EAFL4039W20A0

EAFL4039W20A0 Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : PAGE : 13 Revised record 1 REV. DESCRIPTION RELEASE DATE 1 New Spec Dec.18.2013 Copyright © 2010, Everlight All Rights Reserved. Release Date :Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 EAFL4039W20A0 Features Feature of the device：small package with high efficiency color temperature：6000 K Typical view angle：Horizontal 70°, Vertical 62° ESD protection up to 8KV Soldering methods：SMT Grouping parameter：total luminous flux, color coordinates Typical illuminance：220lx @ 1000 mA The product itself will remain within RoHS compliant version Typical Applications Mobile Phone Flash and Entertainment Lighting System appliances, measuring instruments Signal and Symbol Luminaries for orientation maker lights (e.g. steps, exit ways, etc.) Decorative 2 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Device Selection Guide Chip Emitted Color Materials InGaN White Absolute Maximum Ratings (Tsolder pad =25℃) Parameter Symbol Rating Unit DC Forward Current (mA) IF 200 mA Peak Pulse Current (mA) IPulse 1200 mA ESD Resistance VB 8000 V Reverse Voltage VR [1] V Junction Temperature TJ 125 ℃ Operating Temperature TOpr -40 ~ +85 ℃ Storage Temperature TStg -40 ~ +110 ℃ Power Dissipation (Pulse Mode) Pd 5.2 W Note: 1. The YUAN series LEDs are not designed for reverse bias used. 2. Avoid operating YUAN series LEDs at maximum operating temperature exceed 1 hour. 3. All specification are assured by reliability test for 1000hr, IV degradation less than 30%. 2 4. All reliability items are tested under good thermal management with 1.0x 1.0 cm MCPCB. 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 JEDEC Moisture Sensitivity Soak Requirements Standard Floor Life Level 2 Time (hours) Conditions Time (hours) Conditions 1 year ≦30℃ / 60% RH 168 (+5/-0) 85℃ / 60% RH Electro-Optical Characteristics (T solder pad =25ºC) Parameter Symbol Min. Typ. Max. Unit Luminous Flux(1) Фv 160 200 ---- lm Illuminance ---VF ---4.35 View Angle 2θ1/2 ---- ---- deg Correlated Color Temperature CCT 5000 220 ---70 / 62 (H /V) ---- lux Forward Voltage(2) (3) ---2.95 7000 K V Condition IF=1000mA Note: 1. Luminous Flux, illuminance measurement tolerance：±10% 2. Forward voltage measurement tolerance：±0.1V 3. Electric and optical data is tested at 50 ms pulse condition. 4. Temperature of solder pad：25℃ 5. Illuminance is measured at 1 meter. Bin Range of Forward Voltage Binning Bin Code Min. Typ. Max. Unit 2932 3235 3538 3841 4143 2.95 3.25 3.55 3.85 4.15 ---------------- 3.25 3.55 3.85 4.15 4.35 V Bin Code Min. Typ. Max. Unit J4 J5 J6 J7 160 180 200 250 ------------- 180 200 250 300 lm Condition IF=1000mA Bin Range of Luminous Intensity 4 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 Condition IF=1000mA www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 White Bin Structure 0.45 5000 0.42 5700 y 0.39 (1) 0.36 7000 (2) 0.33 0.30 0.27 0.24 0.27 0.30 0.33 0.36 0.39 0.42 x Notes： 1.Color Bin (1) :5057K 2.Color Bin (2) :5770K White Bin Coordinate Bin 5057 5770 CIE-X CIE-Y 0.3272 0.3524 0.3440 0.3285 0.3000 0.3272 0.3285 0.3110 0.3888 0.4261 0.3420 0.3178 0.3486 0.3888 0.3178 0.2920 CCT Reference Range 5000K ~ 5700K 5700K ~ 7000K Note: 1. Color coordinates measurement allowance : ±0.01 2. Color bins are defined at IF=1000mA and 50ms pulse operation condition. 5 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=1000mA@50ms, Tsolder pad=25℃ Relative Intensity(a.u.) 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 800 Wavelength(nm) Typical Radiation Patterns Illumination Pattern of Target area (1) X axis Y axis 0.8 Relative Intensity(a.u.) Relativety Luminous intensity 1.0 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 90 2q (Degree) Degree X Unit：cm Note: 1. Distance = 1 meter (Illumination Pattern of Target area) 2. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 3. View angle tolerance is ± 5∘. 6 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Forward Voltage vs Forward Current, T solder pad =25ºC Correlated Color Temperature(CCT) vs. Forward Current Corelated Color Temperatrue(K) 6000 5800 5600 5400 5200 5000 0 200 400 600 800 1000 1200 Forward Current(mA@50ms) Luminous Flux vs Forward Current, Tsolder pad =25ºC Note: 2 1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm MCPCB 7 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Relative Luminous Flux --- Iv / Iv(25℃) △ Vf Iv / Iv(25℃) Relative Forward Voltage --- VF - VF (25℃) Junction Temperature(℃) Junction Temperature(℃) Farbortverschiebung Chromaticity Coordinate Shift 0.42 CIE-x CIE-y CIE-x, CIE-y 0.40 0.38 0.36 0.34 0.32 -20 0 20 40 60 80 100 120 Junction Temperature(℃) Note: 2 1. All correlation data is tested under superior thermal management with 1.0x 1.0 cm MCPCB 8 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Package Dimension Note: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 9 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer Specification (when required) ‧P/N: Everlight Americas Production Number ‧QTY: Packing Quantity ‧CAT: Luminous Flux (Brightness) Bin ‧HUE: Color Bin ‧ REF: Forward Voltage Bin ‧ LOT No: Lot Number Carrier Tape Dimensions: Loaded Quantity 800 pcs Per Reel (Minimum Package Quantity : 200 PCS) Note: 1.Dimensions are in millimeters. 2.Tolerances unless mentioned are ±0.1mm. 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Reel Dimensions Note: 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. Moisture Resistant Packing Process Note: 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. 11 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though EAFL4039W20A0 series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen. 2. Storage i. ii. iii. iv. Do not open the moisture proof bag before the products are ready to use. Before opening the package, the LEDs should be stored at temperature less than 30°C and less and relative humidity less than 90%. After opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 85%. If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5°C for 24 hours. 3. Thermal Management i. ii. iii. For maintaining the high flux output and achieving reliability, EAFL4039W20A0 series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically When operating , the solder pad temperature ( or the board temperature nearby the LED) must be controlled under 70℃. 4. Soldering Condition 4.1 Soldering Pad 12 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com DATASHEET ELYU03-5070J4J6294310-N0 4.2 For Reflow Process i. Lead reflow soldering temperature profile ii. iii. iv. Reflow soldering should not be done more than two times. While soldering, do not put stress on the LEDs during heating. After soldering, do not warp the circuit board. 13 Copyright © 2010, Everlight All Rights Reserved. Release Date : Dec.18.2013. Issue No: 1 www.everlightamericas.com