk
VCS,max,FB
Maximum peak current voltage
1.09 V
VCS,min,FB
92% * 1.214 0.125 mV
V
4
Maximum on-time occurs if maximum power is transferred at minimum bus voltage.
Data Sheet
37
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 9
Parameters for Flyback Control Loop (continued)
Symbol
Description
Example
Minimum
Value
VCS,min,FB
Minimum peak current voltage
0.4 V
tdemag,min,FB VCS,max,FB
* Np / Ns *
Vout,OV / Lp *
RCS,FB 5)
0.125 mV
Table 10
Maximum
Value
Granularity
Parameters for Dimming
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
DDIM,max
PWM duty cycle for maximum current
90%
5%
95%
0.25%
DDIM,min
PWM duty cycle for minimum current
10%
5%
95%
0.25%
DDIM,on
PWM duty cycle to exit dim-to-off
5%
5%
95%
0.25%
DDIM,off
PWM duty cycle to enter dim-to-off
5%
5%
95%
0.25%
tblank,DIM,off
Blanking time until when the PWM input 1 ms
has to be available before dim-to-off is
triggered
0 ms
10 ms
tslot
NDIM
Integer dimming curve coefficient
1
1
2
1
Iout,min
Minimum output current
20 mA
20 mA
Iout,full
0.5 mA
n_PWM_hys
PWM detection hysteresis to suppress
jitter in the PWM signal
0
6
40
1
Table 11
Parameters for Fine Tuning
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
Kcoupling
FB transformer coupling coefficient
0.98
0.5
2
0.001
tLEB,FB
FB Current sense leading edge blanking 200 ns
1 / fmclk
600 ns
1 / fmclk
tOCP2,FB
FB OCP2 blanking time
250 ns
1 / fmclk
63 / fmclk
1 / fmclk
tPDC
FB Propagation delay compensation
500 ns
tOCP1,FB
2 us
1 / fmclk
tOCP1,FB
FB OCP1 spike suppression filter
100 ns
50 ns
500 ns
1 / fmclk
tCSFB,offset
FB sampling offset
200 ns
50 ns
500 ns
1 / fmclk
tsw,hysteresis
FB switching period hysteresis for
QRM/DCM mode changes
600 ns
20 ns
1000 ns
1 / fmclk
trsup,FB
FB ZCD ringing suppression
1.2 us
1 / fmclk
2 us
1 / fmclk
tZCD,PD,FB
FB Delay of zero-crossing signal
200 ns
0s
1 us
1 / fmclk
tZCD,PD,RE,FB
FB Rising edge delay of zero-crossing
signal
450 ns
0s
1 us
1 / fmclk
tgate,on
FB Turn-on delay of MOSFET
100 ns
0s
1 us
1 / fmclk
tLEB,PFC
PFC On-time leading edge blanking
200 ns
1 / fmclk
600 ns
1 / fmclk
5
The minimum peak current must ensure that tdemag,min,FB is maintained.
Data Sheet
38
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Design Support
Table 11
Parameters for Fine Tuning (continued)
Symbol
Description
Example
Minimum
Value
Maximum
Value
Granularity
tZCD,PD,PFC
PFC Delay of 0.5 V crossing to real zerocrossing signal
42 ns
-1 us
1 us
1 / fmclk
Ntosc,upd,PFC
PFC AC half cycle number to take
oscillation measurement
0
0
255
1
tosc,init,PFC
PFC Oscillation period initialization
value
1.5 us
0s
8 us
1 / fmclk
tosc,delay,PFC
PFC Delay after zero-crossing to
measure oscillation period
2 ms
0s
12 ms
tslot
ki,PFC
PFC THD optimization coefficient
0.75
0
16
0.125
tsrc,blanking,PF
C
Blanking time for AC/DC source change
12 ms
12 ms
30 ms
1 ms
trms,reset,PFC
Reset time of RMS search
20 ms
tsrc,blanking,PF 30 ms
1 ms
C
4.3
List of Fixed Parameters
This list shows the fixed parameters and their associated values – i.e. parameters whose values cannot be
changed.
Table 12
List of Fixed Parameters
Symbol
Description
Value
VCS,OCP2
Primary overcurrent protection
1.619 V
tdemag,min,FB
FB minimum demagnetizing time
2.0 us
VUVOFF
VCC undervoltage threshold
6.07 V
fmclk
Main clock frequency
50.0 MHz
tslot
Firmware task scheduling interval
32 us
VREF
Internal reference voltage
2.428 V
kpktorms
Constant to convert from peak to RMS values
0.707 (approx.
181/256)
CIIR,PFC
Coefficient of the IIR LP filter for bus voltage
4
Data Sheet
39
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
5
Electrical Characteristics and Parameters
All signals are measured with respect to the ground pin, GND. The voltage levels are valid provided other ratings
are not violated.
