EAFL2016W85A0

EAFL2016W85A0 Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : PAGE : 12 Revised record 1 REV. DESCRIPTION RELEASE DATE 1 New spec Dec.26.2012 Copyright © 2010, Everlight Americas Inc. Release Date: Dec.26.2012. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 EAFL2016W85A0 MASS PRODUTION Features Small & compact package and with high efficiency luminous flux: 85 lm @500mA Typical color temperature: 5700 K@500mA Optical efficiency@500mA : 47 lm/W ESD protection up to 8KV Moisture Sensitivity Level (MSL) Class 1 Grouping parameter: total luminous flux, color coordinates. RoHS compliant & Pb free. Typical Applications Mobile Phone Camera Flash(Camera flash light /strobe light for mobile devices ) light for DV(Digital Video) application Indoor lighting applications Signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) TFT backlighting Exterior and interior illumination applications Decorative and Entertainment Lighting Exterior and interior automotive illumination Torch 2 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Device Selection Guide Chip Emitted Color Materials InGaN White Absolute Maximum Ratings (Tsolder pad=25℃) Parameter Symbol Rating Unit DC Forward Current (mA) IF 350 mA IPulse 1500 mA ESD Resistance VB 8000 V Reverse Voltage VR [1] V Junction Temperature TJ 125 ℃ Operating Temperature TOpr -40 ~ +85 ℃ Storage Temperature TStg -40 ~ +110 ℃ Power Dissipation (Pulse Mode) Soldering Temperature Pd 7.5 W TSol 260 ℃ Allowable Reflow Cycles n/a 2 cycles Viewing Angle(2) 2θ1/2 130 deg Peak Pulse Current (mA) (400ms : ON，3600ms : OFF) Note: 1. The EAFL2016W85A0 LEDs are not designed for reverse bias used. 2. View angle tolerance is ± 5∘ . 3. Avoid operating EAFL2016W85A0 LEDs at maximum operating temperature exceed 1 hour. 4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%. 5. All reliability items are tested under good thermal management with 1.0x 1.0 cm2 MCPCB. 6. Peak pulse current shall be applied under conditions as max duration time 400ms and max duty cycle 10%. 7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability issue. 3 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 JEDEC Moisture Sensitivity Soak Requirements Standard Floor Life Level 1 Time (hours) Conditions Time (hours) Conditions unlimited ≦30℃ / 85% RH 168(+5/-0) 85℃ / 85 RH Electro-Optical Characteristics (T solder pad =25ºC) Parameter Symbol Min. Typ. Max. Unit Luminous Flux(1) Фv VF 85 ---- ---4.15 lm Forward Voltage(2) (3) 70 2.95 CCT 4500 ---- 7000 K Bin Code Min. Typ. Max. Unit 2932 3235 3538 3841 2.95 3.25 3.55 3.85 ------------- 3.25 3.55 3.85 4.15 V Bin Code Min. Typ. Max. Unit F7 F8 F9 J1 J2 J3 70 80 90 100 120 140 ------------------- 80 90 100 120 140 160 lm Correlated Color Temperature V Condition IF=500mA Note: 1. Luminous flux measurement tolerance: ±10%. 2. Forward voltage measurement tolerance: ±0.1V. 3. Electric and optical data is tested at 50 ms pulse condition. Bin Range of Forward Voltage Binning Condition IF=500mA Bin Range of Luminous Intensity 4 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 Condition IF=500mA www.everlightamericas.com DATASHEET EAFL2016W85A0 White Bin Structure 0.45 4500 5000 0.42 5700 0.39 y (1) 0.36 (2) 7000 0.33 (3) 0.30 0.27 0.27 0.30 0.33 0.36 0.39 0.42 0.45 x Notes： 1.Color Bin (1) :4550K 2.Color Bin (2) :5057K 3.Color Bin (3) :5770K White Bin Coordinate Bin CIE-X CIE-Y CCT Reference Range 4550 0.3738 0.3524 0.3440 0.3620 0.4378 0.4061 0.3420 0.3720 4500K ~ 5000K 5057 0.3300 0.3300 0.3440 0.3524 0.3200 0.3730 0.3420 0.4061 5000K ~ 5700K 5770 0.3030 0.3300 0.3300 0.3110 0.3330 0.3730 0.3200 0.2920 5700K ~ 7000K Note: 1.Color coordinates measurement allowance : ±0.01 . 2.Color bins are defined at IF=500mA and 50ms pulse operation condition. 5 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=500mA@50ms, Tsolder pad =25℃ Relative Intensity(a.u.) 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 Wavelength(nm) Typical Radiation Patterns Typical Polar Radiation Pattern for Lambertian X axis Y axis 0.8 Relative Intensity(a.u.) Relativety Luminous intensity 1.0 -15 1.2 -30 0 15 30 1.0 -45 0.6 45 0.8 0.6 0.4 0.4 -75 60 75 0.2 0.2 0.0 0.0 -90 -60 -60 -30 0 2q (Degree) 30 60 90 -90 90 0.2 0.4 0.6 Degree 0.8 1.0 Note: 1.2 of the peak value. 1.2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 2.View angle tolerance is ± 5∘. 6 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Forward Voltage vs Forward Current, T solder pad =25ºC Correlated Color Temperature(CCT) vs. Forward Current Correlated Color Temperatrue(K) 6000 5900 5800 5700 5600 5500 0 250 500 750 1000 1250 1500 Forward Current(mA@50ms) Luminous Flux vs Forward Current, T solder pad =25ºC Forward Current Derating Curve, Derating based on TjMAX=125°C at torch mode 600 500 Forward Current (mA) Relative Luminous Flux(lm) 2.0 1.5 1.0 0.5 400 300 200 100 0.0 0 250 500 750 1000 1250 1500 0 0 Forward Current(mA@50ms) 25 50 75 o Solder temperature ( C) 100 Note: 1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm2 MCPCB 7 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Package Dimension 0.3 -0. 05/+0 0.3 1,64 Optical center 2,04 0.75 Chip position Top view 1,64 0,25 1,1 Optical center 1,45 0,5 Anode pad Cathode pad 0,125 Note: 1.Dimensions are in millimeters. 2.Tolerances unless mentioned are ± 0.1mm. 8 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer Specification (when required) ‧P/N: Everlight Americas Production Number ‧QTY: Packing Quantity ‧CAT: Luminous Flux (Brightness) Bin ‧HUE: Color Bin ‧ REF: Forward Voltage Bin ‧ LOT No: Lot Number Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Progress Direction Polarity Note: 1.Dimensions are in millimeters. 2.Tolerances unless mentioned are ± 0.1mm. 9 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Reel Dimensions Note: 1.Dimensions are in millimeters. Moisture Resistant Packing Process 10 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though EAFL2016W85A0 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen 2. Storage i. ii. iii. iv. 3. Do not open the moisture-proof bag before the products are ready to use. Before opening the package, the LEDs should be stored at temperature less than 30°C and less and relative humidity less than 90%. After opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 85%. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5°C for 24 hours. Thermal Management i. ii. iii. For maintaining the high flux output and achieving reliability, EAFL2016W85A0 LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically When operating , the solder pad temperature ( or the board temperature nearby the LED) must be controlled under 70℃. 4. Soldering Condition 4.1 Soldering Pad 11 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com DATASHEET EAFL2016W85A0 4.2 For Reflow Process i. Lead reflow soldering temperature profile ii. iii. iv. Reflow soldering should not be done more than two times. While soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. 12 Copyright © 2010, Everlight Americas Inc. Release Date: Jan.04.2013. Issue No: 1 www.everlightamericas.com