XMC4200Q48K256BAXUMA1

XMC4100 / XMC4200 Microcontroller Series for Industrial Applications XMC4000 Family ARM® Cortex®-M4 32-bit processor core Data Sheet V1.4 2018-09 Microcontrollers Edition 2018-09 Published by Infineon Technologies AG 81726 Munich, Germany © 2018 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. XMC4100 / XMC4200 Microcontroller Series for Industrial Applications XMC4000 Family ARM® Cortex®-M4 32-bit processor core Data Sheet V1.4 2018-09 Microcontrollers XMC4100 / XMC4200 XMC4000 Family XMC4[12]00 Data Sheet Revision History: V1.4 2018-09 Previous Versions: V1.3 2015-10 V1.2 2014-06 V1.1 2014-03 V1.0 2013-10 V0.6 2012-11 Page Subjects 43 Added RMS Noise parameter in VADC Parameters table. 12 Added a section listing the packages of the different markings. 14 Added BA marking variant. 14 Corrected SCU_IDCHIP value of XMC4100 EES-AA/ES-AA. 36 Added footnote explaining minimum VBAT requirements to start the hibernate domain and/or oscillation of a crystal on RTC_XTAL. 37 Changed pull device definition to System Requirement (SR) to reflect that the specified currents are defined by the characteristics of the external load/driver. 37 Added information that PORST Pull-up is identical to the pull-up on standard I/O pins. 42 Updated CAINSW, CAINTOT and RAIN parameters with improved values. 56 Added footnote on test configuration for LPAC measurement. 58 Corrected parameter name of of USB pull device (upstream port receiving) definition according to USB standard (referenced to DM instead of DP) 62 Relaxed RTC_XTAL VPPX parameter value and changed it to a system requirement. 66 Added footnote on current consumption by enabling of fCCU. 67 Added Flash endurance parameter for 64 Kbytes Physical Sector PS4 NEPS4 for devices with BA marking. many Added PG-TQFP-64-19 and PG-VQFN-48-71 package information. 89, 90 Added tables describing the differences between PG-LQFP-64-19 to PGTQFP-64-19 as well as PG-VQFN-48-53 to PG-VQFN-48-71 packages. 92 Updated to JEDEC standard J-STD-020D for the moisture sensitivity level and added solder temperature parameter according to the same standard. Data Sheet V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Trademarks C166™, TriCore™, XMC™ and DAVE™ are trademarks of Infineon Technologies AG. ARM®, ARM Powered®, Cortex®, Thumb® and AMBA® are registered trademarks of ARM, Limited. CoreSight™, ETM™, Embedded Trace Macrocell™ and Embedded Trace Buffer™ are trademarks of ARM, Limited. Synopsys™ is a trademark of Synopsys, Inc. We Listen to Your Comments Is there any information in this document that you feel is wrong, unclear or missing? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com Data Sheet V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Table of Contents Table of Contents 1 1.1 1.2 1.3 1.4 1.5 1.6 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Device Type Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2 2.1 2.2 2.2.1 2.2.2 2.2.2.1 2.3 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port I/O Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port I/O Function Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Connection Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 18 20 24 25 28 3 3.1 3.1.1 3.1.2 3.1.3 3.1.4 3.1.5 3.2 3.2.1 3.2.2 3.2.3 3.2.4 3.2.5 3.2.5.1 3.2.5.2 3.2.5.3 3.2.6 3.2.7 3.2.8 3.2.9 3.2.10 3.2.11 3.3 3.3.1 3.3.2 3.3.3 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Analog to Digital Converters (ADCx) . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital to Analog Converters (DACx) . . . . . . . . . . . . . . . . . . . . . . . . . . . Out-of-Range Comparator (ORC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High Resolution PWM (HRPWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HRC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CMP and 10-bit DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low Power Analog Comparator (LPAC) . . . . . . . . . . . . . . . . . . . . . . . . Die Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Device Interface DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-Up and Supply Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 30 30 31 33 35 36 37 37 42 47 50 52 52 52 55 56 57 58 59 63 67 69 69 70 71 Data Sheet 6 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Table of Contents 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.8.1 3.3.8.2 3.3.8.3 3.3.9 Phase Locked Loop (PLL) Characteristics . . . . . . . . . . . . . . . . . . . . . . Internal Clock Source Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial Wire Debug Port (SW-DP) Timing . . . . . . . . . . . . . . . . . . . . . . . . Peripheral Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Synchronous Serial Interface (USIC SSC) Timing . . . . . . . . . . . . . . Inter-IC (IIC) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inter-IC Sound (IIS) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . USB Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 74 76 78 79 79 82 84 86 4 4.1 4.1.1 4.2 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 87 87 89 5 Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Data Sheet 7 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family About this Document About this Document This Data Sheet is addressed to embedded hardware and software developers. It provides the reader with detailed descriptions about the ordering designations, available features, electrical and physical characteristics of the XMC4[12]00 series devices. The document describes the characteristics of a superset of the XMC4[12]00 series devices. For simplicity, the various device types are referred to by the collective term XMC4[12]00 throughout this manual. XMC4000 Family User Documentation The set of user documentation includes: • • • Reference Manual – decribes the functionality of the superset of devices. Data Sheets – list the complete ordering designations, available features and electrical characteristics of derivative devices. Errata Sheets – list deviations from the specifications given in the related Reference Manual or Data Sheets. Errata Sheets are provided for the superset of devices. Attention: Please consult all parts of the documentation set to attain consolidated knowledge about your device. Application related guidance is provided by Users Guides and Application Notes. Please refer to http://www.infineon.com/xmc4000 to get access to the latest versions of those documents. Data Sheet 8 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features 1 Summary of Features The XMC4[12]00 devices are members of the XMC4000 Family of microcontrollers based on the ARM Cortex-M4 processor core. The XMC4000 is a family of high performance and energy efficient microcontrollers optimized for Industrial Connectivity, Industrial Control, Power Conversion, Sense & Control. System Masters System Slaves RTC CPU TM ® ERU0 ARM Cortex -M4 DCode WDT USB Device GPDMA0 System SCU ICode FCE Bus Matrix Data Code PSRAM PMU ROM & Flash USIC0 DSRAM1 HRPWM CCU80 PBA0 Figure 1 VADC POSIF0 PORTS DAC PBA1 Peripherals 1 Peripherals 0 ERU1 LEDTS0 CCU40 CCU41 USIC1 CAN System Block Diagram CPU Subsystem • • • • • • • CPU Core – High Performance 32-bit ARM Cortex-M4 CPU – 16-bit and 32-bit Thumb2 instruction set – DSP/MAC instructions – System timer (SysTick) for Operating System support Floating Point Unit Memory Protection Unit Nested Vectored Interrupt Controller One General Purpose DMA with up-to 8 channels Event Request Unit (ERU) for programmable processing of external and internal service requests Flexible CRC Engine (FCE) for multiple bit error detection Data Sheet 9 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features On-Chip Memories • • • • 16 KB on-chip boot ROM up to 16 KB on-chip high-speed program memory up to 24 KB on-chip high speed data memory up to 256 KB on-chip Flash Memory with 1 KB instruction cache Communication Peripherals • • • • Universal Serial Bus, USB 2.0 device, with integrated PHY Controller Area Network interface (MultiCAN), Full-CAN/Basic-CAN with two nodes, 64 message objects (MO), data rate up to 1 MBit/s Four Universal Serial Interface Channels (USIC), providing four serial channels, usable as UART, double-SPI, quad-SPI, IIC, IIS and LIN interfaces LED and Touch-Sense Controller (LEDTS) for Human-Machine interface Analog Frontend Peripherals • • Two Analog-Digital Converters (VADC) of 12-bit resolution, 8 channels each, with input out-of-range comparators Digital-Analog Converter (DAC) with two channels of 12-bit resolution Industrial Control Peripherals • • • • • • • • Two Capture/Compare Units 4 (CCU4) for use as general purpose timers One Capture/Compare Units 8 (CCU8) for motor control and power conversion Four High Resoultion PWM (HRPWM) channels One Position Interface (POSIF) for servo motor positioning Window Watchdog Timer (WDT) for safety sensitive applications Die Temperature Sensor (DTS) Real Time Clock module with alarm support System Control Unit (SCU) for system configuration and control Input/Output Lines • • • • • Programmable port driver control module (PORTS) Individual bit addressability Tri-stated in input mode Push/pull or open drain output mode Boundary scan test support over JTAG interface On-Chip Debug Support • • Full support for debug features: 8 breakpoints, CoreSight, trace Various interfaces: ARM-JTAG, SWD, single wire trace Data Sheet 10 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features 1.1 Ordering Information The ordering code for an Infineon microcontroller provides an exact reference to a specific product. The code “XMC4-” identifies: • • • • • the derivatives function set the package variant – E: LFBGA – F: LQFP, TQFP – Q: VQFN package pin count the temperature range: – F: -40°C to 85°C – K: -40°C to 125°C the Flash memory size. For ordering codes for the XMC4[12]00 please contact your sales representative or local distributor. This document describes several derivatives of the XMC4100 and XMC4200 series, some descriptions may not apply to a specific product. Please see Table 1. For simplicity the term XMC4[12]00 is used for all derivatives throughout this document. 