5.1
Package Characteristics
Table 13
Package Characteristics
Parameter
Symbol
Thermal resistance for PGDSO-16
5.2
RthJA
Limit Values
Unit
min
max
—
119
Remarks
K/W
Absolute Maximum Ratings
Attention: Stresses above the values listed above may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Maximum ratings are absolute ratings; exceeding only one of these values may cause
irreversible damage to the integrated circuit. These values are not tested during production test.
Table 14
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
min
max
Unit
Remarks
Voltage externally supplied
to pin VCC
VVCCEXT
–0.5
26
V
voltage that can be applied
to pin VCC by an external
voltage source
Voltage at pin GDx
VGDx
–0.5
VVCC + 0.3
V
if gate driver is not
configured for digital I/O
Junction temperature
TJ
–40
125
°C
max. operating frequency
66 MHz fMCLK
Storage temperature
TS
–55
150
°C
Soldering temperature
TSOLD
—
260
°C
Wave Soldering 1)
Latch-up capability
ILU
—
150
mA
2) Pin voltages acc. to abs.
ESD capability HBM
VHBM
—
2000
V
3)
ESD capability CDM
VCDM
—
500
V
4)
1
2
3
4
max. ratings
According to JESD22-A111 Rev A.
Latch-up capability according to JEDEC JESD78D, TA= 85°C.
ESD-HBM according to ANSI/ESDA/JEDEC JS-001-2012.
ESD-CDM according to JESD22-C101F.
Data Sheet
40
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 14
Absolute Maximum Ratings (continued)
Parameter
Symbol
Limit Values
min
max
Unit
Remarks
Input Voltage Limit
VIN
–0.5
3.6
V
Voltage externally supplied
to pins GPIO, MFIO, CS, ZCD,
GPIO, VS, GDx (if GDx is
configured as digital I/O). (If
not stated different)
Maximum permanent
negative clamping current
for ZCD and CS
–ICLN_DC
—
2.5
mA
RMS
Maximum transient negative –ICLN_TR
clamping current for ZCD
and CS
—
10
mA
pulse < 500ns
Maximum negative transient –VIN_ZCD
input voltage for ZCD
—
1.5
V
pulse < 500ns
Maximum negative transient –VIN_CS
input voltage for CS
—
3.0
V
pulse < 500ns
Maximum permanent
ICLP_DC
positive clamping current for
CS
—
2.5
mA
RMS
Maximum transient positive
clamping current for CS
ICLP_TR
—
10
mA
pulse < 500ns
Maximum current into pin
VIN
IAC
—
10
mA
for charging operation
Maximum sum of input
ICLH_sum
clamping high currents for
digital input stages of device
—
300
µA
limits for each individual
digital input stage have to
be respected
Voltage at HV pin
-0.5
600
V
5.3
VHV
Operating Conditions
The recommended operating conditions are shown for which the DC Electrical Characteristics are valid.
Table 15
Operating Range
Parameter
Symbol
Limit Values
Unit
min
max
Remarks
Ambient temperature
TA
–40
85
°C
Junction Temperature
TJ
–40
125
°C
max. 66 MHz fMCLK
Lower VCC limit
VVCC
VUVOFF
—
V
device is held in reset when
VVCC < VUVOFF
Voltage externally supplied
to VCC pin
VVCCEXT
—
24
V
maximum voltage that can
be applied to pin VCC by an
external voltage source
Gate driver pin voltage
VGD
–0.5
VVCC + 0.3
V
Data Sheet
41
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
5.4
DC Electrical Characteristics
The electrical characteristics provide the spread of values applicable within the specified supply voltage and
junction temperature range, TJ from -40 °C to +125 °C.
Devices are tested in protection at TA = 25 °C. Values have been verified either with simulation models or by
device characterization up to 125 °C.
Typical values represent the median values related to TA = 25 °C. All voltages refer to GND, and the assumed
supply voltage is VVCC = 18 V if not otherwise specified.
Note:
Not all values given in the tables are tested during production testing. Values not tested are explicitly
marked.
Attention: The Vcc pin voltage must be higher than 3.4V before the voltage of any other pins (except GND
and HV pins) exceeds 1.2V.
Table 16
Power Supply Characteristics
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
VCC_ON threshold
VVCCon
—
VSELF
—
V
Self-powered startup
(default)
VCC_ON_SELF threshold
VSELF
19
20.5
22
V
dVVCC/dt = 0.2 V/ms
VCC_ON_SELF delay
tSELF
—
—
2.1
µs
Reaction time of VVCC
monitor
VCC_UVOFF current
IVCCUVOFF
5
20
40
µA
VVCC < VSELF(min) - 0.3 V
or VVCC < VEXT(min) 0.3 V5)
UVOFF threshold
VUVOFF
—
6.0
—
V
SYS_CFG0.SELUVTHR = 0
0B
UVOFF threshold
tolerance
ΔUVOFF
—
—
±5
%
This value defines the
tolerance of VUVOFF
UVOFF filter constant
tUVOFF
600
—
—
ns
1V overdrive
UVLO (UVWAKE)
threshold
VUVLO
—
VUVOFF ·
1.25
—
V
UVWAKE threshold
tolerance
ΔUVLO
—
—
±5
%
This value defines the
tolerance of VUVLO
UVLO (UVWAKE) filter
constant
tUVLO
0.6
—
2.2
µs
1 V overdrive
OVLO (OVWAKE)
threshold
VOVLO
—
VSELF
—
V
OVLO (OVWAKE) filter
constant
tOVLO
0.6
—
2.4
µs
5
1 V overdrive
Tested at VVCC = 5.5 V
Data Sheet
42
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 16
Power Supply Characteristics (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
VDDP voltage
VVDDP
3.04
3.20
3.36
V
At PMD0/PSMD1. Some
internal values refer to
VVDDP / VVDDA and
VVDDPPS / VVDDAPS
respectively.
