17-21-S3C-6FQ2R2L0E-3T-AM

. Technical Data Sheet 0805 Package Chip LED Lead (Pb) Free Product - RoHS Compliant Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Feature ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ RoHS compliant. Chip LED package. Colorless clear resin. Wide viewing angle 140o. Brightness:90 to 180 mcd at20mA. Qualification according to AEC-Q101. Precondition: Bases on JEDEC J-STD 020 Level 3. Automotive reflow profile (IR reflow or wave soldering)) This is a preliminary specification intended for design purposes and subject to change without prior notice. Applications ‧ ‧ ‧ ‧ ‧ ‧ ‧ Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc. Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. Display for indoor and outdoor application. Ideal for coupling into light guides. Substitution of traditional light. Optical indicator. General applications. Device Selection Guide Chip Emitted Color Material AlGaInP Reddish Orange Water Clear Resin Color Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 1 of 13 . Technical Data Sheet 0805 Package Chip LED Absolute Maximum Ratings (Ta=25℃) Parameter Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Junction Temperature Operating Temperature Storage Temperature Symbol VR IF IFP Pd Tj Topr Tstg Rth J-A Thermal resistance Rth J-S Soldering Temperature ESD (Classification acc. AEC Q101) Tsol ESDHBM ESDMM 450 K/W Reflow Soldering : 260 ℃ for 30 sec. Hand Soldering : 350 ℃ for 3 sec. 2000 200 V V Rating 12 30 60 60 125 -40 ~ +100 -40 ~ +110 800 Unit V mA mA mW ℃ ℃ ℃ K/W Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 2 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage Reverse Current Temperature coefficient of λp Temperature coefficient of λd Temperature coefficient of VF Note: Tolerance of Luminous Intensity: ±11% Tolerance of Dominant Wavelength: ±1nm Tolerance of Forward Voltage: ±0.1V Symbol Iv 2θ1/2 λp λd ∆λ VF IR TCλp TCλd TCV Min. 90 --------613 ----1.70 ----------------Typ. ----140 621 ---18 -------0.06 0.4 -2.3 Max. 180 --------622 ----2.30 10 ------------Unit mcd deg nm nm nm V µA nm/K nm/K mV/K Condition IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA VR=12V IF=20mA IF=20mA IF=20mA Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 3 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Bin Range of Luminous Intensity Bin Code Q2 R1 R2 Min. 90 112 140 Max. 112 140 180 Unit Condition mcd IF=20mA Note Tolerance of Luminous Intensity：±11% Bin Range of Dominant Wavelength Bin Code 1 2 3 Min. 613 616 619 Max. 616 619 622 Unit Condition nm IF=20mA Note: Tolerance of Dominant Wavelength: ±1nm Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 4 of 13 . Technical Data Sheet 0805 Package Chip LED Typical Electro-Optical Characteristics Curves Typical curve of spectral distribution: Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Relative Intensity (%) λp(nm) Note: V(λ)=Standard eye response curve Diagram characteristics of radiation View Angle Relative Intensity Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 5 of 13 . Technical Data Sheet 0805 Package Chip LED Forward Current vs. Forward Voltage (Ta=25℃) Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Dominant Wavelength vs. Forward Current (Ta=25℃) Dominant Wavelength (nm) Forward Current (mA) Forward Voltage (V) Forward Current (mA) Relative Luminous Intensity vs.Forward Current (Ta=25℃) Forward current vs. Ambient and Solder Temperature 40.0 35.0 Relative Luminous Intensity Forward Current (mA) 30.0 25.0 20.0 15.0 10.0 5.0 0 .0 0.0 20.0 40.0 60.0 80.0 100. 0 Temperature (℃) TS TA Forward Current (mA) Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 6 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Relative Luminous Intensity vs. Junction Temperature Relative Forward Voltage vs. Junction Temperature Relative Luminous Intensity Junction Temperature (℃) Relative Forward Voltage Junction Temperature (℃) Note: f(Tj) = Iv / Iv(25℃); IF =20mA Note: △VF = VF -VF(25 ℃) = f(Tj); IF =20mA Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 7 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Package Dimension - + Note: Tolerances unless mentioned ±0.1mm. Unit = mm 1.05 Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 8 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm Label Explanation ․CPN: Customer’s Product Number ․P/N: Product Number ․QTY: Packing Quantity ․CAT: Luminous Intensity Rank ․HUE: Dom. Wavelength Rank ․REF: Forward Voltage Rank ․LOT No: Lot Number Pb EVERLIGHT RoHS CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX CAT : XXX HUE : XXX REF : XXX LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 9 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Reel Dimensions Label Note: Unit = mm Moisture Resistant Packaging Process and Materials Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 10 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM Precautions for Use 1. Soldering Condition (Reference: IPC/JEDEC J-STD-020D) a. IR reflow 300 250 ℃ Temperature( ) 200 150 max. 120s max. 100s 255℃ 240℃ 217℃ max. 30s max. 260℃ 245℃ 100 50 0 0 50 100 150 Times(s) 200 250 300 max. Ramp Up 3 ℃ /s max. Ramp Down 6 ℃ /s b. Wave soldering reflow Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 11 of 13 . Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM (B) Recommend soldering pad Note: Tolerances unless mentioned ±0.1mm. Unit = mm 2. Current limiting A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise damage could occur. 3. Storage 3.1 Moisture proof bag should only be opened immediately prior to usage. 3.2 Environment should be less than 30℃ and 90% RH when moisture proof bag is opened. 3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded. 3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/-5deg for 25 hours. 4. Iron Soldering Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power less than 25W. Allow min. 2 sec. between soldering intervals. 5. Usage Do not exceed the values given in this specification. Application Restrictions 1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 1.05 Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 12 of 13 . Technical Data Sheet 0805 Package Chip LED Revision History: Rev. Modified date File modified contents Preliminary 17-21-S3C-6FQ2R2L0E-3T-AM 1 2010/4/9 New Spec Everlight Electronics Co., Ltd. Device No:DSE-0003444 http://www.everlight.com Page: 13 of 13