EAPL4040BA0

SMD  REFLECTOR EAPL4040BA0 PRELIMINARY Features ․Fluorescence Type ․High Luminous Intensity ․High Efficiency ․Pb-free ․The product itself will remain within RoHS compliant version. Applications ․OA equipment ․Backlighting of full color LCD ․Automotive equipment ․Replacement of conventional light bulbs and Fluorescent Lamps 1 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Device Selection Guide Chip Materials InGaN Emitted Color Resin Color Blue Water Clear Absolute Maximum Ratings (Ta=25℃) 2 Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 30 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 110 mW Electrostatic Discharge(HBM) ESD 1000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Reflow Soldering : 260℃ for 10 sec. Hand Soldering : 350℃ for 3 sec. Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Luminous Intensity Iv 180 ---- 450 mcd Viewing Angle 2θ1/2 ---- 120 ---- deg Peak Wavelength λp ---- 468 ---- nm Dominant Wavelength λd 464.5 ---- 476.5 nm Spectrum Radiation Bandwidth Δλ ---- 25 ---- nm Forward Voltage VF 2.75 ---- 3.95 V Reverse Current IR ---- ---- 50 μA Condition IF=20mA VR=5V Note: 1. Tolerance of Luminous Intensity: ±11% 2. Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Bin Range of Luminous Intensity Bin Code Min. Max. S1 180 225 S2 225 285 T1 285 360 T2 360 450 Unit Conduction mcd IF=20mA Note: Tolerance of Luminous Intensity: ±11% 3 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Bin Range of Dominant Wavelength Groups Bin Min Max A9 464.5 467.5 A10 467.5 470.5 A11 470.5 473.5 A12 473.5 476.5 Unit Condition nm IF=20mA Unit Condition volt IF=20mA A Note: Tolerance of Dominant Wavelength: ±1nm Bin Range of Forward Voltage Groups Bin Min Max 5 2.75 3.05 6 3.05 3.35 7 3.35 3.65 8 3.65 3.95 M Note: Tolerance of Forward Voltage: ±0.1V 4 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Typical Electro-Optical Characteristics Curves Spectrum Distribution Forward Current vs. Forward Voltage Ta=25°C Forward Current 75 50 25 0 400 450 500 550 40 30 20 10 0 2.4 800 2.6 3.0 3.4 3.8 4.2 Forward Voltage (VF)-volts Relative Luminous Intensity vs. Relative Luminous Intensity vs Ambient Temperature Forward Current 1000 Relative Luminous Intensity (%) Relative Luminous Intensity (%) Wavelength λ (nm) 100 10 1 -60 -40 -20 0 20 40 60 80 100 1000 10 1 0 10 1 10 2 10 Forward Current IF(mA) Radiation Diagram Forward Current Derating Curve 0° 50 Forward Current I (mA) F Ta=25°C f=1KHz Duty=1/10 100 Ambient Temperature Ta (°C) 10° Ta=25°C 20° 30° 40 40° 30 1.0 20 10 0.9 50° 0.8 60° 70° 0.7 0 5 Ta=25°C 50 I F (mA) Relative luminous intensity (%) 100 20 40 60 80 100 Ambient Temperature Ta (°C) 80° 90° 0.5 0.3 0.1 0.2 0.4 0.6 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Package Dimension Note: Tolerances unless mentioned ±0.1mm. Unit = mm 6 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Moisture Resistant Packing Materials Label Explanation CAT: Luminous Intensity Rank HUE: Dom. Wavelength Rank REF: Forward Voltage Rank Reel Dimensions Carrier Tape Dimensions: Loaded Quantity 500 pcs Per Reel Note: Tolerances unless mentioned ±0.1mm. Unit = mm 7 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Moisture Resistant Packing Process Note: Tolerances unless mentioned ±0.1mm. Unit = mm Reliability Test Items and Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5sec. 6 Min. 22 pcs. 0/1 2 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 pcs. 0/1 3 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 pcs. 0/1 4 High Temperature Storage Temp. : 100℃ 1000 Hrs. 22 pcs. 0/1 5 Low Temperature Storage Temp. : -40℃ 1000 Hrs. 22 pcs. 0/1 6 DC Operating Life IF = 20 mA 1000 Hrs. 22 pcs. 0/1 7 High Temperature / High Humidity 85℃/ 85%RH 1000 Hrs. 22 pcs. 0/1 8 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com DATASHEET SMD  REFLECTOR EAPL4040BA0 Precautions for Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 72 hours under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 260°C Max. 10sec. Max. Above255°C 30sec.Max. 3°C/sec.Max. 6°C/sec.Max. Pre-heating Above 217°C 60~150sec. 150~200°C 60~120sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 9 Copyright © 2010, Everlight Americas All Rights Reserved. Release Date : Apr.30.2014. Issue No: XXXXXXX www.everlightamericas.com