VDDA voltage
VVDDA
3.20
3.31
3.42
V
At PMD0/PSMD1. Some
internal values refer to
VVDDP / VVDDA and
VVDDPPS / VVDDAPS
respectively.
Nominal range 0% to
100%
VADCVCC
0
—
VREF
V
VADCVCC = 0.09 · VVCC6)
Reduced VCC range for
ADC measurement
RADCVCC
8
—
92
%
7)8)
Maximum error for ADC
measurement (8-bit
result)
TET0VCC
—
—
3.8
LSB8
Maximum error for ADC
measurement (8-bit
result)
TET256VCC
—
—
5.2
LSB8
Gate driver current
consumption excl. gate
charge current
IVCCGD
—
0.26
0.35
mA
Tj ≤ 125°C
VCC quiescent current in
PMD0
IVCCPMD0
—
11
13
mA
All registers have reset
values, clock is active at
66 MHz, CPU is stopped,
Tj ≤ 85 °C
VCC quiescent current in
PMD0
IVCCPMD0
—
—
14.5
mA
All registers have reset
values, clock is active at
66 MHz, CPU is stopped,
Tj ≤ 125 °C
VCC quiescent current in
power saving mode
PSDM3 with standby
logic active
IVCCPSMD3
—
0.25
0.45
mA
Tj ≤ 125 °C
WU_PWD_CFG = 28H
VCC quiescent current in
power saving mode
PSDM4 with standby
logic active
IVCCPSMD4
—
0.14
0.23
mA
Tj ≤ 125 °C
WU_PWD_CFG = 00H
6
7
8
Theoretical minimum value, real minimum value is related to VUVOFF threshold.
Operational values.
Note that the system is turned off if VVCC < VUFOFF.
Data Sheet
43
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 17
Electrical Characteristics of the GDFB Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input clamping current,
low
–ICLL
—
—
100
µA
only digital input
Input clamping current,
high
ICLH
—
—
100
µA
only digital input
APD low voltage (active
VAPD
pull-down while device is
not powered or gate
driver is not enabled)
—
—
1.6
V
IGD = 5 mA
RPPD value
RPPD
—
600
—
kΩ
Permanent pull-down
resistor inside gate
driver
RPPD tolerance
ΔPPD
—
—
±25
%
Permanent pull-down
resistor inside gate
driver
Driver output low
impedance for GD0
RGDL
—
—
4.4
Ω
TJ ≤ 125 °C, IGD = 0.1 A
Nominal output high
voltage in PWM mode
VGDH
—
10.5
—
V
GDx_CFG.VOL = 3,
IGDH = –1 mA
Output voltage tolerance ΔVGDH
—
—
±5
%
Tolerance of
programming options if
VGDH > 10 V, IGDH = –1 mA
Rail-to-rail output high
voltage
VGDHRR
VVCC– 0.5
—
VVCC
V
If VVCC < programmed
VGDH and output at high
state
Output high current in
PWM mode for GD0
–IGDH
—
100
—
mA
GDx_CFG.CUR = 8
Output high current
tolerance in PWM mode
ΔIGDH
—
±15
%
Calibrated 9)
Discharge current for
GD0
IGDDIS
800
—
—
mA
VGD = 4 V and driver at
low state
Output low reverse
current
–IGDREVL
—
—
100
mA
Applies if VGD < 0 V and
driver at low state
Output high reverse
current in PWM mode
IGDREVH
—
1/6 of IGDH
—
9
Applies if
VGD > VGDH + 0.5 V (typ)
and driver at high state
referred to GDx_CFG.CUR = 16
Data Sheet
44
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 18
Electrical Characteristics of the CSFB Pin
Parameter
Symbol
Values
Min.
Input voltage operating
range
Typ.
Max.
