EALP05RDDBA0

Lamp EALP05RDDBA0 Features ˙Popular T-1 3/4 package. ˙High efficiency. ˙General purpose leads. ˙Selected minimum intensities. ˙Available on tape and reel. ˙The product itself will remain within RoHS compliant version. Description ˙The series is specially designed for applications requiring higher brightness. ˙The LED lamps are available with different Applications ˙Status indicators. ˙Commercial use. ˙Advertising Signs. 1 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Device Selection Guide Chip Materials Emitted Color Resin Color InGaN Blue Water Clear Absolute Maximum Ratings (Ta=25℃ ℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 30 mA IFP 100 mA Power Dissipation Pd 110 mW Operating Temperature Topr -40 ~ +85 Tstg -40 ~ +100 ESDHBM 1K V Zener Reverse Current Iz 100 mA Soldering Temperature Tsol Peak Forward Current (Duty 1/10 @1KHz) Storage Temperature ESD 2 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 ℃ ℃ 260 ℃ for 5 sec. www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Electro-Optical Characteristics (Ta=25℃ ℃) Parameter Symbol Min. Typ. Max. Unit Condition Radiometric Intensity Viewing Angle Peak Wavelength IV 2 1/2 p 4500 ------- 7150 15 468 11250 ------- mcd deg nm IF=20mA 465 470 475 ---2.8 ---- 25 3.2 ---- ---3.6 50 -V uA VR=5V Dominant Wavelength Spectrum Half width Forward Voltage Reverse Current θ λ λd Δλ VF IR Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition R S T U 4500 5650 7150 9000 5650 7150 9000 11250 mcd IF =20mA Note: Tolerance of Luminous Intensity: ±10% Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition 1 2 465 470 470 475 nm IF =20mA Bin Code Min. Max. Unit Condition 0 1 2 3 2.8 3.0 3.2 3.4 3.0 3.2 3.4 3.6 V IF =20mA Note: Tolerance of Dominant Wavelength: ±1nm Bin Range of Forward Voltage Note: Tolerance of Forward Voltage: ±0.1V 3 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Typical Electro-Optical Characteristics Curves ℃) ℃) Relative Intensity vs. Wavelength (Ta=25 Directivity (Ta=25 O O 90 O 60 O 20 O O 0.6 0.4 0.2 40 O 50 O 60 0.5 O 70 O 80 400 450 500 550 O 0 600 0 ℃) ℃) 1.5 Relative Intensity(a.u.) 25 20 15 10 5 2.0 2.5 3.0 3.5 4.0 1.0 0.5 0.0 4.5 0 5 Forward Voltage(V) Forward Voltage (V) 10 15 20 25 30 Forward Current (mA) Relative Intensity vs. Ambient Temp. Forward Current vs. Ambient Temp. 2.0 Forward Current (mA) 40 1.5 1.0 0.5 0.0 25 0.5 Relative Intensity vs. Forward Current (Ta=25 30 0 1.5 90 1.0 Radiation Angle Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25 Forward Current (mA) 10O 30 Wavelength (nm) Relative Intensity(a.u.) 0 0.8 0.0 350 30 35 40 45 50 55 60 (℃) 65 70 30 20 10 0 0 20 O Ambient Temperature Ta 4 O 30 1.0 Radiation Angle Relative Intensity (a.u.) 1.0 40 60 80 100 (℃) Ambient Temperature Ta Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Package Dimension Note: ˙Other dimensions are in millimeters, tolerance is 0.25mm except being specified. ˙Protruded resin under flange is 1.5mm Max LED. 5 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Ranks of Luminous Intensity and Forward Voltage ‧HUE: Rank of Dominant Wavelength ‧REF: Reference ‧LOT No: Lot Number Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton Label Pb EL ECTR OSTATIC ELECTR ONAGNET IC MAGNETIC OR RADIOACTIVE RELDS anti-static for 750 ■ Packing Quantity 1. Min 200PCS to Max 1000PCS /1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton 6 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 Notes 1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight Americas and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions: Hand Soldering 300 Max. (30W Temp. at tip of iron Max.) Soldering time 3 sec Max. Distance 3mm Min.(From solder joint to epoxy bulb) ℃ 7 DIP Soldering 100 Max. (60 sec Preheat temp. Max.) Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min. (From solder joint to epoxy bulb) Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 ℃ www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0
Recommended soldering profile laminar wave Fluxing Prehead
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED 5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating curve. 8 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com DATASHEET 5mm Lamp LED EALP05RDDBA0 6. ESD (Electrostatic Discharge)
The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials
Proper grounding is required for all devices, equipment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products.
If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers. 7. Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, it may cause migration resulting in LED damage. 8. Other
Above specification may be changed without notice. Everlight Americas will reserve authority on material change for above specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. Everlight Americas assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of Everlight Americas corporation. Please don’t reproduce or cause anyone to reproduce them without Everlight Americas' consent. 9 Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 30.Mar.2012. Issue No: 1 Rev:1 www.everlightamericas.com