17-21-GPC-A0L1M2B0E-3T-AM

EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Feature ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ RoHS compliant. Chip LED package. Colorless diffiused resin. Wide viewing angle 140o. Brightness: 11.20 to 28.00 mcd at 20 mA. Qualification according to AEC-Q101. Precondition: Bases on JEDEC J-STD 020 Level 3. Useable in severe lead free processes with automotive reflow profile (IR reflow or wave soldering)) This is a preliminary specification intended for design purposes and subject to change without prior notice. Applications ‧ ‧ ‧ ‧ ‧ ‧ ‧ Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc. Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. Display for indoor and outdoor application. Ideal for coupling into light guides. Substitution of traditional light. Optical indicator. General applications. Device Selection Guide Chip Emitted Color Material AlGaInP Pale Green Water Clear Resin Color Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 1 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Absolute Maximum Ratings (Ta=25℃) Parameter Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Junction Temperature Operating Temperature Storage Temperature Symbol VR IF IFP Pd Tj Topr Tstg Rth J-A Thermal resistance Rth J-S Soldering Temperature ESD (Classification acc. AEC Q101) Tsol ESDHBM ESDMM 450 K/W Reflow Soldering : 260 ℃ for 30 sec. Hand Soldering : 350 ℃ for 3 sec. 2000 200 V V Rating 5 25 60 60 115 -40 ~ +100 -40 ~ +110 800 Unit V mA mA mW ℃ ℃ ℃ K/W Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 2 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage Reverse Current Temperature coefficient of λp Temperature coefficient of λd Temperature coefficient of VF Note: Tolerance of Luminous Intensity: ±11% Tolerance of Dominant Wavelength: ±1nm Tolerance of Forward Voltage: ±0.1V Symbol Iv 2θ1/2 λp λd ∆λ VF IR TCλp TCλd TCV Min. 11.20 --------557.5 ----1.75 ----------------Typ. ----140 561 ---20 -------0.13 0.08 -4.3 Max. 28.00 --------567.5 ----2.35 50 ------------Unit mcd deg nm nm nm V µA nm/K nm/K mV/K Condition IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 3 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Bin Range of Luminous Intensity Bin Code L1 L2 M1 M2 Min. 11.20 14.00 18.00 22.40 Max. 14.00 18.00 Unit Condition mcd 22.40 28.00 IF=20mA Note Tolerance of Luminous Intensity：±11% Bin Range of Dominant Wavelength Bin Code C10 C11 C12 C13 C14 Min. 557.5 559.5 561.5 563.5 565.5 Max. 559.5 561.5 563.5 565.5 567.5 Unit Condition nm IF=20mA Note: Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 4 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Typical Electro-Optical Characteristics Curves Typical curve of spectral distribution: Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Relative Intensity (%) λp(nm) Note: V(λ)=Standard eye response curve Diagram characteristics of radiation View Angle Relative Intensity Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 5 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Forward Current vs. Forward Voltage (Ta=25℃) Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Dominant Wavelength vs. Forward Current (Ta=25℃) Forward Voltage (V) Dominant Wavelength (nm) Forward Current (mA) Forward Current (mA) Relative Luminous Intensity vs.Forward Current (Ta=25℃) Forward current vs. Ambient and Solder Temperature Relative Luminous Intensity Forward Current (mA) Forward Current (mA) Temperature (℃) Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 6 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Relative Luminous Intensity vs. Junction Temperature 1.80 1.40 1.00 0.60 0.20 -0.20 -20 0 20 40 60 80 100 120 Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Relative Forward Voltage vs. Junction Temperature 0.15 0.1 Relative Luminous Intensity Relative Luminous Intensity 0.05 0 -0.05 -0.1 -0.15 -0.2 -20 0 20 40 60 80 100 120 Junction Temperature (℃) Junction Temperature (℃) Note: f(Tj) = Iv / Iv(25℃); IF =20mA Note: △VF = VF - VF(25 ℃) = f(Tj); IF =20mA Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 7 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Package Dimension Preliminary 17-21-GPC-A0L1M2B0E-3T-AM - + Note: Tolerances unless mentioned ±0.1mm. Unit = mm 1.05 Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 8 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Label Explanation ․CPN: Customer’s Product Number ․P/N: Product Number ․QTY: Packing Quantity ․CAT: Luminous Intensity Rank ․HUE: Dom. Wavelength Rank ․REF: Forward Voltage Rank ․LOT No: Lot Numbe Pb EVERLIGHT RoHS CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX CAT : XXX HUE : XXX REF : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: Unit = mm Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 9 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packaging Process and Materials Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 10 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED Precautions for Use 1. Soldering Condition 1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Note: Reference: IPC/JEDEC J-STD-020D Preheat Temperature min (Tsmin) 150 °C 200°C Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 60-120 seconds 3 °C/second max. Average ramp-up rate (Tsmax to Tp) Other Liquidus Temperature (TL) 217 °C Time above Liquidus Temperature (t L) 60-150 sec Peak Temperature (TP) 260°C Time within 5 °C of Actual Peak Temperature: TP - 5°C 30 s Ramp- Down Rate from Peak Temperature 6°C /second max. Time 25°C to peak temperature 8 minutes max. Reflow times 3 times All parameters are maximum body case temperature values and cannot be considered as a soldering profile. The body case temperature was measured by soldering a thermal couple to the soldering point of LEDs. Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 11 of 12 EVERLIGHT ELECTRONICS CO., LTD. Technical Data Sheet 0805 Package Chip LED (B) Recommend soldering pad Preliminary 17-21-GPC-A0L1M2B0E-3T-AM Note: Tolerances unless mentioned ±0.1mm. Unit = mm 2. Current limiting A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise damage could occur. 3. Storage 3.1 Moisture proof bag should only be opened immediately prior to usage. 3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened. 3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 24 hours. 4. Iron Soldering Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power less than 25W. Allow min. 2 sec. between soldering intervals. 5. Usage Do not exceed the values given in this specification. Application Restrictions 1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 1.05 Everlight Electronics Co., Ltd. Device No:DSE-0000250 http://www.everlight.com Prepared date: 24-Oct-2008 Rev. 1 Created by: Wuhongmei Page: 12 of 12