1.2 Device Types These device types are available and can be ordered through Infineon’s direct and/or distribution channels. Table 1 Derivative Synopsis of XMC4[12]00 Device Types 1) XMC4200-F64x256 Package Flash Kbytes SRAM Kbytes PG-yQFP-642) 256 40 XMC4200-Q48x256 PG-VQFN-48 256 40 XMC4100-F64x128 PG-yQFP-642) 128 20 XMC4100-Q48x128 PG-VQFN-48 128 20 XMC4104-F64x64 PG-yQFP-642) 64 20 XMC4104-Q48x64 PG-VQFN-48 64 20 XMC4104-F64x128 PG-yQFP-642) 128 20 XMC4104-Q48x128 PG-VQFN-48 128 20 XMC4108-F64x64 PG-yQFP-642) 64 20 XMC4108-Q48x64 PG-VQFN-48 64 20 1) x is a placeholder for the supported temperature range. 2) y is a placeholder for the QFP package variant, LQFP or TQFP depending on the stepping, see Section 1.3. Data Sheet 11 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features 1.3 Package Variants Different markings of the XMC4[12]00 use different package variants. Details of those packages are given in the Package Parameters section of the Data Sheet. Table 2 XMC4[12]00 Package Variants Package Variant Marking Package XMC4[12]00-F64 EES-AA, ES-AA, ES-AB, AB XMC4[12]00-Q48 XMC4[12]00-F64 BA PG-TQFP-64-19 XMC4[12]00-Q48 1.4 PG-LQFP-64-19 PG-VQFN-48-53 PG-VQFN-48-71 Device Type Features The following table lists the available features per device type. Table 3 Features of XMC4[12]00 Device Types 1) Derivative LEDTS Intf. USB Intf. USIC Chan. MultiCAN Nodes, MO XMC4200-F64x256 1 1 2x2 N0, N1 MO[0..63] XMC4200-Q48x256 1 1 2x2 N0, N1 MO[0..63] XMC4100-F64x128 1 1 2x2 N0, N1 MO[0..63] XMC4100-Q48x128 1 1 2x2 N0, N1 MO[0..63] XMC4104-F64x64 1 − 2x2 − XMC4104-Q48x64 1 − 2x2 − XMC4104-F64x128 1 − 2x2 − XMC4104-Q48x128 1 − 2x2 − XMC4108-F64x64 − − 2x2 N0, MO[0..31] XMC4108-Q48x64 − − 2x2 N0, MO[0..31] 1) x is a placeholder for the supported temperature range. Data Sheet 12 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features Table 4 Features of XMC4[12]00 Device Types 1) Derivative ADC Chan. DAC Chan. CCU4 Slice CCU8 Slice POSIF Intf. HRPWM Intf. XMC4200-F64x256 10 2 2x4 1x4 1 1 XMC4200-Q48x256 9 2 2x4 1x4 1 1 XMC4100-F64x128 10 2 2x4 1x4 1 1 XMC4100-Q48x128 9 2 2x4 1x4 1 1 XMC4104-F64x64 10 2 2x4 1x4 1 1 XMC4104-Q48x64 9 2 2x4 1x4 1 1 XMC4104-F64x128 10 2 2x4 1x4 1 1 XMC4104-Q48x128 9 2 2x4 1x4 1 1 XMC4108-F64x64 10 2 2x4 1x4 1 − XMC4108-Q48x64 9 2 2x4 1x4 1 − 1) x is a placeholder for the supported temperature range. 1.5 Definition of Feature Variants The XMC4[12]00 types are offered with several memory sizes and number of available VADC channels. Table 5 describes the location of the available Flash memory, Table 6 describes the location of the available SRAMs, Table 7 the available VADC channels. Table 5 Flash Memory Ranges Total Flash Size Cached Range Uncached Range 256 Kbytes 0800 0000H − 0803 FFFFH 0C00 0000H − 0C03 FFFFH 128 Kbytes 0800 0000H − 0801 FFFFH 0C00 0000H − 0C01 FFFFH 64 Kbytes 0800 0000H − 0800 FFFFH 0C00 0000H − 0C00 FFFFH Data Sheet 13 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features Table 6 SRAM Memory Ranges Total SRAM Size Program SRAM System Data SRAM 40 Kbytes 1FFF C000H − 1FFF FFFFH 2000 0000H − 2000 5FFFH 20 Kbytes 1FFF E000H − 1FFF FFFFH 2000 0000H − 2000 2FFFH ADC Channels1) Table 7 Package VADC G0 VADC G1 LQFP-64, TQFP-64 CH0, CH3..CH7 CH0, CH1, CH3, CH6 PG-VQFN-48 CH0, CH3..CH7 CH0, CH1, CH3 1) Some pins in a package may be connected to more than one channel. For the detailed mapping see the Port I/O Function table. 1.6 Identification Registers The identification registers allow software to identify the marking. Table 8 XMC4200 Identification Registers Register Name Value Marking SCU_IDCHIP 0004 2001H EES-AA, ES-AA SCU_IDCHIP 0004 2002H ES-AB, AB SCU_IDCHIP 0004 2003H BA JTAG IDCODE 101D D083H EES-AA, ES-AA JTAG IDCODE 201D D083H ES-AB, AB JTAG IDCODE 301D D083H BA Data Sheet 14 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Summary of Features Table 9 XMC4100 Identification Registers Register Name Value Marking SCU_IDCHIP 0004 2001H EES-AA, ES-AA SCU_IDCHIP 0004 2002H ES-AB, AB SCU_IDCHIP 0004 1003H BA JTAG IDCODE 101D D083H EES-AA, ES-AA JTAG IDCODE 201D D083H ES-AB, AB JTAG IDCODE 301D D083H BA Data Sheet 15 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information 2 General Device Information This section summarizes the logic symbols and package pin configurations with a detailed list of the functional I/O mapping. 2.1 Logic Symbols VAREF VAGND VDDA VSSA (1) (1) VDDC VDDP VSS (2) (3) (1) Exp. Die Pad (VSS) VBAT (1) (1) VSSO RTC_XTAL1 RTC_XTAL2 Port 0 12 bit HIB_IO_0 Port 1 10 bit XTAL1 Port 2 12 bit XTAL2 USB_DP Port 3 1 bit USB_DM Port 14 9 bit TCK PORST JTAG 3 bit TMS Figure 2 Data Sheet SWD 1 bit via Port Pins XMC4[12]00 Logic Symbol PG-LQFP-64 and PG-TQFP-64 16 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information VAREF VAGND VDDA VSSA (1) (1) VDDC VDDP VSS (2) (3) (1) Exp. Die Pad (VSS) VBAT (1) RTC_XTAL1 RTC_XTAL2 Port 0 9 bit HIB_IO_0 Port 1 6 bit XTAL1 Port 2 6 bit XTAL2 USB_DP USB_DM Port 14 8 bit TCK PORST JTAG 3 bit TMS Figure 3 Data Sheet SWD 1 bit via Port Pins XMC4[12]00 Logic Symbol PG-VQFN-48 17 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information 2.2 Pin Configuration and Definition 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 P0.2 P0.3 P0.4 P0.5 P0.6 P0.11 P0.7 P0.8 VDDP P1.7 P1.8 P1.9 P1.0 P1.1 P1.2 P1.3 The following figures summarize all pins, showing their locations on the different packages. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 XMC4[12]00 (Top View) 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P1.4 P1.5 P1.15 TCK TMS PORST VDDC VSSO XTAL2 XTAL1 VDDP VSS P2.6 P2.7 P2.0 P2.1 P14.5 P14.4 P14.3 P14.0 VSSA/VAGND VDDA/VAREF P14.9 P14.8 P2.15 P2.14 P2.9 P2.8 P2.5 P2.4 P2.3 P2.2 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P0.1 P0.0 P0.10 P0.9 P3.0 USB_DM USB_DP VDDP VDDC HIB_IO_0 RTC_XTAL1 RTC_XTAL2 VBAT P14.14 P14.7 P14.6 Figure 4 Data Sheet XMC4[12]00 PG-LQFP-64 and PG-TQFP-64 Pin Configuration (top view) 18 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family 48 47 46 45 44 43 42 41 40 39 38 37 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P0.8 VDDP P1.0 P1.1 P1.2 P1.3 General Device Information P0.1 P0.0 USB_DM USB_DP VDDP VDDC HIB_IO_0 XMC4[12]00 (Top View) 36 35 34 33 32 31 30 29 28 27 26 25 P1.4 P1.5 TCK TMS PORST VDDC XTAL2 XTAL1 VDDP VSS P2.0 P2.1 P14.5 P14.4 P14.3 P14.0 VSSA/VAGND VDDA/VAREF P14.9 P14.8 P2.5 P2.4 P2.3 P2.2 13 14 15 16 17 18 19 20 21 22 23 24 RTC_XTAL1 RTC_XTAL2 VBAT P14.7 P14.6 1 2 3 4 5 6 7 8 9 10 11 12 Figure 5 Data Sheet XMC4[12]00 PG-VQFN-48 Pin Configuration (top view) 19 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information 2.2.1 Package Pin Summary The following general scheme is used to describe each pin: Table 10 Package Pin Mapping Description Function Package A Package B ... Pad Type Name N Ax ... A1+ Notes The table is sorted by the “Function” column, starting with the regular Port pins (Px.y), followed by the dedicated pins (i.e. PORST) and supply pins. The following columns, titled with the supported package variants, lists the package pin number to which the respective function is mapped in that package. The “Pad Type” indicates the employed pad type (A1, A1+, special=special pad, In=input pad, AN/DIG_IN=analog and digital input, Power=power supply). Details about the pad properties are defined in the Electrical Parameters. In the “Notes”, special information to the respective pin/function is given, i.e. deviations from the default configuration after reset. Per default the regular Port pins are configured as direct input with no internal pull device active. Table 11 Package Pin Mapping Function LQFP-64 TQFP-64 VQFN-48 Pad Type P0.0 2 2 A1+ P0.1 1 1 A1+ P0.2 64 48 A1+ P0.3 63 47 A1+ P0.4 62 46 A1+ P0.5 61 45 A1+ P0.6 60 44 A1+ P0.7 58 43 A1+ After a system reset, via HWSEL this pin selects the DB.TDI function. P0.8 57 42 A1+ After a system reset, via HWSEL this pin selects the DB.TRST function, with a weak pull-down active. P0.9 4 - A1+ P0.10 3 - A1+ Data Sheet 20 Notes V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information Table 11 Package Pin Mapping (cont’d) Function LQFP-64 TQFP-64 VQFN-48 Pad Type P0.11 59 - A1+ P1.0 52 40 A1+ P1.1 51 39 A1+ P1.2 50 38 A1+ P1.3 49 37 A1+ P1.4 48 36 A1+ P1.5 47 35 A1+ P1.7 55 - A1+ P1.8 54 - A1+ P1.9 53 - A1+ P1.15 46 - A1+ P2.0 34 26 A1+ P2.1 33 25 A1+ P2.2 32 24 A1+ P2.3 31 23 A1+ P2.4 30 22 A1+ P2.5 29 21 A1+ P2.6 36 - A1+ P2.7 35 - A1+ P2.8 28 - A1+ P2.9 27 - A1+ P2.14 26 - A1+ P2.15 25 - A1+ After a system reset, via HWSEL this pin selects the DB.TDO function. P3.0 5 - A1+ P14.0 20 16 AN/DIG_IN P14.3 19 15 AN/DIG_IN P14.4 18 14 AN/DIG_IN P14.5 17 13 AN/DIG_IN P14.6 16 12 AN/DIG_IN P14.7 15 11 AN/DIG_IN P14.8 24 20 AN/DAC/DIG_IN Data Sheet 21 Notes V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information Table 11 Package Pin Mapping (cont’d) Function LQFP-64 TQFP-64 VQFN-48 Pad Type P14.9 23 19 AN/DAC/DIG_IN P14.14 14 - AN/DIG_IN USB_DP 7 4 special USB_DM 6 3 special HIB_IO_0 10 7 A1 special Notes At the first power-up and with every reset of the hibernate domain this pin is configured as open-drain output and drives "0". As output the medium driver mode is active. TCK 45 34 A1 Weak pull-down active. TMS 44 33 A1+ Weak pull-up active. As output the strong-soft driver mode is active. PORST 43 32 special Strong pull-down controlled by EVR. Weak pull-up active while strong pull-down is not active. XTAL1 39 29 clock_IN XTAL2 40 30 clock_O RTC_XTAL1 11 8 clock_IN RTC_XTAL2 12 9 clock_O VBAT 13 10 Power When VDDP is supplied VBAT has to be supplied as well. VDDA/VAREF 22 18 AN_Power/AN_ Ref Shared analog supply and reference voltage pin. VSSA/VAGND 21 17 AN_Power/AN_ Ref Shared analog supply and reference ground pin. VDDC 9 6 Power VDDC 42 31 Power VDDP 8 5 Power VDDP 38 28 Power VDDP 56 41 Power VSS 37 27 Power Data Sheet 22 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information Table 11 Package Pin Mapping (cont’d) Function LQFP-64 TQFP-64 VQFN-48 Pad Type VSSO 41 - Power VSS Exp. Pad Exp. Pad Power Data Sheet 23 Notes Exposed Die Pad The exposed die pad is connected internally to VSS. For proper operation, it is mandatory to connect the exposed pad directly to the common ground on the board. For thermal aspects, please refer to the Data Sheet. Board layout examples are given in an application note. V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family General Device Information 2.2.2 Port I/O Functions The following general scheme is used to describe each PORT pin: Table 12 Port I/O Function Description Function Outputs ALT1 ALTn P0.0 Pn.y Inputs