15-21-S2SC-H6D9K2L2A0A-2T8-AM

EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Feature ԦRoHS compliant. ԦChip LED package. ԦWide viewing angle 130o. ԦColorless clear resin. ԦWavelength: 605nm ԦBrightness: 9 to 18 mcd at 2mA ԦInner reflector and white package. ԦUseable in severe lead free processes with automotive reflow profile (IR reflow or wave soldering) Applications ԦAutomotive audio and video equipments. ԦBacklight: LCD, switches, symbol, mobile phone and illuminated advertising. ԦDisplay for indoor and outdoor application. ԦIdeal for coupling into light guides. ԦSubstitution of traditional light. ԦOptical indicator. Device Selection Guide Chip Emitted Color Resin Color Brilliant Orange Water Clear Material AlGaInP Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 1 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Absolute Maximum Ratings (Ta=25к) Parameter Symbol Rating Unit Reverse Voltage VR 10 V Forward Current IF 50 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 120 mW Junction Temperature Tj 115 к Operating Temperature Topr -40 ~ +100 к Storage Temperature Tstg -40 ~ +110 к Rth J-A 800 K/W Rth J-S 450 K/W Thermal resistance Soldering Temperature Tsol ESD (Classification acc. AEC Q101) Reflow Soldering : 260 к for 30 sec. Hand Soldering : 350 к for 3 sec. ESDHBM 2000 V ESDMM 200 V Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 2 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Electro-Optical Characteristics (Ta=25к) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 9.0 ----- 18.0 mcd IF=2mA ----- 130 ----- deg IF=2mA Viewing Angle 2 1/2 Peak Wavelength !p ----- 611 ----- nm IF=2mA Dominant Wavelength !d 604 ---- 610 nm IF=2mA Spectrum Radiation Bandwidth "! ----- 17 ----- nm IF=2mA Forward Voltage VF 1.55 ---- 2.15 V IF=2mA Reverse Current IR ----- ----- 10 #A VR=10V Temperature coefficient of !p TC!p ----- 0.13 ----- nm/K IF=2mA Temperature coefficient of !d TC!d ----- 0.08 ----- nm/K IF=2mA Temperature coefficient of VF TCV ----- -4.3 ----- mV/K IF=2mA Note: Tolerance of Luminous Intensity: ±11% Tolerance of Dominant Wavelength: ±1nm Tolerance of Forward Voltage: ±0.1V Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 3 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Bin Range of Luminous Intensity Bin Code Min. Max. K2 9.00 11.5 L1 11.5 14.5 L2 14.5 18.0 Unit Condition mcd IF=2mA Unit Condition nm IF=2mA Note: Tolerance of Luminous Intensity: ±11% Bin Range of Dominant Wavelength Bin Code Min. Max. 1 604 607 2 607 610 Note: Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 4 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Typical Electro-Optical Characteristics Curves Typical curve of spectral distribution: ˥˸˿˴̇˼̉˸ʳ˜́̇˸́̆˼̇̌ʳʻʸʼ ˄˃ ˃ V(ӳ) ˦˅˦˖ ˈ˃ ˃ ˇ˃ ˃ ˇ ˈ˃ ˈ˃ ˃ ˈ ˈ˃ ˉ˃ ˃ ˉˈ˃ ˊ˃ ˃ ӳ̃ʳʻ́̀ʼ Note: V(!)=Standard eye response curve Diagram characteristics of radiation 20 30 View Angle 50 60 70 80 90 10 o 0 o 1.0 o o 0.8 o 0.6 o 0.4 o Relative Intensity 40 o 0.2 o o 0 1.0 0.8 0.6 0.4 0.2 0 Relative Intensity 20 o o 60 40 View Angle o Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang 80 o Page: 5 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Forward Current vs. Forward Voltage (Ta=25к) Dominant Wavelength vs. Forward Current (Ta=25к) ˗̂̀˼́˴́̇ʳ˪˴̉˸˿˸́˺̇˻ʻ́̀ʼ ˉ˃ˇˁˌ ˉ˃ˇˁˋ ˉ˃ˇˁˊ ˉ˃ˇˁˉ ˉ˃ˇˁˈ ˉ˃ˇˁˇ ˉ˃ˇˁˆ ˉ˃ˇˁ˅ ˉ˃ˇˁ˄ ˉ˃ˇ ˃ ˄ ˅ ˆ ˇ ˈ ˉ ˊ ˋ ˌ ˄˃ ˄˄ Forward Current (mA) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 6 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Relative Luminous Intensity vs. Forward Current (Ta=25к) Relative Luminous Intensity 30.0 25.0 20.0 15.0 10.0 5.0 0.0 0 5 10 15 20 25 30 Forward Current (mA) Forward Current vs. Ambient and Solder Temperature Forward Curent I F (mA) 70 60 50 TS 40 30 TA 20 TA temp. ambient TS temp. solder 10 0 0 20 40 60 80 100 Temperature (к ) Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 7 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM ˥ ˸˿˴̇˼̉ ˸ʳ˟̈ ̀˼́ ̂ ̈ ̆ʳ˜ ́ ̇˸́ ̆˼̇̌ Relative Luminous Intensity vs. Junction Temperature ˄ ˁˉ ˄ ˁˇ ˄ ˁ˅ ˄ ˃ ˁˋ ˃ ˁˉ ˃ ˁˇ ˃ ˁ˅ ˃ ˀ˅˃ ˃ ˅˃ ˇ˃ ˉ˃ ˋ˃ ˄˃˃ ˄˅˃ ˄˃˃ ˄˅˃ ˝̈ ́ ˶̇˼̂ ́ ʳ˧˸̀ ̃ ˸̅ ˴̇̈ ̅ ˸ʳ˧˽ʳʻ кʼ Note: f(Tj) = Iv / Iv(25к)ΙIF=2mA Relative Forward Voltage vs. Junction Temperature ˥ ˸ ˿ ˴ ̇ ˼ ̉˸ ʳ ˙ ̂̅̊˴ ̅˷ʳ ˩̂˿ ̇ ˴ ˺˸ ˃ˁ ˇ ˃ˁ ˆ ˃ˁ ˅ ˃ˁ ˄ ˃ ˀ˃ˁ ˄ ˀ˃ˁ ˅ ˀ˃ˁ ˆ ˀ˃ˁ ˇ ˀ˅˃ ˃ ˅˃ ˇ˃ ˉ˃ ˋ˃ ˝̈́˶ ̇ ˼ ̂́ʳ ˧˸ ̀̃˸ ̅˴ ̇ ̈̅˸ ʳ ˧˽ ʳ ʻкʼ NoteΚϦVF = VF - VF (25 к) = f(Tj); IF=2mA Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 8 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM 1.4 Package Dimension Note: Tolerances unless mentioned ±0.1mm. Unit = mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 9 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Label Explanation ԦCPN: Customer’s Product Number ԦP/N: Product Number ԦQTY: Packing Quantity ԦCAT: Luminous Intensity Rank ԦHUE: Dom. Wavelength Rank ԦREF: Forward Voltage Rank ԦLOT No: Lot Number Reel Dimensions Note: Unit = mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 10 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packaging Process and Materials Label Aluminum moisture-proof bag Desiccant Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Label Page: 11 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM Precautions for Use 1. Soldering Condition 1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile Note: Reference: IPC/JEDEC J-STD-020D Preheat 150 °C Temperature min (Tsmin) Temperature max (Tsmax) 200°C Time (Tsmin to Tsmax) (ts) 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3 °C/second max. Other Liquidus Temperature (TL) 217 °C Time above Liquidus Temperature (t L) 60-150 sec 260°C Peak Temperature (TP) Time within 5 °C of Actual Peak Temperature: TP - 5°C 30 s Ramp- Down Rate from Peak Temperature 6°C /second max. Time 25°C to peak temperature 8 minutes max. Reflow times 3 times All parameters are maximum body case temperature values and cannot be considered as a soldering profile. The body temperature was measured by soldering a thermal couple to the soldering point of LEDs. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 12 of 13 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 1206 Package Chip LED 15-21-S2SC-H6D9K2L2A0A-2T8-AM (B) Recommend soldering pad Note: Tolerances unless mentioned ±0.1mm. Unit = mm 2. Current limiting A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise damage could occur. 3. Storage 3.1 Moisture proof bag should only be opened immediately prior to usage. 3.2 Environment should be less than 30к and 90% RH when moisture proof bag is opened. 3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 25 hours. 4. Iron Soldering Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering iron tip should contact each terminal no more than 3 sec at 350к, using soldering iron with nominal power less than 25W. Allow min. 2 sec. between soldering intervals. 5. Usage Do not exceed the values given in this specification. Application Restrictions 1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Device No. DSA-151-001 Prepared date: 29-July-2008 Created by: Eddie Wang Page: 13 of 13