19-118/BHC-ZL1M2QY/3T

SMD ƒ B 19-118/BHC-ZL1M2QY/3T Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version. Description ․The 19-118 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. 1 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May.2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Device Selection Guide Chip Materials InGaN Emitted Color Resin Color Blue Water Clear Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA IFP 100 mA Power Dissipation Pd 95 mW Electrostatic Discharge ESDHBM 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol eak Forward Current (Duty 1/10 @1KHz) 2 Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage Symbol Min. Typ. Max. Unit Iv 11.5 ----- 28.5 mcd 2θ1/2 ----- 120 ----- deg λp ----- 468 ----- nm Condition IF=5mA λd 465 ----- 475 nm △λ ----- 35 ----- nm VF 2.7 ---- 3.2 V Note: 1.Tolerance of Luminous Intensity: ±11% 2.Tolerance of Dominant Wavelength ±1nm 3. Tolerance of Forward Voltage: ±0.05V 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Bin Range of Luminous Intensity Bin Code Min. Max. L1 11.5 14.5 L2 14.5 18.0 M1 18.0 22.5 M2 22.5 28.5 Unit Condition mcd IF =5mA Unit Condition nm IF =5mA Unit Condition V IF =5mA Bin Range Of Dom. Wavelength Bin Code Min. Max. X 465 470 Y 470 475 Bin Range Of Forward Voltage Bin Code Min. Max. 29 2.70 2.80 30 2.80 2.90 31 2.90 3.00 32 3.00 3.10 33 3.10 3.20 Note: 1.Tolerance of Luminous Intensity: ±11% 2.Tolerance of Dominant Wavelength ±1nm 3. Tolerance of Forward Voltage: ±0.05V 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Typical Electro-Optical Characteristics Curves Forward Current vs. Forward Voltage Ta=25°C 100 Forward Current IF (mA) Relative luminous intensity (%) Spectrum Distribution 75 50 25 0 400 450 500 550 40 30 25 20 10 0 2.6 600 Wavelength λ (nm) Relative luminous intensity (%) Relative luminous intensity (%) 4.2 Forward Current 100 4.5 10 0 20 40 60 80 100 Ta=25°C 100 10 1 10 2 1 10 10 Forward Current IF (mA) Radiation Diagram 0° 10° Forward Current Derating Curve Forward Current IF (mA) 3.8 1000 Ambient Temperature Ta (°C) 50 Ta=25°C 20° 30° 40 40° 30 25 1.0 0.9 50° 20 0.8 60° 10 0 70° 0.7 0 20 40 60 85 100 Ambient Temperature Ta (°C) 5 3.4 Luminous Intensity vs. Ambient Temperature 1 -60 -40 -20 3.0 Forward Voltage VF (V) Luminous Intensity vs. 1000 Ta=25°C 50 80° 90° 0.5 0.3 0.1 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 0.2 0.4 Rev.3 0.6 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Package Dimension Recommended solder pad Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual need. Note: Tolerances unless mentioned ±0.1mm. Unit = mm 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Label Explanation Pb EVERLIGHT CPN : P N : XXXXXXXXXXXXX RoHS XXXXXXXXXXXXX CAT : XXX HUE : XXX REF : XXX QTY : XXX ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number LOT NO : XXXXXXXXXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm 7 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label 8 Aluminum moisture-proof bag Desiccant Label Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 26 0 °C M ax. 10 sec. M ax. A b ov e2 5 5°C 3 0 sec.M ax . 3 °C /sec.M ax . 6 °C /sec.M ax . P re-h eatin g A b o ve 2 1 7 °C 6 0 ~ 1 5 0sec. 15 0 ~ 2 00 °C 6 0 ~ 12 0 sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 9 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com DATASHEET SMD ƒ B 19-118/BHC-ZL1M2QY/3T Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : 29-May-2013. Issue No: DSE-0008926 Rev.3 www.everlight.com