–0.5
—
3.0
V
OCP2 comparator
VOCP2
reference voltage,
derived from VVDDA, given
values assuming
VVDDA = VVDDA,typ
—
1.6
—
V
SYS_CFG0.OCP2 = 00B
Threshold voltage
tolerance
ΔVOCP2
—
—
±5
%
Voltage divider tolerance
Comparator propagation tOCP2PD
delay
15
—
35
ns
Minimum comparator
input pulse width
tOCP2PW
—
—
30
ns
OCP2F comparator
propagation delay
tOCP2FPD
70
—
170
ns
dVCS/dt = 100 V/µs
Delay from VCS crossing
VCSOCP2 to begin of GDx
turn-off (IGD0 > 2mA)
tCSGDxOCP2
125
135
190
ns
dVCS/dt = 100 V/µs;
fMCLK = 66 MHz. GDx
driven by QR_GATE
FIL_OCP2.STABLE = 3
OCP1 operating range
VOCP1
0
—
VREF/2
V
RANGE =00B
OCP1 threshold at full
scale setting
(CS_OCP1LVL=FFH) for
CS0
VOCP1FS
1192
1229
1266
mV
RANGE =00B
Delay from VCS crossing
VCSOCP1 to CS_OCP1
rising edge, 1.2 V range
tCSOCP1
90
170
250
ns
Input signal slope dVCS/
dt = 150 mV/µs. This
slope represents a use
case of a switch-mode
power supply with
minimum input voltage.
Delay from CS_OCP1
rising edge to QR_GATE
falling edge
tOCP1GATE
—
—
12
ns
STB_RET31.
OCP_ASM_SEL=0
Delay from QR_GATE
falling edge to start of
GDx turn-off
tGATEGDx
1
3
5
ns
GDx driven by QR_GATE.
Measured up to
IGDx > 2 mA
OCP1 comparator input
single pulse width filter
tOCP1PW
60
—
95
ns
Shorter pulses than min.
are suppressed, longer
pulses than max. are
passed
Data Sheet
VINP
Unit Note or Test Condition
45
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 18
Electrical Characteristics of the CSFB Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Nominal S&H operating
range 0% to 100%
VCSH
0
—
VREF/2
V
CS_ICR.RANGE =00B
Reduced S&H operating
range
RRCVSH
8
—
92
%
CS_ICR.RANGE =00B
Operational values
Maximum error of CS0
S&H for corrected
measurement (8-bit
result)
TET0CS0S
—
—
4.7
LSB
CS_ICR.RANGE =00B
Maximum error of CS0
S&H for corrected
measurement (8-bit
result)
TET256CS0S —
—
6.0
LSB
CS_ICR.RANGE =00B
Nominal S&H operating
range 0% to 100%
VCSH
0
—
VREF/6
V
CS_ICR.RANGE =11B
Reduced S&H operating
range
RRCVSH
20
—
80
%
CS_ICR.RANGE =11B
Operational values
Maximum error of CS0
S&H for corrected
measurement (8-bit
result)
TET0CS0S
—
—
8.0
LSB
CS_ICR.RANGE =11B
Maximum error of CS0
S&H for corrected
measurement (8-bit
result)
TET256CS0S —
—
8.7
LSB
CS_ICR.RANGE =11B
—
510
ns
Referring to jump in
input voltage. Limits the
minimum gate driver Ton
time.
S&H delay of input buffer tCSHST
Table 19
—
Electrical Characteristics of the ZCD Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input voltage operating
range
VINP
–0.5
—
3.3
V
Input clamping current,
high
ICLH
—
—
100
µA
Zero-crossing threshold
VZCTHR
15
40
70
mV
30
50
70
ns
Comparator propagation tZCPD
delay
Data Sheet
46
dVZCD/dt = 4 V/µs
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 19
Electrical Characteristics of the ZCD Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input voltage negative
clamping level
–VINPCLN
140
180
220
mV
Analog clamp activated
Nominal I/V-conversion
operating range 0% to
100%
–IIV
0
—
4
mA
CRNG =00B Gain = 600
mV/mA
Reduced I/V-conversion
operating range
RRIV
5
—
80
%
Maximum error for
corrected ADC
measurement (8-bit
result)
TET0IV
—
—
4.1
LSB8 CRNG =00B
Maximum error for
corrected ADC
measurement (8-bit
result)
TET256IV
—
—
9.7
LSB8 CRNG =00B
Maximum deviation
between ZCD clamp
voltage and trim result
stored in OTP
EZCDClp
—
—
±5
%
–IIV > 0.25 mA
IV-conversion delay of
input buffer
tIVST
—
—
900
ns
Refers to jump in input
current10)
Nominal S&H input
voltage range 0% to
100%
VZSH
0
—
2/3 · VREF
V
SHRNG =0B
Nominal S&H input
voltage range 0% to
100%
VZSH
VREF /2
—
7/6 · VREF
V
SHRNG =1B
Reduced S&H input
voltage range
RRZVSH
4
—
95
%
Maximum error for
corrected ADC
measurement (8-bit
result)
TET0ZVS0
—
—
3.7
LSB8 SHRNG =0B
Maximum error for
corrected ADC
measurement (8-bit
result)
TET256ZVS0 —
—
4.9
LSB8 SHRNG =0B
10
Limits the minimum gate driver Ton time.
