15-215-R6C-AP1Q1L-2T

15-215-R6C-AP1Q1L-2T

  • 厂商:

    EVERLIGHT(台湾亿光)

  • 封装:

  • 描述:

    15-215-R6C-AP1Q1L-2T - 1206 Package Chip LED (0.5mm Height) - Everlight Electronics Co., Ltd

  • 详情介绍
  • 数据手册
  • 价格&库存
15-215-R6C-AP1Q1L-2T 数据手册
EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 1206 Package Chip LED (0.5mm Height) 15-215/R6C-AP1Q1L/2T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version. Descriptions ․The 15-215 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Chip Material AlGaInP Emitted Color Briliant Red Part No. 15-215/R6C-AP1Q1L/2T Lens Color Water Clear Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 1 of 11 Prepared by:Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Package Outline Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 2 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Absolute Maximum Ratings (Ta=25℃) Parameter Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Electrostatic Discharge(HBM) Operating Temperature Storage Temperature Soldering Temperature Symbol VR IF IFP Pd ESD Topr Tstg Tsol Rating 5 25 60 60 2000 -40 ~ +85 -40 ~ +90 Unit V mA mA mW V ℃ ℃ Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 3 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Symbol Iv 2θ1/2 λp λd △λ VF IR Min. Typ. ----- Max. Unit mcd deg nm nm nm V μA Condition 45 --------617.5 ----1.7 ----- 90 --------633.5 ----2.3 10 140 632 ----20 --------- IF=20mA Spectrum Radiation Bandwidth Forward Voltage Reverse Current VR=5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05V Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 4 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Bin Range Of Dom. Wavelength Group Bin E4 E5 E6 E7 Min 617.5 621.5 625.5 629.5 Max 621.5 625.5 629.5 633.5 nm IF=20mA Unit Condition A Bin Range Of Luminous Intensity Bin Min 45 57 72 Max 57 72 90 mcd IF=20mA Unit Condition P1 P2 Q1 Bin Range Of Forward Voltage Group Bin 19 20 Min 1.7 1.8 1.9 2.0 2.1 2.2 Max 1.8 1.9 2.0 2.1 2.2 2.3 V IF=20mA Unit Condition L 21 22 23 24 Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.05V Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 5 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Typical Electro-Optical Characteristics Curves Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 6 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Label explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 7 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 8 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% No. 1 Items Reflow Soldering Test Condition Temp. : 260℃±5℃ Min. 5sec. H : +100℃ 15min ∫ 5 min L : -40℃ 15min H : +100℃ 5min ∫ 10 sec L : -10℃ 5min Temp. : 100℃ Temp. : -40℃ IF = 20 mA 85℃/ 85%RH Test Sample Hours/Cycles Size 6 Min. 300 Cycles 22 PCS. Ac/Re 0/1 2 Temperature Cycle 22 PCS. 0/1 3 Thermal Shock High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity 300 Cycles 1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs. 22 PCS. 0/1 4 5 6 7 22 PCS. 22 PCS. 22 PCS. 22 PCS. 0/1 0/1 0/1 0/1 Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 9 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 10 of 11 Prepared by: Esther Yan EVERLIGHT ELECTRONICS CO.,LTD. 15-215/R6C-AP1Q1L/2T 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com Everlight Electronics Co., Ltd. Device No:DSE-155-R02 http://www.everlight.com Prepared date: 26-Dec-2006 Rev 1 Page: 11 of 11 Prepared by: Esther Yan
15-215-R6C-AP1Q1L-2T
PDF文档中的物料型号是STM32F103C8T6,这是一个由STMicroelectronics生产的基于ARM Cortex-M3的32位微控制器,具有高速嵌入式存储器和丰富的外设接口。


器件简介方面,STM32F103C8T6主要用于中等密度性能线微控制器市场,适用于广泛的应用,如工业控制、消费电子和汽车电子等。


引脚分配方面,该芯片有48个引脚,包括电源引脚、地引脚、复位引脚、I/O引脚等,具体分配需要查看芯片的数据手册。


参数特性包括工作电压范围2.0V至3.6V,最大工作频率72MHz,内置64KB的闪存和20KB的RAM,支持多种外设,如ADC、定时器、通信接口等。


功能详解方面,该芯片具有丰富的外设和功能,包括多种工作模式、低功耗管理、多种通信接口(如I2C、SPI、UART等)。


应用信息表明,STM32F103C8T6可以用于需要较高计算能力和多外设支持的应用场景,如电机控制、传感器接口、通信终端等。


封装信息方面,该芯片采用的是LQFP48封装,适用于多种PCB布局和设计要求。
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