MP7523JS

MP7523/XRD7523 ...the analog plus company TM 15 V CMOS Multiplying 8-Bit Digital-to-Analog Converter January 1996-2 FEATURES • • • • • • • Full Four-Quadrant Multiplying Low Feedthrough: 1/2 LSB @ 200 kHz Fast Settling: 100 ns (typ.) Low Power Dissipation Low Cost 5 V/15 V Operation Buffered Version: MP7524/XRD7524 APPLICATIONS • • • • • • Battery Operated Equipment Low Power, Ratiometric A/D Converters Digitally Controlled Gain Circuits Digitally Controlled Attenuators CRT Character Generation Low Noise Audio Gain Control GENERAL DESCRIPTION The MP7523/XRD7523 is a low cost multiplying Digital-toAnalog Converter. The device uses an advanced thin-film-onCMOS technology to provide 8-bit resolution with accuracy to 10-bits and very low power dissipation. The MP7523/XRD7523’s excellent multiplying characteristics and low cost allow it to be used in a wide ranging field of applications such as: low noise audio gain control, CRT character generation, motor speed control, digitally controlled attenuators, etc. SIMPLIFIED BLOCK DIAGRAM VDD 2R VREF 4R 4R 4R 4R 2R 2R RFB 4R 4R 4R R IOUT1 IOUT2 2 to 3 Decoder Switch Drivers & Switches R = 10k BIT 1 MSB BIT 8 LSB 3 Segment D/A Converter with Termination to DGND Logical “1” at Digital Input Steers Current to IOUT1 Rev. 3.00 E1996 EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 z (510) 668-7000 z (510) 668-7010 MP7523/XRD7523 ORDERING INFORMATION Package Type Plastic Dip Plastic Dip SOIC (Jedec, 0.300”) SOIC (Jedec, 0.300”) SOIC (Jedec, 0.150”) SOIC (Jedec, 0.150”) SOP (EIAJ) SOP (EIAJ) Temperature Range –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C Part No. MP7523JN MP7523KN MP7523JS MP7523KS XRD7523AID-J XRD7523AID-K XRD7523AIK-J XRD7523AIK-K INL (LSB) 1/2 1/4 1/2 1/4 1/2 1/4 1/2 1/4 DNL (LSB) 1 1 1 1 1 1 1 1 Gain Error (% FSR) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 PIN CONFIGURATIONS IOUT1 IOUT2 GND (MSB) BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 RFB VREF VDD N/C N/C BIT 8 (LSB) BIT 7 BIT 6 IOUT1 IOUT2 GND (MSB) BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 RFB VREF VDD N/C N/C BIT 8 (LSB) BIT 7 BIT 6 16 Pin PDIP (0.300”) 16 pin SOIC (Jedec, 0.300”) 16 pin SOIC (Jedec, 0.150”) 16 pin SOP (EIAJ, 5.5 mm) PIN OUT DEFINITIONS PIN NO. 1 2 3 4 5 6 7 8 NAME IOUT1 IOUT2 GND BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 DESCRIPTION Current Output 1 Current Output 2 Ground Bit 1 (MSB) Bit 2 Bit 3 Bit 4 Bit 5 PIN NO. 9 10 11 12 13 14 15 16 NAME BIT 6 BIT 7 BIT 8 N/C N/C VDD VREF RFB Bit 6 Bit 7 Bit 8 No Connection No Connection Positive Power Supply Reference Input Voltage Internal Feedback Resistor DESCRIPTION Rev. 3.00 2 MP7523/XRD7523 ELECTRICAL CHARACTERISTICS (VDD = + 15 V, VREF = +10 V unless otherwise noted) 25°C Typ Tmin to Tmax Min Max Parameter STATIC PERFORMANCE1 Resolution (All Grades) Integral Non-Linearity (Relative Accuracy) J K Monotonicity Differential Non-Linearity J K Gain Error J K Power Supply Rejection Ratio J K Output Leakage Current (Pin 1) J K Output Leakage Current (Pin 2) J K REFERENCE INPUT Input Resistance DIGITAL INPUTS Logical “1” Voltage Logical “0” Voltage Input Leakage Current ANALOG OUTPUTS Output Capacitance2 Symbol Min Max Units Test Conditions/Comments N INL 8 8 Bits LSB Best Fit Straight Line (Max INL – Min INL) / 2 +1/2 +1/4 +1/2 +1/4 Guaranteed over temp DNL +1 +1 GE +1.5 +1 +1 +1.8 LSB All grades monotonic over full temperature range. % Using Internal RFB Digital Inputs = VINH |∆Gain/∆VDD| ∆VDD = + 5% Digital Inputs = VINH PSRR +200 +300 ppm/% IOUT1 +50nA +200nA nA Digital Inputs = VINL IOUT2 +50nA +200nA nA Digital Inputs = VINH RIN 5 20 5 20 kΩ VOUT1 = VOUT2 = 0 V VIH VIL ILKG 14.5 0.5 +1 14.5 0.5 +1 V V µA COUT1 COUT1 COUT2 COUT2 100 30 30 100 100 30 30 100 pF pF pF pF DAC Inputs all 1’s DAC Inputs all 0’s DAC Inputs all 1’s DAC Inputs all 0’s Rev. 3.00 3 MP7523/XRD7523 ELECTRICAL CHARACTERISTICS (CON’T) Parameter POWER SUPPLY Functional Voltage Range2 Supply Current NOTES: 1 2 3 4 Symbol Min 25°C Typ Max Tmin to Tmax Min Max Units Test Conditions/Comments VDD IDD 5 16 1.6 5 16 1.6 V mA All digital inputs = 0 V or all = 15 V Full Scale Range (FSR) is 10V. Guaranteed but not production tested. Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur. Specified values guarantee functionality. Refer to other parameters for accuracy. Specifications are subject to change without notice ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2 VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V Digital Input Voltage to GND GND –0.5 to VDD +0.5 V IOUT1, IOUT2 to GND . . . . . . . . . . . . . . . . . –0.5 to 6.5 V VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V VRFB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V Storage Temperature . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 10 seconds) . +300°C Package Power Dissipation Rating to 75°C CDIP, PDIP, SOIC . . . . . . . . . . . . . . . . . . . . 800mW Derates above 75°C . . . . . . . . . . . . . . . . . 11mW/°C NOTES: 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. APPLICATION NOTES Refer to Section 8 in the 1995 Data Acquisition Products databook for Applications Information Rev. 3.00 4 MP7523/XRD7523 16 LEAD PLASTIC DUAL-IN-LINE (300 MIL PDIP) 16 1 D 9 8 E1 E A2 Seating Plane A L A1 B e B1 α eB C INCHES SYMBOL A A1 A2 B B1 C D E E1 e eB L α MIN 0.145 0.015 0.115 0.014 0.030 0.008 0.745 0.300 0.240 MAX 0.210 0.070 0.195 0.024 0.070 0.014 0.840 0.325 0.280 MILLIMETERS MIN 3.68 0.38 2.92 0.36 0.76 0.20 18.92 7.62 6.10 MAX 5.33 1.78 4.95 0.56 1.78 0.38 21.34 8.26 7.11 0.100 BSC 0.310 0.115 0° 0.430 0.160 15° 2.54 BSC 7.87 2.92 0° 10.92 4.06 15° Rev. 3.00 5 MP7523/XRD7523 16 LEAD SMALL OUTLINE (150 MIL JEDEC SOIC) D 16 9 8 E H C Seating Plane e B A1 L A α INCHES SYMBOL A A1 B C D E e H L MIN 0.053 0.004 0.013 0.007 0.386 0.150 MAX 0.069 0.010 0.020 0.010 0.394 0.157 MILLIMETERS MIN 1.35 0.10 0.33 0.19 9.80 3.80 MAX 1.75 0.25 0.51 0.25 10.00 4.00 0.050 BSC 0.228 0.016 0° 0.244 0.050 8° 1.27 BSC 5.80 0.40 0° 6.20 1.27 8° α Rev. 3.00 6 MP7523/XRD7523 16 LEAD SMALL OUTLINE (300 MIL JEDEC SOIC) D 16 9 E H 8 C Seating Plane e B A1 L A α INCHES SYMBOL A A1 B C D E e H L α MIN 0.093 0.004 0.013 0.009 0.398 0.291 MAX 0.104 0.012 0.020 0.013 0.413 0.299 MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 MAX 2.65 0.30 0.51 0.32 10.50 7.60 0.050 BSC 0.394 0.016 0° 0.419 0.050 8° 1.27 BSC 10.00 0.40 0° 10.65 1.27 8° Rev. 3.00 7 MP7523/XRD7523 16 LEAD EIAJ SMALL OUTLINE (5.5 mm EIAJ SOP) D 16 9 E 1 H Pin 1 Indexer 8 C Seating Plane e B A1 L A2 A α MILLIMETERS SYMBOL A A1 A2 B C D E e H L MIN 1.80 0.02 1.80 0.30 0.13 9.9 5.30 MAX 2.40 0.20 2.20 0.50 0.20 10.5 5.70 MIN INCHES MAX 0.095 0.008 0.087 0.020 0.008 0.414 0.224 0.071 0.001 0.079 0.012 0.005 0.390 0.209 1.27 BSC 7.80 0.30 0° 8.20 0.90 15° 0.050 BSC 0.307 0.012 0° 0.323 0.035 15° α Rev. 3.00 8 MP7523/XRD7523 Notes Rev. 3.00 9 MP7523/XRD7523 Notes Rev. 3.00 10 MP7523/XRD7523 Notes Rev. 3.00 11 MP7523/XRD7523 NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Copyright EXAR Corporation Datasheet December 1996 Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. Rev. 3.00 12