HWO0 HWI0 Input MODA.OUT MODB.OUT MODB.INA MODA.OUT Input MODC.INA MODA.INA MODC.INB Pn.y XMC4000 Control Logic PAD Input 0 MODA.INA MODA MODB VDDP ... Input n HWI0 HWI1 Pn.y SW MODB.OUT ALT1 ... ALTn HWO0 HWO1 Figure 6 GND Simplified Port Structure Pn.y is the port pin name, defining the control and data bits/registers associated with it. As GPIO, the port is under software control. Its input value is read via Pn_IN.y, Pn_OUT defines the output value. Up to four alternate output functions (ALT1/2/3/4) can be mapped to a single port pin, selected by Pn_IOCR.PC. The output value is directly driven by the respective module, with the pin characteristics controlled by the port registers (within the limits of the connected pad). The port pin input can be connected to multiple peripherals. Most peripherals have an input multiplexer to select between different possible input sources. The input path is also active while the pin is configured as output. This allows to feedback an output to on-chip resources without wasting an additional external pin. By Pn_HWSEL it is possible to select between different hardware “masters” (HWO0/HWI0). The selected peripheral can take control of the pin(s). Hardware control overrules settings in the respective port pin registers. Data Sheet 24 V1.4, 2018-09 Subject to Agreement on the Use of Product Information Data Sheet 2.2.2.1 Table 13 Port I/O Function Table Port I/O Functions Function Output ALT1 P0.0 Input ALT2 ALT3 ALT4 CAN. N0_TXD CCU80. OUT21 LEDTS0. COL2 P0.1 U1C1. DOUT0 CCU80. OUT11 LEDTS0. COL3 P0.2 U1C1. SELO1 CCU80. OUT01 HRPWM0. HROUT01 HWO0 HWI0 U1C0. HWIN3 CCU80. OUT20 HRPWM0. HROUT20 U1C0. DOUT2 U1C0. HWIN2 CCU80. OUT10 HRPWM0. HROUT21 U1C0. DOUT1 U1C0. HWIN1 U1C0. DOUT0 U1C0. HWIN0 U1C0. DOUT0 CCU80. OUT00 HRPWM0. HROUT00 U1C0. SELO0 CCU80. OUT30 HRPWM0. HROUT30 25 U0C0. SELO0 Input Input ERU0. 0B0 USB. VBUSDETECT A U1C0. DX0B CCU80. IN2B ERU0. 2B1 CCU80. IN0A CCU80. IN1B U0C0. SCLKOUT U0C0. DX1B ERU0. 2A1 HRPWM0. HROUT31 U1C1. SELO0 CCU80. OUT12 LEDTS0. COL0 U1C1. DX2A ERU0. 1B0 P0.10 U1C1. SCLKOUT CCU80. OUT02 LEDTS0. COL1 U1C1. DX1A ERU0. 1A0 ERU1. PDOUT3 U0C0. DX2A P1.1 U0C0. SCLKOUT P1.3 U0C0. MCLKOUT U1C0. DX1A U0C0. DX1A ERU0. 3A0 HRPWM0. C0INA CCU40. OUT2 ERU1. PDOUT2 CCU40. IN2A HRPWM0. C1INA ERU1. PDOUT1 U0C0. DOUT3 U0C0. HWIN3 POSIF0. IN1A ERU1. 2B0 CCU40. IN1A HRPWM0. C2INA CCU40. OUT0 ERU1. PDOUT0 U0C0. DOUT2 U0C0. HWIN2 POSIF0. IN0A ERU1. 2A0 CCU40. IN0A HRPWM0. C0INB CCU41. IN0C HRPWM0. BL0A ERU1. 0A0 CCU41. IN1C WWDT. SERVICE_OUT CAN. N0_TXD CCU80. OUT33 U0C0. DOUT1 U0C0. HWIN1 U0C0. DX0B CAN. N1_RXDD ERU0. 2B0 P1.5 CAN. N1_TXD U0C0. DOUT0 CCU80. OUT23 U0C0. DOUT0 U0C0. HWIN0 U0C0. DX0A CAN. N0_RXDA ERU0. 2A0 U0C0. DOUT0 CCU40. IN3A CCU40. OUT1 P1.4 P1.7 U1C1. SELO2 CCU80. IN3A ERU0. 3A2 ERU0. 3B0 POSIF0. IN2A CCU80. IN1A USB. VBUSDETECT B XMC4100 / XMC4200 XMC4000 Family CCU80. OUT31 P1.2 V1.4, 2018-09 Subject to Agreement on the Use of Product Information SCU. EXTCLK CCU40. OUT3 U0C0. DX2B ERU1. 3A0 P0.8 U0C0. SELO0 DB. TRST CCU80. IN2A HRPWM0. C2INB ERU0. 3B2 P0.9 U1C0. SCLKOUT HRPWM0. HROUT10 Input ERU0. 2B3 WWDT. SERVICE_OUT P0.11 DB. TDI Input ERU1. 3B0 U1C0. DX0A U1C0. DX2A HRPWM0. HROUT11 Input HRPWM0. C1INB ERU0. 3B3 P0.7 P1.0 Input ERU0. 0A0 U1C0. DOUT3 P0.3 P0.5 Input U1C1. DX0D P0.4 P0.6 Input Data Sheet Table 13 Port I/O Functions Function ALT1 P1.8 P1.9 (cont’d) Output ALT2 ALT3 U0C0. SELO1 Input ALT4 HWO0 HWI0 Input Input Input Input Input Input U0C0. SCLKOUT P1.15 SCU. EXTCLK U1C0. DOUT0 CAN. N0_TXD LEDTS0. COL1 P2.1 LEDTS0. COL0 ERU1. 1A0 ERU0. 0B3 DB.TDO/ TRACESWO CCU40. IN1C ERU1. 0B0 CCU40. IN0C P2.2 VADC. EMUX00 CCU41. OUT3 LEDTS0. LINE0 LEDTS0. EXTENDED0 LEDTS0. TSIN0A U0C1. DX0A ERU0. 1B2 CCU41. IN3A P2.3 VADC. EMUX01 U0C1. SELO0 CCU41. OUT2 LEDTS0. LINE1 LEDTS0. EXTENDED1 LEDTS0. TSIN1A U0C1. DX2A ERU0. 1A2 CCU41. IN2A P2.4 VADC. EMUX02 U0C1. SCLKOUT CCU41. OUT1 LEDTS0. LINE2 LEDTS0. EXTENDED2 LEDTS0. TSIN2A U0C1. DX1A ERU0. 0B2 CCU41. IN1A HRPWM0. BL1A U0C1. DOUT0 CCU41. OUT0 LEDTS0. LINE3 LEDTS0. EXTENDED3 LEDTS0. TSIN3A U0C1. DX0B ERU0. 0A2 CCU41. IN0A HRPWM0. BL2A CCU80. OUT13 LEDTS0. COL3 CAN. N1_RXDA ERU0. 1B3 CCU40. IN3C P2.6 26 P2.7 Input U1C1. DOUT0 P2.0 P2.5 Input U1C1. SCLKOUT LEDTS0. COL2 CCU80. OUT32 LEDTS0. LINE4 LEDTS0. EXTENDED4 LEDTS0. TSIN4A DAC. TRIGGER5 CCU40. IN0B CCU40. IN1B CCU40. IN2B CCU40. IN3B P2.9 CCU80. OUT22 LEDTS0. LINE5 LEDTS0. EXTENDED5 LEDTS0. TSIN5A DAC. TRIGGER4 CCU41. IN0B CCU41. IN1B CCU41. IN2B CCU41. IN3B CAN. N1_TXD LEDTS0. LINE6 LEDTS0. EXTENDED6 LEDTS0. TSIN6A P2.14 VADC. EMUX11 P2.15 VADC. EMUX12 P3.0 U1C0. DOUT0 ERU1. 1B0 CCU80. OUT21 CCU80. OUT11 CCU40. IN2C U1C0. DX0D U0C1. SCLKOUT U1C0. DX0C U0C1. DX1B CCU80. IN2C P14.0 VADC. G0CH0 P14.3 VADC. G0CH3 P14.4 VADC. G0CH4 P14.5 VADC. G0CH5 POSIF0. IN2B P14.6 VADC. G0CH6 POSIF0. IN1B P14.7 P14.8 VADC. G1CH3 VADC. G0CH7 DAC. OUT_0 CAN. N0_RXDB POSIF0. IN0B VADC. G1CH0 G0ORC6 XMC4100 / XMC4200 XMC4000 Family V1.4, 2018-09 Subject to Agreement on the Use of Product Information CCU80. OUT03 P2.8 Data Sheet Table 13 Port I/O Functions Function (cont’d) Output ALT1 ALT2 P14.9 ALT3 Input ALT4 HWO0 HWI0 Input DAC. OUT_1 Input Input Input Input Input Input Input VADC. G1CH1 P14.14 VADC. G1CH6 G1ORC6 USB_DP USB_DM HIB_IO_0 HIBOUT WWDT. SERVICE_OUT WAKEUPA TCK TMS USB. VBUSDETECT C DB.TCK/ SWCLK DB.TMS/ SWDIO PORST XTAL1 U0C0. DX0F U0C1. DX0F U1C0. DX0F U1C1. DX0F XTAL2 RTC_XTAL1 ERU0. 1B1 27 RTC_XTAL2 XMC4100 / XMC4200 XMC4000 Family V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family 2.3 Power Connection Scheme Figure 7. shows a reference power connection scheme for the XMC4[12]00. XMC4000 VBAT Hibernate domain 2.1...3.6 V Hibernate control Retention Memory RTC 32 kHz Clock GND M x VDDC Core Domain 100 nF x M Dig. Peripherals GPIOs 4.7 µF x 1 CPU RAMs Level shift. GND 3.3V EVR N x VDDP 100 nF x N FLASH VSS 10 µF x 1 Exp. Die Pad PAD Domain VSS Analog Domain GND ADC DAC Out-of-range comparator 3.3V 100 nF VDDA / VAREF VSSA / VAGND GND Figure 7 Power Connection Scheme Every power supply pin needs to be connected. Different pins of the same supply need also to be externally connected. As example, all VDDP pins must be connected externally to one VDDP net. In this reference scheme one 100 nF capacitor is connected at each supply pin against VSS. An additional 10 µF capacitor is connected to the VDDP nets and an additional 4.7uF capacitor to the VDDC nets. Data Sheet 28 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family The XMC4[12]00 has a common ground concept, all VSS, VSSA and VSSO pins share the same ground potential. In packages with an exposed die pad it must be connected to the common ground as well. There are no dedicated connections for the analog reference VAREF and VAGND. Instead, they share the same pins as the analog supply pins VDDA and VSSA.Some analog channels can optionally serve as “Alternate Reference”; further details on this operating mode are described in the Reference Manual. When VDDP is supplied, VBAT must be supplied as well. If no other supply source (e.g. battery) is connected to VBAT, the VBAT pin can also be connected directly to VDDP. Data Sheet 29 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3 Electrical Parameters 3.1 General Parameters 3.1.1 Parameter Interpretation The parameters listed in this section partly represent the characteristics of the XMC4[12]00 and partly its requirements on the system. To aid interpreting the parameters easily when evaluating them for a design, they are marked with an two-letter abbreviation in column “Symbol”: • • CC Such parameters indicate Controller Characteristics, which are a distinctive feature of the XMC4[12]00 and must be regarded for system design. SR Such parameters indicate System Requirements, which must be provided by the application system in which the XMC4[12]00 is designed in. Data Sheet 30 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.1.2 Absolute Maximum Ratings Stresses above the values listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Table 14 Absolute Maximum Rating Parameters Parameter Symbol Values Min. Typ. Max. – 150 °C – − 150 °C – – 4.3 V – – VDDP + 1.0 or max. 4.3 V whichever is lower -1.0 – VAIN VAREF SR IIN SR -10 – VDDP + 1.0 or max. 4.3 V whichever is lower +10 mA +25 mA +100 mA TST SR -65 Junction temperature TJ SR -40 Voltage at 3.3 V power supply VDDP SR – pins with respect to VSS Voltage on any Class A and VIN SR -1.0 Storage temperature dedicated input pin with respect to VSS Voltage on any analog input pin with respect to VAGND Input current on any pin during overload condition Unit Note / Test Con dition Absolute maximum sum of all ΣIIN input circuit currents for one port group during overload condition1) SR -25 Absolute maximum sum of all ΣIIN input circuit currents during overload condition SR -100 – – 1) The port groups are defined in Table 18. Data Sheet 31 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Figure 8 explains the input voltage ranges of VIN and VAIN and its dependency to the supply level of VDDP.The input voltage must not exceed 4.3 V, and it must not be more than 1.0 V above VDDP. For the range up to VDDP + 1.0 V also see the definition of the overload conditions in Section 3.1.3. V V 4.3 VDDP + 1.0 VDDP A B Figure 8 Data Sheet V SS VSS -1.0 -1.0 A Abs. max. input voltage VIN with VDDP > 3.3 V B Abs. max. input voltage VIN with VDDP ≤ 3.3 V Absolute Maximum Input Voltage Ranges 32 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.1.3 Pin Reliability in Overload When receiving signals from higher voltage devices, low-voltage devices experience overload currents and voltages that go beyond their own IO power supplies specification. Table 15 defines overload conditions that will not cause any negative reliability impact if all the following conditions are met: • • full operation life-time is not exceeded Operating Conditions are met for – pad supply levels (VDDP or VDDA) – temperature If a pin current is outside of the Operating Conditions but within the overload parameters, then the parameters functionality of this pin as stated in the Operating Conditions can no longer be guaranteed. Operation is still possible in most cases but with relaxed parameters. Note: An overload condition on one or more pins does not require a reset. Note: A series resistor at the pin to limit the current to