XR1009, XR2009
0.2mA, 35MHz Rail-to-Rail Amplifiers
FE ATURE S
■ 208μA supply current
■ 35MHz bandwidth
■ Input voltage range with 5V supply:
-0.3V to 3.8V
■ Output voltage range with 5V supply:
0.08V to 4.88V
■ 27V/μs slew rate
■ 21nV/√Hz input voltage noise
■ 13mA linear output current
■ Fully specified at 2.7V and 5V supplies
■ Replaces MAX4281
General Description
The XR1009 (single) and XR2009 (dual) are ultra-low power, low cost,
voltage feedback amplifiers. These amplifiers use only 208μA of supply
current and are designed to operate from a supply range of 2.5V to 5.5V
(±1.25 to ±2.75). The input voltage range extends 300mV below the negative
rail and 1.2V below the positive rail.
The XR1009 and XR2009 offer superior dynamic performance with a
35MHz small signal bandwidth and 27V/μs slew rate. The combination of
low power, high bandwidth, and rail-to-rail performance make the XR1009
and XR2009 well suited for battery-powered communication/ computing
systems.
A P P LI CATION S
■ Portable/battery-powered applications
■ Mobile communications, cell phones,
pagers
■ ADC buffer
■ Active filters
■ Portable test instruments
■ Signal conditioning
■ Medical equipment
■ Portable medical instrumentation
■ Interactive whiteboards
Output Swing vs. RL
Frequency Response
4.85
+2.7
6.8μF
4.80
In
+
Out
ROUT
Rf
© 2014 Exar Corporation
0.1μF
XR1009
RIN
Output Swing (Vpp)
+
4.75
4.70
4.65
4.60
4.55
Rg
1
10
100
RL (k1)
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Absolute Maximum Ratings
Operating Conditions
Stresses beyond the limits listed below may cause
permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect
device reliability and lifetime.
Supply Voltage Range ...................................................2.5 to 5.5V
Operating Temperature Range ...............................-40°C to 125°C
Junction Temperature ........................................................... 150°C
Storage Temperature Range...................................-65°C to 150°C
Lead Temperature (Soldering, 10s) ......................................260°C
VS ..................................................................................... 0V to 6V
VIN ............................................................ -VS - 0.5V to +VS +0.5V
Package Thermal Resistance
Continuous Output Current ..................................-30mA to +30mA
θJA (TSOT23-5) ................................................................215°C/W
θJA (SOIC-8) .....................................................................150°C/W
θJA (MSOP-8) .................................................................. 200°C/W
Package thermal resistance (θJA), JEDEC standard, multi-layer
test boards, still air.
ESD Protection
XR1009 (HBM) .........................................................................2kV
XR2009 (HBM) ......................................................................2.5kV
ESD Rating for HBM (Human Body Model).
© 2014 Exar Corporation
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Electrical Characteristics at +2.7V
TA = 25°C, VS = +2.7V, Rf = Rg = 2.5kΩ, RL = 2kΩ to VS/2; G = 2; unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Frequency Domain Response
UGBWSS
Unity Gain -3dB Bandwidth
G = +1, VOUT = 0.05Vpp, Rf = 0
28
MHz
BWSS
-3dB Bandwidth
G = +2, VOUT < 0.2Vpp
15
MHz
BWLS
Large Signal Bandwidth
G = +2, VOUT = 2Vpp
7
MHz
GBWP
Gain Bandwidth Product
G = +11, VOUT = 0.2Vpp
16
MHz
Time Domain Response
tR, tF
Rise and Fall Time
VOUT = 0.2V step; (10% to 90%)
16
ns
tS
Settling Time to 0.1%
VOUT = 1V step
140
ns
OS
Overshoot