Data Sheet
47
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 19
Electrical Characteristics of the ZCD Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Maximum error for
corrected ADC
measurement (8-bit
result)
TET0ZVS1
—
—
4.2
LSB8 SHRNG =1B
Maximum error for
corrected ADC
measurement (8-bit
result)
TET256ZVS1 —
—
5.8
LSB8 SHRNG =1B
S&H delay of input buffer tZSHST
referring to jump of input
voltage
—
—
1.0
µs
SHRNG =0BTj ≤ 125 °C
S&H delay of input buffer tZSHST
referring to jump of input
voltage
—
—
1.6
µs
SHRNG =1BTj ≤ 125 °C
Table 20
Electrical Characteristics of the VS Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Nominal measurement
range 0% to 100%
VVS
0
—
VREF
V
Gain 1, no offset
Nominal measurement
range 0% to 100%
VVS
5/6·VREF
—
7/6·VREF
V
Gain 3, with offset
Reduced operating range RRVVS
5
—
95
%
Gain 1, no offset
Reduced operating range RRVVS
10
—
90
%
Gain 3, with offset
Maximum error for
corrected measurement
(8-bit result)
TET0VS
—
—
4.1
LSB8 Range 1, no offset
Maximum error for
corrected measurement
(8-bit result)
TET256VS
—
—
5.6
LSB8 Range 1, no offset
Maximum error for
corrected measurement
(8-bit result)
TET0VS
—
—
12.0
LSB8 Range 2, with offset
Maximum error for
corrected measurement
(8-bit result)
TET256VS
—
—
12.9
LSB8 Range 2, with offset
Overvoltage comparator
threshold
THROV
2.70
2.8
2.90
V
Overvoltage comparator
propagation delay
tPDOV
—
—
300
µs
Data Sheet
48
Step at input
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 21
Electrical Characteristics of the HV Pin
Parameter
Symbol
Values
Min.
Leakage current at HV
pin
Typ.
Max.
—
—
10
µA
VHV = 600 V HV startup
cell disabled
Nominal current for
IMEAS
measurement path 0% to
100%
0
—
4.8
mA
CURRNG = 10B
Reduced measurement
range for current path
RRIMEAS
5
—
80
%
CURRNG = 10B.
Operational values.
Maximum error for
corrected ADC
measurement (8-bit
result, temperature gain
correction applied)
TET0DP
—
—
3.7
LSB8 CURRNG = 10B
Maximum error for
corrected ADC
measurement (8-bit
result, temperature gain
correction applied)
TET256DP
—
—
7.9
LSB8 CURRNG = 10B
Comparator threshold (in THRCOMP
% of full range of IMEAS)
15
20
25
%
COMPTHR= 00B
Comparator threshold (in THRCOMP
% of full range of IMEAS)
25
30
35
%
COMPTHR= 01B
Comparator threshold (in THRCOMP
% of full range of IMEAS)
35
40
45
%
COMPTHR= 10B
Comparator threshold (in THRCOMP
% of full range of IMEAS)
45
50
55
%
COMPTHR= 11B
Table 22
IHVleak
Unit Note or Test Condition
Electrical Characteristics of the PWM Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input capacitance
CINPUT
—
—
10
pF
Input low voltage
VIL
—
—
1.0
V
Input high voltage
VIH
2.0
—
—
V
Input leakage current, no ILK
pull device
–5
—
+1
µA
VMFIO = 0 V / 3 V
Input low current with
–ILPU
active weak pull-up WPU
30
—
90
µA
Measured at max. VIL
Input high current with
active weak pull-down
WPD
90
—
300
µA
Measured at min. VIH
Data Sheet
IHPD
49
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 22
Electrical Characteristics of the PWM Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Max. input frequency
fINPUT
15
—
—
MHz
Pull-up resistor value
RPU
—
2.25
—
kΩ
RPU=1111B
Pull-up resistor tolerance ΔRPU
—
—
±20
%
Overall tolerance
PWM input frequency
fPWM
500
—
2000
Hz
PWM duty cycle
DPWM
5
—
95
%
Table 23
Electrical Characteristics of the TEMP Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
MFIO reference voltage
VMFIOREF
—
VREF
—
V
Selection = VREF
Nominal range 0% to
100%
VMFIO
0
—
VREF
V
Gain = 1
Reduced operating range RRVMFIO
4
—
96
%
Gain = 1. Operational
values.
