GT-197

Technical Data Sheet 0603 Package Chip LED (0.4mm Height) GT-197 Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process. ․Mono-color type. ․Pb-free. ․The product itself will remain within RoHS compliant version. Descriptions ․The GT-197 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ․ Besides, lightweight makes them ideal for miniature applications. etc. Applications ․Backlighting in dashboard and switch. ․Telecommunication: indicator and backlighting in telephone and fax. ․Flat backlight for LCD, switch and symbol. ․General use. Device Selection Guide Part No. Chip Material Emitted Color InGaN Pure White GT197 Prepared date:04-Jun-2006 Rev.1 Resin Color Yellow Diffused Page: 1 of 12 GT-197 Package Outline Dimensions Note: The tolerances unless mentioned is ±0.1mm , Unit = mm Prepared date:04-Jun-2006 Rev.1 Page: 2 of 12 GT-197 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR 5 V Forward Current IF 25 mA Peak Forward Current (Duty 1/10 @1KHz) IFP 100 mA Power Dissipation Pd 110 mW Electrostatic Discharge(HBM) ESD 150 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +90 ℃ Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Luminous Intensity Iv Viewing Angle 2θ1/2 Forward Voltage VF Reverse Current IR Min. Typ. Max. 28.5 ----- 112 Unit Condition IF=5mA mcd ----- 200 ----- ----- 130 ----- 2.70 ----- 3.30 ----- 3.3 ----- ----- ----- 50 IF=20mA deg IF=5mA IF=5mA V IF=20mA μA VR=5V Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Forward Voltage ±0.1V Prepared date:04-Jun-2006 Rev.1 Page: 3 of 12 GT-197 Bin Range Of Luminous Intensity Bin Min Max N 28.5 45.0 P 45.0 72.0 Q 72.0 112 Unit Condition mcd IF=5mA Unit Condition V IF=5mA Bin Range Of Forward Voltage Bin Min Max 29 2.70 2.80 30 2.80 2.90 31 2.90 3.00 32 3.00 3.10 33 3.10 3.20 34 3.20 3.30 Notes: 1.Tolerance of Luminous Intensity ±11% 2.Tolerance of Forward Voltage ±0.1V Prepared date:04-Jun-2006 Rev.1 Page: 4 of 12 GT-197 Chromaticity Coordinates Specifications for Bin Grading Bin Code A1 A2 A3 A4 A5 A6 CIE_x CIE_y Condition 0.230 0.230 0.270 0.270 0.230 0.230 0.270 0.270 0.270 0.270 0.310 0.310 0.270 0.270 0.310 0.310 0.310 0.310 0.350 0.350 0.310 0.310 0.350 0.350 0.176 0.219 0.270 0.234 0.219 0.263 0.307 0.270 0.234 0.270 0.321 0.292 0.270 0.307 0.350 0.321 0.292 0.321 0.372 0.350 0.321 0.350 0.393 0.372 IF= 5mA Notes: 1.The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01). 2.The products are sensitive to static electricity and care must be fully taken when Prepared date:04-Jun-2006 Rev.1 Page: 5 of 12 GT-197 CIE Chromaticity Diagram Prepared date:04-Jun-2006 Rev.1 Page: 6 of 12 GT-197 Typical Electro-Optical Characteristics Curves Prepared date:04-Jun-2006 Rev.1 Page: 7 of 12 GT-197 Label explanation CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates REF: Forward Voltage Rank Reel Dimensions Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Prepared date:04-Jun-2006 Rev.1 Page: 8 of 12 GT-197 Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Prepared date:04-Jun-2006 Rev.1 Desiccant Label Page: 9 of 12 GT-197 Reliability Test Items And Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% Test Sample Hours/Cycles Size No. Items Test Condition 1 Reflow Soldering Temp. : 260℃±5℃ Min. 5 sec. 6 Min. 22 PCS. 0/1 Temperature Cycle H : +100℃ 15min ∫ 5 min L : -40℃ 15min 300 Cycles 22 PCS. 0/1 3 Thermal Shock H : +100℃ 5min ∫ 10 sec L : -10℃ 5min 300 Cycles 22 PCS. 0/1 4 High Temperature Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1 5 Low Temperature Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1 6 DC Operating Life IF = 20 mA / 25℃ 1000 Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85℃/85%RH 1000 Hrs. 22 PCS. 0/1 2 Prepared date:04-Jun-2006 Rev.1 Ac/Re Page: 10 of 12 GT-197 Precautions For Use 1.Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1Pb-free solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. Prepared date:04-Jun-2006 Rev.1 Page: 11 of 12 GT-197 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 6. Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound Prepared date:04-Jun-2006 Rev.1 Page: 12 of 12