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11-21-BHC-AP2R1-2T

11-21-BHC-AP2R1-2T

  • 厂商:

    EVERLIGHT(台湾亿光)

  • 封装:

  • 描述:

    11-21-BHC-AP2R1-2T - Technical Data Sheet 1206 Package Chip LED with Inner lens - Everlight Electron...

  • 数据手册
  • 价格&库存
11-21-BHC-AP2R1-2T 数据手册
EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 1206 Package Chip LED with Inner lens 11-21/BHC-AP2R1/2T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS complaint version. Descriptions ․The 11-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․ Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Automotive: backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 11-21/BHC-AP2R1/2T Chip Material InGaN Emitted Color Blue Lens Color Water Clear Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 1 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Package Outline Dimensions - + Notes: The tolerances unless mentioned are ±0.1, unit=mm. Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 2 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Absolute Maximum Ratings (Ta=25℃) Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Electrostatic Discharge(HBM) Power Dissipation Peak Forward Current (Duty 1/10 @1KHz) Soldering Temperature Symbol VR IF Topr Tstg ESD Pd IFP Rating 5 25 -40 ~ +85 -40 ~ +90 150 110 100 Unit V mA ℃ ℃ V mW mA Tsol Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage Reverse Current Symbol Iv 2θ1/2 λp λd △λ VF IR Min. 57 --------464.5 ----2.7 ----Typ. ----60 468 ----35 3.3 ----Max. 140 --------476.5 ----3.7 50 Unit mcd deg nm nm nm V μA VR =5V IF =20mA Condition Notes: 1.Tolerance of Luminous Intensity: ±10% 2.Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 3 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Bin Range Of Dom. Wavelength Group Bin A9 Min 464.5 467.5 470.5 473.5 Max 467.5 470.5 473.5 476.5 nm IF =20mA Unit Condition A A10 A11 A12 Bin Range Of Luminous Intensity Bin P2 Q1 Q2 R1 Min 57 72 90 112 Max 72 90 112 140 mcd IF =20mA Unit Condition Notes: 1.Tolerance of Luminous Intensity: ±10% 2.Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 4 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Typical Electro-Optical Characteristics Curves Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 5 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank xxxxxx xxxxxx RoHS xxxxxxxxxxxx xxxx xxxxxxxx Reel Dimensions Note: The tolerances unless mentioned are ±0.1, Unit = mm. Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 6 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: The tolerances unless mentioned are ±0.1, Unit = mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 7 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level : 90 % LTPD : 10 % Test Sample No. Items Test Condition Hours/Cycles Size Temp. : 260℃±5℃ 1 Reflow Soldering 22 PCS. 6 Min. Min. 5sec. 2 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min H : +100℃ 5min ∫ 10 sec L : -10℃ 5min Temp. : 100℃ Temp. : -40℃ IF = 20 mA 85℃/ 85%RH 300 Cycles 22 PCS. Ac/Re 0/1 0/1 3 Thermal Shock High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity 300 Cycles 1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs. 22 PCS. 0/1 4 5 6 7 22 PCS. 22 PCS. 22 PCS. 22 PCS. 0/1 0/1 0/1 0/1 Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 8 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year.(To fit the MSL-2 .) 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 9 of 10 Prepared by: Meng Yali EVERLIGHT ELECTRONICS CO.,LTD. 11-21/BHC-AP2R1/2T 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com Everlight Electronics Co., Ltd. Device No:SZDSE-111-B03 http://www.everlight.com Prepared date: 17-Aug-2005 Rev. 2 Page: 10 of 10 Prepared by: Meng Yali
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