Technical Data Sheet 0603 Package Chip LED(0.8mm Height)
19-21/GPC-FL1M2B/3T
Features
․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version
Descriptions
․The 19-21 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․ Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Automotive: backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use.
Device Selection Guide
Chip Material AlGaInP
Part No. 19-21/GPC-FL1M2B/3T
Emitted Color Pure Green
Resin Color Water Clear
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 1 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Package Outline Dimensions
-
+
0.3
0.3
0.7
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
0.7
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 2 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Absolute Maximum Ratings (Ta=25℃) Parameter
Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Electrostatic Discharge(HBM) Operating Temperature Storage Temperature Soldering Temperature IFP Pd ESD Topr Tstg Tsol 60 60 2000 -40 ~ +85 -40 ~ +90 mA mW V ℃ ℃
Symbol
VR IF
Rating
5 25
Unit
V mA
Reflow Soldering : 260℃ for 10sec. Hand Soldering : 350℃ for 3 sec..
Electro-Optical Characteristics (Ta=25℃) Parameter
Luminous Intensity Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Viewing Angle Forward Voltage
Symbol
Iv λp λd △λ 2θ1/2 VF IR
Min.
11.5 ---557.5 ------1.75 ----
Typ.
----561 ---20 100 -------
Max.
28.5 ---565.5 ------2.35 10
Unit
mcd nm nm nm deg V μA
Condition
IF =20mA
Reverse Current
VR=5V
Notes:
1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 3 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Bin Range Of Dom. Wavelength
Group Bin C10 Min 557.5 559.5 561.5 563.5 Max 559.5 561.5 563.5 565.5 nm IF =20mA Unit Condition
F
C11 C12 C13
Bin Range Of Luminous Intensity
Bin L1 L2 M1 M2 Min 11.5 14.5 18.0 22.5 Max 14.5 18.0 22.5 28.5 mcd IF =20mA Unit Condition
Bin Range Of Forward Voltage
Group Bin 0 Min 1.75 1.95 2.15 Max 1.95 2.15 2.35 V IF =20mA Unit Condition
B
1 2
Notes:
1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm 3.Tolerance of Forward Voltage ±0.1V
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 4 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Typical Electro-Optical Characteristics Curves
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 5 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T Label explanation
CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank
Pb
EVERLIGHT
RoHS
CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX CAT : XXX HUE : XXX REF : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm , Unit = mm
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 6 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm , Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 7 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level : 90 % LTPD : 10 % No. 1 Items Reflow Test Condition Temp. : 260℃±5℃ Min. 5 sec. H : +100℃ 15 min. ∫ 5 min. L : -40℃ 15 min. H : +100℃ 5 min. ∫ 10 sec. L : -10℃ 5 min. Temp. : 100℃ Temp. : -55℃ IF = 20 mA/25℃ 85℃/ 85% RH Test Sample Ac/Rc Hours/Cycles Size 6 min. 300 Cycles 22 Pcs. 0/1
2
Temperature Cycle
22 Pcs.
0/1
3
Thermal Shock High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity
300 Cycles 1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs.
22 Pcs.
0/1
4 5 6 7
22 Pcs. 22 Pcs. 22 Pcs. 22 Pcs.
0/1 0/1 0/1 0/1
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 8 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
Precautions For Use
1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less 2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours.. 3. Soldering Condition 3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 9 of 10
Prepared by: Niu Yanling
19-21/GPC-FL1M2B/3T
4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com
Everlight Electronics Co., Ltd. Device No. : DSE-0002649
http://www.everlight.com Prepared date:04-Nov-2009
Rev.2
Page: 10 of 10
Prepared by: Niu Yanling
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