VOUT = 1V step
1
%
SR
Slew Rate
G = -1, 2V step
20
V/μs
Distortion/Noise Response
HD2
2nd Harmonic Distortion
100kHz, VOUT = 1Vpp
-85
dBc
HD3
3rd Harmonic Distortion
100kHz, VOUT = 1Vpp
-63
dBc
THD
Total Harmonic Distortion
100kHz, VOUT = 1Vpp
62
dB
en
Input Voltage Noise
>10kHz
23
nV/√Hz
XTALK
Crosstalk
100kHz, VOUT = 0.2Vpp
98
dB
DC Performance
VIO
Input Offset Voltage
0.8
mV
dVIO
Average Drift
11
μV/°C
IB
Input Bias Current
0.37
μA
dIB
Average Drift
1
nA/°C
IOS
Input Offset Current
8
nA
PSRR
Power Supply Rejection Ratio
DC
60
dB
AOL
Open Loop Gain
VOUT = VS / 2
65
dB
IS
Supply Current
per channel
185
μA
Non-inverting
>10
MΩ
1.4
pF
-0.3 to
1.5
V
92
dB
RL = 2kΩ to VS / 2
0.08 to
2.6
V
RL = 10kΩ to VS / 2
0.06 to
2.62
V
±8
mA
±12.5
mA
56
Input Characteristics
RIN
Input Resistance
CIN
Input Capacitance
CMIR
Common Mode Input Range
CMRR
Common Mode Rejection Ratio
DC, VCM = 0V to VS - 1.5V
Output Characteristics
VOUT
Output Voltage Swing
IOUT
Output Current
ISC
Short Circuit Current
© 2014 Exar Corporation
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Electrical Characteristics at +5V
TA = 25°C, VS = +5V, Rf = Rg = 2.5kΩ, RL = 2kΩ to VS/2; G = 2; unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Frequency Domain Response
UGBWSS
Unity Gain -3dB Bandwidth
G = +1, VOUT = 0.05Vpp, Rf = 0
35
MHz
BWSS
-3dB Bandwidth
G = +2, VOUT < 0.2Vpp
18
MHz
BWLS
Large Signal Bandwidth
G = +2, VOUT = 2Vpp
8
MHz
GBWP
Gain Bandwidth Product
G = +11, VOUT = 0.2Vpp
20
MHz
Time Domain Response
tR, tF
Rise and Fall Time
VOUT = 0.2V step; (10% to 90%)
13
ns
tS
Settling Time to 0.1%
VOUT = 1V step
140
ns
OS
Overshoot
VOUT = 1V step
1
%
SR
Slew Rate
G = -1, 2V step
27
V/μs
Distortion/Noise Response
HD2
2nd Harmonic Distortion
100kHz, VOUT = 2Vpp
-78
dBc
HD3
3rd Harmonic Distortion
100kHz, VOUT = 2Vpp
-66
dBc
THD
Total Harmonic Distortion
100kHz, VOUT = 2Vpp
65
dB
en
Input Voltage Noise
>10kHz
21
nV/√Hz
XTALK
Crosstalk
100kHz, VOUT = 0.2Vpp
98
dB
DC Performance
VIO
Input Offset Voltage
dVIO
Average Drift
-5
-1.5
5
mV
20
-1.3
0.37
μV/°C
IB
Input Bias Current
dIB
Average Drift
1
1.3
μA
IOS
Input Offset Current
7
PSRR
Power Supply Rejection Ratio
DC
56
60
AOL
Open Loop Gain
VOUT = VS / 2
56
62
IS
Supply Current
per channel
208
Non-inverting
>10
MΩ
1.2
pF
-0.3 to
3.8
V
65
95
dB
0.2 to
4.7
0.1 to
4.8
V
0.08 to
4.88
V
nA/°C
130
nA
dB
dB
260
μA
Input Characteristics
RIN
Input Resistance
CIN
Input Capacitance
CMIR
Common Mode Input Range
CMRR
Common Mode Rejection Ratio
DC, VCM = 0V to VS - 1.5V
Output Characteristics
RL = 2kΩ to VS / 2
VOUT
Output Voltage Swing
RL = 10kΩ to VS / 2
IOUT
Output Current
±8.5
mA
ISC
Short Circuit Current
±13
mA
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exar.com/XR1009
Rev 1B
XR1009, XR2009
XR1009 Pin Configurations
XR1009 Pin Assignments
TSOT-5
TSOT-5
OUT
1
-Vs
2
+IN
3
+Vs
5
+
-IN
4
SOIC-8
NC
Pin Name
Description
1
OUT
Output
2
-VS
Negative supply
3
+IN
Positive input
4
-IN
Negative input
5
+VS
Positive supply
SOIC-8
NC
8
1
-IN
2
-
7
+Vs
+IN
3
+
6
OUT
-Vs
Pin No.
NC
5
4
Pin No.
Pin Name
Description
1
NC
No Connect
2
-IN
Negative input
3
+IN
Positive input
4
-VS
Negative supply
5
NC
No Connect
6
OUT
Output
7
+VS
Positive supply
8
NC
No Connect
XR2009 Pin Configuration
XR2009 Pin Assignments
SOIC-8 / MSOP-8
SOIC-8 / MSOP-8
OUT1
1
2
-
+IN1
3
+
-Vs
4
© 2014 Exar Corporation
+
Pin Name
1
OUT1
Description
Output, channel 1
+Vs
2
-IN1
Negative input, channel 1
7
OUT2
3
+IN1
Positive input, channel 1
4
-VS
6
-IN2
5
+IN2
Positive input, channel 2
6
-IN2
Negative input, channel 2
7
OUT2
8
+VS
8
-IN1
Pin No.
