HIR11-21C/L11/TR8

1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Features ․High reliability ․Small double-end package ․Peak wavelength λp=850nm ․Package in 8mm tape on 7” diameter reel ․Low forward voltage ․Pb free ․The product itself will remain within RoHS compliant version. ․Compliance with EU REACH Descriptions HIR11-21C/L11/TR8 is an infrared emitting diode in miniature SMD package which is molded in a water clear plastic With flat top view lens. The device is spectrally matched with silicon photodiode and phototransistor. Applications ․PCB mounted infrared sensor ․Infrared remote control units with high power requirement ․Smoke detector ․Infrared applied system Device Selection Guide 1 Part Category Chip Material Resin Color HIR GaAlAs Water Clear Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Package Dimensions Notes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mm 3.Suggested pad dimension is just for reference only Please modify the pad dimension based on individual need 2 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Continuous Forward Current IF 65 Units mA Reverse Voltage VR 5 V Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -40 ~ +85 ℃ Tsol 260 ℃ Pd 130 mW Soldering Temperature *1 Power Dissipation at(or below) 25℃Free Air Temperature Notes: *1. Soldering time≦5 seconds. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Ie λp Condition IF=20mA Min. Typ. Max. 1.0 2.0 IF=20mA -- 850 --- Units mW/sr nm Spectral Bandwidth Δλ IF=50mA -- 45 -- nm Forward Voltage VF IF=20mA IR 2θ1/2 VR=5V 1.45 -- 1.65 10 V Reverse Current --- IF=20mA -- 75 -- Radiant Intensity Peak Wavelength View Angle 3 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: μA deg www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Typical Electro-Optical Characteristics Curves Fig.1 Forward Current vs. Ambient Temperature Fig.2 Spectral Distributio n 140 100 120 IF=20mA Ta=25° C 80 100 60 80 60 40 40 20 20 0 0 -25 0 20 40 Fig.3 Forward Current vs. Forward Voltage 4 60 80 100 790 810 830 850 870 890 910 930 950 Fig.4 Relative Intensity vs. Forward Current Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Typical Electro-Optical Characteristics Curves Fig.5 Relative Radiant Intensity vs. Angular Displacement -20 -10 0 10 20 30 1.0 40 0.9 50 0.8 0.7 60 70 80 0.6 0.4 0.2 0 5 0.2 0.4 0.6 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Precautions For Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the Photodiode should be kept at 10℃~30℃ and 90%RH or less. 2.3 The Photodiode suggested be used within one year. 2.4 After opening the package, the devices must be stored at 10°C~30°C and  60%RH, and used within 168 hours (floor life). If unused Photodiode remain, it should be stored in moisture proof packages. 2.5 If the moisture absorbent material (desiccant material) has faded or unopened bag has exceeded the shelf life or devices (out of bag) have exceeded the floor life, baking treatment is required. 2.6 If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure or recommend the following conditions: 96 hours at 60°C ± 5°C and < 5 % RH (reeled/tubed/loose units) 3. Soldering Condition 3.1 Lead solder temperature profile 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 6 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 7 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Package Dimensions Note: The tolerances unless mentioned are ±0.1mm, Unit: mm Carrier Tape Dimensions: (Loaded Quantity: 2000pcs/reel) Note: The tolerances unless mentioned is ±0.1mm, Unit = mm 8 Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever Data Sheet 1206 Package Chip Infrared LED With Inner Lens HIR11-21C/L11/TR8 Label Form Specification CPN: Customer’s Production Number P/N : Production Number LOT No: Lot Number QTY: Packing Quantity HUE: Peak Wavelength CAT: Ranks REF: Reference MSL-X: MSL Level Made In: Manufacture place Notes 1. Above specification may be changed without notice. EVERLIGHT will reserve authority on .material change for above specification. 2. The graphs shown in this datasheet are representing typical data only and do not show .guaranteed values. 3. When using this product, please observe the absolute maximum ratings and the nstructions for.use outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 4. These specification sheets include materials protected under copyright of EVERLIGHT. .Reproduction in any form is prohibited without the specific consent of EVERLIGHT. 5. This product is not intended to be used for military, aircraft, automotive, medical, life sustaining.or life saving applications or any other application which can result in human injury or death..Please contact authorized Everlight sales agent for special application request. EVERLIGHT ELECTRONICS CO., LTD. Office: No. 6-8, Zhonghua Rd., Shulin Dist., New Taipei City 23860, Taiwan 9 Tel: 886-2-2685-6688 Fax: 886-2685-2699，6897 http://www.everlight.com Copyright © 2015, Everlight All Rights Reserved. Release Date: 2015/9/29. Issue No: DIR-0000947. Rev: 4 Revision :4 LifecyclePhase: www.everlight.com Release Date:2015-10-16 11:08:02.0 Expired Period: Forever