12-21/BHC-AP1Q2M/2C

Technical Data Sheet Chip LED with Right Angle Lens 12-21/BHC-AP1Q2M/2C Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS complaint version Descriptions ․The 12-21 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 12-21/BHC-AP1Q2M/2C Everlight Electronics Co., Ltd. Device No:DSE-0002217 Chip Material Emitted Color InGaN Blue http://www.everlight.com Prepared date:31-Aug-2009 Resin Color Water Clear Rev. 1 Page: 1 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C 0.3 0.6 1.4 1.1 Package Outline Dimensions 0.8 0.65 0.9 0.65 0.8 Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 2 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA IFP 100 mA Power Dissipation Pd 95 mW Electrostatic Discharge(HBM) ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 45.0 ----- 112.0 mcd Viewing Angle 2θ1/2 ----- 120 ----- deg Peak Wavelength λp ----- 468 ----- nm Dominant Wavelength λd 464.5 ----- 476.5 nm Spectrum Radiation Bandwidth △λ ----- 35 ----- nm Forward Voltage VF 2.75 ------ 3.95 V Reverse Current IR ----- ----- 50 μA VR=5V Rev. 1 Page: 3 of 10 IF=20mA Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage: ±0.1V Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Bin Range Of Dom. Wavelength Group A Bin Min Max A9 464.5 467.5 A10 467.5 470.5 A11 470.5 473.5 A12 473.5 476.5 Unit Condition nm IF=20mA Unit Condition mcd IF=20mA Unit Condition V IF=20mA Bin Range Of Luminous Intensity Bin Min Max P1 45.0 57.0 P2 57.0 72.0 Q1 72.0 90.0 Q2 90.0 112.0 Bin Range Of Forward Voltage Group M Bin Min Max 5 2.75 3.05 6 3.05 3.35 7 3.35 3.65 8 3.65 3.95 Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage: ±0.1V Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 4 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Typical Electro-Optical Characteristics Curves Ta=25°C Forward Current I (mA) Relative luminous intensity ( % ) Ta=25°C Wavelength λ(nm) Forward Voltage VF (V) Relative luminous intensity ( %) Relative luminous intensity ( % ) Ta=25°C 1000 100 10 1 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C ) Forward Current I (mA) Forward Current I (mA) Ta=25°C Ambient Temperature Ta (°C ) Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 5 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 6 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label Aluminum moistue-proof bag Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Desiccant Label Rev. 1 Page: 7 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% Test Sample Hours/Cycles Size No. Items Test Condition 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 PCS. 0/1 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1 Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 2 3 4 5 High Temperature Storage Low Temperature Storage Ac/Re 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 8 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No:DSE-0002217 http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 9 of 10 Prepared by: Xu juan 12-21/BHC-AP1Q2M/2C 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Everlight Electronics Co., Ltd. Device No:DSE-0002217 Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com http://www.everlight.com Prepared date:31-Aug-2009 Rev. 1 Page: 10 of 10 Prepared by: Xu juan