5
+IN2
5 / 16
Negative supply
Output, channel 2
Positive supply
exar.com/XR1009
Rev 1B
XR1009, XR2009
Typical Performance Characteristics
TA = 25°C, VS = +5V, Rf = Rg = 2.5kΩ, RL = 2kΩ to VS/2; G = 2; unless otherwise noted.
0.1
G=2
Inverting Frequency Response at VS = 5V
Normalized Magnitude (1dB/div)
Normalized Magnitude (2dB/div)
Non-Inverting Frequency Response at VS = 5V
G=1
Rf = 0
G = 10
G=5
1
10
G = -1
G = -2
G = -10
G = -5
0.1
100
1
Frequency (MHz)
0.1
G=1
Rf = 0
G = 10
G=5
1
100
Inverting Frequency Response at VS = 2.7V
Normalized Magnitude (1dB/div)
Normalized Magnitude (2dB/div)
Non-Inverting Frequency Response at VS = 2.7V
G=2
10
Frequency (MHz)
10
G = -1
G = -2
G = -10
G = -5
0.1
100
1
Frequency (MHz)
10
100
Frequency (MHz)
Frequency Response vs. VOUT
Open Loop Gain & Phase vs. Frequency
40
100
Open Loop Gain (dB)
Vo = 1Vpp
Vo = 2Vpp
80
0
60
-40
40
-80
20
-120
-160
0
Open Loop Phase (deg)
Magnitude (1dB/div)
Gain
Phase
-20
0.1
1
10
10
100
1k
10k
100k
1M
-200
10M
Frequency (Hz)
Frequency (MHz)
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Rev 1B
XR1009, XR2009
Typical Performance Characteristics
TA = 25°C, VS = +5V, Rf = Rg = 2.5kΩ, RL = 2kΩ to VS/2; G = 2; unless otherwise noted.
2nd & 3rd Harmonic Distortion at VS = 5V
-40
2nd & 3rd Harmonic Distortion at VS = 2.7V
-40
Vo = 2Vpp
-50
-50
3rd
Distortion (dBc)
Distortion (dBc)
Vo = 1Vpp
-60
-70
-80
2nd
3rd
-60
-70
-80
2nd
-90
-90
-100
-100
10
100
10
1000
100
Frequency (kHz)
CMRR
PSRR
-20
10
-30
0
-40
-10
PSRR (dB)
CMRR (dB)
1000
Frequency (kHz)
-50
-60
-70
-20
-30
-40
-80
-50
-90
-60
-100
-70
10
100
1k
10k
100k
1M
100
10M
Frequency (Hz)
100k
1M
10M
Large Signal Pulse Response
Output Voltage (0.5V/div)
Time (1+s/div)
Time (1ms/div)
© 2014 Exar Corporation
10k
Frequency (Hz)
Output Voltage (0.05V/div)
Small Signal Pulse Response
1k
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Typical Performance Characteristics
TA = 25°C, VS = +5V, Rf = Rg = 2.5kΩ, RL = 2kΩ to VS/2; G = 2; unless otherwise noted.
Output Swing vs. RL
Input Voltage Noise
4.85
100
Voltage Noise (nV/¥Hz)
Output Swing (Vpp)
4.80
4.75
4.70
4.65
4.60
4.55
1
10
60
40
20
0
100
100
RL (k1)
© 2014 Exar Corporation
80
1k
10k
100k
1M
Frequency (Hz)
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Application Information
+Vs
6.8μF
General Description
The XR1009 and XR2009 are a single supply, general
purpose, voltage-feedback amplifiers fabricated on a
complementary bipolar process. The XR1009 offers 35MHz
unity gain bandwidth, 27V/μs slew rate, and only 208μA
supply current. It features a rail-to-rail output stage and is
unity gain stable.
R1
Rg
Input
0.1μF
+
Output
RL
0.1μF
The design utilizes a patent pending topology that provides
increased slew rate performance. The common mode input
range extends to 300mV below ground and to 1.2V below
Vs. Exceeding these values will not cause phase reversal.
However, if the input voltage exceeds the rails by more than
0.5V, the input ESD devices will begin to conduct. The output
will stay at the rail during this overdrive condition.