the maximum permitted overload current is sufficient to handle failure situations like short to battery. Table 15 Overload Parameters Parameter Symbol Values Min. Typ. Unit Note / Test Condition Max. -5 – 5 mA Input current on any port pin during overload condition IOV SR Absolute sum of all input circuit currents for one port group during overload condition1) IOVG SR – – 20 mA – – 20 mA Absolute sum of all input circuit currents during overload condition IOVS SR – – 80 mA Σ|IOVx|, for all IOVx < 0 mA Σ|IOVx|, for all IOVx > 0 mA ΣIOVG 1) The port groups are defined in Table 18. Figure 9 shows the path of the input currents during overload via the ESD protection structures. The diodes against VDDP and ground are a simplified representation of these ESD protection structures. Data Sheet 33 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters VDDP VDDP Pn.y IOVx GND ESD Figure 9 GND Pad Input Overload Current via ESD structures Table 16 and Table 17 list input voltages that can be reached under overload conditions. Note that the absolute maximum input voltages as defined in the Absolute Maximum Ratings must not be exceeded during overload. Table 16 Pad Type A1 / A1+ AN/DIG_IN Table 17 Pad Type A1 / A1+ AN/DIG_IN Table 18 PN-Junction Characterisitics for positive Overload IOV = 5 mA, TJ = -40 °C VIN = VDDP + 1.0 V VIN = VDDP + 1.0 V PN-Junction Characterisitics for negative Overload IOV = 5 mA, TJ = -40 °C VIN = VSS - 1.0 V VIN = VDDP - 1.0 V IOV = 5 mA, TJ = 150 °C VIN = VSS - 0.75 V VIN = VDDP - 0.75 V Port Groups for Overload and Short-Circuit Current Sum Parameters Group Pins 1 P0.[12:0], P3.0 2 P14.[8:0] 3 P2.[15:0] 4 P1.[15:0] Data Sheet IOV = 5 mA, TJ = 150 °C VIN = VDDP + 0.75 V VIN = VDDP + 0.75 V 34 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.1.4 Pad Driver and Pad Classes Summary This section gives an overview on the different pad driver classes and its basic characteristics. More details (mainly DC parameters) are defined in the Section 3.2.1. Table 19 Pad Driver and Pad Classes Overview Class Power Type Supply Sub-Class Speed Grade Load A A1 (e.g. GPIO) 6 MHz 100 pF No A1+ (e.g. serial I/Os) 25 MHz 50 pF 3.3 V LVTTL I/O, LVTTL outputs Termination Series termination recommended V VDDP E F D C Outp ig ut H ltage h Vo VOH VOL u Outp t Low ge Volta VSS t D C Strong – soft drive strength C Figure 10 D Strong – slow drive strength E Medium drive strength F Weak drive strength E F Class A1+ Pads E F Class A1 Pads Output Slopes with different Pad Driver Modes Figure 10 is a qualitative display of the resulting output slope performance with different output driver modes. The detailed input and output characteristics are listed in Section 3.2.1. Data Sheet 35 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.1.5 Operating Conditions The following operating conditions must not be exceeded in order to ensure correct operation and reliability of the XMC4[12]00. All parameters specified in the following tables refer to these operating conditions, unless noted otherwise. Table 20 Operating Conditions Parameters Parameter Symbol Values Min. Note / Test Condition 85 °C Temp. Range F − 125 °C Temp. Range K 3.3 3.632) V 1.3 − V − − Max. SR -40 − -40 Ambient Temperature TA Digital supply voltage VDDP SR 3.131) VDDC −1) Core Supply Voltage Unit Typ. CC Digital ground voltage ADC analog supply voltage VSS SR 0 VDDA SR 3.0 Analog ground voltage for VSSA SR -0.1 Generated internally V 2) 3.3 3.6 V 0 0.1 V 3.63 V VDDA Battery Supply Voltage for Hibernate Domain3) VBAT SR 1.954) − System Frequency fSYS SR − ISC SR -5 − 80 MHz − 5 mA Short circuit current of digital outputs Absolute sum of short circuit currents per pin group5) ΣISC_PG SR − − 20 mA Absolute sum of short circuit currents of the device ΣISC_D SR − − 100 mA When VDDP is supplied VBAT has to be supplied as well. 1) See also the Supply Monitoring thresholds, Section 3.3.2. 2) Voltage overshoot to 4.0 V is permissible at Power-Up and PORST low, provided the pulse duration is less than 100 μs and the cumulated sum of the pulses does not exceed 1 h over lifetime. 3) Different limits apply for LPAC operation, Section 3.2.6 4) To start the hibernate domain it is required that VBAT ≥ 2.1 V, for a reliable start of the oscillation of RTC_XTAL in crystal mode it is required that VBAT ≥ 3.0 V. 5) The port groups are defined in Table 18. Data Sheet 36 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2 DC Parameters 3.2.1 Input/Output Pins The digital input stage of the shared analog/digital input pins is identical to the input stage of the standard digital input/output pins. The pull-up characteristics (IPUH) and the input high and low voltage levels (VIH and VIL) of the PORST pin are identical to the respective values of the standard digital input/output pins. Table 21 Standard Pad Parameters Parameter Symbol Values Unit Note / Test Condition Min. Max. − 10 pF |IPDL| SR 150 − μA 1) − 10 μA 2) Pull-up current |IPUH| SR − 10 μA 100 − μA Input Hysteresis for pads of all A classes3) HYSA 0.1 × − V CC VDDP PORST spike filter always blocked pulse duration tSF1 CC − 10 ns PORST spike filter pass-through pulse duration tSF2 CC 100 − ns PORST pull-down current |IPPD| CC 13 − mA Pin capacitance (digital CIO CC inputs/outputs) Pull-down current VIN ≥ 0.6 × VDDP VIN ≤ 0.36 × VDDP 2) VIN ≥ 0.6 × VDDP 1) VIN ≤ 0.36 × VDDP Vi = 1.0 V 1) Current required to override the pull device with the opposite logic level (“force current”). With active pull device, at load currents between force and keep current the input state is undefined. 2) Load current at which the pull device still maintains the valid logic level (“keep current”). With active pull device, at load currents between force and keep current the input state is undefined. 3) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can not be guaranteed that it suppresses switching due to external system noise. Data Sheet 37 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters V VDDP XMC4000 IN IPDL A IPDL ≥ 150 μA B IPDL ≤ 10 μA A Valid High 0.6 x VDDP Invalid digital input 0.36 x VDDP B Valid Low GND VSS Pull-down active V VDDP VDDP B Valid High 0.6 x VDDP B IN XMC4000 IPUH A IPUH ≤ 10 μA Invalid digital input 0.36 x VDDP IPUH ≥ 100 μA A Valid Low VSS Pull-up active Figure 11 Pull Device Input Characteristics Figure 11 visualizes the input characteristics with an active internal pull device: • • in the cases “A” the internal pull device is overridden by a strong external driver; in the cases “B” the internal pull device defines the input logical state against a weak external load. Data Sheet 38 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 22 Standard Pads Class_A1 Parameter Symbol Input leakage current Input high voltage Input low voltage Output high voltage, POD1) = weak IOZA1 CC VIHA1 SR VILA1 SR VOHA1 CC Output high voltage, POD1) = medium Output low voltage VOLA1 Values Unit Note / Test Condition nA 0 V ≤ VIN ≤ VDDP Min. Max. -500 500 0.6 × VDDP max. 3.6 V -0.3 VDDP + 0.3 V 0.36 × VDDP V VDDP - 0.4 − V 2.4 − V VDDP - 0.4 − V IOH ≥ -400 μA IOH ≥ -500 μA IOH ≥ -1.4 mA IOH ≥ -2 mA IOL ≤ 500 μA; 2.4 − V − 0.4 V POD1) = weak CC − 0.4 V IOL ≤ 2 mA; POD1) = medium tFA1 CC Fall time tRA1 CC Rise time − 150 ns CL = 20 pF; POD1) = weak − 50 ns CL = 50 pF; POD1) = medium − 150 ns CL = 20 pF; POD1) = weak − 50 ns CL = 50 pF; POD1) = medium Unit Note / Test Condition μA 0 V ≤ VIN ≤ VDDP 1) POD = Pin Out Driver Table 23 Standard Pads Class_A1+ Parameter Symbol Values Input leakage current IOZA1+ CC -1 VIHA1+ SR 0.6 × VDDP VILA1+ SR -0.3 Min. Input high voltage Input low voltage Data Sheet Max. 39 1 VDDP + 0.3 V 0.36 × VDDP V max. 3.6 V V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 23 Standard Pads Class_A1+ Parameter Symbol Values Unit Note / Test Condition − V − V − V IOH ≥ -400 μA IOH ≥ -500 μA IOH ≥ -1.4 mA IOH ≥ -2 mA IOH ≥ -1.4 mA IOH ≥ -2 mA IOL ≤ 500 μA; Min. Max. VOHA1+ VDDP - 0.4 CC 2.4 Output high voltage, POD1) = medium VDDP - 0.4 2.4 − V Output high voltage, POD1) = strong VDDP - 0.4 − V 2.4 − V − 0.4 V Output high voltage, POD1) = weak Output low voltage VOLA1+ POD1) = weak CC − 0.4 V IOL ≤ 2 mA; POD1) = medium − 0.4 V IOL ≤ 2 mA; POD1) = strong Fall time tFA1+ CC − 150 ns CL = 20 pF; POD1) = weak − 50 ns CL = 50 pF; POD1) = medium − 28 ns CL = 50 pF; POD1) = strong; edge = slow − 16 ns CL = 50 pF; POD1) = strong; edge = soft; Rise time tRA1+ CC − 150 ns CL = 20 pF; POD1) = weak − 50 ns CL = 50 pF; POD1) = medium − 28 ns CL = 50 pF; POD1) = strong; edge = slow − 16 ns CL = 50 pF; POD1) = strong; edge = soft 1) POD = Pin Out Driver Data Sheet 40 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 24 HIB_IO Class_A1 special Pads Parameter Input leakage current Symbol IOZHIB Values Unit Note / Test Condition 500 nA 0 V ≤ VIN ≤ VBAT 0.6 × VBAT VBAT + 0.3 V max. 3.6 V -0.3 0.36 × VBAT V Min. Max. -500 CC Input high voltage VIHHIB SR Input low voltage VILHIB SR HYSHIB 0.1 × VBAT − V CC 0.06 × − V Output high voltage, POD1) = medium VOHHIB VBAT VBAT - 0.4 VBAT ≥ 3.13 V VBAT < 3.13 V − V IOH ≥ -1.4 mA Output low voltage VOLHIB − 0.4 V IOL ≤ 2 mA tFHIB CC − 50 ns 100 ns 50 ns 100 ns VBAT ≥ 3.13 V CL = 50 pF VBAT < 3.13 V CL = 50 pF VBAT ≥ 3.13 V CL = 50 pF VBAT < 3.13 V CL = 50 pF Input Hysteresis for HIB_IO pins1) CC CC Fall time − Rise time tRHIB CC − − 1) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can not be guaranteed that it suppresses switching due to external system noise. Data Sheet 41 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.2 Table 25 Analog to Digital Converters (ADCx) ADC Parameters (Operating Conditions apply) Parameter Analog reference voltage Symbol VAREF Values Min. Typ. Max. − − − Unit Note / Test Condition V VAREF = VDDA shared analog supply and reference input pin SR Alternate reference voltage5) VAREF VAGND SR +1 Analog reference ground VAGND − − VDDA + V 0.051) − − V Alternate reference voltage range2)5) VAREF VAGND Analog input voltage VAIN SR IOZ1 CC VAGND = VSSA shared analog supply and reference input pin SR − 1 VDDA + V 0.1 SR Input leakage at analog inputs3) Internal ADC clock VAGND − VDDA V -100 − 200 nA 0.03 × VDDA < VAIN < 0.97 × VDDA -500 − 100 nA 0 V ≤ VAIN ≤ 0.03 × VDDA -100 − 500 nA 0.97 × VDDA ≤ VAIN ≤ VDDA − 30 MHz VDDA = 3.3 V 4 6.5 pF fADCI CC 2 CAINSW − Switched capacitance at the analog voltage inputs4) CC Total capacitance of an analog input CAINTOT − 12 20 pF Switched capacitance at the alternate reference voltage input5)6) CAREFSW − 15 30 pF Data Sheet CC CC 42 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 25 ADC Parameters (Operating Conditions apply) Parameter Symbol Values Min. Total capacitance of the alternate reference inputs5) CAREFTOT − Total Unadjusted Error TUE CC -6 EADNL -4.5 Differential Non-Linearity Error8) Gain Error8) Unit Typ. Max. Note / Test Condition 20 40 pF − 6 LSB − 4.5 LSB − 6 LSB − 4.5 LSB − 6 LSB − 1 210)11) LSB − 1.5 2 mA during conversion VDDP = 3.6 V, TJ = 150 oC − 30 − pC 0 V ≤ VAREF ≤ VDDA12) 600 1 200 Ohm 550 900 Ohm CC CC EAGAIN -6 12-bit resolution; VDDA = 3.3 V; VAREF = VDDA7) CC Integral Non-Linearity8) 8) Offset Error EAINLCC -4.5 EAOFF -6 CC RMS Noise9) ENRMS CC Worst case ADC VDDA power supply current per active converter IDDAA Charge consumption on alternate reference per conversion5) QCONV ON resistance of the analog input path RAIN CC − CC CC ON resistance for the ADC RAIN7T test (pull down for AIN7) CC 180 1) A running conversion may become imprecise in case the normal conditions are violated (voltage overshoot). 