6324/F1C9-1LNA

Technical Data Sheet 6324/F1C9-1LNA Features ․4.8mm round package. ․High luminous power. ․Typical chromaticity coordinates x=0.29, y=0.28 according to CIE1931. ․Bulk, available taped on reel. ․ESD-withstand voltage: up to 4KV ․The product itself will remain within RoHS compliant version. Descriptions ․The series is designed for application required high luminous intensity. ․The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal white. Applications ․Message panels ․Optical Indicators ․Backlighting ․Marker Lights Device Selection Guide Chip PART NO. 6324/F1C9-1LNA Lens Color Material Emitted Color InGaN White Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev Water Clear 1 Page: 1 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Package Dimensions Notes: 1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified. 2.Lead spacing is measured where the lead emerges from the package. 3.Protruded resin under flange is 1.5mm Max. LED. Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 2 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit IF 30 mA Peak Forward Current(Duty /10 @ 1KHZ) IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature (T=5 sec) Tsol 260 ℃ Power Dissipation Pd 110 mW Zener Reverse Current Iz 100 mA Electrostatic Discharge ESD 4K V Continuous Forward Current Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 3 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Production Designation 6324/F1C9- □□□□ Voltage Group Luminous Intensity Bins Color Group Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Units VF IF=20mA 2.8 -- 3.6 V Vz Iz=5mA 5.2 -- -- V Reverse Current IR VR=5V -- -- 50 uA Luminous Intensity IV IF=20mA 1425 -- 2850 mcd 2θ1/2 IF=20mA -- 100 -- deg -- 0.29 -- -- -- 0.28 -- -- Forward Voltage Zener Reverse Voltage Viewing Angle x Chromaticity Coordinates IF=20mA y Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 4 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Luminous Intensity Combination (mcd at 20mA) Rank Min Max L 1425 1800 M 1800 2250 N 2250 2850 *Measurement Uncertainty of Luminous Intensity: ±10% Forward Voltage Combination (V at 20mA) Rank Forward Voltage 0 1 2 3 2.8~3.0 3.0~3.2 3.2~3.4 3.4~3.6 *Measurement Uncertainty of Forward Voltage：±0.1V Color Combination ( at 20mA) Group Bins 1 A1+A0+B3+B4+B5+B6+C0 Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 5 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA CIE Chromaticity Diagram 0 .8 CIE-Y 0 .6 56 00K 46 00K 700 0K 0 .4 9 00 0K 1 40 00 K 2 200 0K B4 B3 CO B6 A1 AO B5 0 .2 0 .0 0 .0 0 .1 0 .2 0 .3 0 .4 0 .5 0.6 0 .7 C IE -X Color Ranks (IF=20mA， ，Ta=25℃) Color Ranks CIE X 0.255 0.264 0.28 0.27 Y 0.245 0.267 0.248 0.23 X 0.264 0.283 0.296 0.28 Y 0.267 0.305 0.267 0.248 X 0.283 0.304 0.307 0.287 Y 0.305 0.33 0.315 0.295 X 0.304 0.33 0.33 0.307 Y 0.33 0.36 0.339 0.315 X 0.287 0.307 0.311 0.296 Y 0.295 0.315 0.294 0.276 X 0.307 0.33 0.33 0.311 Y 0.315 0.339 0.318 0.294 X 0.33 0.361 0.355 0.33 Y 0.36 0.385 0.35 *Measurement uncertainty of the color coordinates：±0.01 0.318 A1 A0 B3 B4 B5 B6 C0 Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 6 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Typical Electro-Optical Characteristics Curves Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage 25 0.8 Forward Current(mA) Relative Intensity(a.u.) 1.0 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 20 15 10 5 0 2.0 800 2.5 Wavelength(nm) 4.5 Forward Current(mA) 40 1.0 0.5 0 5 10 15 20 30 20 10 25 0 Forward Current(mA) 0 20 40 60 Relative Intensity vs. Angle Displacement O 90 O 60 O O 30 0 10O Relative Luminusity 1.0 x y 0.280 0.270 0.260 10 20 30 40 O 20 O 30 O 40 O 50 O 60 0.5 O 70 O 80 O 0 0 100 Ambient Temperature Ta( C) 0.300 0.290 80 O Chromaticity Coordinate vs. Forward Current Relative Intensity(a.u.) 4.0 Forward Current vs. Ambient Temp. 1.5 Relative Intensity(a.u.) 3.5 Forward Voltage(V) Relative Intensity vs. Forward Current 0.0 3.0 0 50 0.5 Radiation Angle Forward Current(mA) Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 7 of 12 Established by: Ruby Lin 90 1.0 Technical Data Sheet 6324/F1C9-1LNA Packing Specification ■ Anti-electrostatic bag Label Pb EL ECTROSTATIC ELECTRONAGNETIC MAGNETIC OR RADIOACTIVE RELDS anti-static for 750 ■ Inner Carton ■ ■ Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks of Luminous Intensity and Forward Voltage HUE: Color Rank REF: Reference LOT No: Lot Number Outside Carton MADE IN TAIWAN: Production Place ■ Packing Quantity 1. 500 PCS/1 Bag，5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 8 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA Notes 1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions: Hand Soldering Temp. at tip of 300℃ Max. (30W iron Max.) Soldering time 3 sec Max. Distance 3mm Min.(From solder joint to epoxy bulb) DIP Soldering 100℃ Max. (60 sec Preheat temp. Max.) Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min. (From solder joint to epoxy bulb) Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 9 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA laminar wave Fluxing Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 10 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA 5. Circuit Protection
Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to Vz, the zener diode “breakdown." If the voltage tries to rise above Vz current flows through the zener branch to keep the voltage at exactly Vz.
When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through causing others to light down. In new design, the LED is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up. 6. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 11 of 12 Established by: Ruby Lin Technical Data Sheet 6324/F1C9-1LNA 7. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing. 8. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent. EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\www.everlight.com Everlight Electronics Co., Ltd. http\\:www.everlight.com Device NumberDLE-0000740 Established date: 01/13/2009 Rev 1 Page: 12 of 12 Established by: Ruby Lin