6.8μF
-Vs
Rf
G = - (Rf/Rg)
For optimum input offset
voltage set R1 = Rf || Rg
Figure 2: Typical Inverting Gain Circuit
The design uses a Darlington output stage. The output
stage is short circuit protected and offers “soft” saturation
protection that improves recovery time.
+Vs
6.8μF
Figures 1, 2, and 3 illustrate typical circuit configurations for
non-inverting, inverting, and unity gain topologies for dual
supply applications. They show the recommended bypass
capacitor values and overall closed loop gain equations.
Figure 4 shows the typical non-inverting gain circuit for
single supply applications.
Input
0.1μF
+
Output
RL
0.1μF
6.8μF
+Vs
6.8μF
-Vs
G=1
Figure 3: Unity Gain Circuit
Input
0.1μF
+
+Vs
Output
6.8μF
-
+
RL
0.1μF
Rf
In
Rg
6.8μF
-Vs
+
0.1μF
Out
G = 1 + (Rf/Rg)
-
Figure 1: Typical Non-Inverting Gain Circuit
Rf
Rg
Figure 4: Single Supply Non-Inverting Gain Circuit
© 2014 Exar Corporation
9 / 16
exar.com/XR1009
Rev 1B
XR1009, XR2009
Power Dissipation
Power dissipation should not be a factor when operating
under the stated 2kΩ load condition. However, applications
with low impedance, DC coupled loads should be analyzed
to ensure that maximum allowed junction temperature is
not exceeded. Guidelines listed below can be used to verify
that the particular application will not cause the device to
operate beyond it’s intended operating range.
Assuming the load is referenced in the middle of the power
rails or Vsupply/2.
The XR1009 is short circuit protected. However, this may not
guarantee that the maximum junction temperature (+150°C)
is not exceeded under all conditions. Figure 5 shows the
maximum safe power dissipation in the package vs. the
ambient temperature for the packages available.
1.5
Maximum Power Dissipation (W)
Maximum power levels are set by the absolute maximum
junction rating of 150°C. To calculate the junction
temperature, the package thermal resistance value ThetaJA
(θJA) is used along with the total die power dissipation.
TJunction = TAmbient + (θJA × PD)
Where TAmbient is the temperature of the working
environment.
In order to determine PD, the power dissipated in the load
needs to be subtracted from the total power delivered by the
supplies.
SOIC-8
1
0.5
MSOP-8
TSOT-5
0
-40
-20
0
20
40
60
80
100
120
Ambient Temperature (°C)
PD = Psupply - Pload
Figure 5. Maximum Power Derating
Supply power is calculated by the standard power equation.
Psupply = Vsupply × IRMSsupply
Vsupply = VS+ - VSPower delivered to a purely resistive load is:
Pload = ((Vload)RMS2)/Rloadeff
The effective load resistor (Rloadeff) will need to include the
effect of the feedback network. For instance,
Driving Capacitive Loads
Increased phase delay at the output due to capacitive loading
can cause ringing, peaking in the frequency response, and
possible unstable behavior. Use a series resistance, RS,
between the amplifier and the load to help improve stability
and settling performance. Refer to Figure 6.
Rloadeff in Figure 3 would be calculated as:
Input
+
RL || (Rf + Rg)
-
These measurements are basic and are relatively easy to
perform with standard lab equipment. For design purposes
however, prior knowledge of actual signal levels and load
impedance is needed to determine the dissipated power.
Here, PD can be found from
Rf
(Vload)RMS = Vpeak / √2
( Iload)RMS = ( Vload)RMS / Rloadeff
The dynamic power is focused primarily within the output
stage driving the load. This value can be calculated as:
Output
CL
RL
Rg
PD = PQuiescent + PDynamic - Pload
Quiescent power can be derived from the specified IS values
along with known supply voltage, Vsupply. Load power can
be calculated as above with the desired signal amplitudes
using:
Rs
Figure 6. Addition of RS for Driving Capacitive Loads
Overdrive Recovery
For an amplifier, an overdrive condition occurs when the
output and/or input ranges are exceeded. The recovery time
varies based on whether the input or output is overdriven
and by how much the ranges are exceeded. The XR1009,
and XR2009 will typically recover in less than 20ns from an
overdrive condition.