2) If the analog reference voltage is below VDDA, then the ADC converter errors increase. If the reference voltage is reduced by the factor k (k tOPDD VAREF + 400 mV T < tOPDN VAREF + 200 mV tOPDN < T < tOPDD T > tOPDD T > tOPDN VAREF + 100 mV VAREF Never detected Overvoltage Pulse (Too low) Never Overvoltage detected may be Overvoltage detected Pulse (level uncertain) (Too short) Overvoltage may be detected Always detected Overvoltage Pulse Never detected Overvoltage Pulse (Too short) Overvoltage may be detected Always detected Overvoltage Pulse t Figure 17 Data Sheet ORC Detection Ranges 51 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.5 High Resolution PWM (HRPWM) The following chapters describe the operating conditions, characteristics and timing requirements, for all the components inside the HRPWM module. Each description is given for just one sub unit, e.g., one CSG or one HRC. All the timing information is related to the module clock, fhrpwm. Note: These parameters are not subject to production test, but verified by design and/or characterization. 3.2.5.1 HRC characteristics Table 29 summarizes the characteristics of the HRC units. Table 29 HRC characteristics (Operating Conditions apply) Parameter Symbol Values Min. Unit Typ. Max. High resolution step size1)2) tHRS CC – 150 – ps Startup time (after reset release) tstart CC – – 2 μs Note / Test Condition 1) The step size for clock frequencies equal to 180, 120 and 80 MHz is 150 ps. 2) The step size for clock frequencies different from 180, 120 and 80 MHz but within the range from 180 to 64 MHz can be between 118 to 180 ps (fixed over process and operating conditions) 3.2.5.2 CMP and 10-bit DAC characteristics The Table 30 summarizes the characteristics of the CSG unit. The specified characteristics require that the setup of the HRPWM follows the initialization sequence as documented in the Reference Manual. Table 30 CMP and 10-bit DAC characteristics (Operating Conditions apply) Parameter Symbol Values Min. DAC Resolution Typ. RES Unit Max. 10 Note / Test Condition bits CC DAC differential nonlinearity DNL CC -1 – 1.5 LSB Monotonic behavior, See Figure 18 DAC integral nonlinearity INL CC -3 – 3 LSB See Figure 18 Data Sheet 52 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 30 CMP and 10-bit DAC characteristics (Operating Conditions apply) Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. – – 1 clk tstart CC – IDDbias – – 98 us – 400 μA – – 2 μs -10 – 33 μA VSS – VDDP V – – 80 ns See Figure 20 Input Selector propagation tDhs CC – delay - Full scale – 100 ns See Figure 20 – – ns – 30 MHz – 940 μA – VDDP V tFSls CC – – 160 ns See Figure 20 Input Selector propagation tDls CC – delay - Full Scale – 200 ns See Figure 20 – – ns CSG Output Jitter DCSG CC Bias startup time Bias supply current CC CSGy startup time tCSGS CC Input operation current1) IDDCIN See Figure 19 CC High Speed Mode DAC output voltage range VDOUT CC DAC propagation delay Full scale Comparator bandwidth DAC CLK frequency Supply current tFShs CC tDhs CC 20 fclk SR – – IDDhs CC Low Speed Mode DAC output voltage range VDOUT CC DAC propagation delay Full Scale Comparator bandwidth DAC CLK frequency Supply current 0.1 × VDDP2) tDls CC 20 fclk SR – – IDDls – 30 MHz – 300 μA CC 1) Typical input resistance RCIN = 100kOhm. 2) The INL error increases for DAC output voltages below this limit. Data Sheet 53 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Output Output Electrical Parameters INL DAC Curve Ideal DAC DNL= -0.5LSBs INL DNL= -1LSB Best Fit Straight Line DNL=1.5LSBs DAC code FS Figure 18 FS DAC code CSG DAC INL and DNL example HRPWMx.CyINA CMP Input Selector CSGy + HRPWMx.CyINB Control logic CMP DAC - CMP Input Selector HRPWMx.CyINA/ HRPWMx.CyINB Figure 19 Data Sheet IDDcin Rcin Input operation current 54 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family 3.3 V CMP Input Selector tsishs 0V Output Electrical Parameters CSGy FS + 1LSB CMP - DAC CSGy + CMP FS 0x000 tfshs DAC 1LSB 0x000 - tfshs/tsishs tfshs/tsishs t Figure 20 3.2.5.3 DAC and Input Selector Propagation Delay Clocks HRPWM DAC Conversion Clock The DAC conversion clock can be generated internally or it can be controlled via a HRPWM module pin. Table 31 External DAC conversion trigger operating conditions Parameter Symbol Values Min. Frequency ON time OFF time Typ. Max. fetrg SR – tonetrg SR 2Tccu1)2) toffetrg SR 2Tccu1)2) Unit Note / Test Con dition – 302) MHz – – ns – – ns 1) 50% duty cycle is not obligatory 2) Only valid if the signal was not previously synchronized/generated with the fccu clock (or a synchronous clock) CSG External Clock It is possible to select an external source, that can be used as a clock for the slope generation, HRPWMx.ECLKy. This clock is synchronized internally with the module clock and therefore the external clock needs to meet the criterion described on Table 32. Data Sheet 55 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 32 External clock operating conditions Parameter Symbol Values Min. feclk SR – – toneclk SR 2Tccu1)2) – toffeclk SR 2Tccu1)2) – Frequency ON time OFF time Unit Note / Test Con dition Typ. Max. fhrpwm/4 MHz – ns – ns Only the rising edge is used 1) 50% duty cycle is not obligatory 2) Only valid if the signal was not previously synchronized/generated with the fccu clock (or a synchronous clock) 3.2.6 Low Power Analog Comparator (LPAC) The Low Power Analog Comparator (LPAC) triggers a wake-up event from Hibernate state or an interrupt trigger during normal operation. It does so by comparing VBAT or another external sensor voltage VLPS with a pre-programmed threshold voltage. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 33 Low Power Analog Comparator Parameters Parameter Symbol Values Typ. Max. Unit Note / Test Condition − 3.6 V 0 − 1.2 V Threshold step size − 18.75 − mV Threshold trigger accuracy − − % Min. VBAT supply voltage range for VBAT SR 2.1 LPAC operation Sensor voltage range VLPCS CC Vth CC ΔVth CC Conversion time tLPCC CC Average current consumption ILPCAC ±10 for Vth > 0.4 V − − 250 μs − − 15 μA conversion interval 10 ms1) 150 − μA 1) over time CC Current consumption during conversion ILPCC CC − 1) Single channel conversion, measuring VBAT = 3.3 V, 8 cycles settling time Data Sheet 56 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.7 Die Temperature Sensor The Die Temperature Sensor (DTS) measures the junction temperature TJ. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 34 Die Temperature Sensor Parameters Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition − 150 °C Linearity Error ΔTLE CC − (to the below defined formula) ±1 − °C per ΔTJ ≤ 30 °C ΔTOE CC − ±6 − °C ΔTOE = TJ - TDTS tM CC − tTSST SR − − 100 μs − 10 μs Temperature sensor range Offset Error Measurement time Start-up time after reset inactive TSR SR -40 VDDP ≤ 3.3 V1) 1) At VDDP_max = 3.63 V the typical offset error increases by an additional ΔTOE = ±1 °C. The following formula calculates the temperature measured by the DTS in [oC] from the RESULT bit field of the DTSSTAT register. Temperature TDTS = (RESULT - 605) / 2.05 [°C] This formula and the values defined in Table 34 apply with the following calibration values: • • DTSCON.BGTRIM = 8H DTSCON.REFTRIM = 4H Data Sheet 57 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.8 USB Device Interface DC Characteristics The Universal Serial Bus (USB) Interface is compliant to the USB Rev. 2.0 Specification. High-Speed Mode is not supported. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 35 USB Device Data Line (USB_DP, USB_DM) Parameters (Operating Conditions apply) Parameter Symbol Values Min. Unit Typ. Max. Note / Test Condition SR − − 0.8 V SR 2.0 − − V Input high voltage (floating) 1) VIHZ SR 2.7 − 3.6 V Differential input sensitivity VDIS CC 0.2 − − V Differential common mode range VCM CC 0.8 − 2.5 V Output low voltage VOL CC 0.0 − 0.3 V 1.5 kOhm pullup to 3.6 V Output high voltage VOH CC 2.8 − 3.6 V 15 kOhm pulldown to 0 V DP pull-up resistor (idle RPUI CC 900 bus) − 1 575 Ohm Input low voltage Input high voltage (driven) VIL VIH DP pull-up resistor (upstream port receiving) RPUA CC 1 425 − 3 090 Ohm Input impedance DP, DM ZINP CC 300 − − kOhm 0 V ≤ VIN ≤ VDDP − 44 Ohm Driver output resistance ZDRV CC 28 DP, DM 1) Measured at A-connector with 1.5 kOhm ± 5% to 3.3 V ± 0.3 V connected to USB_DP or USB_DM and at Bconnector with 15 kOhm ± 5% to ground connected to USB_DP and USB_DM. Data Sheet 58 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.9 Oscillator Pins Note: It is strongly recommended to measure the oscillation allowance (negative resistance) in the final target system (layout) to determine the optimal parameters for the oscillator operation. Please refer to the limits specified by the crystal or ceramic resonator supplier. Note: These parameters are not subject to production test, but verified by design and/or characterization. The oscillator pins can be operated with an external crystal (see Figure 21) or in direct input mode (see Figure 22). XTAL1 f OSC GND XTAL2 Damping resistor may be needed for some crystals V VPPX_min VPPX VPPX_min ≤ VPPX ≤ VPPX_max tOSCS t Figure 21 Data Sheet Oscillator in Crystal Mode 59 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters External Clock Source Direct Input Mode XTAL1 XTAL2 not connected V VIHBX_max Inpu ltage h Vo t Hig tH Inpu igh V e oltag VIHBX_min VILBX_max VSS VILBX_min g Volta t Low Inpu e t Figure 22 Data Sheet Oscillator in Direct Input Mode 60 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 36 OSC_XTAL Parameters Parameter Symbol Values Min. Input frequency Unit Note / Test Condition Typ. Max. fOSC SR 4 − 40 MHz Direct Input Mode selected 4 − 25 MHz External Crystal Mode selected − − 10 ms Oscillator start-up time1)2) tOSCS Input voltage at XTAL1 VIX SR -0.5 CC − VDDP + V 0.5 Input amplitude (peakto-peak) at XTAL12)3) Input high voltage at XTAL14) VPPX SR 0.4 × VDDP VIHBXSR 1.0 − VDDP + V 1.0 − VDDP + V 0.5 VILBX SR -0.5 − 0.4 V Input leakage current at IILX1 CC -100 XTAL1 − 100 nA Input low voltage at XTAL14) Oscillator power down 0 V ≤ VIX ≤ VDDP 1) tOSCS is defined from the moment the oscillator is enabled wih SCU_OSCHPCTRL.MODE until the oscillations reach an amplitude at XTAL1 of 0.4 * VDDP. 2) The external oscillator circuitry must be optimized by the customer and checked for negative resistance and amplitude as recommended and specified by crystal suppliers. 