17-21/GHC-XS2T2M/3T

Technical Data Sheet 0805 Package Chip LED(1.0mm Height) 17-21/GHC-XS2T2M/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain with in RoHS compliant version. Descriptions ․The 17-21 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. 17-21/GHC-XS2T2M/3T Chip Material InGaN Emitted Color Resin Color Brilliant Green Water Clear Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 1 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Package Outline Dimensions - 1.05 + Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 2 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Absolute Maximum Ratings (Ta=25℃ ℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA IFP 100 mA Pd 95 mW ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation ElectrostaticDischarge (HBM) Reflow Soldering: 260 ℃ for 10 sec Hand Soldering: 350℃ for 3 sec Electro-Optical Characteristics (Ta=25℃ ℃) Parameter Symbol Min. Typ. Max. Unit Luminous Intensity Iv 225 ----- 450 mcd Viewing Angle 2θ1/2 ---- 140 ---- deg Peak Wavelength λp ---- 518 ---- nm Dominant Wavelength λd 515 ---- 530 nm Spectrum Radiation Bandwidth △λ ---- 35 ---- nm Forward Voltage VF 2.75 ---- 3.95 V Reverse Current IR ---- ---- 50 μA Condition IF=20mA VR=5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 3 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Bin Range Of Dom. Wavelength Groups Bin Min Max W 515 520 X 520 525 Y 525 530 X Unit Condition nm IF=20mA Unit Condition mcd IF=20mA Unit Condition V IF=20mA Bin Range Of Luminous Intensity Bin Min Max S2 225 285 T1 285 360 T2 360 450 Bin Range Of Forward Voltage Groups Bin Min Max 5 2.75 3.05 6 3.05 3.35 7 3.35 3.65 8 3.65 3.95 M Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 4 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Typical Electro-Optical Characteri Ta=25°C Forward Current I (mA) Relative luminous intensity ( % ) Ta=25°C Wavelength λ(nm) Forward Voltage VF (V) Relative luminous intensity ( %) Relative luminous intensity ( % ) Ta=25°C Ambient Temperature Ta (°C ) Forward Current I (mA) I (mA) Ta=25°C 10° Forward Current 40° 1.0 0.9 50° 0.8 60° 0.7 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta (°C ) Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 5 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Label explanation CAT: Luminous Intensity (mcd) Pb HUE: Dom. Wavelength (nm) EVERLIGHT CPN : P N : XXXXXXXXXXXXX RoHS REF: Forward Voltage (V) XXXXXXXXXXXXX CAT : XXX HUE : XXX REF : XXX QTY : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm,Unit = mm Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 6 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm , Unit = mm Moisture Resistant Packaging Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 7 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level : 90 % LTPD : 10 % Test Sample No. Items Test Condition Hours/Cycles Size Temp. : 260℃±5℃ 1 Reflow Soldering 22 PCS. 6 Min. Min. 5sec. 2 3 4 5 Ac/Re 0/1 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1 Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 High Temperature Storage Low Temperature Storage 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 8 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage time 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 9 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng 17-21/GHC-XS2T2M/3T 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com Everlight Electronics Co., Ltd. http://www.everlight.com Rev.1 Page: 10 of 10 Device No. : DSE-0004653 Prepared date:17-Dec-2010 Prepared by:Shaoming Feng