0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
EAIST3224A0

EAIST3224A0

  • 厂商:

    EVERLIGHT(台湾亿光)

  • 封装:

    1209

  • 描述:

    EMITTER IR 850NM 100MA

  • 数据手册
  • 价格&库存
EAIST3224A0 数据手册
1.8mm Round Subminiature Infrared LED EAIST3224A0 Features ․Compatible with infrared and vapor phase reflow solder process. ․Low forward voltage ․Good spectral matching to Si photodetector ․Pb free ․The product itself will remain within RoHS compliant version. Descriptions ․EAIST3224A0 is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic with spherical top view lens. ․The device is spectrally matched with silicon photodiode and phototransistor. Applications ․PCB mounted infrared sensor ․Infrared emitting for miniature light barrier ․Floppy disk drive ․Optoelectronic switch ․Smoke detector Device Selection Guide 1 Part Category Chip Material Lens Color EAIST3224A0 GaAlAs Water clear Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Package Dimensions 1 2 1 2 1 Anode 2 Cathode Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mm Absolute Maximum Ratings (Ta=25°C) 2 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Parameter Symbol Rating Continuous Forward Current IF 100 Peak Forward Current IFP 1.0 Reverse Voltage VR 5 A V Operating Temperature Topr -40 ~ +85 °C Storage Temperature Tstg -40 ~ +100 °C Soldering Temperature *2 Junction temperature Thermal resistance junction (ambient mounted on PC-board padsize 16mm2 each) Thermal resistance junction (Soldering point , mounted on metal block) Tsol Tj 260 115 °C RthJA 400 C/W RthJS 300 C/W Power Dissipation at(or below) 25℃Free Air Temperature Pd 200 mW *1 Unit mA C Notes: *1:IFP Conditions--Pulse Width≦100μs and Duty≦1%. *2:Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25°C) Parameter Radiant Intensity Symbol Ie Condition Min. Typ. Max. IF=20mA 7.0 14.0 -- IFP=150mA , mW/sr Pulse Width≦470μs ,Duty≦1% 50 100 --- nm -- nm 1.7 Peak Wavelength λp IF=20mA -- Spectral Bandwidth Δλ IF=20mA -- 850 30 IF=20mA 1.2 1.4 Forward Voltage Reverse Current View Angle VF IR 2θ1/2 Unit IFP=150mA , V Pulse Width≦470μs ,Duty≦1% 1.4 1.75 2.0 VR=5V -- -- 10 IF=20mA -- 35 -- uA Deg Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. 3 Fig.2 Spectral Distribution Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Ambient Temperature 100 120 IF - Forward Current (mA) 100 IF=20mA Ta=25° C 80 80 60 60 40 40 20 20 0 0 0 20 40 60 80 Tamb - Ambient Temperature (°C) 790 810 830 850 870 890 910 930 950 100 Fig.3 Peak Emission Wavelength Ambient Temperature Fig.4 Forward Current vs. Forward Voltage 10 900 875 10 4 3 850 10 2 825 800 -25 1 10 0 25 50 75 100 0 1 2 3 4 5 6 7 8 Typical Electro-Optical Characteristics Curves Fig.5 Radiant Intensity vs. 4 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Forward Current Ie-Radiant Intensity(mW/sr) 80 60 40 20 0 0 20 40 60 80 100 IF-Forward Current (mA) Fig.6 Relative Radiant Intensity vs. Angular Displacement 0 1.0 30 Relative Radiant Intensity 0.8 0.6 60 0.4 0.2 0.0 -90 -60 -30 90 0 ViewAngle(degree) Precautions For Use 1. Over-current-proof 5 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 1.6 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Customer must apply resistors for protection,otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 48 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and 6 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 7 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Package Dimensions Carrier Tape Dimensions:(Quantity: 2500pcs/reel) Unit: mm 8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com Data Sheet 1.8mm Round Subminiature Infrared LED EAIST3224A0 Packing Procedure Label Aluminum moistue-proof bag Desiccant Label Label Form Specification CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number Notes 1. Above specification may be changed without notice. Everlight Americas will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. Everlight Americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of Everlight Americas corporation. Please don’t reproduce or cause anyone to reproduce them without Everlight Americas’s consent. 9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 5/28/2013. Issue No: 1 Rev:1 www.everlightamericas.com
EAIST3224A0 价格&库存

很抱歉,暂时无法提供与“EAIST3224A0”相匹配的价格&库存,您可以联系我们找货

免费人工找货