3) If the shaper unit is enabled and not bypassed. 4) If the shaper unit is bypassed, dedicated DC-thresholds have to be met. Data Sheet 61 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 37 RTC_XTAL Parameters Parameter Symbol Values Min. Input frequency Oscillator start-up time1)2)3) fOSC SR − tOSCS − Typ. Unit Max. 32.768 − kHz − 5 s CC Input voltage at RTC_XTAL1 VIX SR -0.3 − VBAT + V Input amplitude (peakto-peak) at RTC_XTAL12)4) VPPX SR 0.4 − − Input high voltage at RTC_XTAL15) VIHBXSR 0.6 × VBAT VILBX SR -0.3 − VBAT + V Input low voltage at RTC_XTAL15) Input Hysteresis for RTC_XTAL15)6) Note / Test Condition 0.3 V 0.3 − 0.36 × V VBAT VHYSX 0.1 × CC VBAT 0.03 × − V 3.0 V ≤ VBAT < 3.6 V − V VBAT < 3.0 V 100 nA Oscillator power down 0 V ≤ VIX ≤ VBAT VBAT Input leakage current at IILX1 CC -100 RTC_XTAL1 − 1) tOSCS is defined from the moment the oscillator is enabled by the user with SCU_OSCULCTRL.MODE until the oscillations reach an amplitude at RTC_XTAL1 of 400 mV. 2) The external oscillator circuitry must be optimized by the customer and checked for negative resistance and amplitude as recommended and specified by crystal suppliers. 3) For a reliable start of the oscillation in crystal mode it is required that VBAT ≥ 3.0 V. A running oscillation is maintained across the full VBAT voltage range. 4) If the shaper unit is enabled and not bypassed. 5) If the shaper unit is bypassed, dedicated DC-thresholds have to be met. 6) Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce. It can not be guaranteed that it suppresses switching due to external system noise. Data Sheet 62 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.10 Power Supply Current The total power supply current defined below consists of a leakage and a switching component. Application relevant values are typically lower than those given in the following tables, and depend on the customer's system operating conditions (e.g. thermal connection or used application configurations). Note: These parameters are not subject to production test, but verified by design and/or characterization. If not stated otherwise, the operating conditions for the parameters in the following table are: VDDP = 3.3 V, TA = 25 oC Table 38 Power Supply Parameters Parameter Symbol Values Min. 1) Active supply current Peripherals enabled Frequency: fCPU / fPERIPH / fCCU in MHz Typ. Unit Max. Note / Test Condition IDDPA CC − 80 − − 75 − 80 / 40 / 40 − 73 − 40 / 40 / 80 − 59 − 24 / 24 / 24 − 50 − 1/1/1 mA 80 / 80 / 80 Active supply current Code execution from RAM Flash in Sleep mode Frequency: fCPU / fPERIPH / fCCU in MHz IDDPA CC − 24 − − 19 − Active supply current2) Peripherals disabled Frequency: fCPU / fPERIPH in MHz IDDPA CC − 63 − − 62 − 80 / 40 / 40 − 60 − 40 / 40 / 80 − 54 − 24 / 24 / 24 − 50 − 1/1/1 Data Sheet 63 mA 80 / 80 / 80 80 / 40 / 40 mA 80 / 80 / 80 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 38 Power Supply Parameters Parameter Symbol Values Min. Sleep supply current3) Peripherals enabled Frequency: fCPU / fPERIPH / fCCU in MHz Sleep supply current Peripherals disabled Frequency: fCPU / fPERIPH / fCCU in MHz Unit Max. Note / Test Condition IDDPS CC − 76 − − 73 − 80 / 40 / 40 − 70 − 40 / 40 / 80 − 56 − 24 / 24 / 24 − 47 − 1/1/1 − 46 − 100 / 100 / 100 fCPU / fPERIPH / fCCU in kHz 4) Typ. mA 80 / 80 / 80 IDDPS CC − 59 − − 58 − 80 / 40 / 40 − 57 − 40 / 40 / 80 − 51 − 24 / 24 / 24 − 46 − 1/1/1 mA 80 / 80 / 80 − 46 − IDDPD CC − 6.9 − − 4.3 − 4/4/4 − 3.8 − 1/1/1 fCPU / fPERIPH / fCCU in kHz − 4.5 − 100 / 100 / 100 Hibernate supply current RTC on7) IDDPH CC − Hibernate supply current RTC off8) IDDPH CC − fCPU / fPERIPH / fCCU in kHz Deep Sleep supply current5) Flash in Sleep mode Frequency: fCPU / fPERIPH / fCCU in MHz 100 / 100 / 100 mA 6) − − 10.8 − 8.0 − μA 6.8 − 10.3 − − 7.5 − − 6.3 − IDDPA CC − − 140 VDDA power supply current IDDA CC − IDDP current at PORST Low IDDP_PORST − − −11) mA − 24 mA Worst case active supply current9) μA mA 10) CC Data Sheet 24 / 24 / 24 64 VBAT = 3.3 V VBAT = 2.4 V VBAT = 2.0 V VBAT = 3.3 V VBAT = 2.4 V VBAT = 2.0 V VDDP = 3.6 V, TJ = 150 oC VDDP = 3.6 V, TJ = 150 oC V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 38 Power Supply Parameters Parameter Symbol Values Unit Note / Test Condition 1 W VDDP = 3.6 V, TJ = 150 oC 6 − cycles − − − ms Defined by the wake-up of the Flash module, see Section 3.2.11 − − − ms Wake-up via power-on reset event, see Section 3.3.2 Min. Typ. Max. PDISS CC − − CC − Wake-up time from Deep Sleep to Active mode Wake-up time from Hibernate mode Power Dissipation Wake-up time from Sleep to tSSA Active mode 1) CPU executing code from Flash, all peripherals idle. 2) CPU executing code from Flash. USB and CCU clock off. 3) CPU in sleep, all peripherals idle, Flash in Active mode. 4) CPU in sleep, Flash in Active mode. 5) CPU in sleep, peripherals disabled, after wake-up code execution from RAM. 6) To wake-up the Flash from its Sleep mode, fCPU ≥ 1 MHz is required. 7) OSC_ULP operating with external crystal on RTC_XTAL 8) OSC_ULP off, Hibernate domain operating with OSC_SI clock 9) Test Power Loop: fSYS = 80 MHz, CPU executing benchmark code from Flash, all CCUs in 100kHz timer mode, all ADC groups in continuous conversion mode, USICs as SPI in internal loop-back mode, CAN in 500kHz internal loop-back mode, interrupt triggered DMA block transfers to parity protected RAMs and FCE, DTS measurements and FPU calculations. The power consumption of each customer application will most probably be lower than this value, but must be evaluated separately. 10) IDDP decreases typically by 3.5 mA when fSYS decreases by 10 MHz, at constant TJ 11) Sum of currents of all active converters (ADC and DAC) Data Sheet 65 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Peripheral Idle Currents Test conditions: • • • • • • fsys and derived clocks at 80 MHz VDDP = 3.3 V, Ta =25 °C all peripherals are held in reset (see the PRSTAT registers in the Reset Control Unit of the SCU) the peripheral clocks are disabled (see CGATSTAT registers in the Clock Control Unit of the SCU no I/O activity the given values are a result of differential measurements with asserted and deasserted peripheral reset and enabled clock of the peripheral under test The tested peripheral is left in the state after the peripheral reset is deasserted, no further initialisation or configuration is done. E.g. no timer is running in the CCUs, no communication active in the USICs, etc. Table 39 Peripheral Idle Currents Parameter Symbol Values Min. Unit Typ. Max. IPER CC − ≤ 0.3 − MultiCAN ERU LEDTSCU0 CCU4x1) CCU8x1) − ≤ 1.0 − DAC (digital)2) − 1.3 − PORTS USB FCE WDT POSIFx1) USICx − 3.0 − VADC (digital)2) − 4.5 − DMAx − 6.0 − Note / Test Condition mA 1) Enabling the fCCU clock for the POSIFx/CCU4x/CCU8x modules adds approximately IPER = 1.8 mA, disregarding which and how many of those peripherals are enabled. 2) The current consumption of the analog components are given in the dedicated Data Sheet sections of the respective peripheral. Data Sheet 66 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.2.11 Flash Memory Parameters Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 40 Flash Memory Parameters Parameter Symbol Values Erase Time per 256 Kbyte Sector tERP CC − Min. Unit Typ. Max. 5 5.5 s Erase Time per 64 Kbyte tERP CC − Sector 1.2 1.4 s Erase Time per 16 Kbyte tERP CC − Logical Sector 0.3 0.4 s Program time per page1) tPRP CC − 5.5 11 ms − 15 ms − − μs Erase suspend delay tFL_ErSusp − Note / Test Condition CC Wait time after margin change tFL_Margin 10 Del CC − − 270 μs 20 − − ns For operation with 1 / fCPU < ta wait states must be configured2) Data Retention Time, Physical Sector3)4) tRET CC 20 − − years Max. 1000 erase/program cycles Data Retention Time, Logical Sector3)4) tRETL CC 20 − − years Max. 100 erase/program cycles Wake-up time Read access time Data Sheet tWU CC ta CC 67 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 40 Flash Memory Parameters Parameter Symbol Values Min. Data Retention Time, tRTU CC 20 User Configuration Block (UCB)3)4) Endurance on 64 Kbyte Physical Sector PS4 NEPS4 10000 CC Unit Note / Test Condition − years Max. 4 erase/program cycles per UCB − cycles BA-marking devices only! Cycling distributed over life time5) Typ. Max. − − 1) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The reprogramming takes an additional time of 5.5 ms. 2) The following formula applies to the wait state configuration: FCON.WSPFLASH × (1 / fCPU) ≥ ta. 3) Storage and inactive time included. 