Maximum error for
corrected measurement
(8-bit result)
TET0MFI0
—
—
4.0
LSB8 Gain = 1
Maximum error for
corrected measurement
(8-bit result)
TET256MFI0 —
—
4.8
LSB8 Gain = 1
Offset calibration voltage VCAL
—
VMFIOREF/8
—
V
Offset calibration voltage ΔVCAL
absolute tolerance
—
—
±3
LSB
Ref. to VMFIOREF =VREF,
Gain = 1
Offset calibration voltage ΔVCAL_TMP
variation over
temperature
—
—
±1
LSB
Ref. to VMFIOREF =VREF,
Gain = 1
Pull-up resistor value
—
11
—
kΩ
RPU=0110B
—
—
±20
%
Overall tolerance
RPU
Pull-up resistor tolerance ΔRPU
Table 24
Electrical Characteristics of the CSPFC Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input voltage operating
range
VINP
–0.5
—
3.0
V
OCP1 operating range
VOCP1
0
—
VREF/2
V
Data Sheet
50
RANGE =00B
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 24
Electrical Characteristics of the CSPFC Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
OCP2 comparator
VOCP2
reference voltage,
derived from VVDDA, given
values assuming
VVDDA = VVDDA,typ
—
1.6
—
V
SYS_CFG0.OCP2 = 00B
Threshold voltage
tolerance
ΔVOCP2
—
—
±5
%
Voltage divider tolerance
Comparator propagation tOCP2PD
delay
15
—
35
ns
Minimum comparator
input pulse width
tOCP2PW
—
—
30
ns
OCP2F comparator
propagation delay
tOCP2FPD
70
—
170
ns
dVCS/dt = 100 V/µs
Delay from VCS crossing
VCSOCP2 to begin of GDx
turn-off (IGD0 > 2mA)
tCSGDxOCP2
125
135
190
ns
dVCS/dt = 100 V/µs;
fMCLK = 66 MHz. GDx
driven by QR_GATE
FIL_OCP2.STABLE = 3
Nominal S&H operating
range 0% to 100%
VCSH
0
—
VREF/2
V
CS_ICR.RANGE =00B
Reduced S&H operating
range
RRCVSH
4
—
90
%
Operational values
Hysteretic comparator
threshold
THRHYS
—
0.54
—
V
1 → 0 transition
Hysteretic comparator
threshold
THRHYS
—
1.53
—
V
0 → 1 transition
Hysteretic comparator
threshold tolerance
ΔTHRHYS
—
—
±120
mV
Hysteretic comparator
propagation delay
tPDHYS
—
90
—
ns
Rising edge
Hysteretic comparator
propagation delay
tPDHYS
—
40
—
ns
Falling edge
Hysteretic comparator
minimum input pulse
width
tPWHYS
—
—
300
ns
Data Sheet
51
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 25
Electrical Characteristics of the UART Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input clamping current,
low
–ICLL
—
—
100
µA
only digital input
Input clamping current,
high
ICLH
—
—
100
µA
only digital input
APD low voltage (active
VAPD
pull-down while device is
not powered or gate
driver is not enabled)
—
—
1.6
V
IGD = 5 mA
Input capacitance
CINPUT
—
—
25
pF
Input low voltage
VIL
—
—
1.0
V
Input high voltage
VIH
2.1
—
—
V
Input low current with
–ILPU
active weak pull-up WPU
30
—
90
µA
Max. input frequency
fINPUT
15
—
—
MHz
Output low voltage
VOL
—
—
0.8
V
IOL = 2 mA
Output high voltage
VOH
2.4
—
—
V
IOH = –2 mA
Output sink current
IOL
—
—
2
mA
Output source current
-IOH
—
—
2
mA
Output rise time (0 → 1)
tRISE
—
—
50
ns
20 pF load, push/pull
output
Output fall time (1 → 0)
tFALL
—
—
50
ns
20 pF load, push/pull or
open-drain output
Max. output switching
frequency
fSWITCH
10
—
—
MHz
UART baudrate
fUART
9600
105000
baud
Table 26
Measured at max. VIL
Electrical Characteristics of the GDPFC Pin
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Input clamping current,
low
–ICLL
—
—
100
µA
only digital input
Input clamping current,
high
ICLH
—
—
100
µA
only digital input
APD low voltage (active
VAPD
pull-down while device is
not powered or gate
driver is not enabled)
—
—
1.6
V
IGD = 5 mA
Data Sheet
52
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 26
Electrical Characteristics of the GDPFC Pin (continued)
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
RPPD value
RPPD
—
600
—
kΩ
Permanent pull-down
resistor inside gate
driver
RPPD tolerance
ΔPPD
—
—
±25
%
Permanent pull-down
resistor inside gate
driver
Driver output low
impedance for GD1/2
RGDL
—
—
7.0
Ω
TJ ≤ 125 °C, IGD = 0.1 A
Nominal output high
voltage in PWM mode
VGDH
—
10.5
—
V
GDx_CFG.VOL = 3,
IGDH = –1 mA
Output voltage tolerance ΔVGDH
—
—
±5
%
Tolerance of
programming options if
VGDH > 10 V, IGDH = –1 mA
Rail-to-rail output high
voltage
VGDHRR
VVCC– 0.5
—
VVCC
V
If VVCC < programmed
VGDH and output at high
state
Output high current in
PWM mode for GD1/2
–IGDH
—
104
—
mA
GDx_CFG.CUR = 24
Output high current
tolerance in PWM mode
ΔIGDH
—
±15
%
Calibrated 11)
Discharge current for
GD1/2
IGDDIS
500
—
—
mA
VGD = 4 V and driver at
low state
Output low reverse
current
–IGDREVL
—
—
100
mA
Applies if VGD < 0 V and
driver at low state
Output high reverse
current in PWM mode
IGDREVH
—
1/6 of IGDH
—
Table 27
Electrical Characteristics of the A/D Converter
Parameter
Symbol
Values
Min.
