ELCH08-KB4148J6J7283610-F1H

ELCH08-KB4148J6J7283610-F1H(OPPO) Received ■ MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NO. : DHE-0002730 PAGE : 12 Revised record REV. DESCRIPTION RELEASE DATE 1 New spec Mar.16.2015 2 Changes Allowable Reflow Cycles Apr.27.2015 3 Change VF max spc. & Bin June.30.2015 For ECR*49517 Change VF Binning 2. Change Product Labeling Oct.15.2015 4 1 1. Copyright © 2010, Everlight All Rights Reserved. Release Date :Oct.15.2015 Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) ELCH08-KB4148J6J7283610-F1H(OPPO) Features • Feature of the device：small package with high efficiency • Typical luminous flux@ 1A：250 lm • Optical efficiency@1A：71.63 lm/W • ESD protection (according to JEDEC 3b) (HBM air or contact discharge)up to 8KV • Binning Parameters：Brightness, Forward Voltage and Chromaticity • Grouping parameter: total luminous flux, color coordinates. • RoHS compliant & Pb free. Applications • Mobile Phone Camera Flash(Camera flash light /strobe light for mobile devices ) • Torch light for DV(Digital Video) application • Indoor lighting applications • Signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) • TFT backlighting • Exterior and interior illumination applications • Decorative and Entertainment Lighting • Exterior and interior automotive illumination 2 Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Device Selection Guide Chip Materials Emitted Color InGaN White Absolute Maximum Ratings Parameter Symbol Rating Unit DC Forward Current (Torch Mode) IF 500 mA Peak Pulse Current IPulse 1500 mA ESD Resistance (JEDEC 3b) VB 8000 V Reverse Voltage Note 1 Junction Temperature VR TJ 150 V ℃ Operating Temperature TOpr -40 ~ +85 ℃ Storage Temperature TStg -40 ~ +100 ℃ Soldering Temperature TSol 260 ℃ Allowable Reflow Cycles n/a 3 Cycles Viewing Angle(2) 2θ1/2 120 Deg Notes: 1. The Chin series LEDs are not designed for reverse bias used. 2. View angle measurement tolerance±5° 3. Avoid operating Chin series LEDs at maximum operating temperature exceed 1 hour. 4. All specification are assured by reliability test for 1000hr, IV degradation less than 30%. 5. All reliability item are tested under good thermal management with 1.0 x 1.0 cm2 MCPCB 6. Peak pulse current shall be applied under conditions as max duration time 400 ms and max duty cycle 10% 7. Operate LED component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameters. Exercise multiple maximum rating parameters simultaneously should not be allowed. When maximum rating parameters are applied over a long period will result potential reliability issue. 3 Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) JEDEC Moisture Sensitivity Floor Life Level 1 Soak Requirements Standard Time ( hours ) Conditions Time ( hours ) Conditions Unlimited ≦30℃ / 85% RH 168 (+5/-0) 85℃ / 85% RH Electro-Optical Characteristics (Ts=25℃) Parameter Symbol Min. Typ. Max. Unit Luminous Flux(1) Iv 220 250 300 lm Forward Voltage(2)(3) VF 2.85 3.45 3.95 V CCT 4500 83 4850 K IF=1000mA CRI 4150 80 R9 ---- 10 ---- Bin Symbol Min. Typ. Max. Unit Condition 2835 VF 2.85 ---- 3.55 3539 VF 3.55 ---- 3.95 V IF=1000mA Bin Symbol Min. Typ. Max. J6 Iv 220 ---- 250 J7 Iv 250 ---- 300 Color Temperature Color Rendering Index(4) Condition ---- Forward Voltage Binning Luminous Flux Binning Unit Condition lm IF=1000mA Notes: 4 1. Luminous Flux, illuminance measurement tolerance：±10% 2. Forward voltage measurement tolerance：±0.1V 3. Electric and optical data is tested at 50 ms pulse condition 4. Color Rendering Index measurement tolerance: ± 2 Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) White Bin Structure 0 .4 2 0 .4 0 0 .3 8 4148 CIE-Y 0 .3 6 0 .3 4 0 .3 2 0 .3 0 0 .3 3 0 .3 4 0 .3 5 0 .3 6 0 .3 7 0 .3 8 0 .3 9 0 .4 0 CIE-X Bin CIE-X CIE-Y Reference Range 4148 0.3526 0.3817 0.3707 0.3481 0.3827 0.4043 0.3585 0.3435 4150 ~ 4850K Notes: 5 1. Color coordinates measurement allowance：±0.01 2. Color bins are defined at IF=1000mA operation. Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Typical Electro-Optical Characteristics Curves Relative Spectral Distribution , IF=1000mA @ 50ms, Tsolder pad=25℃ 1 .2 Relative Intensity (a.u.) 1 .0 0 .8 0 .6 0 .4 0 .2 0 .0 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 λp (nm) Typical Radiation Patterns Typical Polar Radiation Pattern for Lambertian 1.0 Relativety Luminous intensity X axis Y axis Relative Intensity 0.8 0.6 0.4 0.2 0.0 -90 -60 -30 0 30 60 90 Illuminance Degree Unit：lx Notes: 6 1. 2θ1/2 is the off axis from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is ± 5∘ Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Forward Voltage vs. Forward Current (Tsolder pad=25℃) Relative Luminous Flux vs. Forward Current (Tsolder pad=25℃) 4.2 1.4 3.9 Relative Luminous Flux 1.2 Forward Voltage (V) 3.6 3.3 3.0 2.7 2.4 2.1 0 250 500 750 1000 1250 1500 Forward Current (mA @ 50ms) 1.0 0.8 0.6 0.4 0.2 0.0 0 250 500 750 1000 1250 1500 Forward Current (mA @ 50ms) CCT vs. Forward Current (Tsoldering pad=25℃) Correlated Color Temperature(K) 4800 4700 4600 4500 4400 4300 4200 0 250 500 750 1000 1250 1500 Forward Current (mA @50ms ) Notes: 1. 7 All correlation data is tested under superior thermal management with 1 x 1 cm2 MCPCB. Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Package Dimension Notes: 8 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Moisture Resistant Packing Materials Product Labeling ‧CPN:Customer’s Product Number ‧P/N:Everlight Product Number ‧LOT NO:Lot Number ‧QTY:Packing Quantity ‧CAT:Luminous Flux (Brightness) Bin ‧HUE:Color Bin ‧REF:Forward Voltage Bin ‧REFERENCE:Reference ‧MSL-X:MSL Level Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel Progress Direction Polarity Notes: 1. 9 Dimensions are in millimeters. Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Emitter Reel Dimensions Notes: 1. Dimensions are in millimeters. Moisture Resistant Packing Process 10 Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) Reflow Soldering Characteristics Soldering and Handling 1. Over-current-proof Though CHIN series has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen. 2. Storage 2.1 Do not open the moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 90% 2.3 After opening the package, the LEDs should be stored at temperature less than 30°C and relative humidity less than 85%. 2.4 If the moisture absorbent material (silicone gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5°C for 24 hours. 3. Thermal Management 3.1 For maintaining the high flux output and achieving reliability, CHIN series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. 3.2 Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically. 3.3 When operating , the solder pad temperature ( or the board temperature nearby the LED) must controlled under 70℃. 4. Soldering Condition 4.1 11 Soldering Pad Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com DATASHEET ELCH08-KB4148J6J7283610-F1H(OPPO) 4.2 For Reflow Process 4.2.1 Lead reflow soldering temperature profile 4.2.2 Reflow soldering should not be done more than two times. 4.2.3 While soldering, do not put stress on the LEDs during heating. 4.2.4 After soldering, do not warp the circuit board. 12 Copyright © 2010, Everlight All Rights Reserved. Release Date : Oct.15.2015. Issue No: DHE-0002730 Ver.:4 Release Date:10/20/2015 　 狀態:Approved(正式發行) www.everlight.com