PDynamic = (VS+ - Vload)RMS × ( Iload)RMS
© 2014 Exar Corporation
10 / 16
exar.com/XR1009
Rev 1B
XR1009, XR2009
Layout Considerations
General layout and supply bypassing play major roles in
high frequency performance. Exar has evaluation boards to
use as a guide for high frequency layout and as an aid in
device testing and characterization. Follow the steps below
as a basis for high frequency layout:
■
Include 6.8µF and 0.1µF ceramic capacitors for power supply
decoupling
■
Place the 6.8µF capacitor within 0.75 inches of the power pin
■
Place the 0.1µF capacitor within 0.1 inches of the power pin
■
Remove the ground plane under and around the part,
especially near the input and output pins to reduce parasitic
capacitance
■
Minimize all trace lengths to reduce series inductances
Refer to the evaluation board layouts below for more
information.
Evaluation Board Information
The following evaluation boards are available to aid in the
testing and layout of these devices:
Figure 9. CEB002 & CEB003 Schematic
Evaluation Board #
Products
CEB002
XR1009 in TSOT
CEB003
XR1009 in SOIC
CEB006
XR2009 in SOIC
CEB010
XR2009 in MSOP
Evaluation Board Schematics
Evaluation board schematics and layouts are shown in
Figures 9-18 These evaluation boards are built for dualsupply operation. Follow these steps to use the board in a
single-supply application:
1. Short -VS to ground.
2. Use C3 and C4, if the -VS pin of the amplifier is not
directly connected to the ground plane.
Figure 10. CEB002 Top View
© 2014 Exar Corporation
11 / 16
exar.com/XR1009
Rev 1B
XR1009, XR2009
Figure 11. CEB002 Bottom View
Figure 14. CEB006 & CEB010 Schematic
Figure 12. CEB003 Top View
Figure 15. CEB006 Top View
Figure 13. CEB003 Bottom View
© 2014 Exar Corporation
12 / 16
exar.com/XR1009
Rev 1B
XR1009, XR2009
Figure 16. CEB006 Bottom View
Figure 17. CEB010 Top View
Figure 18. CEB010 Bottom View
© 2014 Exar Corporation
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Mechanical Dimensions
TSOT-5 Package
MSOP-8 Package
© 2014 Exar Corporation
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exar.com/XR1009
Rev 1B
XR1009, XR2009
SOIC-8 Package
© 2014 Exar Corporation
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exar.com/XR1009
Rev 1B
XR1009, XR2009
Ordering Information
Part Number
Package
Green
Operating Temperature
Range
Packaging Quantity
Marking
XR1009 Ordering Information
XR1009IST5X
TSOT-5
Yes
-40°C to +125°C
2.5k Tape & Reel
UC
XR1009IST5MTR
TSOT-5
Yes
-40°C to +125°C
250 Tape & Reel
UC
XR1009IST5EVB
Evaluation Board
N/A
N/A
N/A
N/A
XR1009ISO8X
SOIC-8
Yes
-40°C to +125°C
2.5k Tape & Reel
XR1009
XR1009ISO8MTR
SOIC-8
Yes
-40°C to +125°C
250 Tape & Reel
XR1009
XR1009ISO8EVB
Evaluation Board
N/A
N/A
N/A
N/A
XR2009 Ordering Information
XR2009ISO8X
SOIC-8
Yes
-40°C to +125°C
2.5k Tape & Reel
XR2009
XR2009ISO8MTR
SOIC-8
Yes
-40°C to +125°C
250 Tape & Reel
XR2009
XR2009ISO8EVB
Evaluation Board
N/A
N/A
N/A
N/A
XR2009IMP8X
MSOP-8
Yes
-40°C to +125°C
2.5k Tape & Reel
2009
XR2009IMP8MTR
MSOP-8
Yes
-40°C to +125°C
250 Tape & Reel
2009
XR2009IMP8EVB
Evaluation Board
N/A
N/A
N/A
N/A
Moisture sensitivity level for all parts is MSL-1.
Revision History
Revision
1A
1B
Date
Description
June 2014
Initial Release
Sept 2014
Added XR1009 ESD, increased operating temperature range, updated package outline drawings, and removed
Preliminary note on XR1009. [ECN 1436-03 l 09/04/14]
[ECN 1426-10 l 06/24/14]
For Further Assistance:
Email: CustomerSupport@exar.com or HPATechSupport@exar.com
Exar Technical Documentation: http://www.exar.com/techdoc/
Exar Corporation Headquarters and Sales Offices
48760 Kato Road
Tel.: +1 (510) 668-7000
Fremont, CA 94538 - USA
Fax: +1 (510) 668-7001
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation
assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free
of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information
in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected
to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR
Corporation is adequately protected under the circumstances.
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
© 2014 Exar Corporation
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Rev 1B
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