Integral non-linearity
11
12
Applies if
VGD > VGDH + 0.5 V (typ)
and driver at high state
INL
—
Unit Note or Test Condition
Typ.
—
Max.
1
LSB8
12)
referred to GDx_CFG.CUR = 16
ADC capability measured via channel MFIO without errors due to switching of neighbouring pins, e.g. gate
drivers, measured with STC = 5. MFIO buffer non-linearity masked out by taking ADC output values ≥ 30
only.
Data Sheet
53
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Electrical Characteristics and Parameters
Table 28
Electrical Characteristics of the Reference Voltage
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Reference voltage
VREF
—
2.428
—
V
VREF overall tolerance
ΔVREF
—
—
±1.5
%
Table 29
Trimmed, Tj ≤ 125 °C and
aging
Electrical Characteristics of the OTP Programming
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
OTP programming
VPP
voltage at the VCC pin for
range C000H to CFFFH
7.35
7.5
7.65
V
Operational values
OTP programming
VPP
voltage at the VCC pin for
range D000H to DFFFH
9.0
—
VVCC
V
Operational values
OTP programming
current
—
1.6
—
mA
Programming of 4 bits in
parallel
Table 30
IPP
Electrical Characteristics of the Clock Oscillators
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Master clock oscillation
period including all
variations
tMCLK
19.2
20.0
21.1
ns
In reference to 50 MHz
fMCLK
Main clock oscillator
frequency variation of
stored DPARAM
frequency
ΔMCLK
–3.2
—
+2.0
%
Temperature drift and
aging only, 50 MHz fMCLK
Standby clock oscillator
frequency
fSTBCLK
96
100
104
kHz
Trimming tolerance at
TA = 25 °C
Standby clock oscillator
frequency
fSTBCLK
90
100
110
kHz
Overall tolerance
Table 31
Electrical Characteristics of the Temperature Sensor
Parameter
Symbol
Values
Min.
Unit Note or Test Condition
Typ.
Max.
Temperature sensor ADC ADCTEMP
output operating range
0
—
190
LSB
ADCTEMP = 40 +
temperature / °C)
Temperature sensor
tolerance
—
—
±6
K
Incl. ADC conversion
accuracy at 3 σ
Data Sheet
ΔTEMP
54
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Package Dimensions
6
Package Dimensions
The package dimensions of PG-DSO-16 are provided.
Figure 29
Package Dimensions for PG-DSO-16
Note:
Dimensions in mm.
Note:
You can find all of our packages, packing types and other package information on our Infineon
Internet page “Products”: http://www.infineon.com/products.
Data Sheet
55
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
References
7
References
1. Infineon Technologies AG: XDPL8220 Reference Board Test Report
2. Infineon Technologies AG: .dp Interface Gen2: Can be ordered at http://ehitex.com/programmer/486/.dpinterface-board-gen2
3. Infineon Technologies AG: .dp Vision User Manual
4. Infineon Technologies AG: .dp Interface Gen2 User Manual
5. Infineon Technologies AG: XDPL8220 Design Guide
6. Infineon Technologies AG: XDPL8220 Programming Manual
Abbreviations
AC
Alternating Current (AC)
An Alternating Current is a form of power supply in which the flow of electric charge periodically reverses
direction.
ADC
Analog-to-Digital Converter (ADC)
An analog-to-digital converter is a device that converts a continuous physical quantity (usually voltage) to a
digital number that represents the quantity's amplitude.
BOM
Bill of Materials (BOM)
A bill of materials is a list of the raw materials, sub-assemblies, intermediate assemblies, sub-components,
parts and the quantities of each needed to manufacture an end product.
CC
Constant Current (CC)
Constant Current is a mode of a power supply in which the output current is kept constant regardless of the
load.
CCM
Continuous Conduction Mode (CCM)
Continuous Conduction Mode is an operational mode of a switching power supply in which the current is
continuously flowing and does not return to zero.
CRC
Cyclic Redundancy Check (CRC)
A cyclic redundancy check is an error-detecting code commonly used to detect accidental changes to raw data.
CV
Constant Voltage (CV)
Constant Voltage is a mode of a power supply in which the output voltage is kept constant regardless of the
load.
DAC
Digital-to-Analog Converter (DAC)
A digital-to-analog converter is a device that converts digital data into an analog signal (typically voltage).
DC
Direct Current (DC)
A Direct Current is a form of power supply in which the flow of electric charge is only into one direction.
Data Sheet
56
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Abbreviations
DCM
Discontinuous Conduction Mode (DCM)
Discontinuous Conduction Mode is an operational mode of a switching power supply in which the current starts
and returns to zero.
ECG
Electronic Control Gear (ECG)
An electronic control gear is a power supply which provides one or more light module(s) with the appropriate
voltage or current.