4) Values given are valid for an average weighted junction temperature of TJ = 110°C. 5) Only valid with robust EEPROM emulation algorithm, equally cycling the logical sectors. For more details see the Reference Manual. Data Sheet 68 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3 AC Parameters 3.3.1 Testing Waveforms VD D P VSS 90% 90% 10% 10% tR tF AC_Rise-Fall-Times.vsd Figure 23 Rise/Fall Time Parameters VD D P VD D P / 2 Test Points VD D P / 2 VSS AC_TestPoints.vsd Figure 24 Testing Waveform, Output Delay VL OAD + 0.1V VL OAD - 0.1V Timing Reference Points VOH - 0.1V VOL + 0.1V AC_HighImp.vsd Figure 25 Data Sheet Testing Waveform, Output High Impedance 69 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.2 Power-Up and Supply Monitoring PORST is always asserted when VDDP and/or VDDC violate the respective thresholds. Note: These parameters are not subject to production test, but verified by design and/or characterization. VDDP VDDP XMC4000 RPORST (optional) PORST PORESET External reset trigger IPPD GND GND Figure 26 PORST Circuit Table 41 Supply Monitoring Parameters Parameter Supply Monitoring Symbol Values Min. Digital supply voltage reset VPOR CC threshold Unit Note / Test Condition 3) Typ. Max. 2.791) − 3.052) V Core supply voltage reset threshold VPV CC − − 1.17 V VDDP voltage to ensure defined pad states VDDPPA − 1.0 − V − − 2 μs − 2.5 3.5 ms Time to the first user code instruction − 550 − μs Ramp up after power-on or after a reset triggered by a violation of VPOR or VPV CC tPR SR Startup time from power-on tSSW CC PORST rise time reset with code execution from Flash VDDC ramp up time tVCR CC 1) Minimum threshold for reset assertion. Data Sheet 70 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 2) Maximum threshold for reset deassertion. 3) The VDDP monitoring has a typical hysteresis of VPORHYS = 180 mV. 3.3 V VPOR VD D P VD D PPA 1.3 V VDDC VPV tV CR PORST t PR t SSW as programmed Pads High-impedance or pull -device active Undefined Figure 27 3.3.3 Power-Up Behavior Power Sequencing While starting up and shutting down as well as when switching power modes of the system it is important to limit the current load steps. A typical cause for such load steps is changing the CPU frequency fCPU. Load steps exceeding the below defined values may cause a power on reset triggered by the supply monitor. Note: These parameters are not subject to production test, but verified by design and/or characterization. Data Sheet 71 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 42 Power Sequencing Parameters Parameter Symbol Values Unit Note / Test Condition 50 mA Load increase on VDDP Δt ≤ 10 ns − 150 mA Load decrease on VDDP Δt ≤ 10 ns − ±100 mV For maximum positive or negative load step − - μs Min. Typ. Max. Positive Load Step Current ΔIPLS SR - − Negative Load Step Current ΔINLS SR - VDDC Voltage Over- ΔVLS CC - / Undershoot from Load Step Positive Load Step Settling tPLSS SR 50 Time Negative Load Step Settling Time tNLSS SR 100 − - μs External Buffer Capacitor on VDDC CEXT SR 3 4.7 6 μF In addition C = 100 nF capacitor on each VDDC pin Positive Load Step Examples System assumptions: fCPU = fSYS, target frequency fCPU = 80 MHz, main PLL fVCO = 480 MHz, stepping done by K2 divider, tPLSS between individual steps: 24 MHz - 48 MHz - 80 MHz (K2 steps 20 - 10 - 6) 24 MHz - 60 MHz - 80 MHz (K2 steps 20 - 8 - 6) Data Sheet 72 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.4 Phase Locked Loop (PLL) Characteristics Main and USB PLL Table 43 PLL Parameters Parameter Symbol Values Unit Note / Test Condition ±5 ns accumulated over 300 cycles fSYS = 80 MHz Low pulse to total period, assuming an ideal input clock source Min. Typ. Max. − − Accumulated Jitter DP CC Duty Cycle1) DDC CC 46 50 54 % PLL base frequency fPLLBASE 30 − 140 MHz − 16 MHz − 520 MHz − 400 μs CC VCO input frequency VCO frequency range PLL lock-in time fREF CC 4 fVCO CC 260 tL CC − 1) 50% for even K2 divider values, 50±(10/K2) for odd K2 divider values. Data Sheet 73 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.5 Internal Clock Source Characteristics Fast Internal Clock Source Table 44 Fast Internal Clock Parameters Parameter Nominal frequency Accuracy Symbol fOFINC Values Unit Min. Typ. Max. − 36.5 − MHz not calibrated CC − 24 − MHz calibrated ΔfOFI -0.5 − 0.5 % automatic calibration1)2) -15 − 15 % factory calibration, VDDP = 3.3 V -25 − 25 % no calibration, VDDP = 3.3 V -7 − 7 % Variation over voltage range3) 3.13 V ≤ VDDP ≤ 3.63 V 50 − μs CC Start-up time Note / Test Condition tOFIS CC − 1) Error in addition to the accuracy of the reference clock. 2) Automatic calibration compensates variations of the temperature and in the VDDP supply voltage. 3) Deviations from the nominal VDDP voltage induce an additional error to the uncalibrated and/or factory calibrated oscillator frequency. Data Sheet 74 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Slow Internal Clock Source Table 45 Slow Internal Clock Parameters Parameter Symbol Nominal frequency fOSI CC ΔfOSI Accuracy Values Unit Min. Typ. − 32.768 − Max. kHz -4 − % 4 CC Note / Test Condition VBAT = const. 0 °C ≤ TA ≤ 85 °C Start-up time Data Sheet -5 − 5 % -5 − 5 % -10 − 10 % 50 − μs tOSIS CC − 75 VBAT = const. TA < 0 °C or TA > 85 °C 2.4 V ≤ VBAT, TA = 25 °C 1.95 V ≤ VBAT < 2.4 V, TA = 25 °C V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.6 JTAG Interface Timing The following parameters are applicable for communication through the JTAG debug interface. The JTAG module is fully compliant with IEEE1149.1-2000. Note: These parameters are not subject to production test, but verified by design and/or characterization. Note: Operating conditions apply. Table 46 JTAG Interface Timing Parameters Parameter Symbol Min. Values Typ. Max. Unit Note / Test Condition TCK clock period t1 SR 30 – – ns For CL = 20 pF on TDO TCK clock period t1 SR 40 – – ns For CL = 50 pF on TDO TCK high time t2 t3 t4 t5 t6 SR 10 – – ns SR 10 – – ns SR – – 4 ns SR – – 4 ns SR 6 – – ns t7 SR 6 – – ns TDO valid after TCK falling t8 edge1) (propagation delay) CC – – 17 ns CL = 50 pF 3 – – ns CL = 20 pF 2 – – ns TCK low time TCK clock rise time TCK clock fall time TDI/TMS setup to TCK rising edge TDI/TMS hold after TCK rising edge TDO hold after TCK falling t18 CC edge1) TDO high imped. to valid from TCK falling edge1)2) t9 – – 14 ns CL = 50 pF TDO valid to high imped. from TCK falling edge1) t10 CC – – 13.5 ns CL = 50 pF CC 1) The falling edge on TCK is used to generate the TDO timing. 2) The setup time for TDO is given implicitly by the TCK cycle time. Data Sheet 76 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters t1 TCK 0.9 VD D P 0.1 VD D P 0.5 VD D P t2 t3 t4 t5 JTAG_TCK .vsd Figure 28 Test Clock Timing (TCK) TCK t6 t7 t6 t7 TMS TDI t9 t8 t10 TDO t18 JTAG_IO.vsd Figure 29 Data Sheet JTAG Timing 77 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.7 Serial Wire Debug Port (SW-DP) Timing The following parameters are applicable for communication through the SW-DP interface. Note: These parameters are not subject to production test, but verified by design and/or characterization. Note: Operating conditions apply. Table 47 SWD Interface Timing Parameters (Operating Conditions apply) Parameter Symbol Values Typ. Max. Unit Note / Test Condition tSC SR 25 – – ns CL = 30 pF 40 – – ns CL = 50 pF SR 10 – 500000 ns SR 10 – 500000 ns SR 6 – – ns SWDIO input hold t4 after SWDCLK rising edge SR 6 – – ns SWDIO output valid time t5 after SWDCLK rising edge CC – – 17 ns CL = 50 pF – – 13 ns CL = 30 pF t6 SWDIO output hold time from SWDCLK rising edge CC 3 – – ns Min. SWDCLK clock period t1 t2 t3 SWDCLK high time SWDCLK low time SWDIO input setup to SWDCLK rising edge tSC t2 t1 SWDCLK t6 SWDIO (Output) t5 t3 t4 SWDIO (Input) Figure 30 Data Sheet SWD Timing 78 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.8 Peripheral Timing Note: These parameters are not subject to production test, but verified by design and/or characterization. Note: Operating conditions apply. 3.3.8.1 Synchronous Serial Interface (USIC SSC) Timing The following parameters are applicable for a USIC channel operated in SSC mode. Note: Operating Conditions apply. Table 48 USIC SSC Master Mode Timing Parameter Symbol Values Min. SCLKOUT master clock period Unit Typ. Max. tCLK CC 40 − − ns Slave select output SELO t1 active to first SCLKOUT transmit edge CC tSYS 6.51) − − ns Slave select output SELO t2 inactive after last SCLKOUT receive edge CC tSYS 8.51) − − ns t3 CC -6 − 8 ns Receive data input t4 DX0/DX[5:3] setup time to SCLKOUT receive edge SR 23 − − ns Data input DX0/DX[5:3] t5 hold time from SCLKOUT receive edge SR 1 − − ns Data output DOUT[3:0] valid time Note / Test Condition 1) tSYS = 1 / fPB Data Sheet 79 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 49 USIC SSC Slave Mode Timing Parameter Symbol Values Min. Unit Typ. Max. − − ns Select input DX2 setup to t10 first clock input DX1 transmit edge1) SR 3 − − ns Select input DX2 hold after last clock input DX1 receive edge1) t11 SR 4 − − ns Receive data input DX0/DX[5:3] setup time to shift clock receive edge1) t12 SR 6 − − ns Data input DX0/DX[5:3] hold t13 time from clock input DX1 receive edge1) SR 4 − − ns Data output DOUT[3:0] valid t14 time CC 0 − 24 ns DX1 slave clock period tCLK SR 66.6 Note / Test Condition 1) These input timing are valid for asynchronous input signal handling of slave select input, shift clock input, and receive data input (bits DXnCR.DSEN = 0). Data Sheet 80 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Master Mode Timing t1 Select Output SELOx t2 Inactive Inactive Active Clock Output SCLKOUT Receive Edge First Transmit Edge Last Receive Edge Transmit Edge t3 t3 Data Output DOUT[3:0] t4 Data Input DX0/DX[5:3] t4 t5 Data valid t5 Data valid Slave Mode Timing t1 0 Select Input DX2 Clock Input DX1 t1 1 Inactive Inactive Active Receive Edge First Transmit Edge t1 2 Data Input DX0/DX[5:3] Last Receive Edge Transmit Edge t1 2 t1 3 t13 Data valid Data valid t14 t1 4 Data Output DOUT[3:0] Transmit Edge: with this clock edge, transmit data is shifted to transmit data output. Receive Edge: with this clock edge, receive data at receive data input is latched . Drawn for BRGH .SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal. USIC_SSC_TMGX.VSD Figure 31 USIC - SSC Master/Slave Mode Timing Note: This timing diagram shows a standard configuration, for which the slave select signal is low-active, and the serial clock signal is not shifted and not inverted. Data Sheet 81 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.8.2 Inter-IC (IIC) Interface Timing The following parameters are applicable for a USIC channel operated in IIC mode. Note: Operating Conditions apply. Table 50 USIC IIC Standard Mode Timing1) Parameter Symbol Values Unit Min. Typ. Max. Fall time of both SDA and t1 SCL CC/SR - - 300 ns Rise time of both SDA and t2 SCL CC/SR - - 1000 ns 0 - - µs 250 - - ns 4.7 - - µs 4.0 - - µs 4.0 - - µs 4.7 - - µs 4.0 - - µs 4.7 - - µs - - 400 pF Data hold time t3 Note / Test Condition CC/SR