Technical Data Sheet 0603 Package Chip LED (0.6mm Height)
19-213/R6C-AN1P2/3T
Features
․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version.
Descriptions
․The 19-213 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․ Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use.
Device Selection Guide
Chip Material 19-213/R6C-AN1P2/3T AlGaInP Brilliant Red Water Clear
Part No.
Emitted Color
Resin Color
Everlight Electronics Co., Ltd. Device No. : DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 1 of 10
Prepared by:Wuhongmei
19-213/R6C-AN1P2/3T
Package Outline Dimensions
-
+
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 2 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Absolute Maximum Ratings (Ta=25℃) Parameter
Reverse Voltage Forward Current Power Dissipation Peak Forward Current (Duty 1/10 @1KHz) Electrostatic Discharge(HBM) Operating Temperature Storage Temperature Soldering Temperature
Symbol
VR IF Pd IFP ESD Topr Tstg Tsol
Rating
5 25 60 60 2000 -40 ~ +85 -40 ~ +90
Unit
V mA mW mA V ℃ ℃
Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃) Parameter
Luminous Intensity Viewing Angle Peak Wavelength Dominant Wavelength Spectrum Radiation Bandwidth Forward Voltage
Symbol
IV 2θ1/2 λp λd △λ VF IR
Min.
28.5 ------617.5 ---1.7 ----
Typ.
----120 632 ---20 2.0 ----
Max.
72.0 ------633.5 ---2.4 10
Unit
mcd deg nm nm nm V μA
Condition
IF =20mA
Reverse Current
VR=5V
Notes:
1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 3 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Bin Range Of Dom. Wavelength
Groups Bin E4 A E5 E6 E7 Min 617.5 621.5 625.5 629.5 Max 621.5 625.5 629.5 633.5 nm IF=20mA Unit Condition
Bin Range Of Luminous Intensity
Bin N1 N2 P1 P2 Min 28.5 36.0 45.0 57.0 Max 36.0 45.0 57.0 72.0 mcd IF =20mA Unit Condition
Notes:
1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Dominant Wavelength ±1nm
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 4 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Typical Electro-Optical Characteristics Curves
Spectrum Distribution Relative luminous intensity (%) 100 75 Ta=25°C I (mA) 50 40 30 25 20 10 0 1.2 1.6 2.0 2.4 2.8 3.0 Forward Current vs. Forward Voltage Ta=25°C
50 25
0 500
550
600
650
700
Wavelength λ (nm) Luminous Intensity vs. Relative luminous intensity (%) Relative luminous intensity (%) 1000 Ambient Temperature 1000 Luminous Intensity vs Forward Current Ta=25°C
f=1KHz Duty=1/10
Forward Current
100
100
10
10
1 -60 -40 -20
0
20 40 60 80 100
1 10
10
10
Ambient Temperature Ta (°C) Forward Current Derating Curve 50 IF(mA) 40 30 25 20 10 0.7 0 0 20 40 60 85 100 1.0 0.9 0.8
Forward Current IF(mA) Radiation Diagram 0° Ta=25°C 10° 20° 30°
Forward Current
40° 50° 60° 70° 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta (°C)
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 5 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Label explanation
CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 6 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
Aluminum moisture-proof bag
Desiccant
Label
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 7 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10%
No. 1
Items Reflow Soldering
Test Condition Temp. : 260℃±5℃ Min. 5sec. H : +100℃ 15min ∫ 5 min L : -40℃ 15min H : +100℃ 5min ∫ 10 sec L : -10℃ 5min Temp. : 100℃ Temp. : -40℃ IF = 20 mA 85℃/ 85%RH
Test Sample Hours/Cycles Size 6 Min. 300 Cycles 22 PCS.
Ac/Re 0/1
2
Temperature Cycle
22 PCS.
0/1
3
Thermal Shock High Temperature Storage Low Temperature Storage DC Operating Life High Temperature / High Humidity
300 Cycles 1000 Hrs. 1000 Hrs. 1000 Hrs. 1000 Hrs.
22 PCS.
0/1
4 5 6 7
22 PCS. 22 PCS. 22 PCS. 22 PCS.
0/1 0/1 0/1 0/1
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 8 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
Precautions For Use
1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition 3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 9 of 10 Wuhongmei
Prepared by:
19-213/R6C-AN1P2/3T
4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C
Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http://www.everlight.com
Everlight Electronics Co., Ltd. Device No. :DSE-0002442
http://www.everlight.com Prepared date:22-Sep-2009
Rev.2
Page: 10 of 10 Wuhongmei
Prepared by:
19-213-R6C-AN1P2-3T 价格&库存
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