FB
Flyback (FB)
A flyback converter is a power converter with the inductor split to form a transformer, so that the voltage ratios
are multiplied with an additional advantage of galvanic isolation between the input and any outputs.
FW
Firmware (FW)
A proprietary software exploiting a set of functions.
GUI
Graphic User Interface (GUI)
A graphical user interface is a type of interface that allows users to interact with electronic devices through
graphical icons and visual indicators.
HW
Hardware (HW)
The collection of physical elements that comprise a computer system.
IC
Integrated Circuit (IC)
A miniaturized electronic circuit that has been manufactured in the surface of a thin substrate of semiconductor
material. An IC may also be referred to as micro-circuit, microchip, silicon chip, or chip.
IIR
Infinite Impulse Response (IIR)
Infinite impulse response is a property applying to many linear time-invariant systems. Common examples of
linear time-invariant systems are most electronic and digital filters. Systems with this property have an impulse
response which does not become exactly zero past a certain point, but continues indefinitely.
LED
Light Emitting Diode (LED)
A light-emitting diode is a two-lead semiconductor light source which emits light when activated.
LP
Limited Power (LP)
Limited Power is a mode of a power supply in which the output power is limited regardless of the load.
NTC
Negative Temperature Coefficient Thermistor (NTC)
A negative temperature coefficient thermistor is a type of resistor whose resistance declines over temperature.
OCP1
Overcurrent Protection Level 1 (OCP1)
The Overcurrent Protection Level 1 is limiting the current in a switched-mode power supply to limit the power
delivered to the output of the power supply.
Data Sheet
57
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Abbreviations
OCP2
Overcurrent Protection Level 2 (OCP2)
The Overcurrent Protection Level 2 is protecting the current in a switched-mode power supply from exceeding a
maximum threshold.
OTP
One Time Programmable Memory (OTP)
A One-Time Programmable memory is a form of memory to which data can be written once. After writing, the
data is stored permanently and cannot be further changed.
PF
Power Factor (PF)
Power factor is the ratio between the real power and the apparent power.
PFC
Power Factor Correction (PFC)
Power factor correction increases the power factor of an AC power circuit closer to 1 which corresponds to
minimizing the reactive power of the power circuit.
PSR
Primary Side Regulated (PSR)
A Primary Side Regulated power supply is controlling its operation based on a property sensed on primary side
of an isolated power supply.
PWM
Pulse Width Modulation (PWM)
Pulse-width modulation is a technique to encode an analog value into the duty cycle of a pulsing signal with
arbitrary amplitude.
QRM
Quasi-Resonant Mode (QRM)
Quasi-Resonant Mode is an operating mode of a switched-mode power supply which maximizes efficiency. This
is achieved by only switching at preferred times when switching losses are low.
QRM1
Quasi-Resonant Mode, switching in valley 1 (QRM1)
Quasi-Resonant Mode is an operating mode of a switched-mode power supply which maximizes efficiency. This
is achieved by switching at the occurrence of the first valley of a signal which corresponds to a time when
switching losses are low.
QRMn
Quasi-Resonant Mode, switching in valley n (QRMn)
Quasi-Resonant Mode is an operating mode of a switched-mode power supply which maximizes efficiency. This
is achieved by switching at the occurence of an nth valley of a signal which corresponds to a time when
switching losses are low.
RAM
Random Access Memory (RAM)
Random-access memory is a form of computer data storage which allows data items to be read and written
regardless of the order in which data items are accessed.
THD
Total Harmonic Distortion (THD)
The total harmonic distortion of a signal is a measurement of the harmonic distortion present and is defined as
the ratio of the sum of the powers of all harmonic components to the power of the fundamental frequency.
Data Sheet
58
Revision 1.0
2016-11-4
XDPL8220 Digital PFC+Flyback Controller IC
XDP™ Digital Power
Revision History
UART
Universal Asynchronous Receiver Transmitter (UART)
A universal asynchronous receiver transmitter is used for serial communications over a peripheral device serial
port by translating data between parallel and serial forms.
USB
Universal Serial Bus (USB)
Universal Serial Bus is an industry standard that defines cables, connectors and communications protocols
used in a bus for connection, communication, and power supply between computers and electronic devices.
UVLO
Undervoltage Lockout (UVLO)
The Undervoltage-Lockout is an electronic circuit used to turn off the power of an electronic device in the event
of the voltage dropping below the operational value.
Revision History
Major changes since previous revision
Revision History
Revision
Description
1.0
• Added the attention that the Vcc must be higher than 3.4V before any other pins
exceeds 1.2V
0.7
• Added a description of the input filter for the PWM sensing
0.6
• Corrected for English language
• Minor update of the PFC and FB content
• Updated electrical characteristics
Data Sheet
59
Revision 1.0
2016-11-4
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™,
DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™,
HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™,
PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™,
SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™.
Trademarks Update 2015-12-22
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2016-11-4
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2016 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-sch1429523754663
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”) .
With respect to any examples, hints or any typical values
stated herein and/or any information regarding the
application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of
any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury