EAISR3216A1

Reverse Package Chip Infrared LED With Inner Lens EAISR3216A1 Features ․Small double-end package ․Low forward voltage ․Good spectral matching to Si photo detector ․Package in 8mm tape on 7〞diameter reel. ․Pb free ․The product itself will remain within RoHS compliant version. Descriptions ․EAISR3216A1 is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic with spherical top view lens. The device is spectrally matched with silicon photodiode and phototransistor Applications ․PCB mounted infrared sensor ․Infrared remote control units with high power requirement ․Scanner ․Infrared applied system Device Selection Guide 1 Part Category Chip Material Resin Color EAISR3216A1 GaAlAs Water clear Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mm 2 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Continuous Forward Current IF 50 Units mA Reverse Voltage VR 5 V Peak Forward Current*1 IFP 1.0 A Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +85 ℃ Soldering Temperature*2 Tsol 260 ℃ Power Dissipation at(or below) 25℃Free Air Temperature Pd 110 mW Notes: *1: IFP Conditions--Pulse Width≦100μs and Duty≦1% *2:Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃) Parameter Radiant Intensity Symbol Ie Condition IF=20mA IF=100 mA Min. Typ. Max. 3.0 5.0 -- (Pulse Width≦100μs and Duty≦50%) 13.0 23.0 --- nm nm mW/sr Peak Wavelength λp IF=20mA -- Spectral Bandwidth Δλ IF=20mA -- 850 42 -- 1.45 VF IF=20mA IF=100mA -1.65 1.66 1.90 -- 10 Forward Voltage (Pulse Width≦100μs and Duty≦50%) Reverse Current Optical rise and fall time View Angle 3 IR tr/tf 2θ1/2 VR=5V -- IF=20mA IF=20mA --- Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Units Rev:1 25/15 35/35 60 -- V μA ns deg www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Ambient Temperature Fig.2 Spectral Distribution Fig.3 Fig.4 Peak Emission Wavelength Ambient Temperature Forward Current vs. Forward Voltage 4 10 900 875 3 10 850 2 10 825 800 -25 4 1 10 0 25 50 75 100 0 1 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 2 3 Rev:1 4 5 6 7 8 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Typical Electro-Optical Characteristics Curves Fig.5 Radiant Intensity vs. Forward Current 5 Fig.6 Relative Radiant Intensity vs. Angular Displacement Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection,otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 48 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 6 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 7 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Package Dimensions Taping Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm 8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1206 Package Chip Infrared LED With Inner Lens EAISR3216A1 Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number Notes 1. Above specification may be changed without notice. Everlight Americas will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. Everlight Americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of Everlight Americas corporation. Please don’t reproduce or cause anyone to reproduce them without Everlight Americas’s consent. 9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com