Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Features
˙Popular T-1 3/4 round package.
˙High efficiency.
˙Available on tape and reel.
˙Reliable and robust.
˙UV resistant epoxy
˙The product itself will remain within RoHS compliant version.
Descriptions
˙The series is specially designed for applications
requiring higher brightness.
˙The LED lamps are available with different
colors, intensities, epoxy colors, etc.
Applications
˙Color Graphic Signs
˙Message boards
˙Variable message signs (VMS)
˙Commercial outdoor advertising
Device Selection Guide
LED Part No.
7383/Y7C3-AQSB/MS
7383/Y7C3-AQSB/P/MS
Chip Material
AlGaInP
Emitted Color
Lens Color
Stopper
No
Brilliant Yellow Water Clear
Yes
Everlight Electronics Co., Ltd.
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Rev 1
Page: 1 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Package Dimensions
No Stopper type
Stopper type
Notes:
˙All dimensions are in millimeters, tolerance is 0.25mm except being specified.
˙Protruded resin under flange is 1.5mm Max LED.
Everlight Electronics Co., Ltd.
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Rev 1
Page: 2 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Absolute Maximum Ratings (Ta=25℃
℃)
Parameter
Forward Current
Symbol
IF
Rating
50
Units
mA
IFP
Topr
Tstg
ESD
160
-40 ~ +85
-40 ~ +100
2K
mA
℃
℃
Tsol
Pd
VR
260
115
5
Pulse Forward Current*1
Operating Temperature
Storage Temperature
Electrostatic Discharge
*2
Soldering Temperature
Power Dissipation
Reverse Voltage
V
℃
mW
V
Notes: Soldering time≦5 seconds.
Electro-Optical Characteristics (Ta=25℃
℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Units
Forward Voltage
VF
IF=20mA
1.8
2.0
2.6
V
Luminous Intensity
IV
IF=20mA
3600
4500
7150
mcd
2θ1/2
IF=20mA
--
30
--
deg
Peak Wavelength
λp
IF=20mA
--
591
--
nm
Dominant Wavelength
λd
IF=20mA
586
589
594
nm
Spectrum Radiation
Bandwidth
Δλ
IF=20mA
--
15
--
nm
IR
VR=5V
--
--
10
μA
Viewing Angle
Reverse Current
Everlight Electronics Co., Ltd.
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Rev 1
Page: 3 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Rank Combination (IF=20mA)
Rank
Luminous Intensity
Q
R
S
3600~4500
4500~5650
5650~7150
*Measurement Uncertainty of Luminous Intensity: ±10%
Rank
Forward Voltage
Unit: :mcd
1
2
3
4
1.8~2.0
2.0~2.2
2.2~2.4
2.4~2.6
*Measurement Uncertainty of Forward Voltage: ±0.1V
Rank
Unit:V
1
2
Dominant Wavelength
586~590
*Measurement Uncertainty of Dominant Wavelength ±1.0nm
590~594
Unit:nm
Everlight Electronics Co., Ltd.
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Rev 1
Page: 4 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength
Forward Current vs. Forward Voltage
50
Forward Current(mA)
Relative Intensity(a.u.)
1.0
0.8
0.6
0.4
0.2
0.0
450
500
550
600
650
40
30
20
10
0
1.0
700
1.5
Relative Luminous Intensity(a.u.)
Relative Luminous Intensity(a.u.)
Relative Intensity vs. Ambient Temp.
1.5
1.0
0.5
0.0
25
30
35
40
45
50
55
2.5
3.0
3.5
Forward Voltage(V)
Wavelength(nm)
2.0
2.0
60
65
70
2.5
Relative Intensity vs. Forward Current
2.0
1.5
1.0
0.5
0.0
0
10
O
20
30
40
50
Forward Current(mA)
Ambient Temperature Ta( C)
Forward Current vs. Ambient Temp.
Radiation Characteristics
O
90
60
O
60
O
0
30
O
O
10
1.0
O
20
Relative Intensity(a.u.)
Forward Current(mA)
O
50
40
30
20
10
0
0
20
40
60
80
100
30
O
40
O
50
O
60
0.5
O
70
O
80
O
0
0
0.5
Radiation Angle
O
Ambient Temperature Ta( C)
Everlight Electronics Co., Ltd.
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Rev 1
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Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
90
1.0
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Packing Specification
■
Anti-electrostatic bag
Label
Pb
EL ECTROSTATIC ELECTRONAGNETIC
MAGNETIC OR RADIOACTIVE RELDS
anti-static for 750
■
Inner Carton
■
■
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks of Luminous Intensity and Forward Voltage
HUE: Rank of Dominant Wavelength
REF: Reference
Outside Carton
LOT No: Lot Number
MADE IN TAIWAN: Production Place
■
Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
Everlight Electronics Co., Ltd.
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Rev 1
Page: 6 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
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Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of
the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the
lead position of the LED. If the LEDs are mounted with stress at the leads, it causes
deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
Everlight Electronics Co., Ltd.
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Rev 1
Page: 7 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
Recommended soldering conditions:
Hand Soldering
300℃ Max. (30W
Temp. at tip of iron
Max.)
Preheat temp.
DIP Soldering
100℃ Max. (60 sec
Max.)
Soldering time
3 sec Max.
Bath temp. & time
260 Max., 5 sec Max
Distance
3mm Min.(From
solder joint to
Distance
3mm Min. (From
solder joint to epoxy
epoxy bulb)
bulb)
Recommended soldering profile
laminar wave
Fluxing
Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature
particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or
vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Although the recommended soldering conditions are specified in the above table, dip or
Everlight Electronics Co., Ltd.
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Rev 1
Page: 8 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature
for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence
of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not
cause damage to the LED
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of
LED application. The current should be de-rated appropriately by referring to the
de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please
refer to the data sheet de-rating curve.
6. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever
handling LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of
the LEDs plastic lens as a result of friction between LEDs during storage and handing.
7. Other
Above specification may be changed without notice. EVERLIGHT will reserve
authority on material change for above specification.
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 1
Page: 9 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
Technical Data Sheet
7383/Y7C3-AQSB/X/MS
When using this product, please observe the absolute maximum ratings and the
instructions for using outlined in these specification sheets. EVERLIGHT assumes no
responsibility for any damage resulting from use of the product which does not comply
with the absolute maximum ratings and the instructions included in these specification
sheets.
These specification sheets include materials protected under copyright of EVERLIGHT
corporation. Please don’t reproduce or cause anyone to reproduce them without
EVERLIGHT’s consent.
EVERLIGHT ELECTRONICS CO., LTD.
Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd,
Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C
http:\\www.everlight.com
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 1
Page: 10 of 10
Device Number : DLE-0000068
Prepared date:10-09-2008
Prepared : Flourix Chen
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