Data set-up time t4 CC/SR LOW period of SCL clock t5 CC/SR HIGH period of SCL clock t6 CC/SR t7 Hold time for (repeated) START condition CC/SR Set-up time for repeated START condition CC/SR Set-up time for STOP condition CC/SR t8 t9 Bus free time between a STOP and START condition t10 Capacitive load for each bus line Cb SR CC/SR 1) Due to the wired-AND configuration of an IIC bus system, the port drivers of the SCL and SDA signal lines need to operate in open-drain mode. The high level on these lines must be held by an external pull-up device, approximalely 10 kOhm for operation at 100 kbit/s, approximately 2 kOhm for operation at 400 kbit/s. Data Sheet 82 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters Table 51 USIC IIC Fast Mode Timing1) Parameter Symbol Values Min. Fall time of both SDA and t1 SCL CC/SR Typ. Unit Max. 20 + 0.1*Cb 300 ns 20 + 0.1*Cb 300 ns 0 - - µs 100 - - ns 1.3 - - µs 0.6 - - µs 0.6 - - µs 0.6 - - µs 0.6 - - µs 1.3 - - µs - - 400 pF Note / Test Condition 2) Rise time of both SDA and t2 SCL CC/SR 2) Data hold time t3 CC/SR Data set-up time t4 CC/SR LOW period of SCL clock t5 CC/SR HIGH period of SCL clock t6 CC/SR t7 Hold time for (repeated) START condition CC/SR Set-up time for repeated START condition CC/SR Set-up time for STOP condition CC/SR t8 t9 Bus free time between a STOP and START condition t10 Capacitive load for each bus line Cb SR CC/SR 1) Due to the wired-AND configuration of an IIC bus system, the port drivers of the SCL and SDA signal lines need to operate in open-drain mode. The high level on these lines must be held by an external pull-up device, approximalely 10 kOhm for operation at 100 kbit/s, approximately 2 kOhm for operation at 400 kbit/s. 2) Cb refers to the total capacitance of one bus line in pF. Data Sheet 83 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters t1 SDA t2 t4 70% 30% t1 t3 t2 t6 SCL th t7 9 clock t5 t10 S SDA t8 t7 t9 SCL th 9 clock Sr Figure 32 3.3.8.3 P S USIC IIC Stand and Fast Mode Timing Inter-IC Sound (IIS) Interface Timing The following parameters are applicable for a USIC channel operated in IIS mode. Note: Operating Conditions apply. Table 52 USIC IIS Master Transmitter Timing Parameter Clock period Clock high time Clock low time Hold time Clock rise time Data Sheet Symbol Values Unit Min. Typ. Max. t1 CC t2 CC 33.3 − − ns 0.35 x − − ns t3 CC 0.35 x − − ns t4 CC t5 CC 0 − − ns − − 0.15 x ns Note / Test Condition t1min t1min t1min 84 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters t1 t2 t5 t3 SCK t4 WA/ DOUT Figure 33 USIC IIS Master Transmitter Timing Table 53 USIC IIS Slave Receiver Timing Parameter Symbol Clock period Clock high time Clock low time t6 SR t7 SR t8 SR t9 SR Set-up time t10 SR Hold time Values Unit Min. Typ. Max. 66.6 − − ns 0.35 x − − ns − − ns − − ns − − ns Note / Test Condition t6min 0.35 x t6min 0.2 x t6min 0 t6 t7 t8 SCK t9 t10 WA/ DIN Figure 34 Data Sheet USIC IIS Slave Receiver Timing 85 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Electrical Parameters 3.3.9 USB Interface Characteristics The Universal Serial Bus (USB) Interface is compliant to the USB Rev. 2.0 Specification. High-Speed Mode is not supported. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 54 USB Timing Parameters (operating conditions apply) Parameter Symbol Values Typ. Max. Unit Note / Test Condition – 20 ns CL = 50 pF – 20 ns CL = 50 pF Rise/Fall time matching tR CC 4 tF CC 4 tR/tF CC 90 – 111.11 % CL = 50 pF Crossover voltage VCRS – 2.0 CL = 50 pF Min. Rise time Fall time CC 1.3 D+ 90% V 90% VC R S DVSS 10% 10% tR tF USB_Rise-Fall-Times.vsd Figure 35 Data Sheet USB Signal Timing 86 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Package and Reliability 4 Package and Reliability The XMC4[12]00 is a member of the XMC4000 Family of microcontrollers. It is also compatible to a certain extent with members of similar families or subfamilies. Each package is optimized for the device it houses. Therefore, there may be slight differences between packages of the same pin-count but for different device types. In particular, the size of the Exposed Die Pad may vary. If different device types are considered or planned for an application, it must be ensured that the board layout fits all packages under consideration. 4.1 Package Parameters Table 55 provides the thermal characteristics of the packages used in XMC4[12]00. The availability of different packages for different markings is listed in Table 2. Table 55 Thermal Characteristics of the Packages Parameter Symbol Limit Values Min. Exposed Die Pad Dimensions Thermal resistance Junction-Ambient Unit Package Types Max. Ex × Ey CC - 5.8 × 5.8 mm PG-LQFP-64-19 5.7 × 5.7 mm PG-TQFP-64-19 - 5.2 × 5.2 mm PG-VQFN-48-53 - 5.2 × 5.2 mm PG-VQFN-48-71 RΘJA - 30 K/W PG-LQFP-64-191) CC - 23.4 K/W PG-TQFP-64-191) - 34.8 K/W PG-VQFN-48-531) PG-VQFN-48-711) 1) Device mounted on a 4-layer JEDEC board (JESD 51-7) with thermal vias; exposed pad soldered. Note: For electrical reasons, it is required to connect the exposed pad to the board ground VSS, independent of EMC and thermal requirements. 4.1.1 Thermal Considerations When operating the XMC4[12]00 in a system, the total heat generated in the chip must be dissipated to the ambient environment to prevent overheating and the resulting thermal damage. The maximum heat that can be dissipated depends on the package and its integration into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The Data Sheet 87 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Package and Reliability power dissipation must be limited so that the average junction temperature does not exceed 150 °C. The difference between junction temperature and ambient temperature is determined by ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA The internal power consumption is defined as PINT = VDDP × IDDP (switching current and leakage current). The static external power consumption caused by the output drivers is defined as PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL) The dynamic external power consumption caused by the output drivers (PIODYN) depends on the capacitive load connected to the respective pins and their switching frequencies. If the total power dissipation for a given system configuration exceeds the defined limit, countermeasures must be taken to ensure proper system operation: • • • • Reduce VDDP, if possible in the system Reduce the system frequency Reduce the number of output pins Reduce the load on active output drivers Data Sheet 88 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Package and Reliability 4.2 Package Outlines The availability of different packages for different devices types is listed in Table 1, specific packages for different device markings are listed in Table 2. The exposed die pad dimensions are listed in Table 55. Table 56 Differences PG-LQFP-64-19 to PG-TQFP-64-19 23.4 K/W Package thickness 1.4±0.05 mm 1.0±0.05 mm 1.6 mm MAX 1.2 mm MAX 5.8 mm × 5.8 mm 5.7 mm × 5.7 mm H 0.5 0.6 ±0.15 0.08 C 64x C SEATING COPLANARITY PLANE +0.07 0.2 -0.03 0.08 M A-B D C 64x 12 10 Bottom View 0.2 A-B D 64x 1) Ex 0.2 A-B D H 4x Ox D Exposed Diepad Oy Ey 10 B 12 A 1) 0.5 x 45° 0°...7° 15 x 0.5 = 7.5 -0.06 0.1±0.05 STAND OFF Exposed Die Pad size 0.15 +0.05 PG-TQFP-64-19 30 K/W 1.6 MAX. PG-LQFP-64-19 Thermal Resistance Junction Ambient (RΘJA) 1.4 ±0.05 Change 64 1 1 64 Index Marking Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side PG-LQFP-64-6, -8, -12, -19, -22-PO V16 Figure 36 Data Sheet PG-LQFP-64-19 (Plastic Green Low Profile Quad Flat Package) 89 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family H 0.5 0°...7° +0.07 0.127 -0.0 4 1.2 MAX. 15 x 0.5 = 7.5 0.1 ±0.05 STAND OFF 1 ±0.05 Package and Reliability 0.6 ±0.15 0.08 C 64x COPLANARITY C SEATING PLANE +0.07 2) 0.2 -0.03 0.08 M A-B D C 64x 12 10 0.2 A-B D 64x 1) 5.7 0.2 A-B D H 4x 4.9 D Exposed Diepad 4.9 5.7 12 10 1) B A 64 64 1 1 Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side 2) Does not include dambar protrusion of 0.08 max. per side PG-TQFP-64-19-PO V02 Figure 37 PG-TQFP-64-19 (Plastic Green Thin Profile Quad Flat Package) Table 57 Differences PG-VQFN-48-53 to PG-VQFN-48-71 Change PG-VQFN-48-53 PG-VQFN-48-71 Package corner chamfered right-angled Lead width Lead height Data Sheet 0.23 ±0.05 ±0.07 0.4 0.25(+0.05, -0.07) mm mm 0.4±0.05 mm mm 90 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Package and Reliability 0.9 MAX. (0.65) 0.5 0.4 x 45˚ Index Marking 37 48 13 12 1 3 .0 ±0 (0.2) Index Marking 48x 0.1 M A B C 0.23 ±0.05 (5.2) 15 0. C 24 (5.2) 48x 0.08 36 25 (6.2) 0.5 +0.03 11 x 0.5 = 5.5 7 ±0.1 6.8 B SEATING PLANE 6.8 11 x 0.5 = 5.5 0.4 ±0.07 A 0. 26 7 ±0.1 (6.2) 0.05 MAX. PG-VQFN-48-15, -19, -20, -22, -24, -48, -51, -52, -53, -54, -55, -56, -57-PO V12 PG-VQFN-48-53 (Plastic Green Very Thin Profile Flat Non Leaded Package) 7 0.9 MAX. A 0.1 A C 2x B 0.05 M A B C Figure 38 (0.2) 11 x 0.5 = 5.5 0.5 25 0.1 B C 2x C Index Marking Figure 39 0.1 C 36 24 37 5.2 ±0.05 SEATING PLANE 7 48x 0.05 C COPLANARITY 5.2 ±0.05 0.05 M A B C 48 13 12 0.4 ±0.05 0.05 MAX. STANDOFF 1 Index Marking +0.05 0.25 -0.07 48x 0.1 M A B C 0.05 M C PG-VQFN-48-71-PO V02 PG-VQFN-48-71 (Plastic Green Very Thin Profile Flat Non Leaded Package) All dimensions in mm. You can find complete information about Infineon packages, packing and marking in our Infineon Internet Page “Packages”: http://www.infineon.com/packages Data Sheet 91 V1.4, 2018-09 Subject to Agreement on the Use of Product Information XMC4100 / XMC4200 XMC4000 Family Quality Declarations 5 Quality Declarations The qualification of the XMC4[12]00 is executed according to the JEDEC standard JESD47H. Note: For automotive applications refer to the Infineon automotive microcontrollers. Table 58 Quality Parameters Parameter Symbol Values Min. Operation lifetime tOP CC 20 Typ. Max. − − Unit Note / Test Condition a TJ ≤ 109°C, device permanent on ESD susceptibility VHBM according to Human Body SR Model (HBM) − − 2 000 V EIA/JESD22A114-B ESD susceptibility according to Charged Device Model (CDM) VCDM − − 500 V Conforming to JESD22-C101-C Moisture sensitivity level MSL − − 3 − JEDEC J-STD-020D − − 260 °C Profile according to JEDEC J-STD-020D SR CC Soldering temperature TSDR SR Data Sheet 92 V1.4, 2018-09 Subject to Agreement on the Use of Product Information w w w . i n f i n e o n . c o m Published by Infineon Technologies AG